A 3D heat spreader

Abstract

This application relates to the field of 3D vapor chamber technology, specifically providing a 3D vapor chamber for heat dissipation of electronic components. The 3D vapor chamber includes a composite copper tube, an upper cover plate, a lower cover plate, and an upper cover capillary. The upper cover plate is welded to the composite copper tube. The lower cover plate is welded to the end of the upper cover plate away from the composite copper tube to form a cavity. The upper cover capillary is disposed within the cavity. The lower cover plate has a recessed area and a peripheral area at the end facing the upper cover plate. The recessed area has a core area and an edge area. The recessed area contains several edge teeth and several core teeth. The edge teeth are fixedly disposed in the edge area, and the core teeth are fixedly disposed in the core area, thereby upgrading the heating core area of ​​the lower cover plate from a two-dimensional structure to a three-dimensional structure. This achieves diversified heat transfer and working fluid evaporation paths in multi-dimensional space, improving heat transfer efficiency in high-power scenarios, thus solving the heat transfer efficiency bottleneck problem existing in the prior art.

Description

Technical Field

[0001] This application relates to the field of 3D heat exchanger technology, and more particularly to a 3D heat exchanger. Background Technology

[0002] As server computing power increases, the heat flux density of server CPUs also increases, making traditional vapor chambers and heat pipes insufficient for heat dissipation. Compared to traditional vapor chambers, 3D vapor chambers transform heat dissipation from a two-dimensional surface to a three-dimensional heat conduction system, significantly improving the heat dissipation capabilities of electronic components.

[0003] A 3D vapor chamber typically consists of a vapor chamber body and copper pipes, with the cavity formed by the vapor chamber body and copper pipes being interconnected. The end of the vapor chamber body furthest from the copper pipes is designated as the heating core area, and a heating boss is usually provided downwards to increase the contact area between the 3D vapor chamber and the heat source. When the heat dissipation medium flows back to the heating boss, it can only be heated by the bottom surface of the heating boss. The heat dissipation efficiency of the heat dissipation medium is low, resulting in a significant bottleneck in the heat transfer efficiency of the 3D vapor chamber under high power consumption conditions.

[0004] Therefore, existing technologies have defects and shortcomings, and need further improvement and development. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a 3D vapor chamber, which aims to solve the problem that the powder filling device of the 3D vapor chamber in the prior art can only rely on the bottom surface of the heating boss to heat the heat dissipation medium, resulting in low heat dissipation efficiency of the heat dissipation medium, which makes the heat transfer efficiency of the 3D vapor chamber in high power consumption environment a significant bottleneck.

[0006] The technical solution adopted by this application to solve the technical problem is as follows: a 3D heat dissipation plate for heat dissipation of electronic components, comprising:

[0007] Composite copper pipe;

[0008] The upper cover plate is welded to the composite copper tube;

[0009] The lower cover plate is welded to the upper cover plate at one end away from the composite copper tube to form an accommodating cavity;

[0010] A capillary cover is disposed within the accommodating cavity;

[0011] The lower cover plate is provided with a recessed area and a peripheral area at one end facing the upper cover plate, and the recessed area is provided with a core area and an edge area;

[0012] The settling platform area is provided with a number of edge tooth plates and a number of core tooth plates;

[0013] A plurality of the edge teeth are fixedly disposed in the edge region, and a plurality of the core teeth are fixedly disposed in the core region.

[0014] Optionally, the core area is covered with a fine copper powder layer with a mesh size of 200 or less, and the porosity of the fine copper powder layer is 30% to 45%; the edge area is filled with coarse copper powder with a mesh size of 100 to 150, and the porosity of the coarse copper powder is 50% to 65%; the peripheral area is filled with coarse copper powder with a mesh size of 70 to 90; the upper half of the slope of the settling platform area is made of coarse copper powder, and the lower half is made of fine copper powder, and the porosity of the upper half of the slope of the settling platform area is greater than the porosity of the lower half of the slope of the settling platform area.

[0015] Optionally, all of the core tooth plates are solid copper tooth plates, and the left and right sides of the core tooth plates are provided with V-shaped grooves, and the front and rear sides of the core tooth plates are set as arc surfaces.

[0016] Optionally, the ratio of the tooth height of the core tooth to the spacing of the core tooth is 1:1.1 to 1.5; the ratio of the length of the core tooth to the length of the edge tooth is 1:0.3 to 0.6.

