A chip temperature-controlled adsorption device

Abstract

This application relates to a chip temperature-controlled adsorption device. The chip temperature-controlled adsorption device includes a suction cup, a flow channel plate disposed below the suction cup, and a heating element disposed between the suction cup and the flow channel plate. The flow channel plate has an inlet main channel, an outlet main channel, and multiple flow channel sub-regions connecting the inlet main channel and the outlet main channel. Each flow channel sub-region includes an inlet branch channel connecting to the inlet main channel and an outlet branch channel connecting to the outlet main channel. The inlet main channel is used to deliver cooling medium in parallel to the multiple flow channel sub-regions through the inlet branches, and the outlet main channel is used to collect the cooling medium flowing out in parallel from the multiple flow channel sub-regions through the outlet branches. This application provides a chip temperature-controlled adsorption device that can reduce flow resistance, improve temperature uniformity, and thus enhance overall temperature control performance.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a chip temperature-controlled adsorption device. Background Technology

[0002] In the field of semiconductor testing, a chuck, also known as a wafer chuck or temperature-controlled chuck, is a commonly used device used to hold chips and conduct heat between them to control their temperature. Currently, the maximum temperature control capability of commonly available chucks with ATC (Advanced Test Control) is generally around 3000W, and it is difficult to further improve the temperature control capability.

[0003] A common chuck disk design in existing technology employs a double-helix flow channel structure. This structure uses two intertwined helical channels to circulate the cooling medium along the helical path for heat exchange. However, the double-helix flow channel is relatively long from the inlet to the outlet, resulting in inconsistent flow rates and heat exchange efficiencies across different regions of the channel. Specifically, areas near the inlet experience overcooling due to lower medium temperatures, while areas further away experience reduced cooling capacity due to increased medium temperature, making it difficult to meet the temperature uniformity requirements of high-precision testing. Furthermore, the curved structure of the helical channel increases the flow resistance of the cooling medium, often necessitating high-pressure pumps to deliver it, leading to increased system energy consumption. Simultaneously, the long channel and uneven flow resistance can cause fluctuations in medium flow rate, further exacerbating temperature control instability.

[0004] Therefore, it is necessary to propose a new technical solution to overcome the shortcomings of existing technologies. Utility Model Content

[0005] Based on this, this application provides a chip temperature control adsorption device that can reduce flow resistance and improve temperature uniformity, thereby improving overall temperature control performance.

[0006] Therefore, this application adopts the following technical solution: a chip temperature-controlled adsorption device, including a suction cup, a flow channel plate disposed below the suction cup, and a heating element disposed between the suction cup and the flow channel plate. The flow channel plate is provided with an inlet main channel, an outlet main channel, and a plurality of flow channel sub-regions connected between the inlet main channel and the outlet main channel. Each flow channel sub-region includes an inlet branch channel connected to the inlet main channel and an outlet branch channel connected to the outlet main channel. The inlet main channel is used to deliver cooling medium to the plurality of flow channel sub-regions in parallel through the inlet branches. The outlet main channel is used to collect the cooling medium flowing out of the plurality of flow channel sub-regions in parallel through the outlet branches.

[0007] In some embodiments, each of the flow channel sub-regions has a serpentine flow channel.

[0008] In some embodiments, the suction cup includes a rectangular adsorption test area, the projection of which on the flow channel disk covers the plurality of flow channel sub-regions, and the inlet and outlet mains are located outside the projection.

[0009] In some embodiments, each of the flow channel sub-regions is rectangular, and the plurality of flow channel sub-regions are arranged in an array within the flow channel disk.

[0010] In some embodiments, the flow channel disk has four flow channel sub-regions; wherein:

[0011] An inlet branch in one of the two flow channel sub-regions away from the main inlet path extends between and connects to the main inlet path between the two flow channel sub-regions close to the main inlet path; and / or,

[0012] An outlet branch, located in one of the two flow channel sub-regions near the inlet main, extends between the two flow channel sub-regions away from the inlet main and connects to the outlet main.

