Electron emitters, electron transmitters, X-ray tubes, and medical imaging equipment

Abstract

This application relates to the field of medical device technology, and provides an electron emitter, an electron transmitter, an X-ray tube, and a medical imaging device. The electron emitter includes an emitting part, a non-emitting part, and a supporting substrate. Both the emitting and non-emitting parts are disposed on the supporting substrate, and the non-emitting part surrounds the outer periphery of the emitting part. The electron emitter provided by this application can ensure that the electron beam is emitted as perpendicularly as possible to the emitting part, reducing the amount of electron diffusion to the outer periphery of the emitting part, thereby reducing the bending deformation of the electron beam path and improving the uniformity of electron distribution.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and in particular to an electron emitter, an electron transmitter, an X-ray tube, and a medical imaging device. Background Technology

[0002] An X-ray tube is a high-vacuum device used in medical equipment. Its basic principle is that an electron emitter located at the cathode emits electrons, which, under the influence of a high-voltage electric field, fly at high speed towards the anode target. The target is bombarded by the electrons, generating X-rays. In the medical field, X-rays can detect human tissue, thus helping doctors determine a patient's condition.

[0003] The electron emitter's emitting section has a high resistance. By applying a voltage, the temperature of this section is increased, causing it to emit thermionic electrons. However, during electron escape, some electrons experience a significant lateral component, particularly those near the edge of the emitting section, where the lateral component in the initial escape direction is larger. This causes the electrons to diffuse laterally towards the emitting section upon escape, and then, under the influence of the electron emitter's focusing electrode, deflect back towards the center, resulting in poor image quality in the generated X-ray image. Utility Model Content

[0004] Therefore, it is necessary to provide an electron emitter that can ensure that the electron beam is emitted as perpendicular to the emitting part as possible, reduce the amount of electron diffusion to the outer periphery of the emitting part, thereby reducing the bending deformation of the electron beam path and improving the uniformity of electron distribution.

[0005] An electron emitter includes a support substrate, an emitting part and a non-emitting part, wherein the emitting part and the non-emitting part are both disposed on the support substrate, and the non-emitting part surrounds the outer periphery of the emitting part.

[0006] Understandably, non-emitting sections are arranged around the emitting section. The emitting section generates heat under the influence of current to emit electrons, while the non-emitting sections do not emit electrons; that is, the temperature of the non-emitting sections is much lower than that of the emitting section. Therefore, by using the non-emitting sections, the electron beam from the emitting section can be focused as much as possible towards the center, reducing the lateral component experienced by electrons at the edges of the emitting section. This ensures that the electron beam is emitted as much as possible in a direction perpendicular to the emitting section, reducing the amount of diffusion to the outer periphery, thereby reducing the bending deformation of the electron beam path and improving the uniformity of electron distribution.

[0007] In some embodiments, the electron emitter further includes an isolation section disposed on a support substrate and located between the emitting section and the non-emitting section.

[0008] In some embodiments, the non-emitting portion is continuously arranged around the outer periphery of the emitting portion.

[0009] In some embodiments, at least two isolation sections are provided and are arranged at circumferential intervals along the emitting section; the emitting section is located within the area jointly enclosed by the isolation sections, and the non-emitting section is located outside the area jointly enclosed by the isolation sections.

[0010] In some embodiments, the emitting portion and / or the non-emitting portion are integrally formed on the support substrate.

[0011] In some embodiments, along the circumferential direction of the transmitter, the area between any two adjacent isolation portions of the support substrate is defined as the current inlet and current outlet of the transmitter;

[0012] The transmitting part is provided with multiple guiding grooves, which are staggered. The area between the isolation part and the guiding grooves is connected to the area between any adjacent guiding grooves, and is connected between the current inlet and the current outlet, thus defining a current loop.

[0013] In some embodiments, the isolation portion is an isolation groove that extends through the support substrate.

[0014] In some embodiments, the electron emitter further includes a current connection portion disposed on the support substrate and located within the non-emitting portion, the current connection portion being connected to the current inlet and current outlet of the emitter.

[0015] In some embodiments, the electron emitter further includes a heat insulation portion disposed on the support substrate and spaced apart from the outer side of the isolation portion; wherein the heat insulation portion is located at least at the current inlet and / or the current outlet of the emitter.

[0016] In some embodiments, the heat insulation portion is a heat insulation groove that extends through the support substrate.

[0017] In some embodiments, the heat insulation groove is at least one of an arc groove, a curved groove, or a straight groove that extends circumferentially along the emitting part.

[0018] In some embodiments, along the circumferential direction of the emitting portion, the supporting substrate defines an overlapping region in the area between the heat insulation portion and the isolation portion, and the current inlet and / or current outlet of the emitting portion is located in the overlapping region; the supporting substrate is provided with a current connection portion in the area of ​​the non-emitting portion, and the current connection portion connects the current inlet and / or the current outlet through the overlapping region.