[0017] Optionally, the lower cover plate further includes a plurality of gradient support columns, a plurality of coarse copper powder rings, and a plurality of fine support columns; the plurality of gradient support columns are all fixedly arranged in the core area, and the plurality of coarse copper powder rings and the plurality of fine support columns are all evenly spaced and fixedly arranged in the peripheral area.

[0018] Optionally, the gradient support column is divided into an upper section, a middle section, and a lower section with lengths decreasing at equal intervals; the porosity of the upper section is greater than that of the middle section, and the porosity of the middle section is greater than that of the lower section.

[0019] Optionally, the capillary of the upper cover is a 200-mesh copper mesh, and the thickness of the capillary of the upper cover is 0.05mm to 0.1mm; the capillary of the upper cover is provided with a plurality of fixing holes, and the aperture of the plurality of fixing holes is adapted to the outer diameter of the plurality of gradient support columns and the plurality of thin support columns.

[0020] The edges of the upper and lower cover plates form a water inlet, which is connected to the accommodating cavity and is used to inject a heat dissipation medium into the accommodating cavity.

[0021] Optionally, the composite copper tube includes a copper tube body and an air inlet notch. The air inlet notch is located at the open end of the copper tube body. The height of the air inlet notch along the axial direction of the copper tube body is set to 3mm to 4mm. The air inlet notch is located within the accommodating cavity.

[0022] Optionally, the inner wall of the copper tube body is provided with a groove capillary region and a copper powder capillary region, and the groove capillary region is located above the copper powder capillary region.

[0023] Optionally, the groove capillary region is provided with spiral grooves or straight grooves, the groove depth of the groove capillary region is 0.05mm to 0.1mm, and the groove spacing of the groove capillary region is 0.2mm to 0.5mm; the copper powder capillary region is covered with a 100-150 mesh copper powder layer and overlaps with the capillary of the lower cover.

[0024] Compared with existing technologies, this application provides a 3D vapor chamber. The 3D vapor chamber upgrades the heating core area of ​​the lower cover plate from a two-dimensional structure to a three-dimensional structure by incorporating composite copper pipes, an upper cover plate, a lower cover plate, an upper cover capillary, a subsidence area, and a peripheral area. Furthermore, it includes several edge teeth and several core teeth within the subsidence area. The placement of core and edge teeth in the core and edge areas of the subsidence area significantly increases the contact area between the heating core area and the heat dissipation medium, effectively improving the heat absorption efficiency of the medium. Simultaneously, the teeth form a three-dimensional heat exchange channel, resulting in more uniform heating of the heat dissipation medium. Compared to existing technologies that rely solely on the bottom surface of the heating platform to heat the heat dissipation medium, this 3D vapor chamber achieves diversified heat transfer and evaporation paths in a multi-dimensional space, significantly improving heat transfer efficiency in high-power scenarios, thereby solving the heat transfer efficiency bottleneck problem in existing technologies. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the 3D heat spreader provided in this application;

[0026] Figure 2 This is a three-dimensional exploded structural diagram of the 3D heat spreader provided in this application;

[0027] Figure 3 This is a three-dimensional structural diagram of the lower cover plate of the 3D heat spreader provided in this application;

[0028] Figure 4 This is a front view of the 3D heat spreader provided in this application;

[0029] Figure 5 It is provided in this application Figure 4 A sectional view along the I-I direction;

[0030] Figure 6 It is provided in this application Figure 5 Enlarged view of point A in the middle;

[0031] Figure 7 This is a front view of the composite copper tube of the 3D heat spreader provided in this application;

[0032] Figure 8This is a cross-sectional view of the composite copper tube of the 3D heat spreader provided in this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 10. 3D heat spreader; 11. Composite copper tube; 12. Top cover plate; 13. Top cover capillary; 14. Bottom cover plate; 141. Settlement area; 142. Peripheral area; 143. Gradient support column; 144. Coarse copper powder ring; 145. Fine support column; 146. Slope; 1411. Core area; 1412. Edge area; 1413. Edge toothed plate; 1414. Core toothed plate; 111. Copper tube body; 112. Air inlet; 131. Fixing hole; 1111. Groove capillary area; 1112. Copper powder capillary area; 15. Water inlet. Detailed Implementation