[0013] In some embodiments, heat exchange fins are provided within the flow channels of the flow channel sub-region.

[0014] In some embodiments, the suction cup is rectangular, the flow channel is circular, and the projection of the suction cup on the flow channel falls completely within the flow channel.

[0015] In some embodiments, the flow channel plate has multiple mounting slots on the side facing the suction cup, and the heating element is multiple independently controlled heating elements, which are correspondingly installed in the mounting slots.

[0016] In some embodiments, graphene pads are provided on both sides of the heating element, and the graphene pads are pressed between the heating element and the suction cup and the flow channel plate.

[0017] In some embodiments, the chip temperature-controlled adsorption device further includes a ceramic disk installed below the flow channel disk, and both the suction cup and the ceramic disk are connected and fixed to the flow channel disk.

[0018] The chip temperature control adsorption device provided in this application, by setting multiple parallel flow channel sub-regions inside the flow channel disk, ensures that the flow velocity and heat exchange efficiency of the cooling medium in the flow channel are relatively consistent, thus improving temperature control uniformity. The design of multiple parallel flow channel sub-regions shortens the flow path of the cooling medium, significantly reduces flow resistance compared to the double-helix structure, and improves flow resistance uniformity, further enhancing temperature control stability. The solution of this application has a fast temperature control rate and high temperature control accuracy, improving overall temperature control performance. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a perspective view of an embodiment of the chip temperature-controlled adsorption device of this application.

[0021] Figure 2 This is an exploded perspective view of an embodiment of the chip temperature-controlled adsorption device of this application.

[0022] Figure 3 This is a three-dimensional exploded view of another embodiment of the chip temperature-controlled adsorption device of this application.

[0023] Figure 4 This is a cross-sectional view of the flow channel plate in one embodiment of the chip temperature-controlled adsorption device of this application.

[0024] The components are labeled as follows: 1. Suction cup; 10. Chip; 2. Flow channel plate; 21. Mounting slot; 22. Liquid inlet main path; 23. Liquid outlet main path; 24. Heat exchange fin; 201. Flow channel sub-area one; 202. Flow channel sub-area two; 203. Flow channel sub-area three; 204. Flow channel sub-area four; 205. Liquid inlet branch; 206. Liquid outlet branch; 3. Ceramic plate; 4. Heating element; 41. Wire. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0030] Please see Figures 1 to 4 As shown, this application provides a chip temperature-controlled adsorption device for carrying a chip 10 and controlling the temperature of the chip 10. The chip temperature-controlled adsorption device includes a suction cup 1, a flow channel plate 2 disposed below the suction cup 1, and a heating element 4 disposed between the suction cup 1 and the flow channel plate 2. The flow channel plate 2 has an inlet main channel 22, an outlet main channel 23, and multiple flow channel sub-regions connecting the inlet main channel 22 and the outlet main channel 23. Each flow channel sub-region includes an inlet branch 205 connected to the inlet main channel 22 and an outlet branch 206 connected to the outlet main channel 23. The inlet main channel 22 is used to deliver cooling medium in parallel to the multiple flow channel sub-regions through the inlet branches 205, and the outlet main channel 23 is used to collect the cooling medium flowing out in parallel from the multiple flow channel sub-regions through the outlet branches 206.

