Heat exchange device

Abstract

The utility model relates to a kind of heat exchange equipment.The heat exchange equipment includes: phase-change energy storage, heat collecting part, heat dissipating part, supporting member;The heat collecting part, the heat dissipating part are all arranged in the heat exchange equipment, the heat collecting part is connected with the heat dissipating part, the heat collecting part is provided with heat collecting portion on the side away from the heat dissipating part, the supporting member is detachably connected with the heat collecting portion, the phase-change energy storage is arranged in the supporting member;Wherein, the heat collecting part is used to absorb the heat of the phase-change energy storage, and the heat dissipating part is used to disperse the heat of the heat collecting part.The heat exchange equipment can improve the refrigeration time of heat exchange equipment.

Description

Technical Field

[0001] This utility model relates to the field of heat exchange equipment, and specifically to a heat exchange device. Background Technology

[0002] An air conditioner is a small air conditioning unit that can regulate the air in a space to maintain a certain temperature, humidity, airflow speed, cleanliness, and freshness. Currently, refrigerators in related technologies use a compressor to perform work on the refrigeration system. The refrigeration system utilizes a low-boiling-point refrigerant, which absorbs cold energy during evaporation and vaporization; or it releases cold energy through phase change energy storage devices. However, the phase change energy storage devices in current related technologies cannot be replaced, resulting in a relatively short cooling time. Utility Model Content

[0003] Therefore, this utility model provides a heat exchange device. The heat exchange device can improve the cooling time of a heat exchanger.

[0004] This utility model provides the following technical solution:

[0005] A heat exchange device includes: a phase change energy storage component, a heat collector, a heat dissipation component, and a support component;

[0006] The heat collector and the heat dissipation component are both installed in the heat exchange equipment. The heat collector is connected to the heat dissipation component. A heat collection part is provided on the side of the heat collector away from the heat dissipation component. The support component is detachably connected to the heat collection part. The phase change energy storage component is installed in the support component.

[0007] The heat collector is used to absorb the heat from the phase change energy storage device, and the heat dissipation device is used to dissipate the heat from the heat collector.

[0008] Furthermore, it also includes: the shell;

[0009] The housing has a receiving cavity, and the heat collection element, the heat dissipation element, the support element, and the phase change energy storage element are all disposed in the receiving cavity;

[0010] An opening is provided on one side of the housing, and a baffle is provided inside the opening. The baffle is movably mounted on the housing.

[0011] Furthermore, the heat collection component divides the accommodating cavity into a first cavity and a second cavity, the first cavity and the second cavity are connected, and the baffle is disposed close to the first cavity; an air inlet is disposed in the first cavity, and an air outlet is disposed in the second cavity;

[0012] The phase change energy storage device is located in the first cavity, and the heat dissipation device is located in the second cavity.

[0013] Furthermore, it also includes: driving components;

[0014] The driving component is disposed in the accommodating cavity. The heat dissipation component has a recessed portion on the side away from the heat collector. The driving component is disposed in the recessed portion. The driving component is used to drive airflow from the air inlet into the accommodating cavity and out from the air outlet. The driving component is located in the second cavity.

[0015] Furthermore, the air intake volume of the air inlet is greater than the air outlet volume of the air outlet.

[0016] Furthermore, the heat sink includes: a plurality of heat dissipation fins;

[0017] The plurality of heat dissipation fins are spaced apart along a first direction, and a flow channel is formed between two adjacent heat dissipation fins. The driving member is used to drive airflow to flow through the flow channel.

[0018] Furthermore, it also includes: semiconductor coolers and heat-conducting components;

[0019] The semiconductor cooler and the heat-conducting component are disposed within the heat exchange equipment. The semiconductor cooler has a cooling surface and a heating surface. The heating surface is disposed close to the side wall of the heat exchange equipment. The cooling surface is connected to the heat-conducting component, and the heat-conducting component is connected to the heat collector.