[0019] In some embodiments, the width of the overlapping region is 0.5 to 2 times the width of the current path in the transmitting section.

[0020] In some embodiments, the overlapping region is provided with a first dividing groove, which divides the overlapping region into a first region and a second region, one of which is connected to the current inlet and the other is connected to the current outlet.

[0021] In some embodiments, the support substrate has at least one second dividing groove at the emitting part, the at least one second dividing groove dividing the emitting part into at least two sub-emitting parts; each sub-emitting part has a plurality of guiding grooves, the plurality of guiding grooves are staggered to guide the current path; each sub-emitting part has a corresponding isolation part.

[0022] In some embodiments, the plurality of current-guiding grooves of each sub-emitting part are arranged in ascending order of length along the circumferential direction of the emitting part, spaced apart and staggered from the inside out, and the area between any two adjacent current-guiding grooves from the inside out is defined as the current path.

[0023] In some embodiments, the support substrate is provided with a current connection portion within the area of ​​the non-emitting portion;

[0024] Each of the sub-emitters is connected in series with the current connection to form a current loop; or, some of the sub-emitters are connected in series to form a current path, and each of the current paths is connected in parallel with the current connection to form multiple current loops.

[0025] In some embodiments, the support substrate has a circular hole at the center of the emitting part, and the circular hole communicates with a portion of the second dividing groove.

[0026] This application also provides an electron emitter, including the aforementioned electron emitter, to reduce heat dissipation of the emitting part, ensure sufficient electron emission, and avoid the electron emitter from being easily damaged by long-term heating, thereby extending its service life.

[0027] This application also provides an X-ray tube including a cathode assembly and an anode assembly. The cathode assembly includes the electron emitter described above, and the anode assembly includes an anode target arranged opposite and spaced apart from the electron emitter. The anode target is configured to generate X-rays in response to electron bombardment from the electron emitter. This X-ray tube has the technical effects of any of the foregoing embodiments.

[0028] This application also provides a medical imaging device, including the X-ray tube described above, which has the technical effects of any of the foregoing embodiments, and will not be repeated here. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of an electron emitter provided in an embodiment of this application;

[0031] Figure 2 A schematic diagram of an electron emitter provided in another embodiment of this application;

[0032] Figure 3 A schematic diagram of an electron emitter provided in another embodiment of this application;

[0033] Figure 4 A simplified cross-sectional view of an electron emitter provided in an embodiment of this application;

[0034] Figure 5 A schematic diagram of the thermal simulation results of an electron emitter provided in an embodiment of this application;

[0035] Figure 6 This is a schematic diagram of the thermal structure coupling simulation results of an electron emitter provided in an embodiment of this application.

[0036] Reference numerals: 10, Support substrate; 20, Isolation section; 30, Heat insulation section; 31, Heat insulation groove; 41, First dividing groove; 42, Second dividing groove; 50, Current connection section; 51, First connection end; 52, Second connection end; 53, Third connection end; 54, Fourth connection end; 101, Emitter; 101a, First sub-emitter; 101b, Second sub-emitter; 101c, Third sub-emitter; 101d, Fourth sub-emitter; 102, Non-emitter; 103, Circular hole; 201, Isolation groove; 1011, Current inlet; 1012, Current outlet; 1013, Guide groove; 1014, Current path; 1021, Overlapping area. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] It should be noted that when a component is referred to as being "fixed to" or "attached to" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0042] In related technologies, the part of an electron emitter used to emit electrons (hereinafter referred to as the emitting part) has a high resistance. By applying a voltage to this part, its temperature is increased, which in turn increases the kinetic energy of the electrons, causing them to escape from the emitting part. During electron escape, some electrons experience a large lateral component, particularly those near the edge of the emitting part, where the lateral component in the initial escape direction is larger. This causes the electrons to diffuse towards both sides of the emitting part upon escape, and then, under the influence of the focusing electrode of the electron emitter, deflect back towards the center. Therefore, the trajectory of the electrons is curved during this process, resulting in poor image quality in the generated X-ray images.

[0043] Based on this, one embodiment of this application provides an electron emitter that not only ensures that the electron beam is emitted as perpendicularly as possible to the emitting part, but also improves the problem of insufficient electron emission caused by heat flow from the emitting part. The structure of this electron emitter is described in detail below.

[0044] Please see Figures 1 to 4 For example, the electron emitter includes a support substrate 10 and an emitting portion 101 and a non-emitting portion 102 disposed on the support substrate 10, with the non-emitting portion 102 surrounding the outer periphery of the emitting portion 101. The electron emitter also includes an isolation portion 20 disposed on the support substrate 10, with the isolation portion 20 located between the emitting portion 101 and the non-emitting portion 102.