[0035] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0036] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] Please refer to the following: Figures 1 to 8The first embodiment of this application provides a 3D heat spreader 10, which includes a composite copper tube 11, an upper cover plate 12, a lower cover plate 14, an upper cover capillary 13, a plurality of core toothed plates 1414, a plurality of edge toothed plates 1413, a plurality of gradient support columns 143, a plurality of fine support columns 145, a plurality of coarse copper powder rings 144, a groove capillary region 1111, a copper powder capillary region 1112, and a water inlet 15. The 3D heat spreader 10 forms a cavity by welding the upper cover plate 12 and the lower cover plate 14. The composite copper tube 11 is welded onto the upper cover plate 12 and extends into the cavity. The outer wall of the composite copper tube 11 can contact existing refrigeration equipment. The lower cover plate 14 is provided with a settling area 141 and a peripheral area 142 at one end facing the upper cover plate 12. The settling area 141 further includes a core area 141. The core area 1411 is provided with a number of solid copper core toothed plates 1414, and the edge area 1412 is provided with a number of edge toothed plates 1413; the core area 1411 of the lower cover plate 14 is also fixedly provided with a number of gradient support columns 143, and the peripheral area 142 is evenly provided with a number of fine support columns 145 and a number of coarse copper powder rings 144; the upper cover capillary 13 is made of 200-mesh copper mesh, the upper cover capillary 13 is provided in the accommodating cavity, and a number of fixing holes 131 are opened on the upper cover capillary 13, and the number of fixing holes 131 are adapted to the outer diameter of the gradient support columns 143 and the fine support columns 145; the composite copper tube 11 includes a copper tube body 111 and an air inlet 112, and the inner wall of the copper tube body 111 is provided with a groove capillary area 1111 and a copper powder capillary area 1112 from top to bottom.

[0039] During the operation of electronic components, their heat is first conducted through the core area 1411 of the lower cover plate 14, which is in direct contact with it, to several core toothed plates 1414. Since the core toothed plates 1414 are made of solid copper and their outer surface is covered with a fine copper powder layer, they have good thermal conductivity, which allows heat to be quickly conducted from the bottom to the top. On the other hand, the fine copper powder layer enhances the capillary force and liquid storage capacity of the core area 1411, preventing localized burn-out under high power consumption. The core toothed plates 1414 have V-shaped grooves on both sides and arc-shaped surfaces on the front and back, which further increases the heat dissipation surface area and strengthens the liquid return path, which is beneficial to the continuous stability of the evaporation process. Several edge toothed plates 1413 in the edge area 1412 form a gradient heat conduction layout with the core toothed plates 1414, which helps to expand the evaporation area.

[0040] The upper half of the slope 146 of the lower cover plate 14's platform area 141 is filled with coarse copper powder, and the lower half is filled with fine copper powder. This multi-level porosity structure, formed by copper powder of different mesh sizes, enables capillary flow transition from the evaporation to the condensation region, enhancing the reflux capacity of the working fluid. The peripheral area 142 of the lower cover plate 14 is filled with coarse copper powder, and several coarse copper powder rings 144 and fine support columns 145 are evenly arranged to construct a reflux path, while simultaneously improving structural strength and liquid storage capacity. Several gradient support columns 143, located in the core area 1411, are divided into upper, middle, and lower sections with progressively decreasing lengths, each corresponding to different porosities. The upper section has a higher porosity than the middle section, and the middle section has a higher porosity than the lower section, providing continuous and stable liquid support and evaporation support functions in the top-to-bottom flow path of the working fluid.

[0041] The capillary 13 of the upper cover covers the upper cavity and is made of large-mesh copper mesh. Its thinness and high porosity effectively reduce steam condensation on the upper cover. At the same time, it is set in conjunction with the fixing holes 131 of several gradient support columns 143 and fine support columns 145 below to achieve stable support for the capillary structure. The water inlet 15 is set in the area enclosed by the edges of the upper cover plate 12 and the lower cover plate 14, and connects to the cavity. It is used to inject heat dissipation working fluid into the cavity to ensure that the 3D heat spreader 10 has a stable evaporation and condensation cycle.

[0042] The composite copper tube 11 is welded onto the upper cover plate 12. An air inlet 112 is provided inside the composite copper tube 11, located within the accommodating cavity and with a height of 3mm to 4mm, ensuring rapid steam entry into the copper tube. The inner wall of the copper tube body 111 is provided with a grooved capillary region 1111 and a copper powder capillary region 1112 from top to bottom. The grooved capillary region 1111 adopts a spiral or straight groove form, with a groove depth of 0.05mm to 0.1mm and a groove spacing of 0.2mm to 0.5mm, effectively enhancing the steam condensation heat transfer area and reducing liquid film thermal resistance. The copper powder capillary region 1112 is located at the bottom and covered with a 100-150 mesh copper powder layer, overlapping with the upper cover capillary 13 to construct a complete and closed liquid capillary reflux path, allowing steam to preferentially condense inside the composite copper tube 11 and efficiently reflux back to the lower cover core area 1411, achieving efficient and stable thermal fluid circulation.