[0020] Furthermore, the heat-conducting component includes: a heat-conducting plate and a heat-conducting element;

[0021] The heat-conducting plate is attached to the cooling surface, one end of the heat-conducting element is connected to the heat-conducting plate, and the other end of the heat-conducting element is connected to the heat-collecting element;

[0022] The heat-conducting plate is used to collect the heat from the cooling surface and transfer it to the heat collector through the heat-conducting component.

[0023] Furthermore, both the heat-conducting plate and the heat-conducting component are made of materials with high thermal conductivity.

[0024] Furthermore, the outer wall of the housing is provided with a heat insulation element.

[0025] The aforementioned heat exchange equipment incorporates a heat collector, which in turn houses a heat collection section. A support structure containing numerous phase change energy storage components is then installed on the heat collection section. This support structure releases energy, which is collected by the heat collector. The energy is then dissipated into the heat exchange equipment via a heat dissipation component. Airflow circulation within the heat exchange equipment transfers the cooling capacity to the indoor air, thus lowering the indoor temperature. Once the phase change energy storage components have exhausted their cooling capacity, the support structure can be removed from the heat collector section and replaced with a new phase change energy storage component to continue cooling. This extends the cooling duration of the heat exchange equipment and improves its cooling efficiency after replacing the phase change energy storage component. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 One of the structural schematic diagrams of the heat exchange device provided in the embodiment of this utility model;

[0028] Figure 2 A second schematic diagram of the structure of the heat exchange device provided in this embodiment of the utility model;

[0029] Figure 3 The third schematic diagram of the heat exchange device provided in the embodiment of this utility model;

[0030] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0031] Figure 5 This is a schematic diagram of the structure of the driving component and the heat exchange component provided in the embodiment of this utility model;

[0032] Figure 6 for Figure 5 Enlarged view of point B in the middle;

[0033] Figure 7 The fourth schematic diagram of the heat exchange device provided in the embodiment of this utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100-Heat exchange equipment; 10-Phase change energy storage component; 20-Heat collector; 21-Heat collection section; 30-Heat dissipation component; 31-Heat dissipation fins; 32-Flow channel; 33-Recess; 40-Shell; 41-Accommodation cavity; 42-First cavity; 43-Second cavity; 44-Air inlet; 45-Air outlet; 46-Baffle; 50-Support component; 60-Semiconductor cooler; 61-Cooling surface; 62-Heating surface; 70-Heat conducting component; 71-Heat conducting plate; 72-Heat conducting component; 80-Insulation component; 90-Drive component. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0038] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0039] Heat exchange equipment is a small air conditioner that can regulate the air in a space to maintain a certain temperature, humidity, airflow speed, cleanliness, and freshness. Currently, refrigerators in related technologies use a compressor to perform work on the refrigeration system. The refrigeration system utilizes a low-boiling-point refrigerant, which absorbs cold energy during evaporation and vaporization; or it releases cold energy through phase change energy storage devices. However, the phase change energy storage devices in current related technologies cannot be replaced, resulting in a relatively short cooling time.

[0040] Therefore, this embodiment provides a heat exchange device 100. The heat exchange device 100 can improve the cooling time of the heat exchange device 100.

[0041] Please see Figure 1 A heat exchange device 100, comprising a phase change energy storage component 10, a heat collector 20, a heat dissipation component 30, and a support component 50;

[0042] The heat collector 20 and the heat sink 30 are both disposed in the heat exchange device 100. The heat collector 20 is connected to the heat sink 30. A heat collection part 21 is disposed on the side of the heat collector 20 away from the heat sink 30. The support member 50 is detachably connected to the heat collection part 21. The phase change energy storage device 10 is disposed in the support member 50.

[0043] The heat collector 20 is used to absorb the heat from the phase change energy storage device 10, and the heat dissipation device 30 is used to dissipate the heat from the heat collector 20.