[0031] As can be understood, parallel delivery refers to the process of simultaneously distributing the cooling medium from the inlet main 22 to multiple flow channel sub-regions. Specifically, the inlet main 22 serves as the main channel for cooling medium input and is connected to each flow channel sub-region through multiple inlet branches 205. When the cooling medium enters the inlet main 22, it is simultaneously distributed to different flow channel sub-regions through each inlet branch 205. Each flow channel sub-region independently receives the cooling medium from the inlet main 22, and the flow of the cooling medium between sub-regions does not interfere with each other. This parallel delivery method ensures that each flow channel sub-region receives a relatively uniform cooling medium flow rate and temperature, avoiding the problem of uneven temperature control caused by the gradual increase in temperature of the cooling medium during flow in traditional series flow channel designs. Similarly, parallel outflow refers to the process of the cooling medium simultaneously flowing from multiple flow channel sub-regions into the outlet main 23. Specifically, the main outlet channel 23 serves as the primary channel for cooling medium output, connecting to each flow channel sub-region via multiple outlet branches 206. Cooling medium that has completed heat exchange within the flow channel sub-regions simultaneously flows into the main outlet channel 23 through each outlet branch 206, ultimately exiting the flow channel plate 2. This parallel outflow method maintains consistent flow resistance across each flow channel sub-region, avoids localized pressure losses, and ensures uniform and stable cooling medium outflow. This helps maintain the uniformity of the temperature field within the flow channel plate 2 and improves temperature control accuracy.

[0032] Therefore, the chip temperature control adsorption device provided in this application employs multiple parallel-operating flow channel sub-regions to achieve zoned temperature control. This ensures that the flow rate and heat transfer efficiency of the cooling medium are similar across each flow channel sub-region, improving temperature control uniformity and rate. Simultaneously, the multiple parallel flow channel sub-regions shorten the flow path of the cooling medium, enhancing flow resistance uniformity and further strengthening temperature control stability. In other words, the solution in this application provides fast temperature control rate and high temperature control accuracy for the chip 10, improving the overall temperature control performance of the chip 10.

[0033] Please see Figures 1 to 4 As shown in the accompanying drawings, in one specific embodiment, the chip temperature-controlled adsorption device includes a suction cup 1, a flow channel plate 2, a ceramic plate 3, and a heating element 4. The chip temperature-controlled adsorption device provided in this application will be described in detail below with reference to the accompanying drawings and a specific embodiment.

[0034] Please see Figure 1 and Figure 2As shown, the suction cup 1 is the component that directly supports the chip 10 under test. The suction cup 1 is fixed above the flow channel disk 2, and temperature control is achieved by the cooling medium flowing inside the flow channel disk 2 and the heating element 4. In this embodiment, the suction cup 1 is fixed to the flow channel disk 2 by screws; of course, in other embodiments, the suction cup 1 can also be fixed to the flow channel disk 2 by snap-fit, riveting, or other methods. In some embodiments, the suction cup 1 can be made of a material with high thermal conductivity and high thermal stability, such as alumina ceramic, to ensure stable performance over a wide temperature range of the three-temperature test. In this embodiment, the suction cup 1 uses negative pressure to adsorb the chip 10. Specifically, the suction cup 1 has an air extraction channel inside, and the surface of the suction cup 1 has adsorption holes. A vacuum device is used to draw air through the air extraction channel to create negative pressure, causing the adsorption holes to adsorb the chip 10.

[0035] In this embodiment, the suction cup 1 includes a rectangular adsorption test area. The projection of the adsorption test area onto the flow channel disk 2 covers multiple flow channel sub-regions and the heating element 4, ensuring effective utilization of the cold energy generated by the multiple flow channel sub-regions and the heat generated by the heating element 4, and reducing cold and heat loss. Furthermore, the liquid inlet main 22 and the liquid outlet main 23 are located outside the projection to avoid interfering with the temperature field of the adsorption test area of ​​the chip 10, i.e., to avoid local temperature anomalies in the adsorption test area caused by the liquid inlet main 22 and the liquid outlet main 23, thus ensuring a relatively uniform temperature throughout the adsorption test area. In this embodiment, the suction cup 1 is rectangular in shape, and the flow channel disk 2 is circular. The projection of the suction cup 1 onto the flow channel disk 2 falls completely within the flow channel disk 2. That is, the circular area formed by the flow channel disk 2 should not be less than the area of ​​the circumcircle of the rectangle formed by the suction cup 1. The liquid inlet main 22 and the liquid outlet main 23 are located within the flow channel disk 2 and outside the rectangular projection formed by the suction cup 1, situated on opposite sides of the rectangular projection.

