Camera module
By introducing optical waveguide components and segmented reflective surfaces into the camera module, combined with autofocus and optical image stabilization drivers, the problem of increased camera module thickness caused by high-resolution image sensors is solved, achieving both thinness and high-performance imaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2025-05-26
- Publication Date
- 2026-05-26
AI Technical Summary
In camera modules that use high-resolution image sensors, especially those with folding zoom capabilities, it is difficult to meet the height requirements of the camera module, resulting in an increase in overall size.
The optical waveguide component uses total internal reflection technology to propagate light between the lens module and the image sensor module. Multiple tilted, segmented reflective surfaces reflect light in different directions to reduce the thickness of the camera module. At the same time, it combines AF/OIS driver to achieve autofocus and optical image stabilization.
It achieves a thinner camera module while maintaining high-quality imaging performance and stability when using a high-resolution image sensor.
Smart Images

Figure CN224289928U_ABST
Abstract
Description
Technical Field
[0001] The following description pertains to the camera module. Background Technology
[0002] With the significant development of information, communication, and semiconductor technologies, the supply and use of electronic devices have increased rapidly. Currently, cameras are used in portable electronic devices such as smartphones, tablet PCs, and laptop computers.
[0003] Smartphone cameras initially used low-resolution sensors, and the competition was limited to magnification. However, the technological competition is now shifting towards overcoming the differences in image quality levels between wide-angle cameras.
[0004] To address this, a high-resolution image sensor was employed, which consequently increased the size of the image sensor and thus the overall size of the camera module. In particular, in the case of a camera module with a folding zoom function (which refracts vertically incident light in the horizontal direction to increase the focal length), there is a problem that the required height of the camera module cannot be met when using a high-resolution image sensor.
[0005] The above information is presented as background information and is intended to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content can be used as prior art with respect to this disclosure. Utility Model Content
[0006] This summary portion is provided to briefly introduce the selection of concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.
[0007] In one general aspect, the camera module includes: a lens module including at least one lens; an optical waveguide member disposed below the lens module and configured to propagate light incident from the lens module in a first direction to a second direction via total internal reflection, and to reflect light propagating in the second direction back to the first direction, the optical waveguide member including a plurality of first segmented reflective surfaces, a waveguide portion, and a plurality of second segmented reflective surfaces; and an image sensor module disposed above the optical waveguide member and spaced apart from the lens module, configured to convert light reflected by the optical waveguide member to the first direction into an electrical signal, wherein the plurality of first segmented reflective surfaces are tilted to reflect light incident from the lens module in the first direction below the lens module, the waveguide portion propagates light reflected from the plurality of first segmented reflective surfaces in the second direction via total internal reflection, and the plurality of second segmented reflective surfaces are tilted below the image sensor module to reflect light propagated by the waveguide portion back to the first direction.
[0008] Multiple first segmented reflective surfaces can be tilted such that the angle of incidence of light incident from the lens module in a first direction is greater than the critical angle of the optical waveguide component. Multiple second segmented reflective surfaces can be tilted such that the angle of incidence of light propagating through the waveguide portion is greater than the critical angle of the optical waveguide component.
[0009] The plurality of first segmented reflective surfaces and the plurality of second segmented reflective surfaces may be formed to be tilted at an angle of 5 degrees or greater and 45 degrees or less relative to a plane perpendicular to the first direction.
[0010] The plurality of first segmented reflective surfaces and the plurality of second segmented reflective surfaces may be formed to be tilted at an angle of 15 degrees or greater and 30 degrees or less relative to a plane perpendicular to the first direction.
[0011] The multiple first-segment reflective surfaces and the multiple second-segment reflective surfaces may each have 2 to 5 reflective surfaces.
[0012] The plurality of first segmented reflective surfaces and the plurality of second segmented reflective surfaces may include a metallic coating.
[0013] Optical waveguide components can be formed from prisms made of plastic or glass materials.
[0014] The imaging surface of the image sensor module can be configured to face the upper surface of the optical waveguide component.
[0015] The lens module may also include an AF / OIS driver configured to perform autofocus (AF) and optical image stabilization (OIS) functions.
[0016] The image sensor module may include an AF / OIS driver configured to perform autofocus and optical image stabilization.
