A diode pin package structure

Abstract

This utility model discloses a diode pin packaging structure, relating to the field of diode pin packaging technology. It includes an axial diode pin and a first pin on one side of the axial diode pin. An axial diode chip is disposed between two first pins. Axial epoxy resin is poured onto the fixed first pins and axial diode chip to form an axial diode epoxy resin encapsulation. One end of a second pin is fixed inside a fixed connection groove. The second pin is tightly connected to the axial diode pin and the first pins, enabling rapid heat dissipation and effectively preventing performance degradation or damage to the diode due to overheating. The second pin not only serves a heat dissipation function but also shares some of the mechanical stress, reducing the mechanical stress exerted on the chip by the first pins, thereby reducing the risk of chip damage and ensuring that the diode's performance and lifespan are not affected.

Description

Technical Field

[0001] This utility model relates to the field of diode pin packaging technology, and in particular to a diode pin packaging structure. Background Technology

[0002] In the field of electronic equipment manufacturing, diodes are fundamental and critical electronic components, and their performance plays a decisive role in the stability and reliability of the entire circuit system. The packaging structure of diode leads, as an important factor affecting diode performance, has always been a focus of research in the electronics industry. With the rapid development of electronic technology, electronic products are constantly moving towards miniaturization and high performance, which puts forward more stringent requirements for diode performance. However, traditional diode lead packaging structures have many defects and are difficult to adapt to the development needs of the modern electronics industry.

[0003] During the operation of a diode, a large amount of heat is generated. If it cannot be dissipated in a timely and effective manner, the diode temperature will continue to rise. Excessive temperature will lead to an increase in the diode's internal resistance and power consumption, which will affect its performance and lifespan. The heat dissipation problem is particularly prominent under high power and high frequency operating conditions, and may even lead to thermal runaway, causing the diode to be damaged and seriously affecting the normal operation of electronic equipment.

[0004] During production, transportation, and use, diodes are subjected to various mechanical stresses. The copper pins in traditional packaging structures are not properly connected to the chip, which can generate significant mechanical stress on the chip, making it prone to cracks or other damage, thus reducing the reliability of the diode. Moreover, when performing secondary processing on the diode leads (such as welding, bending, etc.), traditional packaging structures cannot effectively protect the chip, which can easily damage the chip and further affect the performance and lifespan of the diode.

[0005] As the electronics industry continues to demand higher performance from diodes, the need for a pin packaging structure that can more effectively improve the heat dissipation and mechanical properties of diodes, and better protect the chip's pins during secondary processing, has become a problem that the electronics industry needs to solve. Utility Model Content

[0006] In view of the above, as the electronics industry continues to increase the performance requirements of diodes, there is a need for a diode pin packaging structure that can more effectively improve the heat dissipation performance and mechanical performance of diodes, and better protect the chip pins during secondary processing. This is a problem that the electronics industry needs to solve, and this utility model is proposed.

[0007] Therefore, the purpose of this invention is to encapsulate the axial diode with epoxy resin by molding it onto the two fixed first nails and the axial diode chip, forming an axial diode epoxy resin encapsulation. One end of the second nail is fixed inside the fixing groove. The second nail is tightly connected to the axial diode pin and the first nail, which can quickly dissipate heat and effectively prevent the diode from degrading or being damaged due to excessive temperature. The second nail not only plays a heat dissipation role, but also shares some of the mechanical stress, reducing the mechanical stress generated by the first nail on the chip, thereby reducing the risk of chip damage and ensuring that the performance and service life of the diode are not affected.

[0008] To solve the above technical problems, this utility model provides the following technical solution: a diode pin packaging structure, including an axial diode pin and a first pin on one side of the axial diode pin, with an axial diode chip disposed between the two first pins;

[0009] The heat dissipation assembly includes second pins mounted on the pins of the axial diode, with each second pin having the same spacing from a corresponding first pin;

[0010] The fixing assembly includes an axial diode epoxy resin encapsulation body mounted between two second nail heads, wherein a diode chip fixing groove is provided on the inner side of the axial diode epoxy resin encapsulation body.

[0011] As a preferred embodiment of the diode pin packaging structure of this utility model, wherein: a diode chip fixing groove is formed on the inner side of the epoxy resin encapsulation body of the axial diode, and an axial diode chip is provided on the inner side of the diode chip fixing groove.

