Semiconductor constant-temperature wine decanter
By combining a semiconductor cooling chip and heat dissipation fins to regulate temperature, the problem of temperature fluctuations in decanters is solved, ensuring a stable release of wine aromas and enhancing the drinking experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUAHAI THERMAL POWER CO LTD
- Filing Date
- 2025-06-23
- Publication Date
- 2026-05-29
AI Technical Summary
Existing decanters lack an effective temperature control mechanism, resulting in large temperature fluctuations in the decanting environment, which disrupts the release rhythm of wine aromas and affects the drinking experience.
By combining a semiconductor cooling chip and heat sink, and regulating the temperature with a cooling fan, combined with a knob to control the voltage, a constant temperature control for wine is achieved.
This achieves stable aroma release in wine under constant temperature conditions, enhancing the drinking experience.
Smart Images
Figure CN224291653U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of decanter technology, and in particular relates to a semiconductor constant temperature decanter. Background Technology
[0002] Different types of wine have different suitable temperature ranges when decanting, and the right temperature can better help the wine release its aromas and flavors.
[0003] Currently, decanters on the market lack effective temperature control mechanisms, resulting in large temperature fluctuations in the decanting environment. This unstable temperature disrupts the original orderly release rhythm of wine aromas, causing some aromas to evaporate prematurely while others fail to fully develop, making it difficult for drinkers to clearly perceive the layers and changes in aromas and affecting the drinking experience. Utility Model Content
[0004] The purpose of this invention is to address the problem that current decanters on the market lack an effective temperature control mechanism, resulting in large temperature fluctuations in the decanting environment. This unstable temperature condition disrupts the original orderly release rhythm of wine aromas, causing some aromas to evaporate prematurely while others fail to fully develop, making it difficult for drinkers to clearly perceive the layers and changes in aromas and affecting the drinking experience. Therefore, this invention proposes a semiconductor constant temperature decanter.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor constant temperature wine aerator, comprising a wine storage shell, wherein a wine storage and heat preservation groove is provided inside, a temperature-conducting cold aluminum base is provided at the bottom of the wine storage and heat preservation groove, the cold end of the semiconductor cooling chip abuts against the temperature-conducting cold aluminum base, the hot end of the semiconductor cooling chip abuts against the heat dissipation fins, the heat dissipation fins are connected to a fan cover, a cooling fan is provided inside the fan cover, a plurality of first heat dissipation holes are provided at the bottom of the wine storage shell, the cooling fan faces the plurality of first heat dissipation holes, and a support base is provided at the bottom of the wine storage shell.
[0006] As a further description of the above technical solution:
[0007] The heat dissipation vents at the bottom of the heat dissipation fins face the cooling fan.
[0008] As a further description of the above technical solution:
[0009] The two side walls of the wine storage shell are provided with a number of second heat dissipation holes, and the heat dissipation openings on both sides of the heat dissipation fins face the number of second heat dissipation holes.
[0010] As a further description of the above technical solution:
[0011] The wine storage and heat preservation tank is provided with several fixed shafts and connecting ears, and the wine storage shell is provided with several connecting grooves and fixed ears. The fixed shafts are correspondingly engaged in the connecting grooves, and the connecting ears and the fixed ears are fixed by screws.
[0012] As a further description of the above technical solution:
[0013] The material at the bottom of the wine storage and heat preservation tank that is in contact with the semiconductor cooling chip is a thermally conductive material, and the material at the top of the wine storage and heat preservation tank is a thermally insulating material. The thermally conductive material is aluminum, and the thermally insulating material is EVA.
[0014] As a further description of the above technical solution:
[0015] The bottom of the wine storage and heat preservation tank is provided with a connecting shaft, and the power supply component is fixed on the connecting shaft.
[0016] As a further description of the above technical solution:
[0017] The power supply assembly includes a power supply box, a power supply, and a PCB board. The power supply box is fixed to the connecting shaft by screws. The PCB board is located inside the power supply box. The power supply is connected to the PCB board. The semiconductor cooling chip is wired to the power supply.
[0018] As a further description of the above technical solution:
[0019] The wine storage shell is provided with a knob component, which includes a control board and a knob. The knob is connected to the control board, and the control board is electrically connected to the PCB board.