[0043] The core toothed plate 1414, made of solid copper, works in conjunction with the fine copper powder layer covering its surface to improve the thermal conductivity and capillary force of the evaporation zone. The gradient support column 143, the edge toothed plate 1413, the coarse copper powder area and its annular structure work together to construct the structural support and liquid return path. The grooved capillary area 1111 and the copper powder capillary area 1112 form an inner tube preferential condensation system to reduce condensation loss in non-target areas. The overlapping between the upper and lower capillary structures realizes a complete capillary drive path. Combined with the integrated structure of the water inlet 15 and the accommodating cavity, the rapid evaporation, efficient conduction and stable condensation reflux of the heat transfer medium in the 3D space are realized, which greatly improves the heat transfer efficiency under high power consumption environment and breaks through the efficiency bottleneck caused by traditional two-dimensional heat spreaders that rely solely on bottom heating.

[0044] Please refer to the following: Figures 1 to 3 In some embodiments, the 3D heat spreader 10 includes a composite copper tube 11, an upper cover plate 12, a lower cover plate 14, and an upper cover capillary 13; the upper cover plate 12 is welded to the composite copper tube 11; the lower cover plate 14 is welded to the end of the upper cover plate 12 away from the composite copper tube 11 to form a receiving cavity; the upper cover plate 12 is capillarily disposed within the receiving cavity; the lower cover plate 14 has a settling area 141 and a peripheral area 142 at the end facing the upper cover plate 12, and the settling area 141 has a core area 1411 and an edge area 1412; wherein, the settling area 141... The heating core area of ​​the platform 141 is provided with a plurality of edge toothed plates 1413 and a plurality of core toothed plates 1414. The edge toothed plates 1413 are fixedly disposed in the edge area 1412, and the core toothed plates 1414 are fixedly disposed in the core area 1411. Furthermore, by setting up the composite copper tube 11, upper cover plate 12, lower cover plate 14, upper cover capillary 13, platform 141, and peripheral area 142, and by setting the edge toothed plates 1413 and core toothed plates 1414 within the platform 141, the heating core area of ​​the lower cover plate 14 is upgraded from a two-dimensional structure to a three-dimensional structure. The placement of the core toothed plates 1414 and edge toothed plates 1413 in the core area 1411 and edge area 1412 of the platform 141 significantly increases the contact area between the heating core area and the heat dissipation medium, effectively improving the heat absorption efficiency of the medium. Simultaneously, the toothed plates form a three-dimensional heat exchange channel, making the heat dissipation medium more evenly heated. Compared with the existing technology that relies solely on heating the bottom surface of the heating boss to heat the heat dissipation working fluid, the 3D heat spreader 10 realizes the diversification of heat energy transfer and working fluid evaporation paths in multi-dimensional space, improves heat transfer efficiency in high power consumption scenarios, and thus solves the heat transfer efficiency bottleneck problem in the existing technology.

[0045] Please refer to the following: Figure 3In some embodiments, the core region 1411 is covered with a fine copper powder layer (not shown in the figure) with a mesh size of less than or equal to 200, and the porosity of the fine copper powder layer is 30% to 45%; the edge region 1412 is filled with coarse copper powder with a mesh size of 100 to 150, and the porosity of the coarse copper powder is 50% to 65%; the peripheral region 142 is filled with coarse copper powder with a mesh size of 70 to 90 (not shown in the figure); the upper half of the slope 146 of the settling area 141 is made of coarse copper powder, and the lower half is made of fine copper powder, and the porosity of the upper half of the slope 146 of the settling area 141 is greater than the porosity of the lower half of the slope 146 of the settling area 141. Furthermore, the copper powder covering or filling the core area 1411, edge area 1412, and peripheral area 142 are zoned according to mesh size and porosity to form a gradient capillary structure. The fine copper powder layer has higher capillary force and water storage capacity, which helps to prevent dry burning under high heat load and improves the evaporation efficiency of the core area 1411. The coarser copper powder in the edge area 1412 and peripheral area 142 facilitates the smooth return of liquid after steam condensation, reduces return resistance, and effectively constructs an internal circulation system. Different particle sizes of copper powder are used on the upper and lower slopes 146 of the settling platform area 141 to further optimize the flow state of steam and condensate at the interface. The overall design optimizes the evaporation, condensation, and return paths, improving the heat exchange capacity of the 3D vapor chamber 10 under complex heat loads.

