A spacer device for chip transport

Abstract

The utility model discloses a kind of interval devices for chip transportation, it is related to the technical field of interval devices for chip transportation.The interval device for chip transportation, including bearing plate, the top of bearing plate is provided with chip main body, the top of bearing plate is provided with positioning device.This kind of interval device for chip transportation uses, first, several clamping grooves are opened in the top of bearing plate, the bottom of bearing plate is fixedly connected with the clamping block corresponding with clamping groove, the cooperation of clamping groove and clamping block facilitates the stacking of multiple bearing plates, several storage grooves are opened in the top of bearing plate, positioning block is arranged in the inside of storage groove, to facilitate fixedly connected chip main body, and positioning device is also arranged in the inside of storage groove, by setting positioning device, it is convenient to assist the fixation of chip main body, and chip main body can be quickly taken out from the inside of storage groove simultaneously.

Description

Technical Field

[0001] This utility model belongs to the technical field of spacer devices for chip transportation, and specifically relates to a spacer device for chip transportation. Background Technology

[0002] A chip is a miniature circuit that integrates a large number of electronic components (such as transistors, resistors, and capacitors) onto a tiny semiconductor material (usually silicon). It is a core component of modern electronic devices. Its core characteristics include miniaturization, high integration, and multifunctionality. It is widely used in computing, storage, communication, and other fields. A CPU is a type of chip, belonging to the processor chip category. During the transportation of CPU chips, they are fixed in place using spaced plastic trays.

[0003] The aforementioned device lacks a structure for auxiliary fixing and quick removal of the transport plate during use. As a result, existing transport trays mostly rely on the protrusions in the trays to limit the CPU. Although this has a good limiting effect, removing the CPU requires squeezing and changing the shape of the transport plate to disengage the protrusions from the chip, which is cumbersome and may damage the CPU. Based on the shortcomings of existing technology, this utility model designs a spacer device for chip transport. Utility Model Content

[0004] To address the aforementioned problems in the existing technology, this utility model provides a spacer device for chip transportation, which features auxiliary fixing by a transport plate and rapid removal.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a spacer device for chip transportation, comprising a carrier plate, a chip body being disposed on the top of the carrier plate, and a positioning device being disposed on the top of the carrier plate;

[0006] A positioning device includes a support film, a welding strip, a first fixing strip, a first adhesive strip, a second fixing strip, a tension strip, and a second adhesive strip. The support film is disposed on the top of a support plate, and the bottom of the support film is provided with a welding strip. The top of the support film is fixedly connected to the first fixing strip, and the top of the first fixing strip is fixedly connected to the first adhesive strip. The top of the support film is fixedly connected to the second fixing strip, and a tension strip is fixedly connected to one side of the second fixing strip. The lower surface of the tension strip is fixedly connected to the second adhesive strip.

[0007] As a preferred embodiment of the spacer device for chip transportation according to this utility model, the upper surface of the carrier plate is provided with a slot, and the lower surface of the carrier plate is fixedly connected with a block.

[0008] As a preferred technical solution of the chip transportation interval device of this utility model, the upper surface of the carrier plate is provided with a storage groove, and a positioning block is fixedly connected inside the storage groove.

[0009] As a preferred embodiment of the spacer device for chip transportation according to this utility model, the bearing film is fixedly connected to the inside of the storage groove, and the welding strip is fixedly connected to the inside of the storage groove.

[0010] As a preferred embodiment of the spacer device for chip transportation according to this utility model, the first fixing strip is disposed on the top of the chip body, and the second fixing strip is movably attached to the top of the first adhesive strip.

[0011] As a preferred embodiment of the spacing device for chip transportation according to this utility model, the traction strip is movably attached to the top of the second fixing strip, and the second adhesive tape is movably attached to the top of the second fixing strip.

[0012] As a preferred embodiment of the spacer device for chip transportation according to this utility model, the chip body is disposed on the top of the carrier film and the chip body is disposed at the bottom of the second fixing strip.

[0013] As a preferred technical solution of the chip transportation interval device of this utility model, the chip body is movably engaged inside the storage slot, and the chip body is movably engaged at the bottom of the positioning block.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. When using this utility model, by setting a carrier film, when it is necessary to fix the chip body, firstly, the first fixing strip and the second fixing strip are opened, then the chip body is placed in the storage groove and fixed by the positioning block, while pressing on the upper surface of the carrier film. At this time, the first fixing strip is folded over the storage groove, and then the second fixing strip is also folded over the storage groove. The chip body is fixed and glued to the first fixing strip by the first adhesive tape. This device facilitates the fixing of the chip body.

