X-ray detector and imaging system

Abstract

The utility model provides an X-ray detector and an imaging system. According to the X-ray detector, the positioning columns are matched with the positioning holes of the positioning sleeves fixed to the circuit board assembly, so that the flicker module and the photoelectric conversion module of the circuit board assembly are positioned and aligned more accurately. Moreover, the structure of the existing circuit board assembly does not need to be greatly changed, and the functions can be realized only by using the additionally arranged positioning sleeve with smaller processing error, so that the cost for developing a new circuit board assembly is saved. In the imaging system, more accurate positioning and alignment are realized by the flicker module and the photoelectric conversion module of the circuit board assembly, so that the signal-to-noise ratio of the X-ray detector for imaging can be improved, the risk of image artifacts is reduced, and better imaging quality is obtained.

Description

Technical Field

[0001] This application relates to the field of imaging equipment utilizing X-rays, and more specifically to an X-ray detector and an imaging system including the X-ray detector. Background Technology

[0002] Among existing imaging technologies, computed tomography (CT) is a technique that uses X-rays for imaging, where X-rays are used to perform tomographic scanning of a subject, such as the human body. During a CT scan, X-rays attenuate to varying degrees as they pass through the tissue of the scanned object. These attenuated X-rays are received by an X-ray detector and converted into digital signals. Subsequently, a computer processes these signals to generate detailed images of the internal structure of the scanned object. This CT scanning technology, with its rapid and clear imaging capabilities, is widely used in the diagnosis of various diseases and other fields.

[0003] In existing CT equipment employing the aforementioned CT scanning technology, the X-ray detector is a crucial core component. The X-ray detector is essentially a sensor, and its data acquisition and conversion process is as follows: X-rays pass through the collimator of the X-ray detector and are projected onto a scintillator, which converts the X-rays into visible light. Then, the visible light passes through a photodiode array, converting the optical signal into an electrical signal. This electrical signal is then converted into a raw digital signal by a readout circuit centered around a high-speed multi-channel analog-to-digital converter, and finally transmitted to other components to construct and generate an image.

[0004] To obtain high-quality images, the collimator, scintillator, and photodiode array mentioned above need to be aligned with high precision so that X-rays passing through the collimator channel radiate to each pixelated unit of the scintillator and avoid radiating to adjacent units, and the visible light generated by each unit of the scintillator is received by the corresponding unit of the photodiode array. Utility Model Content

[0005] The applicant recognizes that in X-ray detectors where the circuit board assembly carrying the scintillator module and photoelectric conversion module is mounted on a base, the substrate of the circuit board assembly is limited by materials and processing technology, making it difficult to guarantee the machining accuracy of the positioning holes on the substrate. Therefore, gaps may appear between the positioning posts of the base and the positioning holes on the substrate. This can lead to the circuit board assembly being tilted or offset relative to the base or the collimating assembly mounted on the base after being mounted on the base, during the operation of the CT equipment. Consequently, the alignment accuracy of the scintillator module and photoelectric conversion module of the circuit board assembly with the collimating module of the collimating assembly is insufficient. Based on the above-mentioned problems of the prior art, one object of this application is to provide an X-ray detector that can significantly reduce the probability of the circuit board assembly being tilted or offset relative to the collimating assembly, thereby improving the alignment accuracy of the scintillator module and photoelectric conversion module of the circuit board assembly with the collimating module of the collimating assembly.

[0006] Another objective of this application is to provide an imaging system including the above-mentioned X-ray detector, which, by improving the positioning and alignment accuracy between the circuit board assembly and the collimation assembly of the X-ray detector, enables the imaging system to have a higher signal-to-noise ratio and better imaging quality.

[0007] To achieve the above objectives, the embodiments of this application may adopt the following technical solutions.

[0008] Embodiments of this application provide an X-ray detector including a circuit board assembly, a base, and at least one first positioning post.

[0009] The circuit board assembly is arranged and fixedly installed on the base. The circuit board assembly includes a circuit board, a flashing module, a photoelectric conversion module, and a positioning sleeve. The flashing module and the photoelectric conversion module are stacked on the circuit board. The circuit board has a plurality of holes at its two longitudinal ends. The positioning sleeve is fixed to at least one of the plurality of holes. The inner cavity of the positioning sleeve is formed as a first positioning hole that matches the shape of the first positioning post.

[0010] The first positioning post is inserted through the corresponding first positioning hole and fixed to the base.

