Optoelectronic module and communication system
By introducing isolators and insulators into the optoelectronic module, the problem of insufficient lightning protection capability is solved, and better insulation effect and lightning protection performance are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TP-LINK
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-29
AI Technical Summary
The existing optoelectronic modules have insufficient lightning protection capabilities, resulting in poor voltage isolation between internal components and the casing.
In the optoelectronic module, isolators and insulators are introduced. The isolators isolate the functional components from the housing, and the insulators isolate the inner wall of the opening from the functional components, thereby increasing the insulation distance and improving the insulation effect.
The design of the isolation and insulation components significantly improves the lightning protection capability of the optoelectronic module and enhances the insulation effect between the housing and functional components.
Smart Images
Figure CN224303892U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of communication technology, and more specifically, relates to an optoelectronic module and a communication system. Background Technology
[0002] An optoelectronic module is an optoelectronic device that performs photoelectric conversion and / or electro-optical conversion. It consists of optical components and functional circuits. The optical components include an optical interface and optoelectronic devices, which are divided into transmitting and receiving parts, responsible for converting electrical signals into optical signals and vice versa. However, the voltage isolation between the internal components and the casing of optoelectronic modules in related technologies is poor, resulting in insufficient lightning protection. Utility Model Content
[0003] The purpose of this application is to provide an optoelectronic module to solve the technical problem of insufficient lightning protection capability of existing optoelectronic modules.
[0004] In a first aspect, embodiments of this application provide an optoelectronic module.
[0005] The optoelectronic module provided in this application includes a housing with a receiving cavity; a functional component disposed in the receiving cavity, the functional component including an optical component and an electrical component, the optical component and the electrical component being electrically connected; an isolator disposed within the receiving cavity and isolating the functional component from the housing; and an insulating component. The receiving cavity has a first opening and a second opening, at least a portion of the optical component extends through the first opening to the outside of the housing, at least a portion of the electrical component extends through the second opening to the outside of the housing, and the insulating component is disposed in the first opening to insulate the housing from the functional component.
[0006] The beneficial effects of the optoelectronic module provided in this application embodiment are as follows: Compared with the prior art, on the one hand, the optoelectronic module provided in this application embodiment has an insulating member between the functional component and the housing. The insulating member isolates the housing and the functional component and increases the distance between the housing and the functional component, thereby improving the insulation effect between the housing surface and the functional component. On the other hand, the optoelectronic module provided in this application embodiment has an insulating member in the first opening. The insulating member insulates and isolates the inner wall of the opening from the functional component, further improving the insulation effect between the housing surface and the functional component. Thus, the optoelectronic module provided in this application embodiment has the advantage of better lightning protection.
[0007] Optionally, the isolating member includes a first part and a second part that overlap each other, the first part and the second part forming an inner cavity, and the functional component is disposed in the inner cavity;
[0008] The inner cavity has a third opening and a fourth opening. The third opening is arranged opposite to the first opening. A portion of the optical component passes through the third opening and extends to the first opening. The fourth opening is arranged opposite to the second opening. A portion of the optical component passes through the fourth opening and extends to the second opening.
[0009] Optionally, the wall thickness of the spacer is greater than or equal to 1.5 mm;
[0010] And / or, the material of the insulating element is an insulating material.
[0011] Optionally, one end of the insulating member is located on the side of the first opening away from the third opening, and the other end of the insulating member extends to the side of the third opening facing the first opening.
[0012] Optionally, the optical component includes an optical interface, a receiving terminal, and a transmitting terminal, wherein the receiving terminal and the transmitting terminal are both connected to the optical interface, and both the receiving terminal and the transmitting terminal are electrically connected to the electrical component;
[0013] The optical interface extends through the first opening, and the insulating member extends circumferentially around the optical interface, with the insulating member disposed between the inner wall of the first opening and the optical interface.
[0014] Optionally, the housing is provided with a first guide groove, one end of which is connected to the first opening, and the other end of which extends along the first opening away from the receiving cavity to the surface of the housing, with at least a portion of the optical interface located within the first guide groove.