[0045] Understandably, the support substrate 10 is used to mount the electron emitter at the target location. For example, a cylindrical structure is provided at the bottom of the support substrate 10 to support it. This cylindrical structure can be connected to a base for mounting the electron emitter. Alternatively, the base can have a mounting groove, and the electron emitter is fixed in the mounting groove by the support substrate 10. The emitting part 101 is the part that emits electrons by being heated by an electric current. Since a non-emitting part 102 is provided around the emitting part 101, and the emitting part 101 and the non-emitting part 102 are isolated by the isolation part 20, electrical isolation between the emitting part 101 and the non-emitting part 102 is achieved. Therefore, the current flowing to the emitting part 101 is concentrated as much as possible in the emitting part 101, reducing the diffusion relative to the non-emitting part 102, making the heat of the non-emitting part 102 lower than that of the emitting part 101, thereby ensuring that the electron beam of the emitting part 101 is focused as much as possible towards the center. In this way, the lateral component experienced by electrons at the side of the emitting section 101 can be reduced, ensuring that the electron beam is emitted as perpendicular to the emitting section 101 as possible, reducing the amount of diffusion to the outer periphery, thereby reducing the bending deformation of the electron beam path and improving the uniformity of electron distribution. In addition, it is precisely because of the setting of the isolation section 20 that the current generated by the emitting section 101 is isolated, which can ensure that the temperature of the non-emitting section 102 is much lower than the heat of the emitting section 101, thereby reducing the heat transferred from the emitting section 101 to the non-emitting section 102, and ensuring that the emitting section 101 has sufficient heat for electron escape.

[0046] Please continue reading. Figures 1 to 4In some optional embodiments, the non-emitting portion 102 is continuously arranged around the outer periphery of the emitting portion 101. This arrangement not only increases the focusing range of electrons emitted by the emitting portion 101 and reduces the diffusion at all edges of the emitting portion 101 along its circumference, but also ensures that the non-emitting portion 102 is not discontinuous, thus guaranteeing the structural strength of the non-emitting portion 102 itself. Since the temperature of the emitting portion 101 can reach over 2000 degrees Celsius when emitting electrons, which is extremely high, if the structural strength of the non-emitting portion 102 itself is low, it is very easy to suffer from thermal deformation at high temperatures, thereby affecting the electron focusing problem of the emitting portion 101. Therefore, in this embodiment, the continuous arrangement of the non-emitting portion 102 can effectively prevent thermal deformation on the one hand, and provide sufficient mechanical support on the other hand, ensuring that the electron emitter remains stable in a high-temperature operating environment.

[0047] Furthermore, both the emitting portion 101 and the non-emitting portion 102 are integrally formed on the support substrate 10. At this time, an isolation portion is also integrally formed on the support substrate to separate the support substrate into the emitting portion and the non-emitting portion. For example, the isolation portion 20 is an isolation groove 201 penetrating the support substrate 10. That is, based on the integration of the emitting portion 101 and the non-emitting portion 102 into the support substrate 10, the isolation groove 201 penetrating the support substrate 10 physically separates the emitting portion 101 and the non-emitting portion 102, so that there is no physical connection between the non-emitting portion 102 and the emitting portion 101, and therefore no physical portion for current flow. This better reduces the lateral component experienced by electrons at the side of the emitting portion 101, improving the focusing effect on the electron beam of the emitting portion 101. Moreover, due to this arrangement, the diffusion of heat generated by the emitting portion 101 under the action of current can be blocked as much as possible, so that heat is concentrated in the emitting portion 101 as much as possible, improving the problem of insufficient electron emission caused by heat loss from the emitting portion 101. In addition, this arrangement makes it easy to integrally form the emitting part 101 and the non-emitting part 102 on the support substrate 10, which facilitates production and manufacturing.

[0048] like Figures 1 to 3 Furthermore, at least two isolation sections 20 are provided and are arranged at intervals along the circumference of the transmitting section 101. The transmitting section 101 is located within the area jointly enclosed by the isolation sections 20, while the non-transmitting section 102 is located outside the area jointly enclosed by the isolation sections 20.

[0049] Each isolation section 20 is an isolation groove 201 extending along the thickness direction of the supporting substrate 10. This is equivalent to having at least two isolation grooves 201 spaced circumferentially along the supporting substrate 10. The portion of the supporting substrate 10 enclosed by the multiple isolation grooves 201 serves as the emitting section 101, while the portion outside the multiple isolation grooves 201 serves as the non-emitting section 102. For example, if each isolation groove 201 is arc-shaped, the shape enclosed by at least two isolation grooves 201 is circular, meaning the emitting section 101 is circular, and the non-emitting section 102 is arranged around the outer periphery of the emitting section 101. Alternatively, each isolation groove 201 can also be linear, allowing the multiple isolation grooves 201 to form various shapes such as squares, triangles, and pentagons, corresponding to different shapes for the emitting section 101.