[0046] Please refer to the following: Figure 3 In some embodiments, the core toothed plates 1414 are all solid copper toothed plates, with V-shaped grooves on both the left and right sides, and arc-shaped surfaces on the front and rear sides. This effectively guides the distribution and return path of the heat dissipation medium in the core area 1411 while ensuring heat transfer efficiency. The V-shaped grooves increase the surface area of ​​the heat dissipation medium, facilitating evaporation; the arc-shaped structure avoids dead corners and localized high temperatures, improving the uniformity of the overall temperature distribution. Compared to traditional copper powder sintered toothed plates, solid copper toothed plates have higher thermal conductivity, significantly improving the heat transfer efficiency between the heat source and the working medium.

[0047] Please refer to the following: Figure 3In some embodiments, the ratio of the height of the core toothed plate 1414 to the spacing of the core toothed plate 1414 is 1:1.1 to 1.5; the ratio of the length of the core toothed plate 1414 to the length of the edge toothed plate 1413 is 1:0.3 to 0.6. This achieves structural control and optimization of the toothed plate array. By adjusting the height and spacing, the heat capacity density per unit area is increased. At the same time, by setting the length difference, the edge toothed plate 1413 plays an auxiliary role in guiding the flow and adjusting the steam path, ensuring that the evaporation efficiency in the core toothed plate 1414 area is not disturbed, promoting the orderly flow of steam towards the composite copper tube 11, thereby further improving the heat transfer efficiency and the reliability of the working fluid circulation.

[0048] Please refer to the following: Figures 2 to 3 In some embodiments, the lower cover plate 14 further includes a plurality of gradient support columns 143, a plurality of coarse copper powder rings 144, and a plurality of fine support columns 145; the plurality of gradient support columns 143 are all fixedly disposed in the core area 1411, and the plurality of coarse copper powder rings 144 and the plurality of fine support columns 145 are all evenly spaced and fixedly disposed in the peripheral area 142. Thus, by providing a plurality of gradient support columns 143, a plurality of coarse copper powder rings 144, and a plurality of fine support columns 145 in the lower cover plate 14, a multi-point support system in the steam channel is constructed while ensuring structural strength. The coarse copper powder rings 144 help guide the concentrated flow of steam to the composite copper tube 11, while the fine support columns 145 stabilize the structure and do not obstruct the flow of the working fluid. The gradient support columns 143, disposed in the core area 1411, effectively enhance the three-dimensional structure's resistance to deformation under heating conditions, especially maintaining the structural integrity and evaporation efficiency of the core area 1411 under high-temperature gradient conditions. Furthermore, the synergistic effect of physical support and capillary conduction ensures smooth circulation of the working fluid and structural stability.

[0049] In some embodiments, the gradient support column 143 is divided into an upper section, a middle section, and a lower section with decreasing lengths; the porosity of the upper section is greater than that of the middle section, and the porosity of the middle section is greater than that of the lower section. This creates a vertical capillary gradient structure, which facilitates the gradual return of condensate to the heating core area along the porosity gradient, increasing the return rate and reducing return resistance. Furthermore, the structural gradient within the support column can also achieve stress release and hierarchical distribution of heat conduction during thermal expansion, achieving a dual synergistic optimization of structural strength and thermal cycling performance.

[0050] Please refer to the following: Figure 2In some embodiments, the upper cover capillary 13 is a 200-mesh copper mesh, and the thickness of the upper cover capillary 13 is 0.05mm to 0.1mm. The upper cover capillary 13 is provided with a plurality of fixing holes 131, the diameter of which is adapted to the outer diameter of the plurality of gradient support columns 143 and the plurality of fine support columns 145. The edges of the upper cover plate 12 and the lower cover plate 14 form a water inlet 15, which communicates with the receiving cavity and is used to inject heat dissipation working fluid into the receiving cavity. Furthermore, by setting the upper cover capillary 13 to a 200-250 mesh copper mesh with a thickness of only 0.05mm to 0.1mm, the probability of steam condensation at the upper cover plate 12 is significantly reduced, allowing more steam to be guided into the composite copper tube 11, increasing the condensation ratio of the working fluid in the copper tube, and avoiding steam loss in non-heat exchange areas. The design of the fixing hole 131, which is adapted to the outer diameter of the gradient support column 143 and the thin support column 145, ensures that the capillary 13 of the upper cover fits stably and maintains good contact under the thermal deformation of the overall structure. The water inlet 15 formed by the edge enclosure is connected to the receiving cavity, which facilitates the injection of heat dissipation working fluid and ensures the formation of a complete circulation system inside, effectively improving the ease of assembly and use, and enhancing the initial filling efficiency and sealing reliability.

