Refrigeration appliance

Abstract

The utility model relates to a kind of refrigeration equipment.The refrigeration equipment includes: phase-change energy storage, heat collecting part, heat dissipating part;The heat collecting part, the heat dissipating part are all arranged in the refrigeration equipment, the heat collecting part is connected with the heat dissipating part, the heat collecting part is provided with heat collecting portion on the side away from the heat dissipating part, and the phase-change energy storage is arranged in the heat collecting portion;Wherein, the heat collecting part is used to absorb the cold of the phase-change energy storage, and the heat dissipating part is used to disperse the cold of the heat collecting part.By setting heat collecting part in refrigeration equipment, and setting heat collecting portion on heat collecting part, and installing phase-change energy storage on heat collecting portion, the heat collecting part is collected after energy is released by phase-change energy storage, and the energy on the collecting part is dispersed into refrigeration equipment by heat dissipating part, so that the temperature in refrigeration equipment can be changed, the refrigeration equipment is cooled to achieve the effect of refrigeration, and since there is no compressor in the refrigeration equipment, the refrigeration equipment will not generate heat, so the energy consumption in the refrigeration equipment can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment, and specifically to a refrigeration device. Background Technology

[0002] A refrigerator is a refrigeration device that maintains a constant low temperature, and it is also a consumer product that keeps food or other items at a constant low temperature. Currently, refrigerators in related technologies use a compressor to perform work on the refrigeration system. The refrigeration system utilizes a low-boiling-point refrigerant, which absorbs heat during evaporation and vaporization. However, because the compressor works for extended periods during use, this type of refrigerator generates a significant amount of heat. Utility Model Content

[0003] Therefore, this utility model provides a refrigeration device. The refrigeration device can reduce the heat generated by the refrigeration equipment.

[0004] This utility model provides the following technical solution:

[0005] A refrigeration device includes: a phase change energy storage component, a heat collection component, and a heat dissipation component;

[0006] The heat collector and the heat sink are both disposed in the refrigeration equipment. The heat collector is connected to the heat sink. A heat collection section is disposed on the side of the heat collector away from the heat sink. The phase change energy storage device is disposed in the heat collection section.

[0007] The heat collector is used to absorb the cold energy of the phase change energy storage device, and the heat dissipation device is used to dissipate the cold energy of the heat collector.

[0008] Furthermore, it also includes: driving components;

[0009] The heat sink has a recessed portion, and the driving component is disposed within the recessed portion. The driving component is used to drive airflow within the refrigeration equipment.

[0010] Furthermore, it also includes: the shell;

[0011] The housing is disposed in the refrigeration equipment, and the housing has a receiving cavity, in which the heat collection element, the heat dissipation element, and the driving element are all disposed.

[0012] Furthermore, the housing is provided with an air inlet and an air outlet;

[0013] Both the air inlet and the air outlet are connected to the accommodating cavity. The driving member drives the airflow to enter the accommodating cavity from the air inlet and exit from the air outlet.

[0014] Furthermore, it also includes: heat pipes and condensers;

[0015] The refrigeration equipment has a storage chamber, the condenser is located near the storage chamber or is located in the storage chamber, both ends of the heat pipe are connected to the accommodating cavity, and the driving element drives the airflow to flow in the heat pipe; the condenser is located on the heat pipe.

[0016] Furthermore, the heat sink includes: a plurality of heat dissipation fins;

[0017] The plurality of heat dissipation fins are spaced apart along a first direction, and a flow channel is formed between two adjacent heat dissipation fins. The driving member is used to drive airflow to flow through the flow channel.

[0018] Furthermore, it also includes: multiple support components;

[0019] The support members are spaced apart within the housing along the length of the housing, and there is a flow channel between the support members and the housing to allow airflow.

[0020] Furthermore, it also includes: semiconductor coolers and heat-conducting components;

[0021] The semiconductor cooler and the heat-conducting component are disposed within the refrigeration equipment. The semiconductor cooler has a cooling surface and a heating surface. The heating surface is disposed near the side wall of the refrigeration equipment. The cooling surface is connected to the heat-conducting component, and the heat-conducting component is connected to the heat collector.

[0022] Furthermore, the heat-conducting component includes: a heat-conducting plate and a heat-conducting element;

[0023] The heat-conducting plate is attached to the cooling surface, one end of the heat-conducting element is connected to the heat-conducting plate, and the other end of the heat-conducting element is connected to the heat-collecting element;

[0024] The heat-conducting plate is used to collect the cold energy from the cooling surface and transfer it to the heat collector through the heat-conducting component.

[0025] Furthermore, the outer wall of the housing is provided with a heat insulation layer.