[0017] The lens module may also include an AF driver configured to perform autofocus, and the image sensor module may include an OIS driver configured to perform optical image stabilization.
[0018] In another general aspect, the camera module includes: a lens module including at least one lens; an optical waveguide module disposed below the lens module, configured to propagate light incident from the lens module in a first direction to a second direction via total internal reflection, and to reflect light propagating in the second direction back to the first direction; and an image sensor module disposed above the optical waveguide module and spaced apart from the lens module, and configured to convert light reflected from the optical waveguide module to the first direction into an electrical signal. The optical waveguide module includes: a first mirror plate; a plurality of first segmented reflection arrays obliquely disposed on a surface of the first mirror plate below the lens module to reflect light incident from the lens module in the first direction; a second mirror plate disposed above the first mirror plate to form an optical waveguide between the first and second mirror plates; and a plurality of second segmented reflection arrays obliquely disposed on a surface of the first mirror plate below the image sensor module, such that light propagating by the optical waveguide is reflected back to the first direction.
[0019] Multiple first-segment reflective arrays and multiple second-segment reflective arrays can be configured to be tilted relative to the first mirror plate at an angle between 15 degrees and 30 degrees.
[0020] Multiple first-segment reflective arrays and multiple second-segment reflective arrays may each have 2 to 5 reflective surfaces.
[0021] The imaging surface of the image sensor module can be configured to face the optical waveguide module.
[0022] Other features and aspects will become apparent from the accompanying drawings and the detailed description below. Attached Figure Description
[0023] Figure 1 This is a perspective view showing the exterior of a camera module according to an embodiment.
[0024] Figure 2 It is shown Figure 1 An exploded perspective view of the camera module shown.
[0025] Figure 3 yes Figure 1 A cross-sectional view of a portion of the camera module shown.
[0026] Figure 4 It is shown Figure 1 A diagram of the optical waveguide component in the camera module shown.
[0027] Figure 5 yes Figure 1 The diagram shows the optical path of the camera module.
[0028] Figure 6 This is a schematic diagram of a camera module according to another embodiment.
[0029] Figure 7 This is a schematic diagram of a camera module according to another embodiment.
[0030] Figure 8 This is a schematic diagram of a camera module according to another embodiment.
[0031] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation
[0032] In the following description, although examples of this disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.
[0033] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein, except for operations that must occur in a specific order, as will become apparent upon understanding this disclosure. Furthermore, for clarity and brevity, descriptions of features well-known in the art may be omitted.
[0034] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatuses, and / or systems described herein will become apparent upon understanding this disclosure.
[0035] Throughout this specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, the element may be directly "on," directly "connected to," or directly "attached to" the other element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, there are no other elements between the element and the other element.
[0036] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items; similarly, “at least one” includes any one of the associated listed items and any combination of any two or more items.
[0037] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as a second component, second part, second region, second layer, or second section.
[0038] Spatial relative terms such as “above,” “above,” “below,” and “under” may be used herein for descriptive convenience to describe the relationship of one element relative to another, as shown in the accompanying drawings. In addition to covering the orientation depicted in the drawings, these spatial relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” another element would be located “below” or “under” that other element. Thus, depending on the spatial orientation of the device, the term “above” covers both orientations of “above” and “below”. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.
[0039] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.
[0040] Due to manufacturing techniques and / or tolerances, the shapes shown in the accompanying drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include shape variations that occur during manufacturing.
[0041] It should be noted that in this document, the term "may" is used relative to examples, such as regarding what an example may include or implement, meaning that there exists at least one example that includes or implements such a feature, but not all examples are limited to this.
[0042] The features of the examples described herein can be combined in various ways that will become apparent upon understanding this disclosure. Furthermore, although the examples described herein have multiple configurations, other configurations that will become apparent upon understanding this disclosure are also possible.
[0043] In the following text, the optical axis can be defined as the central axis of the lens, perpendicular to the lens surface, and the direction of the optical axis (Z-axis direction) means the direction parallel to the central axis. In the accompanying drawings, the optical axis is defined as the Z-axis, and the X-axis and Y-axis are defined in directions perpendicular to the optical axis. In this case, the X-axis and Y-axis are perpendicular to each other, and the XY plane formed by the X-axis and Y-axis becomes a plane perpendicular to the optical axis.