[0044] The aforementioned heat exchange device 100 includes a heat collector 20, a heat collector section 21 on the heat collector 20, and a support member 50 with multiple phase change energy storage elements 10 mounted on the heat collector section 21. The support member 50 can release energy and collect energy through the heat collector 20. The energy on the collected element is then dissipated into the heat exchange device 100 through the heat dissipation element 30. The airflow circulation in the heat exchange device 100 can transfer the cooling capacity inside the heat exchange device 100 to the indoor air, thereby cooling the room and achieving a cooling effect. After the phase change energy storage element 10 has released all its cooling capacity, the support member 50 can be removed from the heat collector section 21 and replaced with a new phase change energy storage element 10 to continue cooling. This extends the cooling time of the heat exchange device 100 and also improves the cooling effect of the heat exchange device 100 after replacing the phase change energy storage element 10.

[0045] Understandably, a heat collector 20 is provided in the heat exchanger 100, and a heat collection section 21 is provided on the heat collector 20. A phase change energy storage device 10 is installed on the heat collection section 21. After the phase change energy storage device 10 releases cold energy, the heat collector 20, which is close to the phase change energy storage device 10, can absorb the cold energy released by the phase change energy storage device 10. After absorbing the cold energy, the heat collector 20 conducts the cold energy to the heat dissipation device 30, so that the heat dissipation device 30 can release the cold energy. After the cold energy is released, it can cool the airflow in the heat exchanger 100. When the airflow in the heat exchanger 100 circulates, it can lower the indoor temperature, thus achieving the purpose of regulating the air temperature. The heat exchange device 100 of this utility model does not have an outdoor unit. Cooling can be achieved simply by installing the above-mentioned components indoors. Therefore, there is no need for a compressor and related refrigerant. Thus, the heat exchange device 100 will not generate additional cooling capacity. At the same time, the heat exchange device 100 can be used normally even without being plugged in, as long as the phase change energy storage device 10 has energy. This can also reduce the consumption of electricity.

[0046] Please see Figure 1 and Figure 2 In some embodiments, it further includes: a housing 40;

[0047] The housing 40 has a receiving cavity 41, and the heat collection element 20, the heat dissipation element 30, the support element 50, and the phase change energy storage element 10 are all disposed in the receiving cavity 41.

[0048] An opening is provided on one side of the housing 40, and a baffle 46 is provided inside the opening. The baffle 46 is movably disposed on the housing 40.

[0049] Understandably, the aforementioned housing 40 is the outer shell of the heat exchanger 100. The interior of the housing 40 has a receiving cavity 41, in which the heat dissipation component 30, the heat collector 20, the support component 50, and the phase change energy storage component 10 are all disposed. An opening is provided on one side of the housing 40, and a baffle 46 is provided in the opening. The baffle 46 is hinged and movable in the opening, allowing it to rotate within the opening. When the baffle 46 rotates in the opening, the housing 40 is opened, at which point the support component 50 and the phase change energy storage component 10 disposed in the support component 50 can be replaced, thus enabling the replacement of the phase change energy storage component 10.

[0050] Please see Figure 2 In some embodiments, the heat collector 20 divides the accommodating cavity 41 into a first cavity 42 and a second cavity 43, the first cavity 42 and the second cavity 43 are connected, and the baffle 46 is disposed close to the first cavity; an air inlet 44 is disposed in the first cavity 42, and an air outlet 45 is disposed in the second cavity 43.

[0051] The phase change energy storage device 10 is located in the first cavity, and the heat dissipation device 30 is located in the second cavity.

[0052] Understandably, the heat collector 20 is vertically disposed within the housing 40, thus dividing the accommodating cavity 41 into a first cavity 42 and a second cavity 43, with the first cavity 42 and the second cavity 43 connected. This allows the airflow in the first cavity to exchange heat with the airflow in the second cavity. The aforementioned baffle 46 is disposed in the first cavity, facilitating the removal of the support member 50 from the housing 40 after the baffle 46 is opened.