[0015] Optionally, the insulating element includes a slot extending circumferentially along the optical interface, and at least a portion of the inner wall of the first opening can be fitted into the slot.
[0016] Optionally, the optical interface has a first segment, a second segment, and a third segment arranged in sequence. The first segment and the second segment are both located on the side of the third segment facing the outside of the housing. The outer diameter of the first segment is smaller than that of the second segment, and the outer diameter of the second segment is smaller than that of the third segment. A first stepped surface is provided between the first segment and the second segment, and a second stepped surface is provided between the second segment and the third segment.
[0017] One end of the insulating member abuts against the second step surface, and the insulating member is provided with an inner flange, which is fixed to the first step surface.
[0018] Optionally, the electrical component includes a circuit board and an electrical interface, the circuit board being electrically connected to the optical component, the electrical interface being electrically connected to the circuit board, and at least a portion of the electrical interface being located on the side of the second opening facing the outside of the housing;
[0019] The minimum distance between the circuit board and the inner wall of the housing is greater than or equal to 2 mm.
[0020] Secondly, this application also provides a communication system.
[0021] The communication system provided in this application includes the optoelectronic module described in any of the above embodiments.
[0022] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 A schematic diagram of an optoelectronic module provided in an embodiment of this application;
[0025] Figure 2 for Figure 1 Schematic diagram of the cross section at point AA;
[0026] Figure 3 for Figure 1 Schematic diagram of the cross section at point BB;
[0027] Figure 4 This is an exploded view of the optoelectronic module provided in an embodiment of this application;
[0028] Figure 5 for Figure 3 A magnified view of a portion of point C.
[0029] The following are the labeling elements in the figure:
[0030] 100. Optoelectronic module;
[0031] 10. Shell; 11. Third part; 12. Fourth part; 13. Receiving cavity; 14. First opening; 15. Second opening; 16. First guide groove; 17. Second guide groove;
[0032] 20. Functional component; 21. Optical component; 211. Optical interface; 2111. First segment; 2112. Second segment; 2113. Third segment; 2114. First stepped surface; 2115. Second stepped surface; 212. Receiver terminal; 213. Transmitter terminal; 22. Electrical component; 221. Circuit board; 222. Electrical interface;
[0033] 30. Isolation component; 31. First part; 32. Second part; 33. Inner cavity; 34. Third opening; 35. Fourth opening;
[0034] 40. Insulating component; 41. First annular segment; 42. Second annular segment; 43. Third annular segment; 44. Inner flange. Detailed Implementation
[0035] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0036] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0037] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0039] This application provides an optoelectronic module and a communication system using the optoelectronic module.
[0040] The optoelectronic module provided in this application embodiment is used to convert optical signals into electrical signals or electrical signals into optical signals. The communication system provided in this application embodiment uses the optoelectronic module provided in this application embodiment to realize the conversion between optical signals and electrical signals.
[0041] Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 The optoelectronic module 100 provided in the embodiments of this application will now be described.
[0042] The optoelectronic module 100 provided in this application embodiment includes a housing 10, a functional component 20, a separator 30, and an insulating component 40.
[0043] The housing 10 has a receiving cavity 13. For example... Figures 2 to 4 As shown, the shell 10 has a hollow structure, and the interior of the shell 10 is provided with a receiving cavity 13.
[0044] Functional component 20 is disposed in receiving cavity 13. Functional component 20 includes optical component 21 and electrical component 22. Optical component 21 and electrical component 22 are electrically connected.
[0045] like Figures 2 to 4 As shown, some functional components 20 are disposed within the receiving cavity 13 to protect the functional components 20 through the housing 10. The functional components 20 are components that perform the optoelectronic communication function of the optoelectronic module 100 provided in this application. The functional components 20 include an optical component 21 and an electrical component 22 that are electrically connected to each other. The optical component 21 is used to transmit or receive optical signals, and the electrical component 22 is used to generate or receive electrical signals. The optical component 21 and the electrical component 22 are electrically connected to enable the functional components 20 to realize the mutual conversion between optical signals and electrical signals.
[0046] The isolation member 30 is disposed within the receiving cavity 13 and is isolated between the functional component 20 and the housing 10.