[0044] Figure 1 This is a perspective view showing the exterior of a camera module according to an embodiment. Figure 2 It is shown Figure 1 An exploded perspective view of the camera module shown. Figure 3 yes Figure 1 A cross-sectional view of a portion of the camera module shown. Figure 4 It is shown Figure 1 A diagram of the optical waveguide component in the camera module shown. Figure 5 yes Figure 1 The diagram shows the optical path of the camera module.
[0045] Reference Figures 1 to 4 According to this embodiment, the camera module 10 includes a lens module 100, a housing 200, a circuit board 300 surrounding the housing 200 from the outside, a folding module 400 housed in the internal space of the housing 200, and an image sensor module 600.
[0046] The camera module 10 may include a cover 700 that partially surrounds the housing 200. The cover 700 prevents components housed inside the housing 200 from separating from the housing 200. For example, the housing 200 may have a box-like shape with an open top. That is, the housing 200 may have a bottom and sides with a quadrilateral shape in a plane. The cover 700 may have a box-like shape with an open bottom, allowing the top of the housing 200 to be closed. A folding module 400 may be disposed within the space surrounded by the housing 200 and the cover 700.
[0047] Cover 700 may include a material capable of shielding electromagnetic waves. Cover 700 may block or minimize the escape of electromagnetic waves generated inside camera module 10 to the outside of camera module 10 and block or minimize the entry of electromagnetic waves from outside camera module 10 into camera module 10. For example, cover 700 may be a shielding cover.
[0048] The cover 700 may have an opening 701. A portion of the lens module 100 may protrude to the outside through the opening 701 formed on the cover 700. External light may enter through the opening 701 of the cover 700. The lens housed in the lens module 100 may be positioned in the direction of light propagation.
[0049] Lens module 100 may be partially covered by cover 700. Lens module 100 may protrude partially to the outside through opening 701 of cover 700. Lens module 100 may include a lens barrel and a lens holder. The lens barrel may have a cylindrical shape in which an internal space is formed, and may house multiple lenses within the internal space. The multiple lenses may be arranged along the optical axis (a first direction, the Z-axis direction). Each lens included in the multiple lenses may have specific optical properties. For example, each lens included in the multiple lenses may have a different refractive index. The lens barrel may protrude at least partially to the outside through opening 701 of cover 700.
[0050] The lens holder can accommodate the lens barrel. The lens holder can at least partially contact the side of the housing 200. The lens holder can at least partially be accommodated within the interior space of the housing 200. The lens holder can be at least partially covered by the cover 700.
[0051] Lens module 100 may cover a portion of folding module 400. Lens module 100 may be connected to housing 200 by contacting the outer side of housing 200. Light incident from the outside of lens module 100 in a first direction (Z-axis direction) may pass through lens module 100 and move to folding module 400.
[0052] Lens module 100 may include at least a portion of an AF (autofocus) driver. For example, lens module 100 may include an AF magnet. Lens module 100 may be movable along the optical axis via electromagnetic interaction between the AF magnet and an AF coil mounted on circuit board 300. Lens module 100 may include a shutter (not shown) located at the top of lens module 100 to block light from entering.
[0053] The folding module 400 may include an optical waveguide component 410 that changes the path of light, a support portion 420, and a rotating bracket 430 housed within the support portion 420.
[0054] The optical waveguide component 410 can be disposed below the lens module 100 and can reflect and propagate light incident from the lens module 100 in the first direction (Z-axis direction). The optical waveguide component 410 can propagate light incident from the lens module 100 in the first direction in the second direction (Y-axis direction) via total internal reflection, and can also reflect light propagating in the second direction back to the first direction. Light whose path has been altered by the optical waveguide component 410 can reach the image sensor module 600.
[0055] The optical waveguide component 410 may include a plurality of first segmented reflective surfaces 411 disposed below the lens module 100, a plurality of second segmented reflective surfaces 413 disposed below the image sensor module 600, and a waveguide portion 415 formed between the plurality of first segmented reflective surfaces 411 and the plurality of second segmented reflective surfaces 413. The optical waveguide component 410 may be made of a material that reflects or propagates light, and it may be plastic or glass. For example, the optical waveguide component 410 may be a prism made of plastic or glass material.
