A solderless high-frequency characteristic impedance testing device for circuit boards

Abstract

This utility model discloses a solderless high-frequency characteristic impedance testing device for circuit boards, including a base, a detection component with a probe (341), a pressing component, and a bracket; the bracket is fixed on the base; the pressing component and the bracket are movably connected; the detection component is movably connected above the base. With this solderless high-frequency characteristic impedance testing device, the tester only needs to place the circuit board (21) on the base, and the pressing component drives the detection component to move, so that the probe (341) abuts against the circuit board (21) to perform testing. There is no need to solder connectors to the circuit board (21), thereby improving the accuracy and efficiency of testing while reducing testing costs.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency circuit board testing technology, and in particular to a solderless circuit board high-frequency characteristic impedance testing device. Background Technology

[0002] During the manufacturing process of radio frequency (RF) circuit boards, fluctuations in the production process can cause the RF characteristics of some channels to fail to meet actual requirements. Traditional factory testing requires manual soldering of RF connectors onto the circuit board before analysis and testing. The cumulative deviations in the soldering process increase the inaccuracy of the circuit board testing results, while also raising testing costs and lengthening the testing cycle, which does not meet the production needs of enterprises. Utility Model Content

[0003] This utility model specifically provides a solderless high-frequency characteristic impedance testing device for circuit boards.

[0004] The solderless circuit board high-frequency characteristic impedance testing device provided by this utility model includes a base, a detection component with a probe (341), a pressing component, and a bracket; the bracket is fixed on the base; the pressing component and the bracket are movably connected; the detection component is movably connected above the base.

[0005] Preferably, the detection component includes a connector (34), a movable block (32), two guide posts (33), and a first spring that cooperates with the guide posts (33); the base includes a support block (13); the support block (13) is provided with two sets of first guide holes (131); the two first springs are respectively disposed in the two first guide holes (131); one end of the guide post (33) is inserted into the first guide hole (131) and connected to the first spring, and the other end is fixed to the movable block (32); the connector (34) is fixed between the two guide posts (33); the probe (341) is disposed on the connector (34) and the probe (341) extends outward from the body, and the outwardly extending probe (341) is located above the support block (13).

[0006] Preferably, the pressing assembly includes a lower pressing block (53), a hinge pin (51), and a handle (52); the base also includes a base plate (11); the bracket includes a first side mounting plate (41) and a second side mounting plate (42); the first side mounting plate (41) and the second side mounting plate (42) are both vertically fixed on the base plate (11); the bearing block (13) is fixed on the base plate (11) and located between the first side mounting plate (41) and the second side mounting plate (42); the hinge pin (51) passes through the lower pressing block (53), and its two ends are respectively inserted into the pin holes (412) on the first side mounting plate and the pin holes (412) on the second side mounting plate (42) and are movably connected to them; one end of the lower pressing block (53) is an arc-shaped surface; the arc-shaped surface of the lower pressing block (53) abuts against the movable block (32); the handle (52) is fixed on the lower pressing block (53).

[0007] Preferably, the pin holes (412) on the first side mounting plate (41) and the second side mounting plate (42) are both vertically arranged strip holes; threaded holes (411) are opened on the top of the first side mounting plate (41) and the top of the second side mounting plate (42); the threaded holes (411) and the pin holes (412) are connected; a second spring is provided in each of the two threaded holes (411); the two ends of the second spring abut against the bottom of the threaded hole (411) and the hinge pin (51) respectively; and a bolt is connected to the threaded hole (411).

[0008] Preferably, rollers (31) are hinged to both ends of the movable block (32); roller grooves (413) are provided on the first side mounting plate (41) and the second side mounting plate (42); the rollers (31) roll in the roller grooves (413).

[0009] Preferably, the solderless circuit board high-frequency characteristic impedance testing device provided by this utility model further includes a pad (12); the top of the pad (12) is provided with a positioning pin; the pad (12) is locked on the base plate (11) and located next to the support block (13).