[0047] like Figures 2 to 4 As shown, the isolator 30 is disposed between the inner wall of the housing 10 and the functional component 20, so as to isolate the housing 10 and the functional component 20 from each other through the isolator 30, and to keep the housing 10 and the functional component 20 insulated and increase the insulation distance through the isolator 30, thereby improving the lightning protection capability of the optoelectronic module 100 provided in this application embodiment.
[0048] The receiving cavity 13 has at least two openings, including a first opening 14 and a second opening 15. A portion of the optical component 21 passes through the first opening 14 and extends to the outside of the housing 10. A portion of the electrical component 22 passes through the second opening 15 and extends to the outside of the housing 10. An insulating member 40 is disposed in the first opening 14 to insulate the housing 10 from the functional component 20.
[0049] like Figures 2 to 4 As shown, the first opening 14 penetrates the housing 10 to connect the receiving cavity 13 and the outside of the housing 10. The optical component 21 extends from the receiving cavity 13 to the outside of the housing 10 along the first opening 14. The second opening 15 penetrates the housing 10 to connect the receiving cavity 13 and the outside of the housing 10. The electrical component 22 extends from the receiving cavity 13 to the outside of the housing 10 along the second opening 15.
[0050] In some embodiments, such as Figures 2 to 4 As shown, the insulating member 40 is provided at the first opening 14, and the second opening 15 is not provided with the insulating member 40. The insulating member 40 is located between the inner wall of the first opening 14 and the portion of the optical component 21 that penetrates the first opening 14, so as to increase the insulation distance between the housing 10 and the optical component 21 through the insulating member 40, thereby improving the lightning protection capability of the optoelectronic module 100 provided in this application embodiment.
[0051] The beneficial effects of the optoelectronic module 100 provided in this application embodiment are as follows: Compared with the prior art, on the one hand, the optoelectronic module 100 provided in this application embodiment has an isolation member 30 between the functional component 20 and the housing 10. The isolation member 30 isolates the housing 10 and the functional component 20 and increases the distance between the housing 10 and the functional component 20, thereby improving the insulation effect between the surface of the housing 10 and the functional component 20. On the other hand, the optoelectronic module 100 provided in this application embodiment has an insulating member 40 in the first opening 14. The insulating member 40 insulates and isolates the inner wall of the first opening 14 from the functional component 20, further improving the insulation effect between the surface of the housing 10 and the functional component 20. Thus, the optoelectronic module 100 provided in this application embodiment has the advantage of better lightning protection.
[0052] In some embodiments provided in this application, the isolation member 30 has an inner cavity 33, and the functional component 20 is disposed in the inner cavity 33;
[0053] The inner cavity 33 has a third opening 34 and a fourth opening 35. The third opening 34 is arranged opposite to the first opening 14, and at least a portion of the optical component 21 extends through the third opening 34 to the first opening 14. The fourth opening 35 is arranged opposite to the second opening 15, and at least a portion of the optical component 21 extends through the fourth opening 35 to the second opening 15.
[0054] like Figures 2 to 4As shown, the isolator 30 has a hollow structure and an inner cavity 33 inside. Some functional components 20 are located in the inner cavity 33. The third opening 34 extends through the isolator 30 along the extension direction of the first opening 14. Some optical components 21 extend from the inner cavity 33 to the outside of the housing 10 along the third opening 34 and the first opening 14, respectively. The fourth opening 35 extends through the isolator 30 along the extension direction of the second opening 15. Some electrical components 22 extend from the inner cavity 33 to the outside of the housing 10 along the fourth opening 35 and the second opening 15, respectively.
[0055] Therefore, the isolator 30 covers the outside of the functional component 20, improving the isolation effect of the isolator 30 between the housing 10 and the functional component 20, thereby improving the lightning protection effect of the optoelectronic module 100 provided in this application embodiment.
[0056] In some embodiments, the isolator 30 is made of insulating materials such as plastic or rubber. The isolator 30 prevents static electricity in the housing 10 from being conducted to the functional component 20 by means of insulation, thereby achieving the isolation effect between the housing 10 and the functional component 20. This gives the optoelectronic module 100 provided in this application embodiment the advantage of having a better lightning protection effect.
