An interface plate for a modular raman spectroscopy detection device

By dividing the Raman spectrometer interface board into a power supply area and a logic function area, and centrally distributing the power supply and data interfaces, the problems of uneven heat dissipation and inconsistent data transmission in the existing technology are solved, achieving the effects of efficient heat dissipation and convenient data transmission.

CN224303545UActive Publication Date: 2026-05-29SHENMIN BIOTECHNOLOGY (JIANGXI) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENMIN BIOTECHNOLOGY (JIANGXI) CO LTD
Filing Date
2025-05-28
Publication Date
2026-05-29

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    Figure CN224303545U_ABST
Patent Text Reader

Abstract

The utility model provides a modularization raman spectrum detection device's interface board, including circuit board carrier, be respectively divided with power supply area and logic function area on the circuit board carrier, along the edge of circuit board carrier is provided with power access interface, LED lamp power supply interface, heat abstractor power supply interface, host computer power supply interface, laser generator power supply interface, motion platform wiring interface, host computer data interface, lower computer data interface, extension reserved interface and LED control interface, the abdomen of circuit board carrier is provided with treater. When using, the circuit board carrier is respectively divided with power supply area and logic function area, the heat will be concentrated in the logic function area when the interface board works, thereby only needs to concentrate in the logic function area when carrying out the heat dissipation, and the power supply area only needs to be accompanied by heat dissipation, reaches the effect that the heat dissipation is convenient.
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Description

Technical Field

[0001] This utility model relates to the field of Raman spectrometer technology, and in particular to an interface board for a modular Raman spectroscopy detection device. Background Technology

[0002] A Raman spectrometer is a medical instrument primarily used in research institutes, university physics and chemistry laboratories, and in the fields of biology and medicine for the determination and identification of the composition of substances.

[0003] A Raman spectrometer internally includes a Raman spectrometer, a Raman head, a laser generator, etc., and achieves signal exchange and power supply through connection with an external host computer. Therefore, an interface board is required to connect multiple devices.

[0004] The interface boards inside existing Raman spectrometers are mostly prefabricated boards with overlapping functional and power supply areas. This results in excessively dispersed heat generation on the interface board, requiring large-area heat dissipation for cooling. Furthermore, the overlapping of functional and power supply areas leads to inconsistent distances between the processor and each interface, resulting in significant deviations in data transmission rates.

[0005] Therefore, this application proposes an interface board for a modular Raman spectroscopy detection device, which facilitates heat dissipation of the interface board and keeps the positions of the processor and each interface basically consistent. Utility Model Content

[0006] In view of the shortcomings of the prior art mentioned above, the purpose of this utility model is to provide an interface board for a modular Raman spectroscopy detection device to solve the problem of inconvenience in use mentioned in the prior art.

[0007] To achieve the above and other related objectives, this utility model provides an interface board for a modular Raman spectroscopy detection device, including a circuit board carrier, wherein the circuit board carrier is divided into a power supply area and a logic function area.

[0008] Along the edge of the circuit board carrier, there are power input interface, LED power supply interface, heat dissipation device power supply interface, host computer power supply interface, laser generator power supply interface, motion platform wiring interface, host computer data interface, slave computer data interface, expansion reserved interface and LED control interface respectively. The processor is located on the belly of the circuit board carrier.

[0009] The power input interface, LED light power supply interface, heat dissipation device power supply interface, host computer power supply interface, and laser generator power supply interface are located in the power supply area.

[0010] The motion platform wiring interface, host computer data interface, slave computer data interface, expansion reserved interface, LED control interface, and processor are located in the logical function area.

[0011] The power input interfaces supply power to the LED light power supply interface, the heat dissipation device power supply interface, the host computer power supply interface, the laser generator power supply interface, the motion platform wiring interface, the LED control interface, and the processor, respectively.

[0012] Preferably, the power input interface, LED lamp power supply interface, heat dissipation device power supply interface, host computer power supply interface, and laser generator power supply interface are centrally distributed, and the motion platform wiring interface, host computer data interface, slave computer data interface, expansion reserved interface, LED control interface, and processor are centrally distributed.

[0013] The motion platform has multiple wiring interfaces and expansion reserved interfaces, and each of the motion platform wiring interfaces and expansion reserved interfaces can transmit data independently.

[0014] Preferably, the power input interface, LED light power supply interface, heat dissipation device power supply interface, host computer power supply interface, and laser generator power supply interface are distributed along the edge of the power supply area, and a capacitor is provided in the middle of the power supply area to be connected to the power input interface, LED light power supply interface, heat dissipation device power supply interface, host computer power supply interface, and laser generator power supply interface respectively.