[0010] The solderless high-frequency characteristic impedance testing device for circuit boards provided by this utility model allows the tester to simply place the circuit board (21) on the base and move the testing component through the pressing component so that the probe (341) abuts against the circuit board (21) to test the circuit board (21). There is no need to solder connectors to the circuit board (21), thereby improving the accuracy and efficiency of the test and reducing the test cost. Attached Figure Description

[0011] Figure 1A first-view structural schematic diagram of the solderless circuit board high-frequency characteristic impedance testing device provided by this utility model;

[0012] Figure 2 This is a second-view structural schematic diagram of the solderless circuit board high-frequency characteristic impedance testing device provided by this utility model.

[0013] Figure 3 for Figure 1 A partially enlarged structural diagram;

[0014] Figure 4 This is a schematic diagram of the structure of the pressure block provided in an embodiment of the present utility model;

[0015] Figure 5 A first-view structural diagram of the movable block provided in an embodiment of this utility model;

[0016] Figure 6 This is a second-view structural diagram of the movable block provided in an embodiment of the present utility model;

[0017] Figure 7 This is a schematic diagram of the structure of the support block provided in an embodiment of the present utility model;

[0018] Figure 8 A first-view structural schematic diagram of the connector provided in an embodiment of the present utility model;

[0019] Figure 9 This is a second-view structural schematic diagram of the connector provided in an embodiment of the present utility model;

[0020] Figure 10 This is a schematic diagram of the structure of the first side mounting plate provided in an embodiment of the present utility model; Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] like Figures 1-10As shown, the solderless high-frequency characteristic impedance testing device for circuit boards provided in this embodiment includes a base, a detection component with probe 341, a pressing component, and a bracket; the bracket is fixed on the base; the pressing component and the bracket are movably connected; the detection component is movably connected above the base. Those skilled in the art will understand that the testing personnel only need to place the circuit board 21 on the base, and the pressing component drives the detection component to move, causing the probe 341 to abut against the circuit board 21 to perform testing on the circuit board 21, without the need to solder connectors to the circuit board 21, thereby improving the accuracy and efficiency of testing while reducing testing costs.

[0023] Furthermore, the detection assembly includes a connector 34, a movable block 32, two guide posts 33, and a first spring (not shown in the figure) cooperating with the guide posts 33; the base includes a support block 13; the support block 13 is provided with two sets of first guide holes 131; two first springs are respectively disposed in the two first guide holes 131; one end of the guide post 33 is inserted into the first guide hole 131 and connected to the first spring, and the other end is fixed to the movable block 32; the connector 34 is fixed between the two guide posts 33; the probe 341 is disposed on the connector 34 and extends outward from the body, with the outwardly extending probe 341 located above the support block 13. Those skilled in the art will understand that the circuit board 21 is placed on the support block 13, and then the movable block 32 is pressed downward until the probe 341 and the detection part of the circuit board 21 abut. After the detection is completed, the movable block 32 is pushed upward and reset by the first spring. The connector 34 is a solderless RF connector 34, which is existing technology in the art and will not be described in detail here. The movable block 32 is made of non-metallic material, which can avoid introducing resonance in impedance testing and ensure test stability.

[0024] Furthermore, the pressing assembly includes a lower pressing block 53, a hinge pin 51, and a handle 52; the base also includes a base plate 11; the bracket includes a first side mounting plate 41 and a second side mounting plate 42; both the first side mounting plate 41 and the second side mounting plate 42 are vertically fixed on the base plate 11; the bearing block 13 is fixed on the base plate 11 and located between the first side mounting plate 41 and the second side mounting plate 42; the hinge pin 51 passes through the lower pressing block 53, and its two ends are respectively inserted into the pin holes 412 on the first side mounting plate and the pin holes 412 on the second side mounting plate 42 and are movably connected to them; one end of the lower pressing block 53 is an arc-shaped surface; the arc-shaped surface of the lower pressing block 53 abuts against the movable block 32; the handle 52 is fixed on the lower pressing block 53. Those skilled in the art will understand that when the handle 52 is placed horizontally, it is in its initial position. By pushing the handle 52 upward, the lower pressure block 53 is rotated around the hinge pin 51. The arc-shaped surface of the lower pressure block 53 pushes the movable block 32 downward, thereby causing the probe 341 to move downward and abut against the circuit board 21.