[0051] Please refer to the following: Figures 5 to 8 In some embodiments, the composite copper tube 11 includes a copper tube body 111 and an air inlet 112. The air inlet 112 is located at the open end of the copper tube body 111, and its height along the axial direction of the copper tube body 111 is set to 3mm to 4mm. The air inlet 112 is located within the accommodating cavity. This provides a transition expansion region during the steam entry into the composite copper tube 11, reducing steam flow resistance and increasing its flow velocity and heat exchange rate inside the copper tube. Simultaneously, it prevents steam from accumulating in ineffective areas within the accommodating cavity, causing heat buildup. The air inlet 112 and the steam flow path of the lower cover plate 14 form a good fit, enhancing the steam's ability to guide to the main heat exchange area, thereby achieving flow continuity and directional stability between the evaporation chamber and the condensation chamber.

[0052] Please refer to the following: Figure 2 In some embodiments, the upper capillary 13 is also provided with a plurality of clearance holes, which are provided one-to-one with the copper tube holes from the upper cover plate 12. The composite copper tube 11 passes through the copper tube holes and clearance holes, so that the air inlet 112 overlaps with the lower capillary. The air inlet 112 serves as a steam flow channel.

[0053] Please refer to the following: Figures 7 to 8In some embodiments, the inner wall of the copper tube body 111 is provided with a grooved capillary region 1111 and a copper powder capillary region 1112, with the grooved capillary region 1111 positioned above the copper powder capillary region 1112. Furthermore, by providing the grooved capillary region 1111 and the copper powder capillary region 1112 on the inner wall of the copper tube body 111, and positioning the grooved capillary region 1111 above the copper powder capillary region 1112, the condensate can smoothly flow back into the lower cover core area 1411 within the copper tube, achieving functional stratification of condensation and reflux. The grooved area provides a strong liquid guiding channel, reducing condensate retention on the pipe wall, while the copper powder capillary area 1112 enhances the liquid storage capacity of the return path. The grooved area also increases the heat transfer area between steam and the inner wall of the copper tube body 111, reducing the impact of the liquid film thermal resistance generated on the wall surface during steam condensation on the heat exchange efficiency. The two work together to improve the condensation efficiency and return continuity of the working fluid, thereby ensuring efficient and stable heat transfer during the circulation of the working fluid inside the 3D heat spreader 10.

[0054] Please refer to the following: Figures 7 to 8 In some embodiments, the groove capillary region 1111 is provided with spiral grooves or straight grooves, the groove depth of the groove capillary region 1111 is 0.05mm to 0.1mm, and the groove spacing of the groove capillary region 1111 is 0.2mm to 0.5mm; the copper powder capillary region 1112 is covered with a 100-150 mesh copper powder layer and overlaps with the lower cover capillary, the lower cover capillary is specifically composed of copper powder sintered in the settling area 141 and the peripheral area 142. Furthermore, by providing spiral grooves or straight grooves and limiting the groove depth to 0.05mm to 0.1mm and the groove spacing to 0.2mm to 0.5mm, a high-efficiency liquid film condensation and drainage channel is ensured within the copper tube. The copper powder capillary zone 1112 is covered with 100-150 mesh copper powder and overlaps with the upper cover capillary 13, realizing a closed-loop channel for liquid reflux from the copper tube to the copper powder capillary and then to the upper cover capillary 13 after steam condensation, thus forming a benign capillary self-circulation system. This effectively avoids the backflow failure caused by discontinuous capillary distribution in traditional structures, achieving seamless connection and functional complementarity of the working fluid heat transfer path, thereby improving the overall heat exchange efficiency of the heat spreader and the operational reliability under high power consumption applications.

[0055] In some embodiments, the 3D heat spreader 10 can be processed using the following method, and the processing equipment can be existing equipment: First, the raw material of the lower cover plate 14 is integrally formed using an integrated forging process to prepare a lower cover plate 14 with a accommodating cavity. The lower cover plate 14 is further processed by a stamping and cutting process to form a core area 1411 and a peripheral area 142 for supporting the core toothed plates 1414 and the edge toothed plates 1413. Several core toothed plates 1414 are set on the outer surface of the core area 1411 of the lower cover plate 14. During the processing, 150-200 mesh electrolytic copper powder is used, and the electrolytic copper powder is evenly covered on the designated position of the outer surface of the core area 1411 using a graphite jig and a vibrating powder machine. Then, it is placed in a bell furnace and sintered at a constant temperature of 900°C in a nitrogen-hydrogen mixed atmosphere (nitrogen-hydrogen volume ratio of 9:1) for 2 hours, so that the electrolytic copper powder is sintered to form several core toothed plates 1414 and firmly attached to the lower cover plate 14.