[0036] Please see Figures 2 to 4As shown, the flow channel disk 2 is the core component for temperature control, which controls the temperature of the chip 10 through the cooling medium flowing through it. In this embodiment, the flow channel disk 2 is made of copper, which has high thermal conductivity and a lower coefficient of thermal expansion than traditional aluminum alloys. It is less prone to deformation during long-term use, ensuring flatness and temperature control accuracy. In this embodiment, the flow channel disk 2 is flat and circular, with an inlet and an outlet on its peripheral wall. Inside, there is an inlet main channel 22, an outlet main channel 23, and multiple flow channel sub-regions. Each flow channel sub-region is connected to both the inlet main channel 22 and the outlet main channel 23, making each sub-region independent and parallel. Each flow channel sub-region has a serpentine flow channel. In this embodiment, the flow channels within each sub-region are continuously extending S-shaped, with rounded transitions at the bends to reduce flow resistance. The serpentine flow channel causes the cooling medium to flow in a meandering pattern, facilitating more efficient heat transfer between the cooling medium and the flow channel plate 2, thus improving heat exchange performance. Furthermore, to enhance heat exchange efficiency, heat exchange ribs 24 are also provided within the flow channel sub-regions. Specifically, the extension direction of the heat exchange ribs 24 is consistent with the extension direction of the flow channel. Within a single flow channel, one or more heat exchange ribs 24 can be used, arranged along the width of the flow channel, thereby dividing a flow channel of a certain width into multiple smaller flow channels. The placement of the heat exchange ribs 24 further increases the contact area between the cooling medium and the flow channel plate 2, and enhances the turbulence effect of the cooling medium, significantly improving heat exchange performance.

[0037] Please refer to this carefully. Figure 4 As shown, in this embodiment, each flow channel sub-region is approximately rectangular, and multiple flow channel sub-regions are arranged in an array within the flow channel disk 2. Specifically, in this embodiment, four flow channel sub-regions are provided within the flow channel disk 2: flow channel sub-region one 201, flow channel sub-region two 202, flow channel sub-region three 203, and flow channel sub-region four 204. The flow channel length and cross-sectional area of ​​these four flow channel sub-regions are set to be approximately the same, so that the cooling medium flow conditions in each flow channel sub-region are approximately the same, thereby maintaining approximately the same temperature control capability. Each flow channel sub-region is connected to the main flow through an independent inlet branch 205 and an outlet branch 206, forming a parallel flow channel network. Figure 4 Only the inlet branch 205 of flow channel sub-region 4 204 and the outlet branch 206 of flow channel sub-region 1 201 are labeled, but it is understandable that each flow channel sub-region has an inlet branch 205 and an outlet branch 206.

[0038] In the four flow channel sub-regions mentioned above, the inlet branch 205 of one of the two flow channel sub-regions far from the main inlet channel 22 extends between and connects to the main inlet channel 22. Specifically, the two flow channel sub-regions far from the main inlet channel 22 are flow channel sub-region three 203 and flow channel sub-region four 204, and the two flow channel sub-regions close to the main inlet channel 22 are flow channel sub-region one 201 and flow channel sub-region two 202. In this embodiment, the inlet branch 205 of flow channel sub-region four 204 traverses the gap between flow channel sub-region one 201 and flow channel sub-region two 202 and connects to the main inlet channel 22. In the four flow channel sub-regions mentioned above, the outlet branch 206 of one of the two flow channel sub-regions close to the main inlet channel 22 extends between and connects to the main outlet channel 23. Specifically, in this embodiment, the liquid outlet branch 206 of flow channel sub-region one 201 passes through the gap between flow channel sub-region three 203 and flow channel sub-region four 204 to connect to the main liquid outlet branch 23. This layout design effectively utilizes the area between flow channel sub-regions, reducing the area between each flow channel sub-region where no cooling medium flows; on the other hand, it rationally allocates the arrangement positions of the four liquid inlet branches 205 and the four liquid outlet branches 206, and ensures that the sum of the lengths of the liquid inlet branches 205 and liquid outlet branches 206 in each flow channel sub-region is similar, achieving a balanced distribution of cooling medium and effectively balancing the fluid resistance of each branch.