[0056] The first segmented reflective surface 411 can be formed by multiple tilted reflective surfaces, thereby segmenting and reflecting light incident from the lens module 100 in the first direction. The tilt angle of the first segmented reflective surface 411 can be a total internal reflection angle, at which light incident from the lens module 100 into the optical waveguide member 410 is totally internally reflected at the first segmented reflective surface 411. Here, the reference for the tilt angle of the first segmented reflective surface 411 can be based on a plane perpendicular to the first direction (XY plane).
[0057] The first segmented reflective surface 411 can be tilted such that the angle of incidence of light entering from the lens module 100 in the first direction is greater than the critical angle of the optical waveguide member 410. For example, if the refractive index of the optical waveguide member 410 is 2.0, then the critical angle of the optical waveguide member 410 is 30 degrees, and therefore, the first segmented reflective surface 411 can be formed such that the plurality of reflective surfaces have a tilt angle greater than 30 degrees. As the refractive index of the optical waveguide member 410 increases, the critical angle decreases, so when using an optical waveguide member 410 with a high refractive index, the tilt angle of the first segmented reflective surface 411 can be reduced. The tilt angle of the first segmented reflective surface 411 can be at least 5 degrees, such that light reflected from the first segmented reflective surface 411 can reach the upper surface of the waveguide portion 415. It is desirable that the tilt angle of the first segmented reflective surface 411 is at least 15 degrees, such that light reflected from the outermost reflective surface of the first segmented reflective surface 411 can smoothly reach the upper surface of the waveguide portion 415.
[0058] The first segmented reflective surface 411 can be tilted at an angle not exceeding a maximum angle at which light incident on the optical waveguide member 410 can be guided to the image sensor module 600. To allow light incident in the first direction to propagate in a second direction perpendicular to the first direction, the sum of the incident angle and the reflection angle must be 90 degrees or less. Therefore, the tilt angle of the first segmented reflective surface 411 can be 45 degrees or less, and the closer the tilt angle of the first segmented reflective surface 411 is to 45 degrees, the closer the light reflected from the first segmented reflective surface 411 is to the lower surface of the optical waveguide member 410, potentially increasing the path length to the upper surface of the optical waveguide member 410. Therefore, a tilt angle of 30 degrees or less of the first segmented reflective surface 411 is desirable to facilitate smooth multiple reflections in the waveguide portion 415.
[0059] Therefore, the tilt angle of the first segmented reflective surface 411 can be 5 degrees or greater and 45 degrees or less. For example, the tilt angle of the first segmented reflective surface 411 can be 15 degrees or greater and 30 degrees or less.
[0060] Waveguide portion 415 can be disposed between lens module 100 and image sensor module 600. Through total internal reflection within waveguide portion 415, light reflected from the first segmented reflective surface 411 can propagate in the second direction (Y-axis direction). Waveguide portion 415 can totally reflect light reflected from the first segmented reflective surface 411 from its upper surface to its lower surface, and can totally reflect light totally reflected from its upper surface to its lower surface back to its upper surface. In this way, waveguide portion 415 can propagate light reflected from the first segmented reflective surface 411 in the second direction (Y-axis direction) through repeated total internal reflection. To extend the length of light reflected by a single total internal reflection in the second direction (Y-axis direction), the lower or upper surface of waveguide portion 415 can be formed as inclined.
[0061] The second segmented reflective surface 413 can be formed by a plurality of tilted reflective surfaces, thereby segmenting and reflecting light propagating from the waveguide portion 415. The tilt angle of the second segmented reflective surface 413 can be the angle at which light propagating from the waveguide portion 415 can be totally internally reflected on the second segmented reflective surface 413. Here, the reference for the tilt angle of the second segmented reflective surface 413 can be based on a plane perpendicular to the first direction (XY plane).