[0025] Furthermore, the pin holes 412 on the first side mounting plate 41 and the second side mounting plate 42 are both vertically arranged strip holes; threaded holes 411 are opened on the top of the first side mounting plate 41 and the top of the second side mounting plate 42; the threaded holes 411 and the pin holes 412 are connected; a second spring (not shown in the figure) is provided in each of the two threaded holes 411; the two ends of the second spring abut against the bottom of the threaded hole 411 and the hinge pin 51, respectively; a bolt (not shown in the figure) is connected to the threaded hole 411. Those skilled in the art will understand that by rotating the bolt and cooperating with the second spring, the hinge pin 51 can be finely adjusted up and down in the pin hole 412 to achieve precise control of the downward stroke.

[0026] Furthermore, rollers 31 are hinged to both ends of the movable block 32; roller grooves 413 are provided on both the first side mounting plate 41 and the second side mounting plate 42; the rollers 31 roll within the roller grooves 413. Those skilled in the art will understand that assembling rollers 31 at both ends of the movable block 32 improves the stability of the movable block 32 during its up-and-down movement.

[0027] Furthermore, the solderless circuit board high-frequency characteristic impedance testing device provided in this embodiment also includes a pad 12; the top of the pad 12 is provided with a positioning pin (not shown in the figure); the pad 12 is locked onto the base plate 11 and is located next to the support block 13. Those skilled in the art will understand that the pad 12 is used to place the circuit board 21 and simultaneously position the circuit board 21.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A solderless circuit board high-frequency characteristic impedance testing device, characterized in that, It includes a base, a detection assembly with a probe (341), a pressing assembly, and a bracket; the bracket is fixed on the base; the pressing assembly and the bracket are movably connected; the detection assembly is movably connected above the base.

2. The solderless circuit board high-frequency characteristic impedance testing device as described in claim 1, characterized in that, The detection assembly includes a connector (34), a movable block (32), two guide posts (33), and a first spring that cooperates with the guide posts (33); the base includes a support block (13); the support block (13) is provided with two sets of first guide holes (131); the two first springs are respectively disposed in the two first guide holes (131); one end of the guide post (33) is inserted into the first guide hole (131) and connected to the first spring, and the other end is fixed to the movable block (32); the connector (34) is fixed between the two guide posts (33); the probe (341) is disposed on the connector (34) and the probe (341) extends outward from the connector (34), and the outwardly extending probe (341) is located above the support block (13).

3. The solderless circuit board high-frequency characteristic impedance testing device as described in claim 2, characterized in that, The pressing assembly includes a lower pressing block (53), a hinge pin (51), and a handle (52); the base also includes a base plate (11); the bracket includes a first side mounting plate (41) and a second side mounting plate (42); the first side mounting plate (41) and the second side mounting plate (42) are both vertically fixed on the base plate (11); the bearing block (13) is fixed on the base plate (11) and located between the first side mounting plate (41) and the second side mounting plate (42); the hinge pin (51) passes through the lower pressing block (53), and its two ends are respectively inserted into the pin holes (412) on the first side mounting plate and the pin holes (412) on the second side mounting plate (42) and are movably connected to them; one end of the lower pressing block (53) is an arc-shaped surface; the arc-shaped surface of the lower pressing block (53) abuts against the movable block (32); the handle (52) is fixed on the lower pressing block (53).

4. The solderless circuit board high-frequency characteristic impedance testing device as described in claim 3, characterized in that, The pin holes (412) on the first side mounting plate (41) and the second side mounting plate (42) are both vertically arranged strip holes; threaded holes (411) are opened on the top of the first side mounting plate (41) and the top of the second side mounting plate (42); the threaded holes (411) and the pin holes (412) are connected; a second spring is provided in each of the two threaded holes (411); the two ends of the second spring abut against the bottom of the threaded hole (411) and the hinge pin (51) respectively; a bolt is connected to the threaded hole (411).

5. The solderless circuit board high-frequency characteristic impedance testing device as described in claim 4, characterized in that, Rollers (31) are hinged to both ends of the movable block (32); roller grooves (413) are provided on the first side mounting plate (41) and the second side mounting plate (42); the rollers (31) roll in the roller grooves (413).

6. The solderless circuit board high-frequency characteristic impedance testing device as described in claim 5, characterized in that, It also includes a pad (12); the top of the pad (12) is provided with a positioning pin; the pad (12) is locked on the base plate (11) and located next to the bearing block (13).

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