[0015] Preferably, the motion platform wiring interface, host computer data interface, slave computer data interface, expansion reserved interface, and LED control interface are distributed along the edge of the logical functional area, and the processor is located in the middle of the logical functional area. The motion platform wiring interface, host computer data interface, slave computer data interface, expansion reserved interface, and LED control interface are respectively connected to the corresponding processor.

[0016] Preferably, the number of wiring interfaces of the motion platform is not less than two.

[0017] Preferably, the number of the extended reserved interfaces is no less than two.

[0018] As described above, the interface board of the modular Raman spectroscopy detection device of this invention has the following beneficial effects:

[0019] This invention divides the circuit board carrier into a power supply area and a logic function area. When the interface board is working, the heat will be concentrated in the logic function area. Therefore, when dissipating heat, only the logic function area needs to be focused, while the power supply area only needs to be dissipated incidentally, thus achieving a convenient heat dissipation effect.

[0020] Meanwhile, the circuit board carrier is divided into a power supply area and a logic function area. The power input interface, LED power supply interface, heat dissipation device power supply interface, host computer power supply interface, and laser generator power supply interface are located in the power supply area, while the motion platform wiring interface, host computer data interface, slave computer data interface, expansion reserved interface, and LED control interface are located in the logic function area. During operation, the impact of high temperature on the power supply can be reduced, and centralized heat dissipation is also facilitated.

[0021] The power input interface, LED power supply interface, heat dissipation device power supply interface, host computer power supply interface, and laser generator power supply interface are centrally located. Similarly, the motion platform wiring interface, host computer data interface, slave computer data interface, expansion reserved interface, LED control interface, and processor are also centrally located, forming two functional areas. This separates power supply and logic processing, preventing interference and improving the ease of function expansion and interface soldering. Each interface is located at the edge of the circuit board, facilitating wiring and preventing lines from covering the circuit board. Multiple motion platform wiring interfaces and expansion reserved interfaces are provided, each capable of independent data transmission. During use, the various devices in the Raman spectroscopy detection device can be directly powered and transmit data via terminal plug-in, achieving a convenient user experience.

[0022] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value. Attached Figure Description

[0023] Figure 1 The diagram shown is a structural schematic of the interface board of this utility model.

[0024] Figure 2 The diagram shown is a schematic of the interface board with wiring structure of this utility model.

[0025] Figure 3 The diagram shows the interface board of this utility model installed in a Raman spectroscopy detection device.

[0026] Component designation explanation:

[0027] 1. Circuit board carrier; 101. Power supply area; 102. Logic function area;

[0028] 2. Power input interface; 3. LED light power supply interface; 4. Heat dissipation device power supply interface; 5. Host computer power supply interface; 6. Laser generator power supply interface; 7. Motion platform wiring interface; 8. Host computer data interface; 9. Sub-computer data interface; 10. Expansion reserved interface; 11. LED control interface; 12. Processor. Detailed Implementation

[0029] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0030] Please see Figures 1 to 3 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, the terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and are not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0031] like Figures 1-3 As shown, this utility model provides an interface board for a modular Raman spectroscopy detection device, including a circuit board carrier 1. Along the edge of the circuit board carrier 1 are respectively provided a power input interface 2, an LED power supply interface 3, a heat dissipation device power supply interface 4, a host computer power supply interface 5, a laser generator power supply interface 6, a motion platform wiring interface 7, a host computer data interface 8, a slave computer data interface 9, an expansion reserved interface 10, and an LED control interface 11. A processor 12 is provided on the underside of the circuit board carrier 1.

[0032] Power input interface 2, LED light power supply interface 3, heat dissipation device power supply interface 4, host computer power supply interface 5, and laser generator power supply interface 6 are centrally located to achieve centralized power supply. Motion platform wiring interface 7, host computer data interface 8, slave computer data interface 9, expansion reserved interface 10, LED control interface 11, and processor 12 are centrally located to achieve centralized data transmission. This facilitates maintenance and module soldering. Power input interface 2 supplies power to LED light power supply interface 3, heat dissipation device power supply interface 4, host computer power supply interface 5, laser generator power supply interface 6, motion platform wiring interface 7, LED control interface 11, and processor 12 respectively.