[0039] Please refer to it again. Figure 2As shown, in this embodiment, the flow channel plate 2 has multiple mounting slots 21 on the side facing the suction cup 1, and the heating element 4 consists of multiple independently controllable heating plates, which are correspondingly installed in the mounting slots 21. In this embodiment, the heating plates are fixed on the flow channel plate 2 instead of being directly installed on the suction cup 1, which can improve the flatness of the suction cup 1 adsorption test area. The heating element 4 in this embodiment adopts a zoned control strategy, that is, the heating element 4 includes multiple independently controllable heating plates, which are embedded in the mounting slots 21 of the flow channel plate 2, enabling zoned temperature control. In some embodiments, the multiple heating plates can also be divided into several groups, and each group can be independently controlled. For example, the multiple heating plates can be divided into four groups corresponding to four flow channel sub-regions, with the heating plates in each group being uniformly controlled and the different groups being independently controlled. This design allows each flow channel sub-region to correspond to an independent heating control area, and with the feedback of the temperature sensor, closed-loop control of the temperature field can be achieved. In this embodiment, the heating plates are made of alumina ceramic sheets, which balances thermal conductivity and cost. Furthermore, graphene gaskets are provided on both sides of the heating element, and these gaskets are pressed tightly between the heating element and the suction cup 1 and the flow channel plate 2. The surface of the heating element is covered with graphene gaskets, which, when pressed between the heating element and the suction cup 1 and the flow channel plate 2, improve heat conduction efficiency and also act as stress buffers. Each heating element is connected to an external temperature controller via a wire 41, enabling precise power adjustment. The wire 41 passes through the flow channel plate 2 and is electrically connected to the temperature controller.

[0040] Please see Figures 1 to 3 As shown, in this embodiment, the chip temperature control adsorption device includes a ceramic disk 3 installed below the flow channel disk 2. Both the suction cup 1 and the ceramic disk 3 are connected and fixed to the flow channel disk 2. The ceramic disk 3 can be made of alumina ceramic material, and it has mounting holes corresponding to the flow channel disk 2, achieving a rigid connection by screws. The ceramic disk 3 not only provides insulating support, but its low coefficient of thermal expansion also helps maintain the thermal stability of the overall structure and reduces the heat loss of the flow channel disk 2 to the side away from the suction cup 1, improving the heat utilization rate. The suction cup 1 and the ceramic disk 3 are respectively connected and fixed to the flow channel disk 2 by screws, forming a sandwich-style stacked structure to ensure close contact and efficient heat conduction between the components.

[0041] When the chip temperature control adsorption device provided in this application is in use, the cooling medium is delivered from the inlet to the main inlet channel 22, and then distributed in parallel to the four flow channel sub-regions through the inlet branches 205. The cooling medium flows in a serpentine flow channel in each flow channel sub-region to exchange heat efficiently with the flow channel disk 2, and then flows into the main outlet channel 23 through the outlet branch 206 for discharge. At the same time, the heating element 4 adjusts the output power of each heating element according to the feedback of the temperature sensor, and works in coordination with the cooling system to achieve precise temperature control of the chip 10 on the suction cup 1.

[0042] The chip temperature control adsorption device provided in this application significantly improves temperature uniformity while reducing fluid resistance through a parallel design of multiple flow channel sub-regions. The parallel design ensures that the cooling medium flow state in each flow channel sub-region tends to be consistent, resulting in a significantly improved flow resistance balance compared to the traditional double-helix structure. Furthermore, the serpentine flow channel and heat exchange ribs 24 design within each flow channel sub-region extend the fluid heat exchange path and enhance heat exchange efficiency.