[0026] The aforementioned refrigeration equipment incorporates a heat collector, which in turn houses a heat collection section. A phase change energy storage device is then installed on the heat collection section. Energy is released by the phase change energy storage device and collected by the heat collector. The energy is then dissipated into the refrigeration equipment via a heat dissipation device. This alters the temperature within the refrigeration equipment, thereby cooling it and achieving a refrigeration effect. Furthermore, since there is no compressor in the refrigeration equipment, it does not generate heat, thus reducing energy consumption. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 One of the structural schematic diagrams of the refrigeration equipment provided in the embodiments of this utility model;

[0029] Figure 2 A second schematic diagram of the structure of the refrigeration equipment provided in this embodiment of the utility model;

[0030] Figure 3 One of the structural schematic diagrams of the driving component and heat exchanger provided in the embodiments of this utility model;

[0031] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0032] Figure 5 A second schematic diagram of the structure of the driving component and heat exchanger provided in the embodiments of this utility model;

[0033] Figure 6 The third schematic diagram of the structure of the refrigeration equipment provided in the embodiment of this utility model;

[0034] Figure 7 This is a schematic diagram of the overall structure of the refrigeration equipment provided in an embodiment of the present utility model.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100-Refrigeration equipment; 10-Phase change energy storage component; 20-Heat collector; 21-Heat collector section; 30-Heat dissipation component; 31-Recessed section; 32-Heat dissipation fins; 33-Flow channel; 40-Drive component; 50-Housing shell; 51-Accommodation cavity; 52-Air inlet; 53-Air outlet; 60-Heat pipe; 61-Condenser; 62-Storage chamber; 70-Support component; 71-Semiconductor cooler; 711-Refrigeration surface; 712-Heating surface; 72-Mounting section; 80-Heat conduction component; 81-Heat conduction plate; 82-Heat conduction element; 90-Insulation layer. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0039] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] A refrigerator is a refrigeration device that maintains a constant low temperature, and it is also a consumer product that keeps food or other items at a constant low temperature. Currently, refrigerators in related technologies use a compressor to perform work on the refrigeration system. The refrigeration system utilizes a low-boiling-point refrigerant, which absorbs heat during evaporation and vaporization. However, because the compressor works for extended periods during use, this type of refrigerator generates a significant amount of heat.

[0041] For ease of subsequent explanation, the first direction referred to in this utility model is as follows: Figure 3 The direction referred to in the text is from top to bottom.

[0042] Therefore, this embodiment provides a refrigerator refrigeration device 100. The refrigeration device 100 can reduce the heat generated by the refrigerator.

[0043] Please see Figure 1 A refrigeration device 100 includes: a phase change energy storage component 10, a heat collection component 20, and a heat dissipation component 30;

[0044] The heat collector 20 and the heat sink 30 are both disposed in the refrigeration equipment 100. The heat collector 20 is connected to the heat sink 30. A heat collection section 21 is disposed on the side of the heat collector 20 away from the heat sink 30. The phase change energy storage device 10 is disposed in the heat collection section 21.

[0045] The heat collector 20 is used to absorb the cold energy of the phase change energy storage device 10, and the heat dissipation device 30 is used to dissipate the cold energy of the heat collector 20.

[0046] The aforementioned refrigeration device 100, by providing a heat collector 20, a heat collection section 21 on the heat collector 20, and a phase change energy storage device 10 on the heat collection section 21, releases energy through the phase change energy storage device 10, which is then collected by the heat collector 20. The energy is then dissipated into the refrigeration device 100 through the heat dissipation device 30. This changes the temperature inside the refrigeration device 100, thereby cooling the refrigeration device 100 and achieving a refrigeration effect. At the same time, since there is no compressor in the refrigeration device 100, the refrigeration device 100 does not generate heat, thus reducing the energy consumption of the refrigeration device 100.

[0047] Understandably, a heat collector 20 is provided in the refrigeration device 100, and a heat collection section 21 is provided on the heat collector 20. A phase change energy storage device 10 is provided on the heat collection section 21. After the phase change energy storage device 10 releases cold energy, the heat collector 20, which is close to the phase change energy storage device 10, can absorb the cold energy released by the phase change energy storage device 10. After this part of the cold energy is collected, it can be conducted to the heat dissipation device 30, so that the heat dissipation device 30 can release cold energy. The released cold energy can cool the airflow in the refrigeration device 100. When the airflow in the refrigeration device 100 is cooled, the temperature inside the refrigeration device 100 can be reduced, thus enabling the refrigeration device 100 to achieve refrigeration. Since the refrigeration device 100 releases cold energy through the phase change energy storage device 10, no additional heat is generated in the refrigeration device 100, thus avoiding energy consumption.