[0057] In some embodiments provided in this application, the wall thickness of the spacer 30 is greater than or equal to 1.5 mm.
[0058] like Figure 2 and Figure 3 As shown, the isolator 30 is a hollow, thin-walled structure. The wall thickness of the isolator 30 at its minimum point is greater than or equal to 1.5 mm, thereby increasing the minimum distance between the housing 10 and the functional component 20, further increasing the insulation distance between the housing 10 and the optical component 21, and improving the isolation effect between the housing 10 and the functional component 20. This gives the optoelectronic module 100 provided in this embodiment the advantage of better lightning protection.
[0059] In some embodiments provided in this application, the minimum distance between the functional component 20 and the inner wall of the housing 10 is greater than or equal to 2 mm. Therefore, by increasing the distance between the functional component 20 and the inner wall of the housing 10, the isolation effect between the housing 10 and the functional component 20 is further improved, and the conductivity between the housing 10 and the functional component 20 of the optoelectronic module 100 provided in this application embodiment is reduced.
[0060] In some embodiments provided in this application, one end of the insulating member 40 is located on the side of the third opening 34 facing the first opening 14, and the other end of the insulating member 40 extends to the side of the first opening 14 away from the third opening 34.
[0061] like Figure 2 and Figure 3As shown, the insulating member 40 extends in the same direction as the first opening 14. The insulating member 40 extends from the outside of the housing 10 to the inner cavity 33. Thus, the insulating member 40 is isolated between the inner wall of the first opening 14 and the optical component 21, and the insulating member 40 is isolated between the third opening 34 and the optical component 21. On the one hand, it improves the insulation effect between the housing 10 and the optical component 21, and on the other hand, it improves the insulation effect between the insulating member 30 and the optical component 21.
[0062] In other embodiments (not shown in the figures), the insulating member 40 extends from the side of the first opening 14 away from the third opening 34 to the side of the third opening 34 away from the first opening 14.
[0063] In other embodiments (not shown in the figures), the insulating member 40 extends from the side of the first opening 14 away from the third opening 34 into the third opening 34.
[0064] In some embodiments provided in this application, the optical component 21 includes an optical interface 211, a receiving terminal 212 and a transmitting terminal 213. The receiving terminal 212 and the transmitting terminal 213 are both connected to the optical interface 211, and the receiving terminal 212 and the transmitting terminal 213 are both electrically connected to the electrical component 22.
[0065] The optical interface 211 is arranged through the first opening 14, and the insulating member 40 extends in a closed manner around the optical interface 211, and the insulating member 40 is disposed between the inner wall of the first opening 14 and the optical interface 211.
[0066] The optical interface 211 is used to transmit or receive optical signals. The receiving terminal 212 is used to convert the optical signals received by the optical interface 211 into electrical signals and transmit them to the electrical component 22. The transmitting terminal 213 is used to convert the electrical signals in the electrical component 22 into optical signals and transmit them through the optical interface 211. Thus, the optoelectronic module 100 has the function of converting electrical signals into optical signals through the optical interface 211, the receiving terminal 212 and the transmitting terminal 213.
[0067] One end of the optical interface 211 is located in the inner cavity 33, and the other end of the optical interface 211 extends through the third opening 34 and the first opening 14 to communicate with the outside of the housing 10. The insulating member 40 is sleeved on the outside of the optical interface 211 to improve the insulation effect between the optical interface 211 and the housing 10.
[0068] In some embodiments provided in this application, the optical interface 211 is detachably connected to the transmitting terminal 213 and the receiving terminal 212. Thus, the optical interface 211 can be removed from the optical component 21 and replaced with optical interfaces 211 of different sizes, so that the optoelectronic module 100 provided in the embodiments of this application can be compatible with different optical communication devices.
[0069] In other embodiments provided in this application, the optical component 21 is detachably connected to the electrical component 22. This allows the optical component 21 to be removed from the functional component 20 and replaced with an optical component 211 having a different shape of optical interface 211, enabling the optoelectronic module 100 provided in this application to be compatible with different optical communication devices.