[0062] The second segmented reflective surface 413 can be tilted such that the angle of incidence of light propagating from the waveguide portion 415 is greater than the critical angle of the optical waveguide member 410. For example, if the refractive index of the optical waveguide member 410 is 2.0, then the critical angle of the optical waveguide member 410 is 30 degrees, and therefore the second segmented reflective surface 413 can be formed such that the multiple reflective surfaces have tilt angles greater than 30 degrees. As the refractive index of the optical waveguide member 410 increases, the critical angle decreases; therefore, the larger the refractive index of the optical waveguide member 410 used, the smaller the tilt angle of the second segmented reflective surface 413 can be.
[0063] The tilt angle of the second segmented reflective surface 413 can be between 5 degrees and 45 degrees. For example, the tilt angle can be between 15 degrees and 30 degrees, such that all light reaching the second segmented reflective surface 413 from the waveguide portion 415 can be totally internally reflected, and the light reflected from the second segmented reflective surface 413 can reach the image sensor module 600. If the tilt angle of the second segmented reflective surface 413 is less than 5 degrees, light may not be totally internally reflected at the second segmented reflective surface 413, and if the tilt angle of the second segmented reflective surface 413 exceeds 45 degrees, the light reflected from the second segmented reflective surface 413 may not reach the image sensor module 600.
[0064] To achieve a thinner camera module 10, the number of reflective surfaces, including the first segmented reflective surface 411 and the second segmented reflective surface 413, can be two or more. Increasing the number of reflective surfaces 411 and 413 enhances the thinning effect of the camera module 10. However, as the number of reflective surfaces increases, the possibility of diffraction interference caused by the reflective surface grid also increases; therefore, having five or fewer reflective surfaces is desirable to prevent this.
[0065] A metallic coating can be formed on the reflective surfaces of the first segmented reflective surface 411 and the second segmented reflective surface 413 to promote total internal reflection of light.
[0066] The optical waveguide component 410 can be connected to the rotating bracket 430. For example, the support portion 420 can be supported by a ball assembly (not shown) located between the bottom of the housing 200 and the support portion 420, allowing the support portion 420 to rotate about a first axis parallel to a first direction (Z-axis direction). Furthermore, the rotating bracket 430 can be supported by a second ball assembly (not shown) located between the support portion 420 and the rotating bracket 430, allowing the rotating bracket 430 to rotate about a second axis parallel to a second direction (X-axis direction). When the support portion 420 or the rotating bracket 430 rotates, the optical waveguide component 410 housed in the rotating bracket 430 can also rotate.
[0067] The folding module 400 may include at least a portion of an OIS driver. For example, the folding module 400 may include an OIS magnet. Through electromagnetic interaction between the OIS magnet and an OIS coil mounted on the circuit board 300, the folding module 400 can rotate about an axis perpendicular to the optical axis.
[0068] The image sensor module 600 may be disposed on top of the optical waveguide member 410, spaced apart from the lens module 100. A portion of the image sensor module 600 may be exposed on one side of the cover 700.
[0069] The image sensor module 600 includes a sensor substrate and an image sensor disposed on the sensor substrate. The image sensor is a device that receives incident light from the folding module 400 and converts the incident light into an electrical signal, and may be a charge-coupled device (CCD) or complementary metal-oxide-semiconductor (CMOS), but is not limited thereto.
[0070] Image sensor module 600 has an imaging surface that uses light to form an image. Image sensor module 600 can be configured such that the imaging surface is perpendicular to the direction of light incident from folded module 400. The image sensor can generate an electrical signal for forming an image on the imaging surface. The electrical signal can be transmitted to external circuitry via a connector.
[0071] The housing 200 may accommodate the folding module 400 and may have an opening that exposes the OIS coil toward the OIS magnet inside the housing 200. Additionally, the housing 200 may have an opening that exposes the AF coil toward the AF magnet inside the housing 200.
[0072] The circuit board 300 may be configured to surround the housing 200 from the outside. In other words, the circuit board 300 may surround at least a portion of the side of the housing 200. For example, the circuit board 300 may have a shape that bends twice. The housing 200 may have a box-shaped shape with an open top, a bottom, and four sides, and in this case, the circuit board 300, which bends twice, may be configured to surround three of the four sides of the housing 200. The circuit board 300 may include a flexible printed circuit board (FPCB) or a rigid flexible printed circuit board (RFPCB).