[0011] In one alternative embodiment, mounting holes are formed at both ends of the circuit board along the longitudinal direction, the mounting holes being used to insert and fix the first positioning post.

[0012] In another alternative embodiment, the circuit board assembly includes two of the positioning sleeves, the circuit board having a centerline extending along the longitudinal direction and passing through the centerline of each of the positioning sleeves.

[0013] In another alternative, the positioning sleeve is constructed as an annular cylinder and is installed in the mounting hole with an interference fit, so that the positioning sleeve and the circuit board are fixed to each other.

[0014] In another alternative embodiment, the circuit board further includes a plurality of mounting holes located at both ends and arranged symmetrically with respect to the center line.

[0015] The X-ray detector also includes a plurality of fasteners, each of which extends through a corresponding fastening hole and is inserted into the base to secure the circuit board assembly to the base.

[0016] In another alternative embodiment, the base is formed with a second positioning hole, and the first positioning post is inserted into the second positioning hole.

[0017] One of the second positioning holes has the same cross-sectional shape as the first positioning hole, and the other second positioning hole has an elongated oval cross-section, the length of which extends along the longitudinal direction.

[0018] In another alternative embodiment, the circuit board includes a central region for mounting the flashing module and the photoelectric conversion module in the longitudinal direction, and end regions located on both sides of the central region, wherein the plurality of holes are located at the far ends of the end regions away from the central region.

[0019] In another alternative embodiment, the base includes a support rail disposed at a position corresponding to the junction of the middle and end regions of the circuit board, the support rail extending linearly along the transverse direction of the circuit board.

[0020] In another alternative embodiment, a collimation assembly is also included, which is configured to be stacked with the circuit board assembly.

[0021] The collimation assembly includes a collimation module and two supports fixed to each other with the collimation module. The two supports are positioned at both ends of the collimation module, and each of the supports forms a third positioning hole corresponding to the first positioning post, into which the first positioning post is inserted.

[0022] In another alternative embodiment, one of the alignment module and the bracket is provided with a second positioning post, and the other of the alignment module and the bracket is provided with a fourth positioning hole that cooperates with the second positioning post, and the second positioning post is inserted into the fourth positioning hole.

[0023] In another alternative embodiment, the system includes multiple circuit board assemblies and multiple collimation assemblies.

[0024] In the lateral direction of the circuit board, a plurality of circuit board assemblies are arranged side by side and a plurality of collimation assemblies are arranged side by side, and

[0025] Each of the collimation components and the corresponding circuit board assembly are stacked in a thickness direction perpendicular to the longitudinal and transverse directions.

[0026] This application also provides an imaging system including an X-ray generator and an X-ray detector as described in any of the above technical solutions.

[0027] In one alternative, the imaging system is a computed tomography (CT) imaging system. Attached Figure Description

[0028] Figure 1 This is a perspective view of an X-ray detector according to an embodiment of the present application, wherein the X-ray detector is in an assembled state.

[0029] Figure 2 This is another perspective schematic diagram of an X-ray detector according to an embodiment of the present application, wherein the X-ray detector is in an assembled state.

[0030] Figure 3 This is yet another perspective view of an X-ray detector according to an embodiment of the present application, wherein the X-ray detector is in a disassembled state.

[0031] Figure 4 It shows Figure 1 A three-dimensional schematic diagram of the circuit board assembly of the X-ray detector, in which the positioning sleeve and the circuit board are in a disassembled state.

[0032] Figure 5 It shows Figure 4 A three-dimensional schematic diagram of the circuit board assembly, in which the flashing module, photoelectric conversion module and circuit board are in a disassembled state.

[0033] Figure 6 It shows Figure 4 A cross-sectional perspective view of the circuit board assembly taken from a plane including its centerline extending longitudinally, wherein the section lines are omitted.

[0034] Figure 7 It shows Figure 4 The diagram shows a top view of the assembly of the circuit board and the positioning sleeve in the circuit board assembly.

[0035] Figure 8 It shows Figure 4 A bottom view of the assembly of the circuit board and the positioning sleeve in the circuit board assembly.

[0036] Figure 9 It shows Figure 1 A three-dimensional schematic diagram of the assembly of the X-ray detector base and the first positioning post.

[0037] Figure 10 It shows Figure 1 A three-dimensional schematic diagram of the collimation assembly of the X-ray detector, in which the collimation module and the support are in a disassembled state.