[0070] In some embodiments provided in this application, the housing 10 is provided with a first guide groove 16, one end of the first guide groove 16 is connected to the first opening 14, and the other end of the first guide groove 16 extends along the first opening 14 away from the receiving cavity 13 to the surface of the housing 10, and at least part of the optical interface 211 is located in the first guide groove 16.
[0071] like Figures 2 to 4 As shown, one end of the first guide groove 16 is connected to the side of the first opening 14 away from the receiving cavity 13, and the other end of the first guide groove 16 extends to the surface of the housing 10. On the one hand, the first guide groove 16 connects the first opening 14 to the outer surface of the housing 10, and on the other hand, the first guide groove 16 guides the device port connected to the optical interface 211 to the optical interface 211. The device port is plugged into the housing 10 through the inner wall of the first guide groove 16, thereby improving the connection stability and reliability of the optoelectronic interface 222 provided in this application embodiment.
[0072] In some embodiments provided in this application, the insulating member 40 includes a slot extending circumferentially along the optical interface 211, and at least a portion of the inner wall of the first opening 14 can be fitted into the slot.
[0073] like Figure 3 and Figure 5 As shown, the insulating member 40 has a first annular segment 41, a second annular segment 42, and a third annular segment 43 in the extending direction of the optical interface 211. The outer diameter of the second annular segment 42 is smaller than the outer diameter of the first annular segment 41, and the outer diameter of the second annular segment 42 is smaller than the outer diameter of the third annular segment 43, thereby forming a groove on the outer periphery of the second annular segment 42. The inner wall of the first opening 14 fits into the groove. On the one hand, the groove positions the insulating member 40 and the housing 10, preventing the insulating member 40 from sliding relative to the housing 10 in its extending direction. On the other hand, the first annular segment 41 insulates the side of the housing 10 away from the receiving cavity 13 at the first opening 14 from the optical interface 211, the third annular segment 43 insulates the side of the housing 10 facing the receiving cavity 13 at the first opening 14 from the optical interface 211, and the second annular segment 42 insulates the inner wall of the first opening 14 from the optical interface 211, thereby improving the insulation effect of the insulating member 40 between the housing 10 and the optical interface 211.
[0074] In some embodiments, such as Figure 2 and Figure 3As shown, one end of the insulating member 40 is riveted to the surface of the housing 10 at the first opening 14 on the side away from the receiving cavity 13. The optical interface 211 is provided with an annular flange, which abuts against the other end of the insulating member 40 to position the housing 10, the isolator 30 and the functional component 20 through the slot.
[0075] In some embodiments provided in this application, the minimum thickness of the insulating element 40 between the housing 10 and the optical interface 211 is greater than or equal to 0.25 mm.
[0076] In some embodiments provided in this application, the optical interface 211 has a first segment 2111, a second segment 2112 and a third segment 2113 arranged in sequence. The first segment 2111 and the second segment 2112 are both located on the side of the third segment 2113 facing the outside of the housing 10. The outer diameter of the first segment 2111 is smaller than that of the second segment 2112, and the outer diameter of the second segment 2112 is smaller than that of the third segment 2113. A first stepped surface 2114 is provided between the first segment 2111 and the second segment 2112, and a second stepped surface 2115 is provided between the second segment 2112 and the third segment 2113.
[0077] One end of the insulating member 40 abuts against the second step surface 2115, and the insulating member 40 is provided with an inner flange 44, which is fixed to the first step surface 2114.
[0078] like Figure 4 As shown, the optical interface 211 has a stepped rotating structure. The outer diameters of the first segment 2111, the second segment 2112, and the third segment 2113 increase sequentially, thereby forming a first stepped surface 2114 between the first segment 2111 and the second segment 2112, and a second stepped surface 2115 between the second segment 2112 and the third segment 2113. The end of the insulating member 40 abuts against the second stepped surface 2115, and the end of the inner flange 44 of the insulating member 40 facing the second stepped surface 2115 abuts against the first stepped surface 2114. The inner flange 44 of the insulating member 40 is riveted to the first stepped surface 2114, thereby fixing the insulating member 40 to the outside of the optical interface 211, preventing the insulating member 40 from falling off the optical interface 211, and ensuring the protective effect of the insulating member 40 on the optical interface 211.