[0053] Understandably, an air inlet 44 is provided in the first cavity 42, and an air outlet 45 is provided in the second cavity 43. In this way, airflow can enter the first cavity through the air inlet 44. When the airflow enters the first cavity, it can exchange heat with the phase change energy storage device 10 when it flows through the phase change energy storage device 10 in the first cavity to initially cool the airflow. Then, the airflow flows to the heat dissipation device 30 in the second cavity to cool the airflow. After that, the cooled airflow is discharged into the room through the air outlet 45 to cool the room and thus achieve the purpose of air temperature regulation.

[0054] Please see Figure 2 In some embodiments, the air intake volume of the air inlet 44 is greater than the air outlet volume of the air outlet 45.

[0055] Understandably, the air intake volume of the air inlet 44 is greater than the air outlet volume of the air outlet 45. This creates a positive pressure environment inside the accommodating cavity 41, which accelerates the airflow within the accommodating cavity 41, thereby increasing the airflow velocity in the room and causing the room temperature to drop more quickly. This, in turn, improves the cooling effect of the heat exchange equipment 100.

[0056] Please see Figure 3 and Figure 4 In some embodiments, it further includes: a drive element 90;

[0057] The driving member 90 is disposed in the accommodating cavity 41. The heat dissipation member 30 has a recessed portion 33 on the side away from the heat collector 20. The driving member 90 is disposed in the recessed portion 33. The driving member 90 is used to drive the airflow from the air inlet 44 into the accommodating cavity 41 and out from the air outlet 45.

[0058] Understandably, the heat exchanger 100 also includes a drive component 90. The drive component 90 is used to accelerate the airflow within the housing 40. To improve the heat dissipation effect of the drive component 90, a recess 33 is provided on the heat sink 30, and the drive component 90 is positioned within the recess 33. The drive component 90 drives the airflow circulation near the heat sink 30, thereby allowing the airflow near the heat sink 30 to be cooled by the heat sink 30 more quickly. Simultaneously, it also allows the temperature of the heat sink 30 to drop rapidly, enabling the cooling energy of the heat conduction element 72 to be transferred to the heat sink 30 more quickly, thus accelerating the heat exchange efficiency of the heat exchanger. Specifically, when the drive component 90 is working, the airflow enters the accommodating cavity 41 through the air inlet 44 for heat exchange and cooling, and then exits through the air outlet 45. The drive component 90's placement within the recess 33 allows more airflow to pass through the heat sink 30 when driving the airflow, thus improving the heat dissipation effect of the heat sink 30.

[0059] Please see Figure 5 and Figure 6 In some embodiments, the heat sink 30 includes a plurality of heat sink fins 31;

[0060] The plurality of heat dissipation fins 31 are along a first direction (e.g.) Figure 5 or Figure 6 The heat dissipation fins 31 are spaced apart (as shown in the top-to-bottom direction), and a flow channel 32 is formed between two adjacent heat dissipation fins 31. The drive member 90 is used to drive airflow from the flow channel 32.

[0061] Understandably, the heat sink 30 includes multiple heat dissipation fins 31, which are spaced apart along a first direction. A flow channel 32 is formed between adjacent heat dissipation fins 31, allowing airflow to pass through, thus improving the cooling effect of the heat dissipation fins 31. When the driving component 90 drives the airflow, the airflow can pass through the flow channel 32 between adjacent heat dissipation fins 31, allowing the airflow to be cooled by the heat dissipation fins 31. Since the airflow flows over the surfaces of the two heat dissipation fins 31, it has a larger cooling area, enabling rapid cooling and further improving the cooling effect of the heat dissipation fins 31, thereby enhancing the cooling efficiency of the heat sink 30.

[0062] Please see Figure 7 In some embodiments, it also includes: a semiconductor cooler 60 and a heat-conducting component 70;

[0063] The semiconductor cooler 60 and the heat-conducting component 70 are disposed within the heat exchange device 100. The semiconductor cooler 60 has a cooling surface 61 and a heating surface 62. The heating surface 62 is disposed close to the side wall of the heat exchange device 100. The cooling surface 61 is connected to the heat-conducting component 70, and the heat-conducting component 70 is connected to the heat collector 20.