[0033] Specifically, power input interface 2 is used to connect to an external power supply to power the interface board. After the interface board receives power, the components on the circuit board carrier 1 transform the voltage and transmit it to the LED power supply interface 3, heat dissipation device power supply interface 4, host computer power supply interface 5, laser generator power supply interface 6, and motion platform wiring interface 7 according to the voltage requirements, thus powering the corresponding devices. Simultaneously, the data generated by the motion platform wiring interface 7, host computer data interface 8, slave computer data interface 9, expansion reserved interface 10, and LED control interface 11 are all processed and forwarded by the processor 12. The LED control interface 11 is used to control the color change of the LED lights on the Raman spectroscopy detection device used to indicate status through a logic program.

[0034] Multiple motion platform wiring interfaces 7 and multiple expansion reserved interfaces 10 are provided, and each motion platform wiring interface 7 and expansion reserved interface 10 can transmit data independently. The motion platform wiring interface 7 outputs 24V voltage to the motor in the motion platform to drive the motor to work. It also controls the motor's working logic according to the logic generated by the processor 12. The expansion reserved interface 10 contains paired input and output ports for functional expansion.

[0035] like Figure 1 and Figure 2 As shown, in some embodiments, the circuit board carrier 1 of this invention is divided into a power supply area 101 and a logic function area 102, thereby separating the power supply unit and the logic processing unit and reducing mutual interference. In particular, the logic processing unit generates a large amount of heat during operation. High heat leads to increased resistance during power supply and accelerates the aging of components. Centralizing the logic processing unit allows for convenient heat dissipation devices to concentrate heat dissipation from the heat points on the circuit board carrier 1, improving heat dissipation performance.

[0036] Specifically, power input interface 2, LED power supply interface 3, heat dissipation device power supply interface 4, host computer power supply interface 5, and laser generator power supply interface 6 are located in power supply area 101. This reduces the power transmission distance and minimizes losses during current delivery. Motion platform wiring interface 7, host computer data interface 8, slave computer data interface 9, expansion reserved interface 10, LED control interface 11, and processor 12 are located in logic function area 102. This reduces data transmission distance and improves data transmission efficiency.

[0037] like Figure 1 and Figure 2As shown, in some embodiments, the power input interface 2, LED power supply interface 3, heat dissipation device power supply interface 4, host computer power supply interface 5, and laser generator power supply interface 6 are distributed along the edge of the power supply area 101. This facilitates the connection of power jumpers and prevents the power jumpers from crossing over the circuit board carrier 1, which would weaken the heat dissipation of the circuit board carrier 1. It also facilitates the insertion and removal of power jumpers. A capacitor is provided in the middle of the power supply area 101, which is connected to the power input interface 2, LED power supply interface 3, heat dissipation device power supply interface 4, host computer power supply interface 5, and laser generator power supply interface 6 respectively. The capacitor isolates the current and couples the connections between components, thus protecting the circuit.

[0038] In some embodiments, the motion platform wiring interface 7, host computer data interface 8, slave computer data interface 9, expansion reserved interface 10, and LED control interface 11 are distributed along the edge of the logic functional area 102, facilitating data jumper connection and preventing data jumpers from crossing over the circuit board carrier 1 and causing heat accumulation. This also facilitates the insertion and removal of data jumpers and the installation of heat sinks. The processor 12 is located in the central part of the logic functional area 102, and the motion platform wiring interface 7, host computer data interface 8, slave computer data interface 9, expansion reserved interface 10, and LED control interface 11 are respectively connected to the corresponding processor 12. The processor 12 is positioned such that the distance between the motion platform wiring interface 7, host computer data interface 8, slave computer data interface 9, expansion reserved interface 10, and LED control interface 11 and the processor 12 is approximately equal, improving data transmission capability and concentrating heat points for convenient centralized heat dissipation.

[0039] like Figure 1 As shown, in some embodiments, the number of motion platform wiring interfaces 7 of this utility model is not less than two. The two motion platform wiring interfaces 7 are respectively used for the longitudinal drive motor and the horizontal drive motor in the Raman spectroscopy detection device, respectively controlling the longitudinal movement of the sample on the motion platform and the horizontal movement of the Raman head. The additional motion platform wiring interfaces 7 are reserved for use when functional expansion is required.

[0040] like Figure 1 As shown, in some embodiments, the number of extended reserved interfaces 10 of this utility model is not less than two. The extended reserved interfaces 10 are paired with one input and one output, which is used to facilitate the expansion of functions.