[0050] In other words, the influence of the emitting part 101 on the non-emitting part 102 is reduced by setting at least two isolation grooves 201; and, since the non-emitting part 102 is arranged in a ring around the emitting part 101, that is, the non-emitting part 102 is continuously arranged around the outer periphery of the emitting part 101, the problem of the non-emitting part 102 being easily deformed or broken due to heat is alleviated.

[0051] Furthermore, along the circumferential direction of the emitting section 101, the supporting substrate 10 defines the area between any two adjacent isolation sections 20 as the current inlet 1011 or the current outlet 1012 of the emitting section 101. Simultaneously, the emitting section 101 is provided with a plurality of guiding trenches 1013, which are staggered. The area between the isolation section 20 and the guiding trenches 1013, and the area between any two adjacent guiding trenches 1013, are connected, and are also connected between the current inlet 1011 and the current outlet 1012. Each guiding trench 1013 extends through the supporting substrate 10 along its thickness direction.

[0052] In practical use, the support substrate 10 has a current connection portion 50 in the area outside the emitting portion 102. The current connection portion 50 is connected to the current inlet 1011 and the current outlet 1012 of the emitting portion 101. Specifically, the current connection portion 50 includes at least a first connection end 51 and a second connection end 52. The first connection end 51 can be connected to the current inlet 1011, and the second connection end 52 can be connected to the current outlet 1012. In this way, the current flows through the first connection end 51 to the current inlet 1011, flows along the area between the isolation portion 20 and the guide trench 1013 and the area between any two adjacent guide trenches 1013, and then flows out from the current outlet 1012 and flows to the second connection end 52, forming a complete current loop. In this process, the staggered arrangement of multiple guide trenches 1013 can make the current path corresponding to the emitting part 101 larger, that is, ensure that the emitting part 101 has a large resistance value that can be used for heating. For example, the emitting part 101 can be heated to a temperature of more than 2000 degrees Celsius under the action of current, which will increase the kinetic energy of electrons on the emitting part 101 and cause them to escape, thus realizing electron emission.

[0053] Among them, with Figure 1 For example, Figure 1 The diagram shows two isolation sections 20 (i.e., two isolation slots 201), which are arranged in an arc shape along the circumference of the transmitting section 101. The ends of the two isolation slots 201 extending along their own arc direction are not connected, but are separated by a gap, i.e., the two isolation sections 20 are arranged at intervals. This gap separates the aforementioned current inlet 1011 and current outlet 1012.

[0054] In practical use, the current connection portion 50 can be an opening provided in the support substrate 10 to facilitate the connection of conductive components, such as conductive wires or conductive pillars. Alternatively, the current connection portion 50 can be a conductive protrusion provided on the support substrate 10 to facilitate the connection of conductive wires or conductive pillars.

[0055] Furthermore, the support substrate 10 is mainly made of a metal material with a very high melting point, such as tungsten, molybdenum, iridium, etc., and the thickness of the support substrate 10 is between 0.1mm and 0.25mm, for example, it can be 0.1mm, 0.13mm, 0.175mm, 0.21mm, 0.235mm or 0.25mm, etc.

[0056] Please see Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6As one example, the electron emitter further includes a heat insulation portion 30, which is disposed on the support substrate 10 and spaced apart from the outer side of the isolation portion 20. The heat insulation portion 30 is located at least at the current inlet 1011 and the current outlet 1012 of the emitter 101. The heat insulation portion 30 is used to block heat transfer.

[0057] In related technologies, the application of voltage to the emitting section results in current inlet and current outlet. Therefore, when the temperature of the emitting section rises under voltage, heat easily dissipates along the current path at the current inlet and outlet, leading to heat loss in the electron-emitting section. This prevents some electrons from reaching their escape kinetic energy, resulting in insufficient electron emission. In such cases, increasing the voltage to generate more heat may be necessary to ensure sufficient electron emission. However, excessive heat leads to excessive heat loss in the electron emitter, potentially causing deformation and other problems with prolonged use.

[0058] In other words, in this embodiment, since the portion of the support substrate 10 located between any two adjacent isolation portions 20 serves as the current inlet 1011 and current outlet 1012 of the emitting portion 101, and the current connection portion 50 is located in the non-emitting portion 102, when the current is transmitted between the current connection portion 50 and the current inlet 1011 and current outlet 1012, a portion of it will inevitably pass through the non-emitting portion 102. This can easily lead to the heat of the emitting portion 101 being lost from the current inlet and current outlet. Therefore, in this embodiment, by utilizing the heat insulation portion 30 at the current inlet 1011 and current outlet 1012, the emitting portion 101 can be isolated from the non-emitting portion 102, especially from the current inlet 1011 and / or current outlet 1012. This reduces the amount of heat generated by the emitting portion 101 diffusing from the current inlet 1011 and current outlet 1012 to the non-emitting portion 102, ensuring that the heat is concentrated in the emitting portion 101 as much as possible, and improving the problem of insufficient electron emission caused by heat loss from the emitting portion 101. The heat insulation section 30 is located at the interval between any two adjacent isolation grooves 201 to provide heat insulation for the current inlet 1011 and the current outlet 1012.