[0064] Understandably, a semiconductor cooler 60 and a heat-conducting component 70 are also provided in the heat exchange device 100. The semiconductor cooler 60 has a cooling surface 61 and a heating surface 62, wherein the cooling surface 61 is used to generate cold energy and the heating surface 62 is used to generate heat energy. In this embodiment, the cold energy generated by the semiconductor cooler is used to store energy in the phase change energy storage device 10. In order to dissipate the heat generated by the semiconductor cooler 60, the heating surface 62 of the semiconductor cooler 60 is placed close to the side wall of the heat exchange device 100, and the cooling surface 61 is connected to the heat-conducting component 70. The other end of the heat-conducting component 70 is connected to the heat collector 20. In this way, the cold energy generated by the semiconductor cooler 60 can be conducted to the phase change energy storage device 10 through the heat-conducting component 70. When the phase change energy storage device 10 stops releasing cold energy, it can absorb the cold energy on the heat collector 20 for energy storage, thus enabling the phase change energy storage device 10 to complete energy replenishment.

[0065] Please see Figure 7 In some embodiments, the heat-conducting component 70 includes: a heat-conducting plate 71 and a heat-conducting element 72;

[0066] The heat-conducting plate 71 is attached to the cooling surface 61, one end of the heat-conducting element 72 is connected to the heat-conducting plate 71, and the other end of the heat-conducting element 72 is connected to the heat-collecting element 20;

[0067] The heat-conducting plate 71 is used to collect the heat from the cooling surface 61 and transfer it to the heat collector 20 through the heat-conducting component 72.

[0068] Understandably, the heat-conducting component 70 includes a heat-conducting plate 71 and a heat-conducting element 72. The heat-conducting plate 71 is attached to the cooling surface 61, which allows the heat-conducting plate 71 to absorb the heat from the phase change energy storage device 10. The heat-conducting element 72 is connected to the heat-conducting plate 71, and the heat generated on the heat-conducting plate 71 is transferred to the heat collector 20 through the heat-conducting element 72. The heat-conducting element 72 is also connected to the heat collector 20, which can transfer the heat from the heat-conducting plate 71 to the heat collector 20. This reduces the loss of cold energy during the transfer process and allows more cold energy to be transferred to the heat collector 20, so that the phase change energy storage device 10 can better absorb cold energy for energy storage, thereby improving the energy storage efficiency of the phase change energy storage device 10.

[0069] In some embodiments, both the heat-conducting plate 71 and the heat-conducting element 72 are made of a material with high thermal conductivity.

[0070] Understandably, using materials with high thermal conductivity for both the heat-conducting plate 71 and the heat-conducting component 72 enables the cooling capacity of the phase change energy storage component 10 to be quickly transferred to the heat dissipation component 30. This accelerates energy transfer, reduces energy loss during the transfer process, and improves the heat dissipation and cooling efficiency of the heat exchange device 100.

[0071] Please see Figure 7 In some embodiments, the sidewall of the housing 40 is provided with a heat insulation element 80.

[0072] Understandably, a heat insulation component 80 is provided on the side wall of the shell 40. The heat insulation component 80 can be provided on the inner side wall of the heat exchange device 100 or on the outer side wall of the heat exchange device 100. The heat insulation component 80 can isolate the shell 40 from the temperature inside the refrigerator. When the temperature inside the shell 40 is low and the temperature outside the shell 40 is high, the heat insulation component 80 can prevent the cold air inside the shell 40 from leaking out, reduce the loss of cold air in the shell 40, reduce energy waste, and also enable the condenser to have better cooling capacity when the refrigerator is cooling.

[0073] In some embodiments, the phase change energy storage device 10 can be sodium acetate trihydrate or paraffin wax, which is prepared by microencapsulation technology, that is, encapsulating the phase change material in tiny capsules.