[0038] Figure 11 This is a three-dimensional schematic diagram illustrating an imaging system according to an embodiment of this application. Detailed Implementation

[0039] The embodiments of this application are described below with reference to the accompanying drawings. For ease of understanding, the elements shown in the drawings may include elements expressed differently from actual dimensions and scales. Furthermore, in the detailed description of the embodiments, for the sake of brevity, this specification does not describe all features of the embodiments in detail. For those skilled in the art related to the content disclosed in this application, any supplements, refinements, or changes to design, manufacturing, or production made based on the technical content disclosed in this application are conventional technical means and are still within the scope of this application and should not be construed as insufficient disclosure of this application.

[0040] Unless otherwise defined, the technical or scientific terms used in the claims and description shall have the ordinary meaning understood by those skilled in the art to which this application pertains. The terms "first," "second," and similar terms used in the description and claims of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" indicate that the components or objects preceding "comprising" encompass the components or objects listed following "comprising" and their equivalents, and do not exclude other components or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, nor are they limited to direct or indirect connections.

[0041] In this application, "approximately" means that the conditions described herein can be considered to be met within a reasonable margin of error recognized by a person skilled in the art, and the following description uses this expression to convey a similar meaning.

[0042] In this application, "longitudinal" refers to the length direction of the circuit board assembly (the circuit board) of the X-ray detector according to this application, "lateral" refers to the width direction of the circuit board assembly, and "thickness direction" refers to the thickness direction of the circuit board assembly, wherein the longitudinal, lateral, and thickness directions are perpendicular to each other.

[0043] The following description, in conjunction with the accompanying drawings, details an embodiment of the X-ray detector according to this application.

[0044] The X-ray detector according to this application can typically be applied to imaging systems, such as CT equipment (see [link]). Figure 11 ).like Figures 1 to 3 As shown, the X-ray detector according to an embodiment of this application includes a circuit board assembly 1, a base 2, a collimation assembly 3, a first positioning post 4, and a fixing member 5 assembled together. The circuit board assembly 1, the base 2, and the collimation assembly 3 are positioned and aligned via the first positioning post 4, and the circuit board assembly 1, the base 2, and the collimation assembly 3 are fixedly assembled together via the fixing member 5. In this embodiment, all circuit board assemblies 1 have the same longitudinal direction D1, transverse direction D2, and thickness direction D3. On the transverse direction D2 of the circuit board 11, three circuit board assemblies 1 are arranged side by side, and three collimation assemblies 3 are arranged side by side, and each collimation assembly 3 is stacked with the corresponding circuit board assembly 1 in the thickness direction D3. By arranging these circuit board assemblies 1 and collimation assemblies 3 side by side, the X-ray detector's ability to receive X-rays can be increased, thereby increasing the number of pixels in the image generated corresponding to the X-rays received by the X-ray detector. Moreover, even if the blinking module 12 of a certain circuit board assembly 1 is not precisely aligned with the collimation module 31 of the corresponding collimation assembly 3, it will not affect the precise alignment of the blinking module 12 of other circuit board assemblies 1 with the collimation module 31 of the corresponding collimation assembly 3.

[0045] It is understood that the X-ray detector according to this application does not limit the number of circuit board assembly 1 and the number of collimation assembly 3, and can be changed as needed, as long as the scintillation module 12 and photoelectric conversion module 13 of circuit board assembly 1 correspond to each other and achieve precise positioning and alignment with the collimation module 31 of collimation assembly 3.

[0046] In this embodiment, as Figures 1 to 8 As shown, the circuit board assembly 1 includes a circuit board 11, a flashing module 12, a photoelectric conversion module 13, and a positioning sleeve 14 assembled together.

[0047] like Figures 4 to 8 As shown, the circuit board 11 is generally rectangular in shape, and includes a substrate and various electronic components such as capacitors, inductors, and resistors disposed on the substrate. Figure 7 and Figure 8As shown, on the longitudinal direction D1 of the circuit board 11, the circuit board 11 is divided into a middle region 11r1 for mounting the flashing module 12 and the photoelectric conversion module 13, and end regions 11r2 located on both sides of the middle region 11r1. The middle region 11r1 spans the centerline of the circuit board 11 on the longitudinal direction D1, and the middle region 11r1 can be adjusted according to the size of the flashing module 12 and the photoelectric conversion module 13 to be mounted. The various electronic components can be arranged in the end regions 11r2 on both sides to achieve electrical connection with the electrical circuit on the substrate. In addition, at the far end of each end region 11r2 away from the middle region 11r1, five through holes are provided along the thickness direction D3 through the circuit board 11. Among the group of five through holes, there is a mounting hole 11h1 located in the center and four fixing holes 11h2 located on both sides of the mounting hole 11h1 on the transverse direction D2. The mounting hole 11h1 is used for mounting and fixing the positioning sleeve 14, and the fixing holes 11h2 are used for inserting and installing the fixing member 5. In this way, a relatively simple structure is formed to fix the positioning sleeve 14 to the circuit board 11 without reducing the area on the circuit board 11 for arranging electronic components.