[0048] Please see Figures 2 to 5 In some embodiments, it also includes: a drive element 40;

[0049] The heat sink 30 is provided with a recess 31, and the driving member 40 is disposed in the recess 31. The driving member 40 is used to drive the airflow to flow in the refrigeration device 100.

[0050] Understandably, the refrigeration equipment 100 also includes a driving component 40. To improve the heat dissipation effect of the driving component 40, a recess 31 is provided on the heat sink 30, and the driving component 40 is placed within the recess 31. The driving component 40 drives the airflow around the heat sink 30 to circulate, allowing the airflow around the heat sink 30 to flow and thus enabling the airflow around the heat sink 30 to be cooled by the heat sink 30 more quickly. At the same time, it also allows the temperature of the heat sink 30 to drop more quickly, so that the cooling capacity of the heat conduction element 82 can be transferred to the heat sink 30 more quickly, thereby accelerating the heat exchange efficiency of the heat exchange element. Placing the driving component 40 within the recess 31 allows more airflow to pass through the heat sink 30 when the driving component 40 drives the airflow, thus improving the heat dissipation effect of the heat sink 30.

[0051] Please see Figure 2 In some embodiments, it further includes: a housing 50;

[0052] The housing 50 is disposed in the refrigeration device 100. The housing 50 has a receiving cavity 51. The heat collection element 20, the heat dissipation element 30, and the driving element 40 are all disposed in the receiving cavity 51.

[0053] It is understood that the aforementioned housing 50 is the housing 50 of the refrigeration device 100. The housing 50 is provided with a receiving cavity 51, and the heat collection element 20, heat dissipation element 30, and driving element 40 are arranged in the receiving cavity 51. In this way, the driving element 40 can drive the airflow in the housing 50 to flow at a relatively high speed to remove the cold energy on the heat dissipation element 30, thereby rapidly cooling the airflow in the housing 50, thus significantly reducing the temperature inside the housing 50.

[0054] Please see Figure 2 In some embodiments, the housing 50 is provided with an air inlet 52 and an air outlet 53;

[0055] Both the air inlet 52 and the air outlet 53 are connected to the accommodating cavity 51. The driving member 40 drives the airflow to enter the accommodating cavity 51 from the air inlet 52 and exit from the air outlet 53.

[0056] Understandably, an air inlet 52 and an air outlet 53 are provided on the housing 50. In this way, the airflow can enter the housing through the air inlet 52 under the action of the drive component 40. After being cooled by the heat dissipation component 30, the airflow is discharged through the air outlet 53. This can lower the temperature inside the refrigeration equipment 100, thereby achieving the purpose and effect of cooling inside the refrigeration equipment 100. This can lower the temperature inside the refrigeration equipment 100 and transfer the temperature to the storage chamber 62 for concentration. This can make the temperature of the storage chamber 62 relatively low, thereby achieving the effect of cooling the refrigeration equipment 100.

[0057] In this process, after the airflow passes through the storage chamber 62 in the flow channel 33, the airflow can return to the air inlet 52 by setting many small holes on the side wall of the storage chamber 62, so that the heat-dissipating element can exchange heat with the airflow again and the airflow has a lower temperature.

[0058] Please see Figure 6 In some embodiments, it also includes: a heat pipe 60 and a condenser 61;

[0059] The refrigeration equipment 100 has a storage chamber 62, the condenser 61 is disposed near the storage chamber 62, or the condenser 61 is disposed in the storage chamber 62, both ends of the heat pipe 60 are connected to the accommodating cavity 51, and the driving member 40 drives the airflow to flow in the heat pipe 60; the condenser 61 is disposed on the heat pipe 60.

[0060] Understandably, the refrigeration equipment 100 includes a storage compartment 62. The condenser 61 is placed inside or near the storage compartment 62. When the condenser 61 receives cooling energy, this energy can be directly discharged into the storage compartment 62, allowing the storage compartment 62 to quickly receive more cooling. This rapidly reduces the cooling rate of the storage compartment 62, significantly improving the refrigeration efficiency of the refrigeration equipment 100 and helping to better maintain the freshness of the food inside. Furthermore, placing the condenser 61 close to the storage compartment 62 reduces cooling loss, further lowering the energy consumption of the refrigeration equipment 100 and achieving energy-saving and environmentally friendly effects.

[0061] Please see Figure 3 and Figure 4 In some embodiments, the heat sink 30 includes a plurality of heat sink fins 32;

[0062] The plurality of heat dissipation fins 32 are spaced apart along a first direction, and a flow channel 33 is formed between two adjacent heat dissipation fins 32. The driving member 40 is used to drive airflow to flow through the flow channel 33.