[0056] Several edge teeth 1413 are provided in the peripheral area 142 of the lower cover plate 14. This part uses 60-100 mesh electrolytic copper powder, and is covered, sintered and demolded in the manner described above. The sintered edge teeth 1413 form the capillary structure of the edge area of ​​the 3D heat spreader 10, which improves the liquid reflux capability.

[0057] Within the core area 1411 of the lower cover plate 14, several gradient support columns 143 are provided, located between or near the core toothed plates 1414; several fine support columns 145 are provided in the peripheral area 142 of the lower cover plate 14 to support and maintain the consistent spacing of the upper cover plate 12. The aforementioned gradient support columns 143 and fine support columns 145 are sintered together with the core toothed plates 1414 and the edge toothed plates 1413 to ensure structural stability and channel continuity.

[0058] An upper cover capillary 13 is provided on the inner side of the upper cover plate 12. By attaching a 200-mesh copper mesh to its inner surface and sintering it in a bell furnace at a constant temperature of 900℃ for 2 hours, the upper cover capillary 13 is tightly sintered and bonded to the upper cover plate 12, enhancing liquid adsorption and reflux performance. Specifically, electrolytic copper powder of different mesh sizes can be selected according to actual needs, and this application does not impose too many restrictions.

[0059] Several welding copper powder rings are pre-set around the lower cover plate 14 as auxiliary fillers in the welding area between the upper cover plate 12 and the lower cover plate 14. After the above sintering structure is completed, the upper cover plate 12 and the lower cover plate 14 are aligned and closed, so that the upper cover plate 12 and the lower cover plate 14 form an accommodating cavity, and a metallurgical connection is formed in the designated welding area with the help of the welding copper powder rings. The welding process adopts diffusion welding, and the process parameters are: temperature 860℃, constant temperature for 1.5 hours, and pressure of 70kg, to achieve a firm weld between the upper cover plate 12 and the lower cover plate 14.

[0060] Several composite copper tubes 11 are inserted on the side of the upper cover plate 12 away from the lower cover plate 14, and the gap between the composite copper tubes 11 and the upper cover plate 12 is filled with copper solder. Then, high-frequency welding is used to weld them so that the composite copper tubes 11 and the upper cover plate 12 form a reliable sealed connection.

[0061] Finally, an appropriate amount of ultrapure water is injected into the cavity through the injection device, and vacuum evacuation, degassing, and sealing are performed using conventional vapor chamber technology to create a stable gas-liquid coexistence state within the cavity. At this point, the 3D vapor chamber 10, comprising the upper cover plate 12, lower cover plate 14, composite copper tube 11, upper cover capillary 13, core toothed plate 1414, edge toothed plate 1413, gradient support column 143, fine support column 145, coarse copper powder ring 144, and water inlet 15, is manufactured. The upper cover plate 12, lower cover plate 14, composite copper tube 11, upper cover capillary 13, core toothed plate 1414, edge toothed plate 1413, gradient support column 143, fine support column 145, coarse copper powder ring 144, and water inlet 15 work collaboratively and are inseparable, possessing synergistic thermal control functions of evaporation, heat transfer, and reflux.

[0062] In summary, this application provides a 3D vapor chamber for heat dissipation of electronic components. The 3D vapor chamber includes a composite copper tube, an upper cover plate, a lower cover plate, and an upper cover capillary. The upper cover plate is welded to the composite copper tube. The lower cover plate is welded to the end of the upper cover plate away from the composite copper tube to form a cavity. The upper cover capillary is disposed within the cavity. The lower cover plate has a recessed area and a peripheral area at the end facing the upper cover plate. The recessed area has a core area and an edge area. The recessed area has a plurality of edge teeth and a plurality of core teeth. The edge teeth are fixedly disposed in the edge area, and the core teeth are fixedly disposed in the core area. By setting the composite copper tube, upper cover plate, lower cover plate, upper cover capillary, recessed area, and peripheral area, and by setting the plurality of edge teeth and core teeth in the recessed area, the heating core area of ​​the lower cover plate is upgraded from a two-dimensional structure to a three-dimensional structure. By configuring several core and edge teeth in the core and edge areas of the heat exchange platform, the contact area between the heating core and the heat dissipation medium can be significantly increased, effectively improving the heat absorption efficiency of the medium. Simultaneously, the teeth form a three-dimensional heat exchange channel, making the heat dissipation medium heat-dissipating more uniformly. Compared with existing technologies that rely solely on the bottom surface of the heating platform to heat the heat dissipation medium, this 3D vapor chamber achieves diversified heat transfer and evaporation paths in multi-dimensional space, significantly improving heat transfer efficiency in high-power scenarios, thus solving the heat transfer efficiency bottleneck problem in existing technologies.