[0020] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:
[0021] 1. In this utility model, a cold aluminum base is set at the bottom of the wine storage and insulation tank, and a semiconductor cooling chip is set at the bottom of the cold aluminum base. The cold end of the semiconductor cooling chip abuts against the cold aluminum base, transferring the temperature upward into the wine storage and insulation tank. The hot end of the semiconductor cooling chip dissipates the temperature from the first heat dissipation hole and the second heat dissipation hole through heat dissipation fins and a heat dissipation fan, ensuring that the internal temperature remains constant and unaffected. This structure places the wine bottle in the wine storage and insulation tank, ensuring a constant temperature for the wine inside the bottle. Under constant temperature conditions, the evaporation rate of aroma molecules is relatively stable, enabling the wine to continuously and stably release various aromas, thus improving the drinking experience.
[0022] 2. In this utility model, a knob is provided, and the control board inside the knob is electrically connected to the PCB board. By rotating the knob, the voltage of the power input to the semiconductor cooling chip is controlled, thereby regulating the temperature of the semiconductor cooling chip. This structure can decant various wines as needed and maintain a constant temperature to ensure the unique aroma and taste of the red wine. Attached Figure Description
[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 A three-dimensional semiconductor constant temperature decanter Figure 1 .
[0025] Figure 2 A three-dimensional semiconductor constant temperature decanter Figure 2 .
[0026] Figure 3 Cross-section of a semiconductor constant temperature decanter Figure 1 .
[0027] Figure 4 Cross-section of a semiconductor constant temperature decanter Figure 2 .
[0028] Legend:
[0029] 1-Wine storage shell; 2-Wine storage and insulation tank; 3-Temperature-conducting aluminum base; 4-Semiconductor cooling chip; 5-Heat dissipation fins; 6-Fan cover; 7-Cooling fan; 8-First heat dissipation hole; 9-Second heat dissipation hole; 10-Fixed shaft; 11-Connecting ear; 12-Connecting groove; 13-Fixed ear; 14-Connecting shaft; 15-Power supply assembly; 151-Power supply box; 152-Power supply; 153-PCB board; 16-Knob; 161-Control board; 162-Knob; 17-Support base. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0033] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0034] In the description of the embodiments of this utility model, it should be noted that the terms "upper" and "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0035] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0036] Please see Figure 1-4This utility model provides a technical solution: a semiconductor constant temperature wine aerator, including a wine storage shell 1, which has a wine storage and heat preservation tank 2 inside. The bottom of the wine storage and heat preservation tank 2 is provided with a temperature-conducting cold aluminum base 3. The cold end of the semiconductor cooling chip 4 abuts against the temperature-conducting cold aluminum base 3, and the hot end of the semiconductor cooling chip 4 abuts against the heat dissipation fins 5. The heat dissipation fins 5 are connected to a fan cover 6. A cooling fan 7 is provided inside the fan cover 6. The bottom of the wine storage shell 1 is provided with a plurality of first heat dissipation holes 8. The cooling fan 7 faces the plurality of first heat dissipation holes 8. A support base 17 is provided at the bottom of the wine storage shell 1.
[0037] The heat dissipation vents at the bottom of the heat dissipation fins 5 face the cooling fan 7.
[0038] The wine storage shell 1 has several second heat dissipation holes 9 on both sides, and the heat dissipation openings on both sides of the heat dissipation fins 5 face the several second heat dissipation holes 9. This allows the heat source of the semiconductor cooling chip to be dissipated in a timely manner, avoiding its impact on the wine storage and insulation tank.
[0039] The wine storage and insulation tank 2 is provided with several fixed shafts 10 and connecting ears 11, and the wine storage shell 1 is provided with several connecting grooves 12 and fixed ears 13. The fixed shafts 10 are correspondingly engaged in the connecting grooves 12, and the connecting ears 11 and fixed ears 13 are fixed by screws. This improves the stability and load-bearing capacity of the wine storage and insulation tank within the wine storage shell.
[0040] The bottom of the wine storage and heat preservation tank 2, which is in contact with the semiconductor cooling chip 4, is made of a thermally conductive material, while the top of the wine storage and heat preservation tank 2 is made of a thermally insulating material. The thermally conductive material is aluminum, and the thermally insulating material is EVA. This ensures that the temperature inside the wine storage and heat preservation tank does not diffuse from the top, and the bottom thermal conductivity always maintains a constant temperature in the wine storage and heat preservation tank.