[0043] As described above in the specific embodiments, the chip temperature control adsorption device provided in this application divides the flow channel disk 2 into multiple parallel flow channel sub-regions. Each sub-region independently receives the cooling medium from the inlet main channel 22 and independently discharges it to the outlet main channel 23, ensuring consistent flow velocity and heat exchange efficiency of the cooling medium within the flow channel, thus improving temperature control uniformity. The design of multiple parallel flow channel sub-regions shortens the flow path of the cooling medium, significantly reducing flow resistance compared to the double-helix structure and improving flow resistance uniformity, further enhancing temperature control stability. The solution in this application offers fast temperature control rate and high temperature control accuracy, improving overall temperature control performance.

[0044] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A chip temperature-controlled adsorption device, comprising a suction cup (1), a flow channel disk (2) disposed below the suction cup (1), and a heating element (4) disposed between the suction cup (1) and the flow channel disk (2), characterized in that, The flow channel plate (2) is provided with an inlet main channel (22), an outlet main channel (23), and multiple flow channel sub-regions connected between the inlet main channel (22) and the outlet main channel (23). Each flow channel sub-region includes an inlet branch (205) connected to the inlet main channel (22) and an outlet branch (206) connected to the outlet main channel (23). The inlet main channel (22) is used to deliver cooling medium to the multiple flow channel sub-regions in parallel through each inlet branch (205). The outlet main channel (23) is used to collect the cooling medium flowing out of the multiple flow channel sub-regions in parallel through each outlet branch (206).

2. The chip temperature-controlled adsorption device as described in claim 1, characterized in that, Each of the aforementioned flow channel sub-regions has a serpentine flow channel.

3. The chip temperature-controlled adsorption device as described in claim 1 or 2, characterized in that, The suction cup (1) includes a rectangular adsorption test area, the projection of which on the flow channel plate (2) covers the plurality of flow channel sub-regions, and the liquid inlet main (22) and liquid outlet main (23) are located outside the projection.

4. The chip temperature-controlled adsorption device as described in claim 3, characterized in that, Each of the flow channel sub-regions is rectangular, and the plurality of flow channel sub-regions are arranged in an array within the flow channel disk (2).

5. The chip temperature-controlled adsorption device as described in claim 4, characterized in that, The flow channel plate (2) is provided with four flow channel sub-regions; wherein: An inlet branch (205) of one of the two flow channel sub-regions away from the main inlet channel (22) extends between and connects to the main inlet channel (22) between the two flow channel sub-regions close to the main inlet channel (22); and / or, An outlet branch (206) of one of the two flow channel sub-regions near the inlet main (22) extends between the two flow channel sub-regions away from the inlet main (22) and connects to the outlet main (23).

6. The chip temperature-controlled adsorption device as described in claim 1 or 2, characterized in that, Heat exchange fins (24) are provided inside the flow channel of the flow channel sub-region. 。 7. The chip temperature-controlled adsorption device as described in claim 3, characterized in that, The suction cup (1) is rectangular, the flow channel plate (2) is circular, and the projection of the suction cup (1) on the flow channel plate (2) falls completely into the flow channel plate (2).

8. The chip temperature-controlled adsorption device as described in claim 1, characterized in that, The flow channel plate (2) has multiple mounting slots (21) on the side facing the suction cup (1), and the heating element (4) consists of multiple independently controlled heating plates, which are installed in the mounting slots (21).

9. The chip temperature-controlled adsorption device as described in claim 1, characterized in that, The heating element is provided with graphene pads on both sides, and the graphene pads are pressed between the heating element and the suction cup (1) and the flow channel plate (2).

10. The chip temperature-controlled adsorption device as described in claim 1 or 9, characterized in that, The chip temperature control adsorption device also includes a ceramic disk (3) installed below the flow channel disk (2), and both the suction cup (1) and the ceramic disk (3) are connected and fixed to the flow channel disk (2).

Images