A signal amplifier heat dissipation device

CN224290322UActive Publication Date: 2026-05-26SHENZHEN BORUI COMM TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN BORUI COMM TECH CO LTD
Filing Date
2025-06-16
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

The existing signal amplifier's heat dissipation device adopts an open structure, which causes heat to accumulate in the core area. The heat dissipation area is insufficient and dust is easily accumulated. Turbulent airflow leads to excessive temperature rise, affecting the stable operation of the equipment.

Method used

The upper and lower shells form a fully enclosed structure, combined with directional forced airflow and heat dissipation fin design. A directional airflow is generated by an axial fan to guide heat to the outside. A graphene coating is used to enhance heat conduction, and a dust filter prevents dust from entering.

Benefits of technology

It effectively blocks dust and moisture, improves heat dissipation efficiency, reduces equipment thermal resistance, extends component life, and ensures long-term stable operation of the signal amplification module.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model belongs to the field of signal amplifier technology and discloses a heat dissipation device for a signal amplifier, including an upper shell and a lower shell. The upper shell and the lower shell are connected to form a sealed cavity. The top of the upper shell is provided with a first heat dissipation fin along the airflow direction, and the bottom of the lower shell is provided with a second heat dissipation fin along the airflow direction. A heat dissipation substrate is fixed in the inner cavity of the lower shell, and at least two sets of heat dissipation components are installed on the heat dissipation substrate. The side wall of the lower shell is provided with an air inlet channel and an air outlet channel corresponding to each set of heat dissipation components. The corresponding arrangement of the heat dissipation components with the air inlet and outlet channels in this application forms a directional forced airflow in the sealed cavity, which directs heat to the outside of the signal amplifier. This solves the problems of easy dust accumulation and excessive temperature rise in the core area caused by turbulent airflow in traditional open heat dissipation structures, ensuring the long-term stable operation of the signal amplification module.
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