[0073] At least a portion of the OIS driver and at least a portion of the AF driver can be disposed on the circuit board 300. For example, the OIS coil and the AF coil can be disposed on the circuit board 300. That is, the OIS coil and the AF coil can be disposed in the housing 200 via the circuit board 300.
[0074] Camera module 10 can provide optical image stabilization (OIS). If the camera shakes unintentionally during shooting due to hand tremors or other reasons, the OIS function can compensate for this. For example, camera module 10 can provide OIS by driving folding module 400 via an OIS driver.
[0075] An OIS driver may include an OIS magnet and an OIS coil. For example, the OIS magnet may be located on the folding module 400, and the OIS coil may be located on the circuit board 300. The OIS magnet and the OIS coil may be arranged facing each other, and when power is supplied to the OIS coil through the circuit board 300, the folding module 400 may rotate about a first axis parallel to a first direction (Z-axis direction) due to the electromagnetic interaction between the OIS coil and the OIS magnet. The OIS magnet and the OIS coil may be arranged as a group corresponding to the lens module 100. This disclosure is not limited thereto, and an OIS driver including an OIS magnet and an OIS coil may be disposed in a lens holder.
[0076] Camera module 10 can provide autofocus (AF) functionality. AF functionality allows the camera to automatically focus on a subject. For example, camera module 10 can provide AF functionality by driving lens module 100 in the optical axis direction via an autofocus (AF) driver.
[0077] The AF driver may include an AF magnet and an AF coil. The AF magnet may be located in the lens module 100 and the AF coil may be located on the circuit board 300.
[0078] The AF magnet and AF coil can be positioned facing each other, and when power is supplied to the AF coil via the circuit board 300, the lens module 100 can move in the optical axis direction (Z-axis direction) through the electromagnetic interaction between the AF coil and the AF magnet. The AF magnet and AF coil can be arranged as a pair in the lens module 100.
[0079] Reference Figure 5 Observing the optical path of the camera module according to this embodiment, light incident from the lens module 100 in the first direction can undergo total internal reflection at the first segmented reflective surface 411 of the optical waveguide member 410 towards the upper surface of the waveguide portion 415. Light reaching the upper surface of the waveguide portion 415 can undergo total internal reflection towards the lower surface of the waveguide portion 415, and light reaching the lower surface of the waveguide portion 415 can again undergo total internal reflection towards the upper surface of the waveguide portion 415. After this total internal reflection is repeated several times within the waveguide portion 415, the light can reach the second segmented reflective surface 413. Light reaching the second segmented reflective surface 413 can undergo total internal reflection at the second segmented reflective surface 413 and be incident on the image sensor module 600. Figure 5The diagram shows three total internal reflections occurring within waveguide section 415, but this is for illustrative purposes only, and in this embodiment, more total internal reflections may occur within waveguide section 415.
[0080] In the following text, reference will be made to Figure 6 and Figure 7 Describes camera modules according to various implementations. Figure 6 and Figure 7 This is a schematic diagram of a camera module according to another embodiment.
[0081] Figure 6 and Figure 7 The camera module shown has the same characteristics as the reference. Figures 1 to 3 The described embodiments have substantially the same configuration. Different configurations are described below, and the same reference numerals are used for the same configurations. Configurations not described separately may be used in conjunction with… Figures 1 to 3 The implementation shown is configured in the same way.
[0082] Reference Figure 6 The camera module according to this embodiment may have AF / OIS drivers for autofocus (AF) and optical image stabilization (OIS) disposed in both the lens module 100 and the image sensor module 600. This allows autofocus and optical image stabilization to be performed in the lens module 100 and again in the image sensor module 600.
[0083] Reference Figure 7 In the camera module according to this embodiment, the AF driver for autofocus can be disposed in the lens module 100, and the AF / OIS driver for autofocus and optical image stabilization can be disposed in the image sensor module 600. Therefore, autofocus can be performed in the lens module 100, and autofocus and optical image stabilization can be performed in the image sensor module 600.
[0084] In the following text, reference will be made to Figure 8 Describes a camera module according to another embodiment. Figure 8 This is a schematic diagram of a camera module according to another embodiment.
