A matrix board system for automotive electronic testing

Abstract

The utility model discloses a kind of matrix board card systems for automobile electronic testing, comprising: matrix board card, by MCU control chip, high-frequency signal relay, fast-fuse fuse, CAN transceiver circuit and ethernet transceiver circuit composition;Chassis, inside is equipped with backplane connector, for fixed matrix board card and provide power supply and signal transmission channel;Power module, through the backplane connector to the matrix board card provides DC regulated power supply;Communication interface, including CAN interface and ethernet interface.Matrix board card cooperates chassis and uses different board card, can satisfy different automobile test item needs, wherein matrix board card uses high-frequency signal relay, bus series resistance and special connector collaborative work, solve the problem of high-frequency signal attenuation and waveform distortion caused by traditional relay card due to insufficient bandwidth, make the accuracy of test data be promoted, to meet the core demand of precise signal acquisition in automobile electronic testing.

Description

Technical Field

[0001] This utility model relates to the field of automotive electronics testing technology, and in particular to a matrix board system for automotive electronics testing. Background Technology

[0002] With the rapid development of automotive electronics technology, the complexity and integration of in-vehicle electronic devices are constantly increasing. Various electronic control units (ECUs), sensors, and actuators are being used more and more widely in vehicles, placing increasingly stringent demands on testing systems. As a crucial link in ensuring vehicle safety, reliability, and performance, the accuracy and efficiency of automotive electronics testing directly affect the market competitiveness of automotive products.

[0003] In traditional automotive electronics testing methods, the transmission and testing of high-frequency signals often rely on ordinary relay cards for signal switching and distribution. However, with the continuous advancement of automotive electronics technology, especially the widespread application of high-frequency signals in in-vehicle communication, radar systems, and autonomous driving assistance systems, ordinary relay cards have significant design flaws: their bandwidth is limited (generally below 5MHz), which cannot meet the transmission requirements of high-frequency signals (such as oscilloscope acquisition and signal generator output) in modern automotive electronics. This leads to severe signal attenuation and waveform distortion during transmission, directly affecting the accuracy of test data. Furthermore, ordinary relay cards lack effective protection mechanisms. Once a short circuit or overload fault occurs, it can easily trigger a chain reaction, damaging the entire testing system, increasing maintenance costs, and potentially causing test interruptions or even equipment failure. Summary of the Invention

[0004] This invention overcomes the shortcomings of the prior art and provides a matrix board system for automotive electronic testing.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a matrix board system for automotive electronic testing, comprising:

[0006] The matrix board consists of an MCU control chip, high-frequency signal relays, fast-blow fuses, CAN transceiver circuits, and Ethernet transceiver circuits.

[0007] The chassis has an internal backplane connector for fixing matrix boards and providing power and signal transmission channels;

[0008] The power module provides DC regulated power to the matrix board through the backplane connector;

[0009] The communication interface, including a CAN interface and an Ethernet interface, is connected to the CAN transceiver circuit or the Ethernet transceiver circuit via the backplane connector.

[0010] In a preferred embodiment of this utility model, the channel configuration of the matrix board is as follows:

[0011] MATRIX CARD 64X4: Supports 8-channel BUS and 64 channels;

[0012] Or MATRIX CARD 32X4: Supports 4-way BUS bus and 32 channels;

[0013] Or MATRIX CARD 48X2: Supports 4-way BUS bus with 48 channels.

[0014] In a preferred embodiment of this utility model, the high-frequency signal relay switches to different BUS buses through the shorting point control channel output terminal on the matrix board, and each channel is independently configured with a fast-blow fuse. The high-frequency signal relay is directly driven by the MCU control chip.

[0015] In a preferred embodiment of this invention, a 200Ω resistor is connected in series at each BUS bus input terminal. The resistor is integrated on the matrix board circuit and is used to suppress signal overshoot.

[0016] In a preferred embodiment of this utility model, the CAN transceiver circuit is connected to the CAN interface through the backplane connector, and is compatible with Zhouligong CAN card and FK-CAN card.

[0017] In a preferred embodiment of this utility model, the Ethernet transceiver circuit is connected to the Ethernet interface through the backplane connector, and realizes high-speed data transmission and multi-device interoperability based on the IP protocol.