[0041] The bottom of the wine storage and heat preservation tank 2 is provided with a connecting shaft 14, and the power supply assembly 15 is fixed on the connecting shaft 14.
[0042] The power supply assembly 15 includes a power supply box 151, a power supply 152, and a PCB board 153. The power supply box 151 is fixed to the connecting shaft 14 by screws. The PCB board 153 is located inside the power supply box 151. The power supply 152 is connected to the PCB board 153. The semiconductor cooling chip 4 is wired to the power supply 152.
[0043] The wine storage housing 1 is equipped with a knob 16, which includes a control board 161 and a knob 162. The knob 162 is connected to the control board 161, and the control board 161 is electrically connected to the PCB board 153. By rotating the knob, the voltage input to the semiconductor cooling chip is controlled, thereby regulating the temperature of the semiconductor cooling chip. This structure can be used to decan various types of wine as needed, while maintaining a constant temperature to preserve the unique aroma and taste of the wine.
[0044] Working principle: A cold aluminum base is installed at the bottom of the wine storage and insulation tank. A semiconductor cooling chip is placed at the bottom of the cold aluminum base. The cold end of the semiconductor cooling chip abuts against the cold aluminum base, transferring heat upwards into the wine storage and insulation tank. The hot end of the semiconductor cooling chip dissipates the heat through heat dissipation fins and a cooling fan through the first and second heat dissipation holes, ensuring that the internal temperature remains constant. This structure places the wine bottle in the wine storage and insulation tank, ensuring a constant temperature for the wine inside. Under this constant temperature environment, the evaporation rate of aroma molecules is relatively stable, allowing the wine to continuously and stably release various aromas, thus improving the drinking experience.
[0045] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A semiconductor constant temperature wine aerator, characterized in that, The device includes a wine storage shell with an internal wine storage and insulation tank. A temperature-conducting cold aluminum base is located at the bottom of the wine storage and insulation tank. The cold end of a semiconductor cooling chip abuts against the temperature-conducting cold aluminum base, and the hot end of the semiconductor cooling chip abuts against a heat dissipation fin. The heat dissipation fin is connected to a fan cover, and a cooling fan is located inside the fan cover. Several first heat dissipation holes are located at the bottom of the wine storage shell, and the cooling fan faces the several first heat dissipation holes. A support base is located at the bottom of the wine storage shell.
2. The semiconductor constant temperature wine aerator according to claim 1, characterized in that, The heat dissipation vents at the bottom of the heat dissipation fins face the cooling fan.
3. A semiconductor constant temperature wine aerator according to claim 2, characterized in that, The two side walls of the wine storage shell are provided with a number of second heat dissipation holes, and the heat dissipation openings on both sides of the heat dissipation fins face the number of second heat dissipation holes.
4. A semiconductor constant temperature wine aerator according to claim 1, characterized in that, The wine storage and heat preservation tank is provided with several fixed shafts and connecting ears, and the wine storage shell is provided with several connecting grooves and fixed ears. The fixed shafts are correspondingly engaged in the connecting grooves, and the connecting ears and the fixed ears are fixed by screws.
5. A semiconductor constant temperature wine aerator according to claim 4, characterized in that, The material at the bottom of the wine storage and heat preservation tank that is in contact with the semiconductor cooling chip is a thermally conductive material, and the material at the top of the wine storage and heat preservation tank is a thermally insulating material. The thermally conductive material is aluminum, and the thermally insulating material is EVA.
6. A semiconductor constant temperature wine aerator according to claim 1, characterized in that... The bottom of the wine storage and heat preservation tank is provided with a connecting shaft, and the power supply assembly is fixed on the connecting shaft.
7. A semiconductor constant temperature wine aerator according to claim 6, characterized in that... The power supply assembly includes a power supply box, a power supply, and a PCB board. The power supply box is fixed to the connecting shaft by screws. The PCB board is located inside the power supply box. The power supply is connected to the PCB board. The semiconductor cooling chip is wired to the power supply.
8. A semiconductor constant temperature wine aerator according to claim 7, characterized in that... The wine storage shell is provided with a knob component, which includes a control board and a knob. The knob is connected to the control board, and the control board is electrically connected to the PCB board.