[0063] Understandably, the heat sink 30 includes multiple heat sink fins 32, which are spaced apart along a first direction. A flow channel 33 is formed between two adjacent heat sink fins 32 to allow airflow. In order to enable the heat sink fins 32 to have a better cooling effect, the drive member 40 is set in the recess 31. When the drive member 40 drives the airflow, the airflow can pass through the flow channel 33 between two adjacent heat sink fins 32. In this way, the airflow can be cooled by the heat sink fins 32. As the drive member 40 continues to work, the airflow in the housing 50 is gradually cooled, and then most of the airflow in the housing 50 is cooled, thereby reducing the overall temperature in the cooling device 100. In this way, the cooling device 100 can generate energy and achieve cooling.

[0064] Please see Figure 6 In some embodiments, it also includes: a plurality of support members 70;

[0065] The support member 70 is spaced apart within the housing 50 along the length direction of the housing 50, and there is a flow channel 33 between the support member 70 and the housing 50 to allow airflow.

[0066] Understandably, multiple support members 70 are provided inside the housing 50. The support members 70 are located inside the housing 50, which can divide the housing 50 into multiple installation parts 72. Each installation part 72 can install a phase change energy storage device 10. This allows more phase change energy storage devices 10 to be installed and stored inside the housing, thereby increasing the overall cooling capacity of the refrigeration equipment 100. This enables the refrigeration equipment 100 to be used for a longer period of time, and also allows the refrigeration equipment 100 to achieve rapid cooling during the initial cooling process, thereby improving the cooling effect and cooling time of the refrigeration equipment 100.

[0067] Please see Figure 7 In some embodiments, it also includes: a semiconductor cooler 71 and a heat-conducting component 80;

[0068] The semiconductor cooler 71 and the heat-conducting component 80 are disposed within the refrigeration device 100. The semiconductor cooler 71 has a cooling surface 711 and a heating surface 712. The heating surface 712 is disposed close to the side wall of the refrigeration device 100. The cooling surface 711 is connected to the heat-conducting component 80, and the heat-conducting component 80 is connected to the heat collector 20.

[0069] Understandably, a semiconductor cooler 71 and a heat-conducting component 80 are also provided in the refrigeration device 100. The semiconductor cooler 71 has a cooling surface 711 and a heating surface 712, wherein the cooling surface 711 is used to generate cold energy and the heating surface 712 is used to generate heat energy. In this embodiment, the cold energy generated by the semiconductor cooler is used to store energy in the phase change energy storage device 10. In order to dissipate the heat generated by the semiconductor cooler 71, the heating surface 712 of the semiconductor cooler 71 is placed close to the side wall of the refrigeration device 100, and the cooling surface 711 is connected to the heat-conducting component 80. The other end of the heat-conducting component 80 is connected to the heat collector 20. In this way, the cold energy generated by the semiconductor cooler 71 can be conducted to the phase change energy storage device 10 through the heat-conducting component 80. When the phase change energy storage device 10 stops cooling, it can absorb the cold energy on the heat collector 20 for energy storage, thus enabling the phase change energy storage device 10 to complete energy replenishment.

[0070] Please see Figure 7 In some embodiments, the heat-conducting component 80 includes: a heat-conducting plate 81 and a heat-conducting element 82;

[0071] The heat-conducting plate 81 is attached to the cooling surface 711, one end of the heat-conducting element 82 is connected to the heat-conducting plate 81, and the other end of the heat-conducting element 82 is connected to the heat-collecting element 20;

[0072] The heat-conducting plate 81 is used to collect the cold energy of the cooling surface 711 and transfer it to the heat collector 20 through the heat-conducting component 82.

[0073] Understandably, the heat-conducting component 80 includes a heat-conducting plate 81 and a heat-conducting element 82. The heat-conducting plate 81 is attached to the cooling surface 711, which allows the heat-conducting plate 81 to absorb the heat from the phase change energy storage device 10. The heat-conducting element 82 is connected to the heat-conducting plate 81, and the heat generated on the heat-conducting plate 81 is transferred to the heat collector 20 through the heat-conducting element 82. The heat-conducting element 82 is also connected to the heat collector 20, which can transfer the heat from the heat-conducting plate 81 to the heat collector 20. This reduces the loss of cold energy during the transfer process and allows more cold energy to be transferred to the heat collector 20, so that the phase change energy storage device 10 can better absorb cold energy for energy storage, thereby improving the energy storage efficiency of the phase change energy storage device 10.