[0018] In a preferred embodiment of this utility model, the backplane connector of the chassis supports cascading of multiple boards and can be expanded in series through the BUS input connector, supporting expansion to 1344 channels.

[0019] In a preferred embodiment of this utility model, the backplane connector of the matrix board adopts a 40-pin high-frequency ERNI connector.

[0020] In a preferred embodiment of this utility model, the high-frequency signal relay is a low-capacitance radio frequency relay with a bandwidth ≥10MHz.

[0021] This utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0022] (1) This utility model provides a matrix board system for automotive electronic testing. The matrix board is used in conjunction with a chassis and different boards to meet the needs of different automotive testing items. The matrix board uses high-frequency signal relays, bus series resistors and dedicated connectors to work together. The high-frequency relays reduce signal transmission loss by optimizing the contact structure. The series resistors effectively suppress signal overshoot and crosstalk. The dedicated connectors ensure the mechanical stability and electrical continuity of the physical layer connection, thereby solving the problem of high-frequency signal attenuation and waveform distortion caused by insufficient bandwidth of traditional relay cards, thus improving the accuracy of test data and meeting the core requirements for precision signal acquisition in automotive electronic testing.

[0023] (2) In this utility model, each channel is independently equipped with a fast-blow fuse and is directly connected in series with the relay circuit. At the same time, the control chip monitors the channel status in real time. When a single channel is short-circuited, the fuse melts quickly based on the current threshold characteristic, physically isolating the fault point. The control chip locks the abnormal channel and feeds back the status to the host computer. Through the dual protection of hardware melting and software monitoring, the fault propagation path is blocked, thereby significantly improving the long-term operational stability of the system and the service life of the equipment.

[0024] (3) In this utility model, multiple boards are cascaded through the chassis backplane connector. Combined with modular boards, the channel scale can be expanded as needed. CAN and Ethernet dual communication protocols respectively undertake real-time control commands and high-speed data transmission functions. The IP protocol enables seamless integration of multiple devices, allowing test resources to dynamically adapt to project requirements, greatly reducing the cost of repeated equipment investment. At the same time, the test process efficiency is optimized through protocol collaboration, significantly shortening the overall cycle of complex test scenarios. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0026] Figure 1 This is a schematic diagram of the matrix board system of Embodiment 1 of this utility model;

[0027] Figure 2 This is a schematic diagram of the matrix board system of Embodiment 3 of this utility model. Detailed Implementation

[0028] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams, which are only used to illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0029] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] Example 1

[0031] like Figure 1 As shown, a matrix board system for automotive electronics testing includes:

[0032] The matrix board consists of an MCU control chip, high-frequency signal relays, fast-blow fuses, CAN transceiver circuits, and Ethernet transceiver circuits.

[0033] It should be noted that the matrix board's channel configuration is as follows: MATRIX CARD 64X4: supports 8 BUS buses and 64 channels; high-frequency signal relays control the channel output to switch to different BUS buses via shorting contacts on the matrix board, and each channel is independently equipped with a fast-blow fuse. The high-frequency signal relays are directly driven by the MCU control chip, and are low-capacitance RF relays with a bandwidth ≥10MHz, supporting 250mA current loads; the CAN transceiver circuit connects to the CAN interface via a backplane connector, is compatible with ZLG CAN cards and FK-CAN cards, and supports LabVIEW / Python library control; the Ethernet transceiver circuit connects to the Ethernet interface via a backplane connector, enabling high-speed data transmission and multi-device interoperability based on the IP protocol.

[0034] Each BUS bus input terminal has a 200Ω resistor connected in series. The resistor is integrated on the matrix board circuit and is used to suppress signal overshoot. The matrix board's backplane connector uses a 40Pin high-frequency ERNI connector.

[0035] Specifically, the matrix board utilizes an MCU control chip for precise control of high-frequency signal relays. The MCU directly drives these relays to switch channels by sending commands. These high-frequency relays feature high bandwidth and low capacitance, ensuring the integrity and stability of the high-frequency signal during transmission. Each channel is independently equipped with a fast-blow fuse; when the current exceeds a safety threshold, the fuse quickly blows, cutting off the circuit, preventing fault propagation, and protecting the equipment. Simultaneously, the matrix board communicates with external devices via CAN and Ethernet transceiver circuits. The CAN transceiver circuit is compatible with various CAN cards and supports LabVIEW / Python library control, ensuring compatibility with different devices. The Ethernet transceiver circuit, based on the IP protocol, enables high-speed data transmission and multi-device interoperability, meeting the needs of large data volume transmission.