[0048] like Figures 3 to 6 As shown, the scintillator module 12 and the photoelectric conversion module 13 are stacked in the thickness direction D3 on the middle region 11r1 of the circuit board 11, and the scintillator module 12 and the photoelectric conversion module 13 are fixed together with the circuit board 11. The scintillator module 12 includes a plurality of scintillators arranged in an array, and the photoelectric conversion module 13 includes a plurality of photodiodes arranged in an array. The scintillators and photodiodes can form a one-to-one mapping relationship. In this way, after X-rays are converted into visible light by the scintillators, the visible light is projected into the corresponding photodiode and converted into an electrical signal. It can be understood that the more scintillators and photodiodes there are, the higher the pixel count of the image generated subsequently.

[0049] like Figures 3 to 8As shown, the circuit board assembly 1 includes two positioning sleeves 14. Each positioning sleeve 14 may be made of, for example, metal and is constructed as an annular cylinder, whereby the inner cavity of the positioning sleeve 14 is formed as a first positioning hole 14 with a circular cross-section that mates with the shape of the first positioning post 4. As described above, the circuit board 11 has a mounting hole 11h1 formed at each end of its longitudinal direction D1, for the mounting sleeve to be inserted and installed. Specifically, the positioning sleeve 14 may be installed in the mounting hole 11h1, for example, by an interference fit, so that the positioning sleeve 14 and the circuit board 11 are fixed to each other. When the positioning sleeve 14 is fixedly installed on the circuit board 11, the centerline L of the circuit board 11 extending along its longitudinal direction D1 extends through the centerline of each positioning sleeve 14. The centerline L divides the circuit board 11 into two parts with the same lateral dimension and approximately symmetrical structure. The centerline is the centerline of the first positioning hole 14 extending along its axial direction. The first positioning hole 14 formed by the two positioning sleeves 14 arranged in this way, with the first positioning post 4 inserted in the first positioning hole 14, is more conducive to improving the positioning and alignment accuracy of the scintillation module 12 and photoelectric conversion module 13 of the circuit board assembly 1 with the collimation module 31 of the collimation assembly 3. In addition, the fixing hole 11h2 formed on the circuit board 11 is also symmetrically arranged with respect to the center line L of the circuit board 11. With the fixing hole 11h2 arranged in this way, when the fixing member 5 is inserted into the fixing hole 11h2, the force on the circuit board 11 can be more balanced, which is more conducive to the fixation between the circuit board assembly 1, the base 2 and the collimation assembly 3.

[0050] It is understood that the shape of the positioning sleeve 14 is not limited according to the X-ray detector of this application. The positioning sleeve 14 can be constructed into a cylindrical structure of other shapes than a circular annular cylinder. For example, in an alternative embodiment, the inner cavity of the positioning sleeve 14 can be formed into an oblong or elliptical cross-sectional shape. In conjunction with the alternative shape of the positioning sleeve 14, the number of positioning sleeves 14 can also be adjusted accordingly. In an alternative embodiment where the shape and / or number of positioning sleeves 14 are changed, the cross-sectional shape and / or number of the first positioning post 4 are adaptively adjusted, as long as the first positioning post 4 inserted into the positioning sleeve 14 can achieve precise positioning and alignment of the circuit board assembly 1 and the collimation assembly 3.