[0074] Please see Figure 7 In some embodiments, the outer side wall of the housing 50 is provided with a heat insulation layer 90.

[0075] Understandably, a heat insulation layer 90 is provided on the outer wall of the housing 50. The heat insulation layer 90 can isolate the temperature between the housing 50 and the refrigeration equipment 100. When the temperature inside the housing 50 is low and the temperature outside the housing 50 is high, the heat insulation layer 90 can prevent the cold energy inside the housing 50 from leaking out, reduce the loss of cold energy in the housing 50, reduce energy waste, and also enable the refrigeration equipment 100 to have a better cooling capacity when the condenser 61 is cooling.

[0076] In some embodiments, the phase change energy storage device 10 can be sodium acetate trihydrate or paraffin wax, which is prepared by microencapsulation technology, that is, encapsulating the phase change material in tiny capsules.

[0077] When the phase change energy storage device 10 absorbs heat, the ambient temperature rises to the phase change temperature of the phase change material, at which point the phase change material inside the capsule begins to absorb heat. The heat absorbed by the phase change material causes it to change from a solid to a liquid state; this process is called melting. During this process, the temperature of the phase change material inside the capsule remains relatively constant because the absorbed heat is used to overcome intermolecular forces rather than to raise the temperature.

[0078] When the phase change energy storage device 10 releases heat, the liquid phase change material inside the capsule begins to release heat when the ambient temperature drops below the phase change temperature of the phase change material. The phase change material releases heat and changes from a liquid to a solid state; this process is called solidification. Similarly, the temperature remains relatively constant during this process.

[0079] In this utility model, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The appearance of these phrases in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this utility model can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this utility model can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. A refrigeration device, characterized in that, include: Phase change energy storage devices, heat collectors, and heat dissipation devices; The heat collector and the heat sink are both disposed in the refrigeration equipment. The heat collector is connected to the heat sink. A heat collection section is disposed on the side of the heat collector away from the heat sink. The phase change energy storage device is disposed in the heat collection section. The heat collector is used to absorb the cold energy of the phase change energy storage device, and the heat dissipation device is used to dissipate the cold energy of the heat collector.

2. The refrigeration equipment according to claim 1, characterized in that, Also includes: Drive components; The heat sink has a recessed portion, and the driving component is disposed within the recessed portion. The driving component is used to drive airflow within the refrigeration equipment.

3. The refrigeration equipment according to claim 2, characterized in that, Also includes: case; The housing is disposed in the refrigeration equipment, and the housing has a receiving cavity, in which the heat collection element, the heat dissipation element, and the driving element are all disposed.

4. The refrigeration equipment according to claim 3, characterized in that, The housing is provided with an air inlet and an air outlet; Both the air inlet and the air outlet are connected to the accommodating cavity. The driving member drives the airflow to enter the accommodating cavity from the air inlet and exit from the air outlet.

5. The refrigeration equipment according to claim 3, characterized in that, Also includes: Heat pipes, condensers; The refrigeration equipment has a storage chamber, the condenser is located near the storage chamber or is located in the storage chamber, both ends of the heat pipe are connected to the accommodating cavity, and the driving element drives the airflow to flow in the heat pipe; the condenser is located on the heat pipe.

6. The refrigeration equipment according to claim 5, characterized in that, The heat sink includes: multiple heat dissipation fins; The plurality of heat dissipation fins are spaced apart along a first direction, and a flow channel is formed between two adjacent heat dissipation fins. The driving member is used to drive airflow to flow through the flow channel.

7. The refrigeration equipment according to claim 3, characterized in that, Also includes: Multiple support components; The support members are spaced apart within the housing along the length of the housing, and a mounting portion is formed between the plurality of support members.

8. The refrigeration equipment according to claim 7, characterized in that, Also includes: Semiconductor coolers, heat-conducting components; The semiconductor cooler and the heat-conducting component are disposed within the refrigeration equipment. The semiconductor cooler has a cooling surface and a heating surface. The heating surface is disposed near the side wall of the refrigeration equipment. The cooling surface is connected to the heat-conducting component, and the heat-conducting component is connected to the heat collector.

9. The refrigeration equipment according to claim 8, characterized in that, The heat-conducting component includes: a heat-conducting plate and a heat-conducting element; The heat-conducting plate is attached to the cooling surface, one end of the heat-conducting element is connected to the heat-conducting plate, and the other end of the heat-conducting element is connected to the heat-collecting element; The heat-conducting plate is used to collect the cold energy from the cooling surface and transfer it to the heat collector through the heat-conducting component.

10. The refrigeration equipment according to claim 9, characterized in that, The outer wall of the housing is provided with a heat insulation layer.

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