[0085] Figure 8 The camera module shown has the same characteristics as the reference. Figures 1 to 3 The described embodiments have substantially the same configuration. Different configurations are described below, and the same reference numerals are used for the same configurations. Configurations not described separately may be used in conjunction with… Figures 1 to 3 The implementation shown is configured in the same way.
[0086] Reference Figure 8The camera module according to this embodiment includes a folded module having an optical waveguide module 500. The optical waveguide module 500 includes a first mirror plate 510, a plurality of first segmented reflection arrays 511 obliquely disposed on one surface of the first mirror plate 510 below the lens module 100, a second mirror plate 520 disposed above the first mirror plate 510 and spaced apart from the first mirror plate 510, and a plurality of second segmented reflection arrays 513 obliquely disposed on one surface of the first mirror plate 510 below the image sensor module 600.
[0087] The first mirror plate 510 can extend from below the lens module 100 to below the image sensor module 600. The first mirror plate 510 can be made of a plate-shaped mirror.
[0088] The first segmented reflective array 511 may have multiple reflective surfaces and may be set at a predetermined angle relative to the first mirror plate 510 to totally reflect light incident from the lens module 100 in the first direction.
[0089] The second mirror plate 520 can be configured to be upwardly spaced from the first mirror plate 510 to form an optical waveguide 515 between the first mirror plate 510 and the second mirror plate 520. The second mirror plate 520 can be located between the lens module 100 and the image sensor module 600. Therefore, an optical waveguide 515 can be formed between the first mirror plate 510 and the second mirror plate 525, through which light reflected from the first segmented reflection array 511 propagates in a second direction. This embodiment is not limited to this, and the second mirror plate 520 can also extend below the image sensor module 600.
[0090] The second segmented reflective array 513 may have multiple reflective surfaces and may be set at a predetermined angle relative to the first mirror plate 510 to totally reflect the light propagating in the second direction by the optical waveguide 515 to the image sensor module 600.
[0091] The tilt angles of the first segmented reflective array 511 and the second segmented reflective array 513 can be between 5 degrees and 45 degrees. For example, the tilt angles can be between 15 degrees and 30 degrees, such that all light can be totally reflected on the reflective surface, and the light reflected from the reflective surface can reach the second mirror plate 520 or the image sensor module 600. If the tilt angle of the first segmented reflective array 511 and the second segmented reflective array 513 is less than 5 degrees, the light may not be totally reflected on the reflective surface, and if the tilt angle of the first segmented reflective array 511 and the second segmented reflective array 513 exceeds 45 degrees, the light reflected from the reflective surface may not reach the second mirror plate 520 or the image sensor module 600.
[0092] To achieve a thinner camera module, the number of reflective surfaces in the first segmented reflective array 511 and the second segmented reflective array 513 can be two or more. Increasing the number of reflective surfaces in the first segmented reflective array 511 and the second segmented reflective array 513 enhances the thinning effect of the camera module. However, as the number of reflective surfaces increases, the possibility of diffraction interference due to the reflective surface grid also increases; therefore, having five or fewer reflective surfaces is desirable to prevent this.
[0093] The image sensor module 600 may be disposed on top of the optical waveguide module 500, spaced apart from the lens module 100 in a direction perpendicular to the optical axis. A portion of the image sensor module 600 may be exposed on one side of the cover 700.
[0094] The image sensor module 600 has an imaging surface that forms an image of the light reflected by the optical waveguide module 500. The image sensor module 600 can be configured to face the optical waveguide module 500 such that the imaging surface of the light is perpendicular to the direction of the light incident from the optical waveguide module 500.
[0095] exist Figure 8 The diagram shows an AF / OIS driver for autofocus (AF) and optical image stabilization (OIS) housed in the lens module 100, but this embodiment is not limited to this. For example, the AF / OIS driver may be housed in both the lens module 100 and the image sensor module 600, or the AF driver may be housed in the image sensor module 600, or both the AF driver and the OIS driver may be housed in the lens module 100.
[0096] One aspect of the implementation provides a camera module that can achieve a thinner profile while employing a high-resolution image sensor.
[0097] While specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for limiting purposes. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.