[0059] Alternatively, the heat insulation part 30 may be provided only at the current inlet 1011 or only at the current outlet 1012, as long as it can reduce the heat diffusion of the emitting part 101.

[0060] In the aforementioned embodiments, both the current inlet 1011 and the current outlet 1012 of the emitting unit 101 are provided with heat insulation parts 30 to ensure that both the current inlet 1011 and the current outlet 1012 can reduce heat diffusion and improve the heat insulation effect. When the current inlet 1011 and the current outlet 1012 of the emitting unit 101 are located on the same side of the electron emitter, the two corresponding heat insulation parts 30 can be connected as a whole to jointly block heat diffusion.

[0061] The length of the heat insulation part 30 along the circumference of the emitting part 101 is greater than the interval between any two adjacent isolation grooves 201, thereby increasing the heat insulation range and improving the heat insulation effect, and further reducing the amount of heat diffusion at the current inlet 1011 and the current outlet 1012.

[0062] like Figures 1 to 3 As shown, the heat insulation portion 30 can further be a heat insulation groove 31 that penetrates the support substrate 10. Since the electron emitter is in a vacuum environment during operation, the heat insulation groove 31 ensures that there is no heat conduction medium, thereby reducing the heat diffusion of the emitter 101 from the current inlet 1011 and the current outlet 1012. The isolation groove 201 also ensures that there is no heat conduction medium between the emitter 101 and the non-emitter 102, thereby not only reducing the heat loss of the emitter 101, but also reducing the amount of electrons emitted from the emitter 101 diffuse to the outer periphery.

[0063] like Figure 1 As shown, in some specific embodiments, taking a circular emitting part 101 as an example, the heat insulation groove 31 can be an arc-shaped groove extending circumferentially along the emitting part 101 and concentrically arranged with the emitting part 101. In this case, the radial distance between the heat insulation groove 31 and the emitting part 101 along its own extending direction is the same, ensuring that the force is basically consistent. Figure 3 As shown, alternatively, the heat insulation groove 31 can be a straight groove extending circumferentially along the emitting part 101, that is, the heat insulation part 30 is also straight. Another alternative, the heat insulation groove 31 can also be a curved groove extending circumferentially along the emitting part 101, for example, in a wavy shape.

[0064] like Figure 2 As shown, alternatively, the heat insulation groove 31 can also be a combination of the aforementioned arc-shaped groove and straight groove, or a combination of arc-shaped groove and curved groove, or a combination of curved groove and straight groove, or a combination of curved groove, arc-shaped groove and straight groove. Each of the arc-shaped groove, curved groove, and straight groove can have at least one segment, or two, three, or even more segments, and the curvature, slope, etc., of each segment can be different. Its main purpose is to roughly match the shape of the emitting part 101 and provide a heat insulation effect.

[0065] Furthermore, taking a horizontally placed electron emitter as an example, the emitting part 101 has two sets of current inlets 1011 and current outlets 1012 that are opposite and spaced apart along the X-axis. Heat insulation grooves 31 are respectively provided on both sides of the emitting part 101 along the X-axis. The electron emitter has first edges that are opposite and spaced apart along the Y-axis. The distance from each end of the heat insulation groove 31 to the first edge on the same side should not be too large or too small. If it is too large, the length of the heat insulation groove 31 itself will be too short, weakening the heat insulation effect, and the problem of heat loss from the emitting part 101 will still exist; if it is too small, the length of the heat insulation groove 31 itself will be too long, weakening the structural strength of the electron emitter itself, making it prone to deformation under heat influence.

[0066] In other embodiments, the emitting part 101 may also be square, and the corresponding heat insulation groove 31 may be a straight groove, a curved groove, etc., which mainly adapts to the shape of the emitting part 101 and plays a heat insulation role.

[0067] like Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, in some embodiments, along the circumferential direction of the emitting portion 101, the area of ​​the supporting substrate 10 between the heat insulation portion 30 and the isolation portion 20 is defined as an overlapping region 1021. The current inlet 1011 and the current outlet 1012 of the emitting portion 101 are located in this overlapping region 1021, and the current connection portion 50 is connected through the overlapping region 1021. Since the current connection portion 50 on the supporting substrate 10 is located on the outer periphery of the heat insulation groove 31, this overlapping region 1021 serves not only as the area for current to enter and exit the emitting portion 101, but also as the area where heat from the emitting portion 101 diffuses outward. Therefore, it is necessary to limit the size of the overlapping region 1021 to reduce heat diffusion while ensuring current conduction. The overlapping region 1021 can be understood as the part of the non-emitting part 102 between the outer contour of the emitting part 101 and the heat insulation part 30. Therefore, the length of the overlapping region 1021 is equal to the length of the heat insulation part 30, and the width of the overlapping region 1021 is the distance between the outer contour of the emitting part 101 and the inner wall of the heat insulation part 30.