[0036] The chassis has an internal backplane connector for fixing matrix boards and providing power and signal transmission channels.

[0037] It should be noted that the chassis backplane connector supports multi-board cascading and can be expanded in series via the BUS input connector, supporting expansion to 1344 channels.

[0038] Specifically, the chassis serves as the carrier for the matrix circuit boards, providing a stable installation environment and efficient signal transmission channels. The backplane connectors inside the chassis are used to fix the matrix circuit boards and provide power and signal transmission channels. The backplane connectors support cascading of multiple boards and can be extended in series through the BUS input connectors, enabling multiple matrix circuit boards to work together and maximizing the utilization of channel resources. This not only improves the flexibility and scalability of the system but also reduces testing costs, meeting the needs of multi-pin, complex scenarios in automotive electronics testing.

[0039] The power module provides DC regulated power to the matrix board via a backplane connector.

[0040] It should be noted that the power module is powered by an external 12V / 12.5A DC regulated power supply and contains an internal voltage regulation circuit to output a stable operating voltage to power each matrix board, avoiding damage to the matrix boards caused by voltage fluctuations. Through the backplane connector, the power module transmits stable voltage to the matrix boards, providing reliable power support for the entire test system.

[0041] The communication interface, including the CAN interface and the Ethernet interface, is connected to the CAN transceiver circuit or the Ethernet transceiver circuit via a backplane connector.

[0042] It should be noted that the CAN interface uses a DB9 socket, and the Ethernet interface uses an RJ45 socket.

[0043] Specifically, the communication interface serves as a bridge for data exchange between the matrix board and external devices, providing diverse communication methods to meet the needs of different users. The CAN interface enables communication with external CAN devices, while the Ethernet interface connects to the MCU control chip via Ethernet transceiver circuitry. CAN communication is compatible with any operating system and programming language, offering broad compatibility; Ethernet communication, on the other hand, boasts high-speed transmission performance, meeting the demands of large data volume transmission. Through the communication interface, the matrix board can efficiently and stably exchange data with external devices such as host computers and testing instruments, achieving automation and intelligence in automotive electronics testing.

[0044] Working principle:

[0045] 1) The signal source of the product under test is connected to the matrix board via a 10-pin interface;

[0046] 2) Each channel is equipped with 4 high-frequency signal relays, and the 4-channel or 8-channel BUS bus mode can be selected via the shorting contacts on the matrix board:

[0047] 4-channel mode: The output of the high-frequency signal relay control channel is switched to the BUS1-BUS4 bus;

[0048] 8-channel mode: Extends the operating range of high-frequency signal relays and supports switching to BUS1-BUS8 bus;

[0049] 3) The host computer sends CAN or Ethernet commands to control the on / off state of the high-frequency signal relays of the specified channel, and routes the signals to the target bus.

[0050] Work style:

[0051] 1) The matrix board is inserted into the 8U chassis slot and powered by a 12V DC power supply provided by the power module inside the chassis;

[0052] 2) The CAN card is connected via the CAN interface of the chassis back panel connector, or the Ethernet card is connected via the Ethernet interface;

[0053] 3) After power-on, the MCU control chip initializes, and the high-frequency signal relay is disconnected by default;

[0054] 4) After successful communication, the command drives the high-frequency signal relay to operate, completing the signal switching;

[0055] 5) Multiple matrix boards can be cascaded via the front panel BUS input connector, supporting a maximum of 1344 channel expansion.

[0056] Example 2

[0057] This embodiment is basically the same as embodiment 1, except that the channel configuration of the matrix board is: MATRIX CARD32X4: supports 4 BUS buses and 32 channels.

[0058] Working principle:

[0059] 1) The signal source is connected through a 10-pin interface, and the shorting point is fixed in 4-channel BUS bus mode;

[0060] 2) The four high-frequency signal relays of each channel control the output terminal to switch to the BUS1-BUS4 bus respectively;

[0061] 3) The host computer sends instructions to control the on / off state of designated high-frequency signal relays to achieve dynamic routing of 32 channels.