Claims
1. A camera module, characterized in that, The camera module includes: Lens module, including at least one lens; An optical waveguide component, disposed below the lens module, is configured to propagate light incident from the lens module in a first direction to a second direction via total internal reflection, and to reflect the light propagating in the second direction back to the first direction. The optical waveguide component includes a plurality of first segmented reflective surfaces, a waveguide portion, and a plurality of second segmented reflective surfaces. An image sensor module is disposed above the optical waveguide member and spaced apart from the lens module, and configured to convert the light reflected by the optical waveguide member into an electrical signal in the first direction. The plurality of first segmented reflective surfaces are tilted to reflect light incident from the lens module in the first direction below the lens module, the waveguide portion propagates the light reflected from the plurality of first segmented reflective surfaces in the second direction by total internal reflection, and the plurality of second segmented reflective surfaces are tilted to reflect the light propagated by the waveguide portion back to the first direction below the image sensor module.
2. The camera module according to claim 1, characterized in that, The plurality of first segmented reflective surfaces are tilted such that the angle of incidence of the light incident from the lens module in the first direction is greater than the critical angle of the optical waveguide member, and The plurality of second segmented reflective surfaces are tilted such that the incident angle of the light propagating from the waveguide portion is greater than the critical angle of the optical waveguide member.
3. The camera module according to claim 1, characterized in that, The plurality of first segmented reflective surfaces and the plurality of second segmented reflective surfaces are formed to be inclined at an angle of 5 degrees or greater and 45 degrees or less relative to a plane perpendicular to the first direction.
4. The camera module according to claim 3, characterized in that, The plurality of first segmented reflective surfaces and the plurality of second segmented reflective surfaces are formed to be inclined at an angle of 15 degrees or greater and 30 degrees or less relative to the plane perpendicular to the first direction.
5. The camera module according to claim 1, characterized in that, Each of the plurality of first segmented reflective surfaces and the plurality of second segmented reflective surfaces has 2 to 5 reflective surfaces.
6. The camera module according to claim 1, characterized in that, The plurality of first segmented reflective surfaces and the plurality of second segmented reflective surfaces include a metallic coating.
7. The camera module according to claim 1, characterized in that, The optical waveguide component is formed from a prism made of plastic or glass material.
8. The camera module according to claim 1, characterized in that, The imaging surface of the image sensor module is configured to face the upper surface of the optical waveguide component.
9. The camera module according to claim 1, characterized in that, The lens module also includes an AF / OIS driver configured to perform autofocus and optical image stabilization.
10. The camera module according to claim 1, characterized in that, The image sensor module includes an AF / OIS driver configured to perform autofocus and optical image stabilization.
11. The camera module according to claim 1, characterized in that, The lens module further includes an AF driver configured to perform autofocus, and the image sensor module includes an OIS driver configured to perform optical image stabilization.
12. A camera module, characterized in that, The camera module includes: Lens module, including at least one lens; An optical waveguide module, disposed below the lens module, is configured to propagate light incident from the lens module in a first direction to a second direction via total internal reflection, and to reflect the light propagating in the second direction back to the first direction; and An image sensor module is disposed above the optical waveguide module and spaced apart from the lens module, and configured to convert the light reflected by the optical waveguide module into an electrical signal in the first direction. The optical waveguide module includes: a first mirror plate; a plurality of first segmented reflection arrays obliquely disposed on one surface of the first mirror plate below the lens module to reflect light incident from the lens module in the first direction; a second mirror plate disposed above the first mirror plate to form an optical waveguide between the first mirror plate and the second mirror plate; and a plurality of second segmented reflection arrays obliquely disposed on the one surface of the first mirror plate below the image sensor module such that light propagated by the optical waveguide is reflected to the first direction.
13. The camera module according to claim 12, characterized in that, The plurality of first segmented reflective arrays and the plurality of second segmented reflective arrays are configured to be tilted relative to the first mirror plate at an angle between 15 degrees and 30 degrees.
14. The camera module according to claim 12, characterized in that, Each of the plurality of first segmented reflective arrays and the plurality of second segmented reflective arrays has 2 to 5 reflective surfaces.
15. The camera module according to claim 12, characterized in that, The imaging surface of the image sensor module is configured to face the optical waveguide module.