[0051] In this embodiment, as Figures 1 to 3 as well as Figure 9 As shown, the base 2 includes a base body 21 and a support rail 22 formed integrally. A second positioning hole 21h is formed in the base body 21 at a position corresponding to the first positioning hole 14 of the circuit board assembly 1. Figure 9As shown, corresponding to the two first positioning holes 14 of a circuit board assembly 1, the base body 21 forms two second positioning holes 21h for the insertion of the first positioning pins 4. The cross-sectional shape of one second positioning hole 21h is the same as that of the first positioning hole 14, forming a circle, while the cross-sectional shape of the other second positioning hole 21h is formed as an elongated oval, the length of which can extend along the longitudinal direction D1. The cross-sectional profile of the "elongated oval" here can be a so-called racetrack shape. By using the elongated oval second positioning hole 21h, the manufacturing errors of the two first positioning pins 4 and the two second positioning holes 21h can be compensated, effectively avoiding the situation where the two first positioning pins 4 inserted through the first positioning hole 14 cannot be installed on the base 2 due to such manufacturing errors. Blind holes corresponding to the fixing holes 11h2 of the circuit board 11 are also provided on both sides of the first positioning hole 14. The blind holes can be formed with internal threads, and the fixing members 5 passing through the fixing holes 11h2 of the circuit board 11 can be inserted into the blind holes and threadedly engaged with the base 2. Furthermore, a support rail 22 can be provided at a position on the base body 21 corresponding to the junction of the middle region 11r1 and the end region 11r2 of each circuit board 11. The support rail 22 extends linearly along the transverse direction D2 of the circuit board 11. Therefore, adjacent support rails 22 extend substantially continuously along the transverse direction D2. In this way, even if the longitudinal length of the circuit board 11 is large, the base 2 can effectively support the circuit board 11; and the support rail 22 can reduce the adverse effects of the deformation of the circuit board 11 during use on the aforementioned alignment.

[0052] In this embodiment, as Figures 1 to 3 and Figure 10As shown, the collimation assembly 3 is configured to be stacked with the circuit board assembly 1 in the thickness direction D3. Specifically, the collimation assembly 3 includes a collimation module 31 and two supports 32 fixed to each other with the collimation module 31. The two supports 32 are positioned at both ends of the collimation module 31 in the transverse direction D2. The collimation module 31 functions as a collimator, receiving X-rays passing through the scanned object, so that these X-rays are collimated and projected onto the scintillation module 12. Further, at a position corresponding to the first positioning hole 14, each support 32 forms a third positioning hole 3h for the insertion of the first positioning post 4. The third positioning hole 3h extends through the support 32 along the thickness direction D3. The cross-sectional shape of the third positioning hole 3h is the same as that of the first positioning hole 14h, thereby allowing the first positioning post 4 to be inserted through the third positioning hole 3h. In addition, each support 32 is provided with a second positioning post 33, and the collimation module 31 is provided with a fourth positioning hole 31h that mates with the second positioning post 33, with the second positioning post 33 inserted into the fourth positioning hole 31h. Thus, with the collimation assembly 3 having separately manufactured collimation module 31 and bracket 32, the structure of collimation module 31 can be precisely formed using methods such as 3D printing, while also improving the alignment accuracy between collimation module 31 and scintillation module 12 with a relatively simple structure. To achieve fixation between collimation module 31 and bracket 32, corresponding holes are formed at both ends of collimation module 31 and the end of bracket 32. Connectors passing through these holes can fix collimation module 31 and bracket 32 ​​together. Thus, with the collimation assembly 3 having separately manufactured collimation module 31 and bracket 32, their fixed connection can be achieved with a relatively simple structure. Furthermore, to achieve fixation between collimation assembly 3 and circuit board assembly 1 and base 2, corresponding holes are formed at the end of bracket 32. Fixing members 5 passing through these holes can fix collimation assembly 3, circuit board assembly 1, and base 2 together.

[0053] It is understood that this application does not limit the positioning structure between the collimation module 31 and the support 32. For example, one of the collimation module 31 and the support 32 may be provided with a second positioning post 33, and the other of the collimation module 31 and the support 32 may be provided with a fourth positioning hole 31h that cooperates with the second positioning post 33, with the second positioning post 33 inserted into the fourth positioning hole 31h. In other words, as long as the collimation module 31 and the support 32 can achieve precise positioning after being assembled together, the specific structure of their positioning structure can be adjusted as needed.

[0054] In this embodiment, as Figure 1 , Figure 3 and Figure 9The first positioning post 4 is constructed in a cylindrical shape and extends linearly along the thickness direction D3. The first positioning post 4 matches the first positioning hole 14, the second positioning hole 21h (which has a circular cross-section), and the third positioning hole 3h in both cross-sectional shape and size. Therefore, the first positioning post 4 can sequentially pass through the third positioning hole 3h and the first positioning hole 14 along the thickness direction D3 and be inserted into the second positioning hole 21h, thereby achieving precise positioning and alignment of the circuit board assembly 1 and the collimation assembly 3. It is understood that if the cross-sectional shapes of the first positioning hole 14, the second positioning hole 21h, and the third positioning hole 3h are adjusted, the cross-sectional shape of the first positioning post 4 should be adjusted accordingly.