[0016] When it is necessary to remove the chip body from the storage slot, first pinch one end of the pull bar and peel off the second adhesive tape to fully unfold the pull bar. Then, pull the unfolded pull bar upward to lift the second fixing strip and the bottom support film. At this time, the second fixing strip and the support film, which are lifted, will cause the chip body fixed inside to move upward and disengage from the positioning block and be removed from the storage slot. Finally, peel off the first adhesive tape from the first fixing strip to open the first and second fixing strips and remove the chip body. This device facilitates the removal of the chip body from the storage slot. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the support plate structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the card slot structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the card block structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the main structure of the chip of this utility model;

[0022] Figure 5 This is a schematic diagram of the positioning device structure of this utility model.

[0023] In the diagram: 1. Carrier plate; 101. Card slot; 102. Card block; 2. Chip body; 201. Storage slot; 202. Positioning block; 3. Positioning device; 301. Carrier film; 302. Welding strip; 303. First fixing strip; 304. First adhesive strip; 305. Second fixing strip; 306. Pulling strip; 307. Second adhesive strip. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example 1

[0026] Please see Figure 1-5 The present invention provides the following technical solution: a spacer device for chip transportation, comprising a carrier plate 1, a chip body 2 disposed on the top of the carrier plate 1, and a positioning device 3 disposed on the top of the carrier plate 1;

[0027] The upper surface of the support plate 1 is provided with a slot 101, and the lower surface of the support plate 1 is fixedly connected with a block 102.

[0028] The upper surface of the support plate 1 is provided with a storage groove 201, and a positioning block 202 is fixedly connected inside the storage groove 201.

[0029] The chip body 2 is disposed on top of the carrier film 301 and at the bottom of the second fixing strip 305.

[0030] The chip body 2 is movably attached inside the storage slot 201, and the chip body 2 is movably attached to the bottom of the positioning block 202.

[0031] Further explanation is needed: Several slots 101 are provided on the top of the carrier plate 1, and corresponding card blocks 102 are fixedly connected to the bottom of the carrier plate 1. The slots 101 and card blocks 102 cooperate to facilitate the stacking of multiple carrier plates 1. Several storage slots 201 are provided on the top of the carrier plate 1. Positioning blocks 202 are provided inside the storage slots 201 to facilitate the fixing of the chip body 2. Positioning devices 3 are also provided inside the storage slots 201. The positioning devices 3 facilitate the fixing of the chip body 2 and allow the chip body 2 to be quickly removed from the storage slots 201.

[0032] Example 2

[0033] Please see Figure 2-5 The present invention provides the following technical solution:

[0034] The positioning device 3 includes a support film 301, a welding strip 302, a first fixing strip 303, a first adhesive strip 304, a second fixing strip 305, a tension strip 306, and a second adhesive strip 307. The support film 301 is disposed on the top of the support plate 1, and the welding strip 302 is disposed on the bottom of the support film 301. The first fixing strip 303 is fixedly connected to the top of the support film 301, the first adhesive strip 304 is fixedly connected to the top of the first fixing strip 303, the second fixing strip 305 is fixedly connected to the top of the support film 301, the tension strip 306 is fixedly connected to one side of the second fixing strip 305, and the second adhesive strip 307 is fixedly connected to the lower surface of the tension strip 306.

[0035] The supporting film 301 is fixedly connected to the inside of the storage tank 201, and the welding strip 302 is fixedly connected to the inside of the storage tank 201.

[0036] The first fixing strip 303 is set on the top of the chip body 2, and the second fixing strip 305 is movably attached to the top of the first adhesive strip 304.

[0037] The tension strip 306 is movably attached to the top of the second fixing strip 305, and the second adhesive tape 307 is movably attached to the top of the second fixing strip 305.

[0038] Further explanation is needed: With the first fixing strip 303 and the second fixing strip 305 open, the chip body 2 is placed in the storage slot 201 and fixed using the positioning block 202, simultaneously pressing it against the upper surface of the supporting film 301. At this point, the first fixing strip 303 is folded over the storage slot 201, and then the second fixing strip 305 is also folded over the storage slot 201. The chip body 2 is then fixed and bonded to the first fixing strip 303 using the first adhesive tape 304. To remove the chip body 2 from the storage slot 201, firstly... Pinch one end of the pull bar 306 and peel off the second adhesive tape 307 to fully unfold the pull bar 306. Then pull the unfolded pull bar 306 upward to lift the second fixing bar 305 and the bottom support film 301. At this time, the second fixing bar 305 and the support film 301, which are lifted, will cause the chip body 2 fixed inside to move upward and disengage from the positioning block 202 and be taken out from the storage slot 201. Finally, peel off the first adhesive tape 304 from the first fixing bar 303 to open the first fixing bar 303 and the second fixing bar 305 and take out the chip body 2.