[0012] As a preferred embodiment of the diode pin packaging structure of this utility model, two pin fixing grooves are formed on the inner side of the epoxy resin encapsulation body of the axial diode, and each pin fixing groove is connected to the corresponding diode chip fixing groove.

[0013] In a preferred embodiment of the diode pin packaging structure of this utility model, each of the first pin heads is fixed inside the corresponding pin copper pin fixing groove, and each pin copper pin fixing groove is in contact with one side of the diode chip fixing groove.

[0014] As a preferred embodiment of the diode pin packaging structure of this utility model, two diode pin fixing slots are formed on the epoxy resin encapsulation body of each axial diode, and each diode pin fixing slot is connected to the pin copper nail fixing slot.

[0015] As a preferred embodiment of the diode pin packaging structure of this utility model, each axial diode pin is disposed inside the corresponding diode pin fixing groove, and two fixing connection grooves are formed on the epoxy resin encapsulation body of each axial diode.

[0016] In a preferred embodiment of the diode pin packaging structure of this utility model, each of the fixed connection slots is connected to the corresponding diode pin fixing slot, and one end of each second nail head is fixed inside the fixed connection slot.

[0017] The beneficial effects of this utility model are:

[0018] Axial epoxy resin is encapsulated onto the two fixed first pins and the axial diode chip to form an axial diode epoxy resin encapsulation. One end of the second pin is fixed inside the fixing connection groove. The second pin is tightly connected to the axial diode pin and the first pin, which can quickly dissipate heat and effectively prevent the diode from degrading or being damaged due to excessive temperature. The second pin not only plays a heat dissipation role, but also shares some of the mechanical stress, reducing the mechanical stress generated by the first pin on the chip, thereby reducing the risk of chip damage and ensuring that the performance and service life of the diode are not affected. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0021] Figure 2 This is a cross-sectional structural diagram of the present invention.

[0022] Figure 3 This is a schematic diagram of the internal structure of the epoxy resin encapsulated body of the axial diode of this utility model.

[0023] Figure 4 This is a schematic diagram of the first nail head structure of this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Axial diode pin; 2. Second pin head; 3. First pin head; 4. Axial diode epoxy resin encapsulation body; 5. Pin copper pin fixing groove; 6. Diode pin fixing groove; 7. Fixing connection groove; 8. Diode chip fixing groove; 9. Axial diode chip. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Example 1

[0028] Reference Figure 1-3 This is the first embodiment of the present invention, which provides a diode pin packaging structure, including an axial diode pin 1 and a first nail head 3 on one side of the axial diode pin 1. An axial diode chip 9 is provided between the two first nail heads 3. It includes a second nail head 2 mounted on the axial diode pin 1. The spacing between each second nail head 2 and the corresponding first nail head 3 is the same. A diode chip fixing groove 8 is opened inside the axial diode epoxy resin encapsulation body 4. An axial diode chip 9 is provided inside the diode chip fixing groove 8.

[0029] Two pin fixing slots 5 are opened inside the epoxy resin encapsulation body 4 of the axial diode. Each pin fixing slot 5 is connected to the corresponding diode chip fixing slot 8. Each first nail head 3 is fixed inside the corresponding pin fixing slot 5. Each pin fixing slot 5 is in contact with one side of the diode chip fixing slot 8.

[0030] Example 2

[0031] Reference Figure 2-4 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that it includes an axial diode epoxy resin encapsulation body 4 installed between two second nail heads 2. The inner side of the axial diode epoxy resin encapsulation body 4 is provided with a diode chip fixing groove 8. Two diode pin fixing grooves 6 are opened on each axial diode epoxy resin encapsulation body 4. Each diode pin fixing groove 6 is connected to the pin copper nail fixing groove 5.

[0032] Each axial diode pin 1 is located inside the corresponding diode pin fixing groove 6. Two fixing connection grooves 7 are opened on the epoxy resin encapsulation body 4 of each axial diode. Each fixing connection groove 7 is connected to the corresponding diode pin fixing groove 6. One end of each second nail head 2 is fixed inside the fixing connection groove 7.