[0055] In this embodiment, as Figure 1 and Figure 3 As shown, each fastener 5 extends through a corresponding fastening hole 11h2. The fastener 5 is also inserted into the holes of both the base 2 and the collimation assembly 3 to fix the circuit board assembly 1 to the base 2 and the collimation assembly 3. The fastener 5 may also have an external thread that engages with the base 2. In this way, the relatively simple structure for fixing the circuit board assembly 1 to the base 2 and the collimation assembly 3 helps to ensure that the circuit board assembly 1 and the collimation assembly 3 are fixed to the base 2 in the desired orientation, thus not affecting the accuracy of aligning the scintillation module 12 and the photoelectric conversion module 13 with the collimation module 31 using the first positioning post 4.

[0056] By adopting the above-described scheme, in the X-ray detector of this application, the scintillation module 12 and photoelectric conversion module 13 of the circuit board assembly 1 are more precisely positioned and aligned with the collimation module 31 of the collimation assembly 3 by the first positioning post 4 cooperating with the first positioning hole 14 of the positioning sleeve 14. Moreover, since it is not necessary to make significant changes to the existing structure of the circuit board assembly 1, the accuracy of the alignment between the scintillation module 12 and photoelectric conversion module 13 and the collimation module 31 can be improved simply by using the additionally provided positioning sleeve 14 with smaller processing error, thus saving the cost of developing a new circuit board assembly 1.

[0057] Furthermore, this application also provides an imaging system. This imaging system may include the X-ray detector described in the above embodiments and an X-ray generator used in conjunction with the X-ray detector. A typical example of an imaging system is a computed tomography (CT) imaging system (or CT equipment), and the above scheme provides a typical application scenario for the X-ray detector of this application. As described above, in the X-ray detector, the collimation module 31, scintillation module 12, and photoelectric conversion module 13, which are stacked and precisely aligned in the thickness direction D3, enable X-rays collimated by the collimation module 31 to be incident on the scintillator of the scintillation module 12 and converted into visible light. The visible light is then converted into an electrical signal by a photodiode, thereby improving the signal-to-noise ratio of X-ray imaging, reducing the risk of image artifacts, and obtaining better image quality. It is understood that the X-ray detector according to this application can also be applied to other application scenarios.

[0058] Figure 11 An exemplary imaging system 100 according to this application is illustrated, configured to image a scanned object 110 (such as a human body, an inanimate object, one or more manufactured parts, industrial parts) and / or a foreign object (such as an implant, stent 32, and / or contrast agent present in the body). It is understood that a human body is one type of scanned object 110 that can be imaged by the imaging system 100; that is, the scanned object 110 may include not only the human body but also other objects. Specifically, as... Figure 11 As shown, the imaging system 100 includes a frame 101, at least one X-ray generator 102, at least one X-ray detector 103, an image processing unit 104, a depth camera 105, and a scanning bed 106.

[0059] like Figure 11 As shown, an X-ray generator (also referred to as an X-ray radiation source) 102 can be mounted on a rack. The X-ray generator 102 is used to project an X-ray beam (or X-rays) through the scanned object 110. The X-ray generator 102 is configured to project X-rays toward an X-ray detector 103 positioned on the opposite side of the rack 101. Although Figure 11Only one X-ray generator 102 is shown, but in other alternatives, multiple X-ray generators 102 can be used to project multiple X-rays toward multiple X-ray detectors 103 to obtain projection data corresponding to the scanned object 110 at different energy levels. Typically, the X-ray generator 102 can project a fan-shaped or cone-shaped X-ray beam, which is attenuated after passing through the scanned object 110 before being projected onto the X-ray detector 103. The intensity of the attenuated X-ray beam received by the X-ray detector 103 depends on the attenuation capability of the tissue and structure of the scanned object 110 for X-rays. Each detector element of the X-ray detector 103 generates a separate electrical signal, which is a measure of the beam intensity of the X-ray detector 103. Intensity measurements from all detector elements are obtained to generate the X-ray transmission distribution.