[0079] In some embodiments provided in this application, the electrical component 22 includes a circuit board 221 and an electrical interface 222. The circuit board 221 is electrically connected to the optical component 21, and the electrical interface 222 is electrically connected to the circuit board 221.
[0080] At least a portion of the electrical interface 222 is located on the side of the second opening 15 facing the outside of the housing 10.
[0081] Circuit board 221 is electrically connected to transmitting terminal 213 to input electrical signals to transmitting terminal 213. Circuit board 221 is also connected to receiving terminal 212 to receive electrical signals from receiving terminal 212. Circuit board 221 is also connected to electrical interface 222 to transmit electrical signals to communication devices connected to optoelectronic module 100 provided in this application embodiment through electrical interface 222, or to transmit electrical signals from communication devices connected to optoelectronic module 100 provided in this application embodiment to circuit board 221.
[0082] The electrical interface 222 can be a gold finger, a universal serial interface, or other interface that can transmit electrical signals. One end of the electrical interface 222 is located in the inner cavity 33, and the other end of the electrical interface 222 extends through the fourth opening 35 and the second opening 15 to communicate with the outside of the housing 10.
[0083] In some embodiments, the electrical interface 222 is located entirely on the side of the second opening 15 facing the outside of the housing 10.
[0084] In other embodiments, one portion of the electrical interface 222 is located on the side of the second opening 15 facing the outside of the housing 10, while another portion of the electrical interface 222 is located inside the receiving cavity 13.
[0085] In some embodiments provided in this application, the housing 10 is provided with a second guide groove 17, one end of the second guide groove 17 is connected to the second opening 15, and the other end of the second guide groove 17 extends to the surface of the housing 10 along the direction away from the receiving cavity 13 of the second opening 15, and at least part of the electrical interface 222 is located in the second guide groove 17.
[0086] like Figures 2 to 4 As shown, one end of the second guide groove 17 is connected to the side of the second opening 15 away from the receiving cavity 13, and the other end of the second guide groove 17 extends to the surface of the housing 10. On the one hand, the second opening 15 is connected to the outer surface of the housing 10 through the second guide groove 17, and on the other hand, the second guide groove 17 guides the device port of the electrical communication device connected to the electrical interface 222 to the electrical interface 222. The device port is plugged into the housing 10 through the inner wall of the second guide groove 17, thereby improving the connection stability and reliability of the optoelectronic interface 222 provided in this application embodiment.
[0087] In some embodiments, the outer wall of the isolator 30 is provided with a positioning groove, and the inner wall of the housing 10 is provided with a positioning protrusion. The positioning protrusion can be fitted into the positioning groove to position the isolator 30 within the housing 10, thereby preventing displacement of the isolator 30 within the housing 10 and increasing the stability of the assembly between the housing 10 and the isolator 30.
[0088] The structure of the optoelectronic module 100 provided in the embodiments of this application is described below. It should be noted that the first direction x in the following text is the x direction shown in the figure, and the second direction y in the following text is the y direction shown in the figure.
[0089] In some embodiments provided in this application, as shown in the figure, the first opening 14 is located on the side of the housing 10 facing the first direction x, the second opening 15 is located on the other side of the housing 10 facing the first direction x, the third opening 34 is located on the side of the isolation member 30 facing the first opening 14 in the first direction x, and the fourth opening 35 is located on the side of the isolation member 30 facing the second opening 15 in the first direction x.
[0090] The optical interface 211 is located at one end of the functional component 20 in the first direction x, and the electrical interface 222 is located at the other end of the functional component 20 in the first direction x. The first guide groove 16 and the second guide groove 17 both extend along the first direction x.
[0091] The isolation member 30 includes a first part 31 and a second part 32 arranged opposite to each other along the second direction y, and the first part 31 and the second part 32 are joined together along the second direction y to form the isolation member 30.