[0074] When the phase change energy storage device 10 absorbs heat, the ambient temperature rises to the phase change temperature of the phase change material, at which point the phase change material inside the capsule begins to absorb heat. The heat absorbed by the phase change material causes it to change from a solid to a liquid state; this process is called melting. During this process, the temperature of the phase change material inside the capsule remains relatively constant because the absorbed heat is used to overcome intermolecular forces rather than to raise the temperature.

[0075] When the phase change energy storage device 10 releases heat, the liquid phase change material inside the capsule begins to release heat when the ambient temperature drops below the phase change temperature of the phase change material. The phase change material releases heat and changes from a liquid to a solid state; this process is called solidification. Similarly, the temperature remains relatively constant during this process.

[0076] In this utility model, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The appearance of these phrases in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this utility model can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this utility model can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. A heat exchange device, characterized in that, include: Phase change energy storage components, heat collectors, heat dissipation components, and support components; The heat collector and the heat dissipation component are both installed in the heat exchange equipment. The heat collector is connected to the heat dissipation component. A heat collection part is provided on the side of the heat collector away from the heat dissipation component. The support component is detachably connected to the heat collection part. The phase change energy storage component is installed in the support component. The heat collector is used to absorb the heat from the phase change energy storage device, and the heat dissipation device is used to dissipate the heat from the heat collector.

2. The heat exchange device according to claim 1, characterized in that, Also includes: case; The housing has a receiving cavity, and the heat collection element, the heat dissipation element, the support element, and the phase change energy storage element are all disposed in the receiving cavity; An opening is provided on one side of the housing, and a baffle is provided inside the opening. The baffle is movably mounted on the housing.

3. The heat exchange device according to claim 2, characterized in that, The heat collection component divides the accommodating cavity into a first cavity and a second cavity, the first cavity and the second cavity are connected, and the baffle is disposed close to the first cavity; an air inlet is disposed in the first cavity and an air outlet is disposed in the second cavity; The phase change energy storage device is located in the first cavity, and the heat dissipation device is located in the second cavity.

4. The heat exchange device according to claim 3, characterized in that, Also includes: Drive components; The driving component is disposed in the accommodating cavity. The heat dissipation component has a recessed portion on the side away from the heat collector. The driving component is disposed in the recessed portion. The driving component is used to drive airflow from the air inlet into the accommodating cavity and out from the air outlet. The driving component is located in the second cavity.

5. The heat exchange device according to claim 4, characterized in that, The air intake volume of the air inlet is greater than the air outlet volume of the air outlet.

6. The heat exchange device according to claim 4, characterized in that, The heat sink includes: multiple heat dissipation fins; The plurality of heat dissipation fins are spaced apart along a first direction, and a flow channel is formed between two adjacent heat dissipation fins. The driving member is used to drive airflow to flow through the flow channel.

7. The heat exchange device according to claim 1, characterized in that, Also includes: Semiconductor coolers, heat-conducting components; The semiconductor cooler and the heat-conducting component are disposed within the heat exchange equipment. The semiconductor cooler has a cooling surface and a heating surface. The heating surface is disposed close to the side wall of the heat exchange equipment. The cooling surface is connected to the heat-conducting component, and the heat-conducting component is connected to the heat collector.

8. The heat exchange device according to claim 7, characterized in that, The heat-conducting component includes: a heat-conducting plate and a heat-conducting element; The heat-conducting plate is attached to the cooling surface, one end of the heat-conducting element is connected to the heat-conducting plate, and the other end of the heat-conducting element is connected to the heat-collecting element; The heat-conducting plate is used to collect the heat from the cooling surface and transfer it to the heat collector through the heat-conducting component.

9. The heat exchange device according to claim 8, characterized in that, Both the heat-conducting plate and the heat-conducting component are made of materials with high thermal conductivity.

10. The heat exchange device according to claim 2, characterized in that, The outer wall of the housing is provided with a heat insulation component.

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