[0033] When encapsulating the diode pins, the axial diode chip 9 is first fixed between two first nail heads 3, so that the two first nail heads 3 are connected and attached to the axial diode chip 9 to form a good electrical connection. Then, axial epoxy resin is poured onto the fixed two first nail heads 3 and the axial diode chip 9 to form the axial diode epoxy resin encapsulation body 4.

[0034] The axial diode pin 1 is installed in the diode pin fixing slot 6, which is connected to the pin copper nail fixing slot 5, thus realizing a stable connection between the axial diode pin 1 and the first nail head 3. The fixing connection slot 7 opened on the epoxy resin encapsulation body 4 of the axial diode is connected to the diode pin fixing slot 6. One end of the second nail head 2 is fixed inside the fixing connection slot 7, further connecting the second nail head 2 with the entire encapsulation structure as a whole, thereby enhancing the stability of the encapsulation structure.

[0035] The second pin 2 in the heat dissipation assembly is mounted on the axial diode pin 1, and the spacing between each second pin 2 and the corresponding first pin 3 is the same. During the operation of the diode, when current passes through, heat is generated. The heat is transferred from the axial diode chip 9 to the first pin 3 and then conducted to the axial diode pin 1.

[0036] Since the second pin 2 is tightly connected to the axial diode pin 1 and the first pin 3, and has good thermal conductivity, it can quickly dissipate heat, thereby reducing the operating temperature of the diode. The uniform spacing design ensures the balance of heat dissipation, improves heat dissipation efficiency, and effectively avoids the diode from degrading or being damaged due to excessive temperature.

[0037] The epoxy resin encapsulation body 4 of the axial diode securely encapsulates the axial diode chip 9, the first pin 3, and the axial diode pin 1 together, providing mechanical protection for the entire diode during production, transportation, and use. The second pin 2 not only serves to dissipate heat but also shares some of the mechanical stress, reducing the mechanical stress generated by the first pin 3 on the chip.

[0038] When performing secondary processing on the diode pins (such as welding, bending, etc.), the axial diode epoxy resin encapsulator 4 and the second nail head 2 work together to better protect the chip, reduce the risk of chip damage, and ensure that the performance and service life of the diode are not affected.

[0039] The remaining structure is the same as that in Example 1.

[0040] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A diode pin package structure, characterized in that: It includes an axial diode pin (1) and a first nail (3) on one side of the axial diode pin (1), with an axial diode chip (9) between the two first nails (3). The heat dissipation assembly includes second pins (2) mounted on the axial diode pins (1), with each second pin (2) having the same spacing from the corresponding first pin (3); The fixing assembly includes an axial diode epoxy resin encapsulation (4) installed between two second nail heads (2), and the inner side of the axial diode epoxy resin encapsulation (4) is provided with a diode chip fixing groove (8).

2. The diode-lead package structure of claim 1, wherein: The axial diode epoxy resin encapsulation body (4) has a diode chip fixing groove (8) inside, and the axial diode chip (9) is provided inside the diode chip fixing groove (8).

3. The diode pin packaging structure according to claim 2, characterized in that: Two pin fixing slots (5) are opened on the inner side of the axial diode epoxy resin encapsulation body (4), and each pin fixing slot (5) is connected to the corresponding diode chip fixing slot (8).

4. The diode pin packaging structure according to claim 1, characterized in that: Each of the first nail heads (3) is fixed inside the corresponding pin copper nail fixing groove (5), and each of the pin copper nail fixing grooves (5) is in contact with one side of the diode chip fixing groove (8).

5. The diode pin packaging structure according to claim 4, characterized in that: Two diode pin fixing slots (6) are formed on each of the axial diode epoxy resin encapsulation bodies (4), and each of the diode pin fixing slots (6) is connected to the pin copper nail fixing slots (5).

6. The diode pin packaging structure according to claim 1, characterized in that: Each axial diode pin (1) is located inside the corresponding diode pin fixing groove (6), and two fixing connection grooves (7) are opened on the epoxy resin encapsulation body (4) of each axial diode.

7. The diode pin packaging structure according to claim 6, characterized in that: Each of the fixed connection slots (7) is connected to the corresponding diode pin fixing slot (6), and one end of each second nail head (2) is fixed inside the fixed connection slot (7).

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