[0062] Work style:

[0063] 1) The matrix board is inserted into the 5U chassis slot and powered by a 12V DC power supply from the power module inside the chassis;

[0064] 2) The CAN card is connected via the CAN interface of the chassis back panel connector, or the Ethernet card is connected via the Ethernet interface;

[0065] 3) After power-on, the MCU control chip initializes, and the instructions control the high-frequency signal relay to operate via the bus;

[0066] 4) Multiple matrix board cards can be connected via the chassis backplane connector, supporting a maximum of 512 channels.

[0067] Example 3

[0068] like Figure 2 As shown, this embodiment is basically the same as embodiment 1, except that the channel configuration of the matrix board is: MATRIX CARD 48X2: supports 4 BUS buses and 48 channels.

[0069] Working principle:

[0070] 1) The signal source is connected through a 10-pin interface, and the shorting point is fixed in 4-channel BUS bus mode (only 2 channels are enabled);

[0071] 2) Two high-frequency signal relays for each channel control the output to switch to BUS1 or BUS2 bus;

[0072] 3) The host computer sends instructions to drive the high-frequency signal relays to achieve simplified routing of 48 channels.

[0073] Work style:

[0074] 1) The matrix board is inserted into the 5U chassis slot and powered by a 12V DC power supply from the power module inside the chassis;

[0075] 2) The CAN card is connected via the CAN interface of the chassis back panel connector, or the Ethernet card is connected via the Ethernet interface;

[0076] 3) After power-on, the MCU control chip initializes, and the instructions control the high-frequency signal relay to operate via the bus;

[0077] 4) Multiple matrix board cards can be connected via the chassis backplane connector, supporting a maximum of 768 channels.

[0078] Based on the above description and the preferred embodiments of this utility model, it will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0079] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A matrix board system for automotive electronic testing, characterized in that, include: The matrix board consists of an MCU control chip, high-frequency signal relays, fast-blow fuses, CAN transceiver circuits, and Ethernet transceiver circuits. The chassis has an internal backplane connector for fixing matrix boards and providing power and signal transmission channels; The power module provides DC regulated power to the matrix board through the backplane connector; The communication interface, including a CAN interface and an Ethernet interface, is connected to the CAN transceiver circuit or the Ethernet transceiver circuit via the backplane connector.

2. The matrix board system for automotive electronic testing according to claim 1, characterized in that: The channel configuration of the matrix board is as follows: MATRIX CARD 64X4: Supports 8-channel BUS and 64 channels; Or MATRIX CARD 32X4: Supports 4-way BUS bus and 32 channels; Or MATRIX CARD 48X2: Supports 4-way BUS bus with 48 channels.

3. The matrix board system for automotive electronic testing according to claim 1, characterized in that: The high-frequency signal relay switches to different BUS buses through the short-circuit control channel output terminal on the matrix board, and each channel is independently configured with a fast-blow fuse. The high-frequency signal relay is directly driven by the MCU control chip.

4. A matrix board system for automotive electronic testing according to claim 3, characterized in that: Each BUS input terminal is connected in series with a 200Ω resistor, which is integrated on the matrix board circuit and is used to suppress signal overshoot.

5. A matrix board system for automotive electronic testing according to claim 1, characterized in that: The CAN transceiver circuit is connected to the CAN interface via the backplane connector, and is compatible with ZLG CAN cards and FK-CAN cards.

6. A matrix board system for automotive electronic testing according to claim 1, characterized in that: The Ethernet transceiver circuit is connected to the Ethernet interface through the backplane connector, enabling high-speed data transmission and multi-device interoperability based on the IP protocol.

7. A matrix board system for automotive electronic testing according to claim 1, characterized in that: The backplane connector of the chassis supports cascading of multiple boards and can be expanded in series via the BUS input connector, supporting expansion to 1344 channels.

8. A matrix board system for automotive electronic testing according to claim 1, characterized in that: The backplane connector of the matrix board uses a 40-pin high-frequency ERNI connector.

9. A matrix board system for automotive electronic testing according to claim 1, characterized in that: The high-frequency signal relay is a low-capacitance radio frequency relay with a bandwidth ≥10MHz.

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