[0068] Specifically, the width of the overlapping region 1021 is 0.5-2 times the width of the current path 1014 in the transmitter 101. Understandably, the width of the overlapping region 1021 should not be too large or too small. If the width of the overlapping region 1021 is too large, more heat will diffuse into it, leading to heat loss from the transmitter 101; if its width is too small, the connection strength of this area will be weakened, making it prone to deformation or breakage under heat. In some specific embodiments, the width of the overlapping region 1021 is 0.5 times, 0.85 times, 1.35 times, 1.68 times, 1.9 times, or 2 times the width of the current path 1014 in the transmitter 101.

[0069] Please see Figures 1 to 3 In the overlapping region 1021, the supporting substrate 10 has a first dividing groove 41 extending along its thickness direction. The length of the first dividing groove 41 can extend along the X-axis direction, and the first dividing groove 41 is connected to the heat insulation groove 31. The first dividing groove 41 divides the overlapping region 1021 into a first region and a second region, one of which is connected to the current inlet 1011, and the other is connected to the current outlet 1012. In this way, problems such as short circuits caused by the current inlet 1011 and the current outlet 1012 being connected in the overlapping region 1021 can be avoided. For example, the region facing oy can be the first region, and the region facing oy' can be the second region, with the first region connected to the current inlet 1011 and the second region connected to the current outlet 1012. Alternatively, the first region can be connected to the current outlet 1012, and the second region can be connected to the current inlet 1011. As long as it can enable the current to enter and exit the emitting part 101, it is acceptable.

[0070] Please continue reading. Figures 1 to 3 Optionally, the support substrate 10 has multiple current-guiding grooves 1013 on the emitting part 101. Each current-guiding groove 1013 extends circumferentially along the emitting part 101 and is staggered to guide a current path 1014. Each current-guiding groove 1013 extends through the support substrate 10 along its thickness direction. The staggered arrangement of the multiple current-guiding grooves 1013 results in a larger current path at the emitting part 101, ensuring that the emitting part 101 has a large resistance for heat generation and electron escape. Of course, using a grooved design on the support substrate 10 facilitates manufacturing and production.

[0071] The width of the current path 1014 is between 0.2mm and 0.8mm. The area between any two adjacent guide trenches 1013 along the radial direction of the emitting portion 101 is used for current conduction. Therefore, the area between any two adjacent guide trenches 1013 along the radial direction defines the current path 1014, and the spacing between them is the width of the current path 1014. This arrangement ensures current flow while providing sufficient strength, and also ensures a longer current path 1014 within the effective area of ​​the emitting portion 101, thereby generating more heat to fully emit electrons. In some specific embodiments, the width of the current path 1014 is 0.2mm, 0.35mm, 0.56mm, 0.68mm, 0.75mm, or 0.8mm, etc.

[0072] Please continue reading. Figures 1 to 3 In some embodiments, the support substrate 10 has at least one second dividing groove 42 at the emitting section 101, which divides the emitting section 101 into at least two sub-emitting sections. Each sub-emitting section has multiple guiding grooves 1013, which are staggered to guide current paths 1014. Each sub-emitting section has a corresponding isolation section 20, thereby ensuring that the outer periphery of each sub-emitting section has a continuous non-emitting section 102. The second dividing groove 42, which is in the same length direction as the first dividing groove 41, is connected to a first dividing groove 41 at both ends along its own length direction. That is, the first dividing groove 41 and the second dividing groove 42, which are in the same length direction, are connected to form a whole to separate the emitting section 101 and the aforementioned overlapping area 1021.

[0073] Taking a second dividing groove 42 as an example, the length of the second dividing groove 42 extends along the X-axis direction. Based on the second dividing groove 42, the emitting part 101 is divided into two symmetrical parts, namely two sub-emitting parts arranged at intervals along the Y-axis direction. Each sub-emitting part has a corresponding current inlet 1011 and current outlet 1012. Therefore, a set of current inlets 1011 and current outlets 1012 are respectively provided at both ends of the second dividing groove 42 along the X-axis direction, and respectively correspond to a first dividing groove 41 and a heat insulation groove 31.

[0074] In practical use, if the number of second dividing grooves 42 is N, then the number of sub-emitters M = 2N, and each sub-emitter is arranged at intervals around the central axis of the support substrate 10. Taking two second dividing grooves 42 as an example, the number of sub-emitters is four, namely the first sub-emitter 101a, the second sub-emitter 101b, the third sub-emitter 101c, and the fourth sub-emitter 101d. The two ends of a second dividing groove 42 with a length along the X-axis are respectively connected to a first dividing groove 41 and a heat insulation groove 31, and the two ends of a second dividing groove 42 with a length along the Y-axis extend to the edge of the support substrate 10. The current connection portion 50 on the support substrate 10 includes a first connection end 51, a second connection end 52, and a third connection end 53. The first connection end 51 and the second connection end 52 can be arranged opposite each other and at intervals along the X-axis, and the first connection end 51 and the third connection end 53 can be arranged opposite each other and at intervals along the Y-axis.