[0041] In summary, the interface board of this modular Raman spectroscopy detection device, by centrally distributing the power supply interface 2, LED power supply interface 3, heat dissipation device power supply interface 4, host computer power supply interface 5, and laser generator power supply interface 6 on the circuit board carrier 1, and centrally distributing the motion platform wiring interface 7, host computer data interface 8, slave computer data interface 9, expansion reserved interface 10, LED control interface 11, and processor 12, forms two functional areas. This separates power supply and logic processing, preventing interference and improving the convenience of function expansion and interface soldering. All interfaces are located at the edge of the circuit board carrier 1, facilitating wiring and preventing lines from covering the circuit board carrier 1. Furthermore, multiple motion platform wiring interfaces 7 and expansion reserved interfaces 10 are provided, each capable of independent data transmission. During use, the various devices of the Raman spectroscopy detection device can be directly powered and transmitted via terminal plug-in, achieving a convenient user experience.

[0042] Meanwhile, this utility model sets up a power supply area 101 and a logic function area 102 on the circuit board carrier 1. The power supply interface 2, LED power supply interface 3, heat dissipation device power supply interface 4, host computer power supply interface 5, and laser generator power supply interface 6 are set in the power supply area 101. The motion platform wiring interface 7, host computer data interface 8, slave computer data interface 9, expansion reserved interface 10, and LED control interface 11 are set in the logic function area 102. During operation, the impact of high temperature on power supply can be reduced, and centralized heat dissipation is facilitated.

[0043] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0044] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An interface board for a modular Raman spectroscopy detection device, characterized in that, It includes a circuit board carrier (1), on which a power supply area (101) and a logic function area (102) are respectively divided; Along the edge of the circuit board carrier (1), there are respectively a power input interface (2), an LED lamp power supply interface (3), a heat dissipation device power supply interface (4), a host computer power supply interface (5), a laser generator power supply interface (6), a motion platform wiring interface (7), a host computer data interface (8), a slave computer data interface (9), an expansion reserved interface (10), and an LED control interface (11). A processor (12) is provided on the belly of the circuit board carrier (1). The power input interface (2), LED lamp power supply interface (3), heat dissipation device power supply interface (4), host computer power supply interface (5), and laser generator power supply interface (6) are located in the power supply area (101). The motion platform wiring interface (7), host computer data interface (8), slave computer data interface (9), expansion reserved interface (10), LED control interface (11), and processor (12) are located in the logic function area (102). The power input interface (2) supplies power to the LED lamp power supply interface (3), the heat dissipation device power supply interface (4), the host computer power supply interface (5), the laser generator power supply interface (6), the motion platform wiring interface (7), the LED control interface (11), and the processor (12), respectively.

2. The interface board of the modular Raman spectroscopy detection device according to claim 1, characterized in that: The power input interface (2), LED lamp power supply interface (3), heat dissipation device power supply interface (4), host computer power supply interface (5), and laser generator power supply interface (6) are distributed in a concentrated manner. The motion platform wiring interface (7), host computer data interface (8), slave computer data interface (9), expansion reserved interface (10), LED control interface (11), and processor (12) are distributed in a concentrated manner. The motion platform wiring interface (7) and the expansion reserved interface (10) are provided in multiple ways, and each of the motion platform wiring interface (7) and the expansion reserved interface (10) can transmit data independently.

3. The interface board of the modular Raman spectroscopy detection device according to claim 2, characterized in that: The power input interface (2), LED lamp power supply interface (3), heat dissipation device power supply interface (4), host computer power supply interface (5), and laser generator power supply interface (6) are distributed along the edge of the power supply area (101). A capacitor is provided in the middle of the power supply area (101) and is connected to the power input interface (2), LED lamp power supply interface (3), heat dissipation device power supply interface (4), host computer power supply interface (5), and laser generator power supply interface (6) respectively.

4. The interface board of the modular Raman spectroscopy detection device according to claim 2, characterized in that: The motion platform wiring interface (7), host computer data interface (8), slave computer data interface (9), expansion reserved interface (10), and LED control interface (11) are distributed along the edge of the logic functional area (102). The processor (12) is located in the middle of the logic functional area (102). The motion platform wiring interface (7), host computer data interface (8), slave computer data interface (9), expansion reserved interface (10), and LED control interface (11) are respectively connected to the corresponding processor (12).

5. The interface board of the modular Raman spectroscopy detection device according to any one of claims 1-4, characterized in that: The number of the motion platform wiring interfaces (7) shall not be less than two.

6. The interface board of the modular Raman spectroscopy detection device according to any one of claims 1-4, characterized in that: The number of the extended reserved interfaces (10) shall not be less than two.