[0039] Working principle: When a chip transport spacer is used, several slots 101 are first opened on the top of the carrier plate 1, and a corresponding card block 102 is fixedly connected to the bottom of the carrier plate 1. The slots 101 and the card block 102 cooperate to facilitate the stacking of multiple carrier plates 1. Several storage slots 201 are opened on the top of the carrier plate 1. A positioning block 202 is set inside the storage slot 201 to fix and attach the chip body 2. A positioning device 3 is also set inside the storage slot 201. The positioning device 3 helps to fix the chip body 2 and can quickly remove the chip body 2 from the storage slot 201.

[0040] When it is necessary to fix the chip body 2, firstly, open the first fixing strip 303 and the second fixing strip 305, then place the chip body 2 in the storage groove 201 and fix it with the positioning block 202, while pressing it on the upper surface of the supporting film 301. At this time, fold the first fixing strip 303 over the storage groove 201, and then fold the second fixing strip 305 over the storage groove 201 as well. Fix and adhere the chip body 2 to the first fixing strip 303 with the first adhesive tape 304. This device facilitates the fixing of the chip body 2.

[0041] When it is necessary to remove the chip body 2 from the storage slot 201, first pinch one end of the pull bar 306 and peel off the second adhesive strip 307 to fully unfold the pull bar 306. Then, pull the unfolded pull bar 306 upward to lift the second fixing strip 305 and the bottom support film 301. At this time, the second fixing strip 305 and the support film 301, which are lifted, will cause the chip body 2, which is fixed inside, to move upward and disengage from the positioning block 202 and be removed from the storage slot 201. Finally, peel off the first adhesive strip 304 from the first fixing strip 303 to open the first fixing strip 303 and the second fixing strip 305 and remove the chip body 2. This device facilitates the removal of the chip body 2 from the storage slot 201.

[0042] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A spacer device for chip transport, comprising a carrier plate (1), characterized in that: The top of the carrier plate (1) is provided with a chip body (2) and the top of the carrier plate (1) is provided with a positioning device (3). The positioning device (3) includes a carrier film (301), a welding strip (302), a first fixing strip (303), a first adhesive strip (304), a second fixing strip (305), a pull strip (306), and a second adhesive strip (307). The carrier film (301) is disposed on the top of the carrier plate (1), and the bottom of the carrier film (301) is provided with a welding strip (302). The top of the carrier film (301) is fixedly connected to the first fixing strip (303), the top of the first fixing strip (303) is fixedly connected to the first adhesive strip (304), the top of the carrier film (301) is fixedly connected to the second fixing strip (305), one side of the second fixing strip (305) is fixedly connected to the pull strip (306), and the lower surface of the pull strip (306) is fixedly connected to the second adhesive strip (307).

2. The spacer device for chip transport according to claim 1, characterized in that: The upper surface of the support plate (1) is provided with a slot (101), and the lower surface of the support plate (1) is fixedly connected with a block (102).

3. The spacer device for chip transport according to claim 1, characterized in that: The upper surface of the support plate (1) is provided with a storage groove (201), and a positioning block (202) is fixedly connected inside the storage groove (201).

4. The spacer device for chip transport according to claim 1, characterized in that: The supporting film (301) is fixedly connected to the inside of the storage groove (201), and the welding strip (302) is fixedly connected to the inside of the storage groove (201).

5. The spacer device for chip transport according to claim 1, characterized in that: The first fixing strip (303) is set on the top of the chip body (2), and the second fixing strip (305) is movably attached to the top of the first adhesive tape (304).

6. The spacer device for chip transport according to claim 1, characterized in that: The tension strip (306) is movably attached to the top of the second fixing strip (305), and the second adhesive tape (307) is movably attached to the top of the second fixing strip (305).

7. The spacer device for chip transport according to claim 1, characterized in that: The chip body (2) is disposed on top of the carrier film (301) and the chip body (2) is disposed at the bottom of the second fixing strip (305).

8. The spacer device for chip transport according to claim 1, characterized in that: The chip body (2) is movably engaged inside the storage slot (201) and the chip body (2) is movably engaged at the bottom of the positioning block (202).

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