[0060] In the imaging system 100, the X-ray generator 102 and X-ray detector 103 can be rotated around the object being scanned 110 using a gantry 101, causing the angle at which the X-ray beam intersects the object to continuously change. One gantry rotation cycle is achieved when the gantry 101 completes a full 360-degree rotation. A set of X-ray attenuation measurements from the X-ray detector 103 at one gantry angle within this rotation cycle can be referred to as a "view." A "scan" of the object 110 includes a set of views obtained at different gantry angles within one gantry rotation cycle of the X-ray generator 102 and X-ray detector 103. During axial scanning using the imaging system 100, the views are processed to construct an image corresponding to a two-dimensional slice taken through the object 110.

[0061] like Figure 11 As shown, the image processing unit 104 is configured to reconstruct an image of the scanned object 110 using a suitable reconstruction method (such as an iterative or analytical image reconstruction method). For example, the image processing unit 104 may use an analytical image reconstruction method such as filtered back projection (FBP) to reconstruct an image of the target volume of the scanned object 110. The image processing unit 104 may use iterative image reconstruction methods (such as adaptive statistical iterative reconstruction (ASIR), conjugate gradient (CG), maximum likelihood expectation maximization (MLEM), model-based iterative reconstruction (MBIR), etc.) to reconstruct an image of the target volume of the scanned object 110. The term "reconstructed image" is not intended to exclude schemes of this application that generate data representing an image rather than a visual image. Therefore, "image" broadly refers to both a visual image and the data representing the visual image.

[0062] The depth camera 105 can be positioned on the rack 101 or externally. For example... Figure 11As shown, a depth camera 105 is mounted on a ceiling 120 located above a scanned object 110 and oriented to image the scanned object 110 when it is at least partially outside the frame 101. The depth camera 105 may include one or more light sensors, including one or more visible light sensors and / or one or more infrared light sensors. Alternatively, the one or more infrared light sensors may include one or more sensors in both near-infrared and far-infrared light ranges to achieve thermal imaging. Alternatively, the depth camera 105 may also include an infrared light source. Furthermore, the light sensor can be any 3D depth sensor, such as a time-of-flight (ToF) sensor, a stereo sensor, or a structured light depth sensor, which can generate a 3D depth image. The light sensor can also be a 2D sensor, which can generate a 2D image and can be used to infer depth based on an understanding of light reflection phenomena to estimate 3D depth. Regardless of whether the light sensor is a 3D depth sensor or a 2D sensor, the depth camera 105 can be configured to output a signal encoding an image to a suitable interface that can be configured to receive the signal encoding the image from the depth camera 105. Furthermore, the depth camera 105 may also include other components, such as a microphone, to enable the reception and analysis of directional and / or non-directional sound from the observed scanned object and / or other sources.

[0063] like Figure 11 As shown, the object to be scanned 110 is positioned on the scanning bed 106 for imaging. The scanning bed 106 may be electrically powered, allowing movement in both the horizontal and vertical directions. For this purpose, the scanning bed 106 may include a motor and a motor controller, the motor controller of which moves the scanning bed 106 by adjusting the motor to properly position the object to be scanned 110 within the gantry 101 to acquire data corresponding to the target volume of the object to be scanned 110. The motor controller of the scanning bed 106 can adjust the vertical and horizontal positions of the scanning bed 106.

[0064] It should be understood that the above embodiments are merely exemplary and are not intended to limit this application. Those skilled in the art can make various modifications and changes to the above embodiments under the teachings of this application without departing from the scope of this application. The following supplementary description is provided regarding the technical solutions of this application.

[0065] i. As described in the above embodiments, the circuit board assembly 1, the base 2, and the collimation assembly 3 are positioned and aligned with each other via multiple first positioning posts 4, but this application is not limited to this. For example, in other alternative solutions, for the circuit board assembly 1 and the collimation assembly 3 arranged in groups, only one first positioning post 4 can be provided to position and align the two, or multiple first positioning posts 4 of a different number than those described in the above embodiments can be used to achieve the same function.

[0066] ii. Experiments show that, in the scheme without the positioning sleeve 14, the machining error of the positioning hole of the circuit board assembly 1 is greater than 30 micrometers; while with the positioning sleeve 14, for example, made of metal, the machining error of the first positioning hole 14h of the positioning sleeve 14 is less than 8 micrometers. Therefore, compared with the scheme without the positioning sleeve 14, the positioning alignment accuracy can be significantly improved by using the positioning sleeve 14.