[0075] like Figure 1 and Figure 2 As shown, the first sub-emitter 101a, the second sub-emitter 101b, the third sub-emitter 101c, and the fourth sub-emitter 101d can be connected in series between the first connecting end 51 and the second connecting end 52 to form a first current loop. In this case, the current inlet 1011 of the first sub-emitter 101a can be connected to the first connecting end 51, and the current outlet 1012 of the fourth sub-emitter 101d can be connected to the second connecting end 52. One heat insulation groove 31 is located at the current inlet 1011 of the first sub-emitter 101a and the current inlet 1011 of the fourth sub-emitter 101d, and the other heat insulation groove 31 is located at the current outlet 1012 of the second sub-emitter 101b and the current inlet 1011 of the third sub-emitter 101c, and both heat insulation grooves 31 are connected to the first dividing groove 41.

[0076] Alternatively, the first sub-emitter 101a and the second sub-emitter 101b can be connected in series to form a first flow path, with their two ends connected to a first connecting end 51 and a third connecting end 53, respectively. The third sub-emitter 101c and the fourth sub-emitter 101d can be connected in series to form a second flow path, with their two ends connected to a second connecting end 52 and a third connecting end 53, respectively. The second flow path and the first flow path can be connected in parallel.

[0077] like Figure 3As shown, another alternative configuration has two sets of current inlets 1011 and current outlets 1012 disposed on both sides of the support substrate 10 along the Y-axis. The first dividing groove 41 corresponding to each set of current inlets 1011 and current outlets 1012 extends to the edge of the support substrate 10 and communicates with a second dividing groove 42 of the same length direction. In this configuration, the first sub-emitter 101a and the fourth sub-emitter 101d are connected in series to form a third flow path, with their two ends connected to the first connecting end 51 and the second connecting end 52, respectively. The current inlets 1011 of the first sub-emitter 101a and the current outlets 1012 of the fourth sub-emitter 101d are arranged opposite each other and spaced apart along the Y-axis. The second sub-emitter 101b and the third sub-emitter 101c are connected in series to form a fourth flow path, with their two ends connected to the third connecting end 53 and the fourth connecting end 54, respectively. The current inlets 1011 of the second sub-emitter 101b and the current outlets 1012 of the third sub-emitter 101c are arranged opposite each other and spaced apart along the Y-axis. At this time, the heat insulation groove 31 is provided at both ends of the transmitter 101 along the Y-axis direction, and a heat insulation groove 31 can be provided for each current inlet 1011 and each current outlet 1012.

[0078] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, in some embodiments, the support substrate 10 has a circular hole 103 at the center of the emitting part 101, and the circular hole 103 is connected to the second dividing groove 42 corresponding to the heat insulation groove 31. By using the circular hole 103, it can be ensured that the width of the current path 1014 at the center of the emitting part 101 is consistent with the width of the current path 1014 in other areas.

[0079] Another embodiment of this application provides an electron transmitter, including the aforementioned electron emitter and the aforementioned base. The electron emitter is mounted on the base via a cylindrical structure connected to a supporting substrate, and is used to emit electrons. This electron transmitter has the technical effects of any of the foregoing embodiments, which will not be repeated here.

[0080] Another embodiment of this application provides an X-ray tube, including a cathode assembly and an anode assembly. The cathode assembly includes the aforementioned electron emitter, and the anode assembly includes a metal target. The metal target and the electron emitter are arranged opposite to each other and spaced apart. Electrons emitted by the emitting part after heating are accelerated and can collide with the metal target to form X-rays.

[0081] This application also provides a medical imaging device, including a power supply, a control console, a high-voltage generator, and an X-ray tube. The control console is connected to the power supply, the high-voltage generator is connected to the control console, and the X-ray tube is connected to the high-voltage generator. The power supply provides power support to each device. The control console is used to convert the single input voltage of the power supply network into an adjustable voltage to meet the different power requirements of different devices. The high-voltage generator is used to boost the voltage and rectify the output to provide DC high voltage to the X-ray tube, which is used to emit X-rays.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. An electron emitter, characterized in that, It includes a support substrate (10), an emitting part (101) and a non-emitting part (102), wherein the emitting part (101) and the non-emitting part (102) are both disposed on the support substrate (10), and the non-emitting part (102) surrounds the outer periphery of the emitting part (101); The electron emitter also includes a heat insulation part (30), which is disposed on the support substrate (10) and is located at least at the current inlet (1011) and / or the current outlet (1012) of the emitter (101).