[0092] The housing 10 includes a third part 11 and a fourth part 12 arranged opposite to each other along the second direction y, and the third part 11 and the fourth part 12 are joined together along the second direction y to form the housing 10.
[0093] The communication system provided in the embodiments of this application is described below.
[0094] The communication system provided in this application includes the optoelectronic module 100 in any of the above embodiments.
[0095] The communication system provided in this application includes an optoelectronic module 100, an electrical communication device, and an optical communication device. The optoelectronic module 100 is connected between the electrical communication device and the optical communication device to realize optoelectronic communication between the optical communication device and the electrical communication device.
[0096] Because the optoelectronic module 100 provided in this application has good lightning protection performance, the communication system provided in this application embodiment also has good lightning protection performance.
[0097] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A photoelectric module, characterized in that, include: A housing having a receiving cavity; A functional component is disposed in the receiving cavity, the functional component including an optical component and an electrical component, the optical component being electrically connected to the electrical component; A spacer is disposed within the receiving cavity and is isolated between the functional component and the housing; An insulating element has a receiving cavity having a first opening and a second opening, at least a portion of an optical component extending through the first opening to the outside of a housing, and at least a portion of an electrical component extending through the second opening to the outside of a housing, the insulating element being disposed at the first opening to insulate the housing from the functional components.
2. The optoelectronic module as described in claim 1, characterized in that: The isolation component includes a first part and a second part that overlap each other, the first part and the second part forming an inner cavity, and the functional component is disposed in the inner cavity; The inner cavity has a third opening and a fourth opening. The third opening is arranged opposite to the first opening. A portion of the optical component passes through the third opening and extends to the first opening. The fourth opening is arranged opposite to the second opening. A portion of the optical component passes through the fourth opening and extends to the second opening.
3. The optoelectronic module as described in claim 2, characterized in that: The wall thickness of the isolation element is greater than or equal to 1.5 mm; And / or, the material of the insulating element is an insulating material.
4. The optoelectronic module as described in claim 2, characterized in that: One end of the insulating member is located on the side of the first opening away from the third opening, and the other end of the insulating member extends to the side of the third opening facing the first opening.
5. The optoelectronic module as described in claim 1, characterized in that: The optical component includes an optical interface, a receiving terminal, and a transmitting terminal. The receiving terminal and the transmitting terminal are both connected to the optical interface, and the receiving terminal and the transmitting terminal are both electrically connected to the electrical component. The optical interface extends through the first opening, and the insulating member extends circumferentially around the optical interface, with the insulating member disposed between the inner wall of the first opening and the optical interface.
6. The optoelectronic module as described in claim 5, characterized in that: The housing is provided with a first guide groove, one end of which is connected to the first opening, and the other end of which extends along the first opening away from the receiving cavity to the surface of the housing, with at least a portion of the optical interface located within the first guide groove.
7. The optoelectronic module as described in claim 5, characterized in that: The insulating element includes a slot extending circumferentially along the optical interface, and at least a portion of the inner wall of the first opening is fit into the slot.
8. The optoelectronic module as described in claim 5, characterized in that: The optical interface has a first segment, a second segment, and a third segment arranged in sequence. The first segment and the second segment are both located on the side of the third segment facing the outside of the housing. The outer diameter of the first segment is smaller than that of the second segment, and the outer diameter of the second segment is smaller than that of the third segment. A first stepped surface is provided between the first segment and the second segment, and a second stepped surface is provided between the second segment and the third segment. One end of the insulating member abuts against the second step surface, and the insulating member is provided with an inner flange, which is fixed to the first step surface.
9. The optoelectronic module as described in claim 2, characterized in that: The electrical component includes a circuit board and an electrical interface. The circuit board is electrically connected to the optical component, and the electrical interface is electrically connected to the circuit board. At least a portion of the electrical interface is located on the side of the second opening facing the outside of the housing. The minimum distance between the circuit board and the inner wall of the housing is greater than or equal to 2 mm.
10. A communication system, characterized in that: Includes the optoelectronic module as described in any one of claims 1-9.