[0067] Furthermore, in the scheme without the positioning sleeve 14, the centrifugal force generated by the high-speed rotation of the X-ray detector during operation can cause undesirable deformation of the circuit board 11, especially around the positioning holes for inserting the positioning posts. Even methods such as copper plating inside the positioning holes of the circuit board 11 cannot effectively reduce this deformation, resulting in decreased positioning accuracy. In contrast, in the scheme using the positioning sleeve 14, since the positioning sleeve 14 can be made of materials such as metal, the strength of the structure around the positioning holes for inserting the positioning posts is effectively improved. Therefore, undesirable deformation of the structure around the positioning holes can be significantly reduced or even completely avoided, thereby greatly alleviating the problem of decreased positioning accuracy due to deformation.

[0068] The foregoing has described exemplary embodiments and variations of this application; however, it should be understood that various modifications may be made. For example, if the described techniques are performed in a different order and / or if components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents, achieving the same, similar, or other suitable results, these changes or modifications also fall within the scope of the claims.

Claims

1. An X-ray detector, characterized in that, Includes a circuit board assembly, a base, and at least one first positioning post. The circuit board assembly is arranged and fixedly installed on the base. The circuit board assembly includes a circuit board, a flashing module, a photoelectric conversion module, and a positioning sleeve. The flashing module and the photoelectric conversion module are stacked on the circuit board. The circuit board has a plurality of holes at its two longitudinal ends. The positioning sleeve is fixed to at least one of the plurality of holes. The inner cavity of the positioning sleeve is formed as a first positioning hole that matches the shape of the first positioning post. The first positioning post is inserted into and passes through the corresponding first positioning hole and is fixed to the base.

2. The X-ray detector according to claim 1, characterized in that, The circuit board has mounting holes formed at both ends in the longitudinal direction, and the mounting holes are for the first positioning post to be inserted and fixed.

3. The X-ray detector according to claim 2, characterized in that, The circuit board assembly includes two of the positioning sleeves, and the circuit board has a centerline extending along the longitudinal direction, the centerline extending through the centerline of each of the positioning sleeves.

4. The X-ray detector according to claim 3, characterized in that, The positioning sleeve is constructed as an annular cylinder and is installed in the mounting hole with an interference fit so that the positioning sleeve and the circuit board are fixed to each other.

5. The X-ray detector according to claim 3, characterized in that, The circuit board also includes a plurality of fixing holes, which are located at the two ends and arranged symmetrically with respect to the center line. The X-ray detector also includes a plurality of fasteners, each of which extends through a corresponding fastening hole and is also inserted into the base to secure the circuit board assembly to the base.

6. The X-ray detector according to any one of claims 2 to 5, characterized in that, The base has a second positioning hole, and the first positioning pin is inserted into the second positioning hole. One of the second positioning holes has the same cross-sectional shape as the first positioning hole, and the other second positioning hole has an elongated oval cross-section, the length of which extends along the longitudinal direction.

7. The X-ray detector according to any one of claims 2 to 5, characterized in that, The circuit board includes a central region for mounting the flashing module and the photoelectric conversion module in the longitudinal direction, and end regions located on both sides of the central region, wherein the plurality of holes are located at the far ends of the end regions away from the central region.

8. The X-ray detector according to claim 7, characterized in that, The base includes a support rail disposed at a position corresponding to the junction of the middle region and the end region of the circuit board, the support rail extending linearly along the transverse direction of the circuit board.

9. The X-ray detector according to any one of claims 2 to 5, characterized in that, It also includes a collimation assembly configured to be stacked with the circuit board assembly. The collimation assembly includes a collimation module and two supports fixed to each other with the collimation module. The two supports are positioned at both ends of the collimation module, and each support forms a third positioning hole corresponding to the first positioning post, into which the first positioning post is inserted.

10. The X-ray detector according to claim 9, characterized in that, One of the alignment module and the bracket is provided with a second positioning post, and the other of the alignment module and the bracket is provided with a fourth positioning hole that cooperates with the second positioning post, and the second positioning post is inserted into the fourth positioning hole.

11. The X-ray detector according to claim 9, characterized in that, Includes multiple circuit board assemblies and multiple collimation assemblies, In the lateral direction of the circuit board, a plurality of circuit board assemblies are arranged side by side and a plurality of collimation assemblies are arranged side by side, and Each of the collimation components and the corresponding circuit board assembly are stacked in a thickness direction perpendicular to the longitudinal and transverse directions.

12. An imaging system, characterized in that, It includes an X-ray generator and an X-ray detector according to any one of claims 1 to 11.

13. The imaging system according to claim 12, characterized in that, The imaging system is a computed tomography (CT) imaging system.

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