2. The electron emitter according to claim 1, characterized in that, The electron emitter also includes an isolation section (20), which is disposed on the support substrate (10) and located between the emitting section (101) and the non-emitting section (102).

3. The electron emitter according to claim 2, characterized in that, The non-emitting part (102) is continuously arranged around the outer periphery of the emitting part (101).

4. The electron emitter according to claim 2, characterized in that, The isolation section (20) is provided in at least two parts and is arranged at circumferential intervals along the transmitting section (101); The emitting part (101) is located in the area enclosed by all the isolation parts (20), and the non-emitting part (102) is located outside the area enclosed by all the isolation parts (20).

5. The electron emitter according to claim 1 or 4, characterized in that, The emitting part (101) and / or the non-emitting part (102) are integrally formed on the support substrate (10).

6. The electron emitter according to claim 4, characterized in that, Along the circumferential direction of the transmitting part (101), the area of ​​the supporting substrate (10) between any two adjacent isolation parts (20) is defined as the current inlet (1011) and current outlet (1012) of the transmitting part (101). The transmitting part (101) is provided with a plurality of guiding grooves (1013), which are staggered. The area between the isolation part (20) and the guiding grooves (1013) and the area between any adjacent guiding grooves (1013) are connected, and are connected between the current inlet (1011) and the current outlet (1012) to jointly define a current loop.

7. The electron emitter according to claim 2, characterized in that, The isolation section (20) is an isolation groove (201) that penetrates the support substrate (10).

8. The electron emitter according to claim 1, characterized in that... The electron emitter also includes a current connection part (50), which is disposed on the support substrate (10) and located within the range of the non-emitting part (102). The current connection part (50) is connected to the current inlet (1011) and current outlet (1012) of the emitting part (101).

9. The electron emitter according to claim 2, characterized in that, The heat insulation portion (30) is arranged circumferentially on the outside of the isolation portion (20).

10. The electron emitter according to claim 9, characterized in that, The heat insulation part (30) is a heat insulation groove (31) that penetrates the support substrate (10).

11. The electron emitter according to claim 10, characterized in that, The heat insulation groove (31) is at least one of an arc-shaped groove, a curved groove, or a straight groove that extends circumferentially along the emitting part (101).

12. The electron emitter according to claim 9, characterized in that, Along the circumferential direction of the emitting part (101), the supporting substrate (10) defines an overlapping region (1021) between the heat insulation part (30) and the isolation part (20), and the current inlet (1011) and / or the current outlet (1012) are provided in the overlapping region (1021). The support substrate (10) has a current connection portion (50) within the area of ​​the non-emitting portion (102), and the current connection portion (50) connects the current inlet (1011) and / or the current outlet (1012) through the overlapping area (1021).

13. The electron emitter according to claim 12, characterized in that, The width of the overlapping region (1021) is 0.5-2 times the width of the current path (1014) in the transmitting part (101).

14. The electron emitter according to claim 12, characterized in that, The overlapping region (1021) is provided with a first dividing groove (41), which divides the overlapping region (1021) into a first region and a second region, one of which is connected to the current inlet (1011) and the other is connected to the current outlet (1012).

15. The electron emitter according to claim 2, characterized in that, The support substrate (10) has at least one second dividing groove (42) at the emitting part (101), and the at least one second dividing groove (42) divides the emitting part (101) into at least two sub-emitting parts; Each of the sub-emitting units is provided with multiple guiding grooves (1013), and the multiple guiding grooves (1013) are staggered to guide the current path (1014). Each of the sub-emitting units is provided with an isolation unit (20).

16. The electron emitter according to claim 15, characterized in that, The multiple guide trenches (1013) of each sub-emitting part are arranged in ascending order of length along the circumference of the emitting part (101), spaced apart and staggered from the inside to the outside, and the area between any two adjacent guide trenches (1013) from the inside to the outside is defined as the current path (1014).

17. The electron emitter according to claim 15, characterized in that, The support substrate (10) is provided with a current connection portion (50) within the area of ​​the non-emitting portion (102). Each of the sub-emitters is connected in series with the current connection part (50) to form a current loop; or, some of the sub-emitters are connected in series to form a current path, and each of the current paths is connected in parallel with the current connection part (50) to form multiple current loops.

18. The electron emitter according to claim 15, characterized in that, The support substrate (10) has a circular hole (103) at the center of the emitting part (101), and the circular hole (103) communicates with part of the second dividing groove (42).

19. An electron transmitter, characterized in that, Includes the electron emitter according to any one of claims 1 to 18.

20. An X-ray tube, characterized in that, The device includes a cathode assembly and an anode assembly, the cathode assembly including the electron emitter of claim 19, and the anode assembly including an anode target arranged opposite and spaced apart from the electron emitter, the anode target being configured to generate X-rays in response to electron bombardment by the electron emitter.

21. A medical imaging device, characterized in that, Including the X-ray tube as described in claim 20.

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