[0063] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A 3D vapor chamber for heat dissipation of electronic components, characterized in that, The 3D heat spreader includes: Composite copper pipe; The upper cover plate is welded to the composite copper tube; The lower cover plate is welded to the upper cover plate at one end away from the composite copper tube to form an accommodating cavity; A capillary cover is disposed within the accommodating cavity; The lower cover plate is provided with a recessed area and a peripheral area at one end facing the upper cover plate, and the recessed area is provided with a core area and an edge area; The settling platform area is provided with a number of edge tooth plates and a number of core tooth plates; A plurality of the edge teeth are fixedly disposed in the edge region, and a plurality of the core teeth are fixedly disposed in the core region.

2. The 3D heat spreader according to claim 1, characterized in that, The core area is covered with a fine copper powder layer with a mesh size of 200 or less, and the porosity of the fine copper powder layer is 30% to 45%; the edge area is filled with coarse copper powder with a mesh size of 100 to 150, and the porosity of the coarse copper powder is 50% to 65%; the peripheral area is filled with coarse copper powder with a mesh size of 70 to 90; the upper half of the slope of the settling platform area is made of coarse copper powder, and the lower half of the slope is made of fine copper powder, and the porosity of the upper half of the slope of the settling platform area is greater than that of the lower half of the slope of the settling platform area.

3. The 3D heat spreader according to claim 1, characterized in that, The core tooth plates are all solid copper tooth plates, and the left and right sides of the core tooth plates are provided with V-shaped grooves, while the front and rear sides of the core tooth plates are arc-shaped.

4. The 3D heat spreader according to claim 3, characterized in that, The ratio of the core tooth height to the spacing of the core tooth is 1:1.1 to 1.5; the ratio of the length of the core tooth to the length of the edge tooth is 1:0.3 to 0.

6.

5. The 3D heat spreader according to claim 1, characterized in that, The lower cover plate also includes several gradient support columns, several coarse copper powder rings, and several fine support columns; several of the gradient support columns are fixedly arranged in the core area, and several of the coarse copper powder rings and several fine support columns are evenly spaced and fixedly arranged in the peripheral area.

6. The 3D heat spreader according to claim 5, characterized in that, The gradient support column is divided into an upper section, a middle section, and a lower section with lengths decreasing at equal intervals; the porosity of the upper section is greater than that of the middle section, and the porosity of the middle section is greater than that of the lower section.

7. The 3D heat spreader according to claim 5, characterized in that, The capillary of the upper cover is a 200-mesh copper mesh, and the thickness of the capillary of the upper cover is 0.05mm to 0.1mm; the capillary of the upper cover is provided with a plurality of fixing holes, and the diameter of the plurality of fixing holes is adapted to the outer diameter of the plurality of gradient support columns and the plurality of thin support columns. The edges of the upper and lower cover plates form a water inlet, which is connected to the accommodating cavity and is used to inject a heat dissipation medium into the accommodating cavity.

8. The 3D heat spreader according to claim 1, characterized in that, The composite copper tube includes a copper tube body and an air inlet notch. The air inlet notch is located at the open end of the copper tube body. The height of the air inlet notch along the axial direction of the copper tube body is set to 3mm to 4mm. The air inlet notch is located inside the accommodating cavity.

9. The 3D heat spreader according to claim 8, characterized in that, The inner wall of the copper tube body is provided with a groove capillary zone and a copper powder capillary zone, and the groove capillary zone is located above the copper powder capillary zone.

10. The 3D heat spreader according to claim 9, characterized in that, The groove capillary zone is provided with spiral grooves or straight grooves, the groove depth of the groove capillary zone is 0.05mm to 0.1mm, and the groove spacing of the groove capillary zone is 0.2mm to 0.5mm; the copper powder capillary zone is covered with a 100-150 mesh copper powder layer and overlaps with the capillary layer of the lower cover.

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