Electronic device

Abstract

The present disclosure provides an electronic device, comprising: a first shell, a heat generating component, and a heat dissipating component; the first shell has a first inner wall and a second inner wall opposite along a preset direction, the preset direction being a thickness direction of the first shell; the heat generating component is arranged between the first inner wall and the second inner wall, a spacing region between the heat generating component and the first inner wall being a first region, a region between the heat generating component and the second inner wall being a second region, the heat generating component being capable of dissipating heat so that an internal temperature of the first region is greater than an internal temperature of the second region; the heat dissipating component is arranged inside the first shell, and a heat dissipation rate of the heat dissipating component to the first region is greater than a heat dissipation rate of the heat dissipating component to the second region.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] In electronic devices such as laptops and mainframes, integrated electronic components such as motherboards and power boards generate heat during operation, so heat dissipation devices are used to cool the entire integrated electronic components. Utility Model Content

[0003] This disclosure provides an electronic device, comprising: a first housing, a heat-generating component, and a heat-dissipating component; the first housing has a first inner wall and a second inner wall opposite to each other along a preset direction, the preset direction being the thickness direction of the first housing; the heat-generating component is disposed between the first inner wall and the second inner wall, the space between the heat-generating component and the first inner wall is a first region, and the region between the heat-generating component and the second inner wall is a second region, the heat-generating component is capable of dissipating heat so that the internal temperature of the first region is greater than the internal temperature of the second region; the heat-dissipating component is disposed inside the first housing, and the heat dissipation rate of the heat-dissipating component to the first region is greater than the heat dissipation rate of the heat-dissipating component to the second region.

[0004] Furthermore, the distance between the heating element and the first inner wall is smaller than the distance between the heating element and the second inner wall, the heat dissipation element can release a first heat dissipation fluid to the first region, the heat dissipation element can release a second heat dissipation fluid to the second region, and the flow rate of the first heat dissipation fluid is greater than the flow rate of the second heat dissipation fluid.

[0005] Furthermore, the heat dissipation component has a first air outlet facing the heat-generating component. The first air outlet has a first air outlet area relative to the first region and a second air outlet area relative to the second region. The cross-section of the first air outlet area along a preset direction is larger than the cross-section of the second air outlet area along the preset direction.

[0006] Furthermore, the heat dissipation component includes:

[0007] The fan body has a first flow channel;

[0008] The functional component is disposed within the first flow channel to form a first air outlet. The functional component can adjust the flow direction of the heat dissipation fluid released by the fan body.

[0009] Furthermore, the functional components include:

[0010] A blocking part is provided inside the first flow channel and blocks part of the first outlet of the first flow channel so that the side wall of the first flow channel of the blocking part forms a first air outlet.

[0011] The flow guide is located inside the first flow channel. The first end of the flow guide is connected to the blocking part. The second end of the flow guide extends inside the first flow channel in a direction away from the first outlet of the first flow channel. The flow guide and the inner wall of the first flow channel form a second flow channel. The second flow channel is connected to the first air outlet. From the second end to the first end of the flow guide, the size of the second flow channel decreases along a preset direction.

[0012] Furthermore, the fan body includes:

[0013] The second housing has an arc-shaped flow-guiding structure;

[0014] The impeller is rotatably connected to the inside of the second housing, and the circumference of the impeller and the second housing form a first flow channel.

[0015] The impeller can rotate, so that the gas in the first flow channel moves along the guide structure under the action of centrifugal force to generate a heat dissipation airflow.

[0016] Furthermore, the drainage section is connected to the inner wall of the flow guiding structure, and the extension direction of the second end of the drainage section is the same as the extension direction of the inner wall of the flow guiding structure. The thickness of the drainage section increases along a preset direction from the second end to the first end.

[0017] Furthermore, the electronic device includes:

[0018] A heat exchange component, the first end of which is positioned at a preset location on the heating component to exchange heat with the heating component;

[0019] The first flow channel is provided with a second outlet, which faces the second end of the heat exchange component.

[0020] Furthermore, the first housing includes:

[0021] A first cover plate and a second cover plate are provided at intervals along a preset direction, and the thickness of the first cover plate is greater than the thickness of the second cover plate.

[0022] The second housing includes:

[0023] The first sub-shell and the second sub-shell are arranged opposite each other along a preset direction, and the first sub-shell is connected to the first cover plate.

[0024] Furthermore, the electronic device is selected from one of the following combinations:

[0025] The first cover plate has a first inner wall, the second cover plate has a second inner wall, and the functional components are disposed inside the second sub-shell.

[0026] The second cover plate has a first inner wall, the first cover plate has a second inner wall, and the functional components are disposed inside the first sub-shell. Attached Figure Description

[0027] The above and other objects, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0028] Figure 1 A schematic cross-sectional view of the first type of motor device is shown.

[0029] Figure 2 A schematic cross-sectional view of the second type of motor device is shown.

[0030] Figure 3 A schematic diagram of the heat dissipation component is shown.

[0031] Figure 4 A schematic diagram of the fan body is shown.

[0032] Figure 5 A schematic diagram of part of the structure of the electronic device is shown.

[0033] Explanation of icon numbers:

[0034] 1. First housing; 101. First cover plate; 102. Second cover plate;

[0035] 2. Heating components;

[0036] 3. Heat dissipation components; 301. First air outlet; 302. Functional components; 3021. Baffle; 3022. Airflow guide; 303. Fan body; 3031. Second housing; 30311. Airflow guide structure; 30312. First sub-housing; 30313. Second sub-housing; 3032. Impeller;

[0037] 4. Heat exchange components;

[0038] A. Preset direction; B. First area; C. Second area; D. First inner wall; E. Second inner wall; F. First flow channel; F1. Second outlet; G. Second flow channel; H. First air outlet area; I. Second air outlet area. Detailed Implementation

[0039] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0040] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0041] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0043] With the development of electronic technology, the performance of integrated electronic devices in compact electronic devices is constantly improving, and their heat generation is also increasing. During the research and development of electronic devices, inventors discovered that differences in the space between the integrated electronic device and the device's casing, or differences in the heat-generating capabilities of the electronic components on both sides of the integrated electronic device, can cause temperature differences on both sides. This can negatively impact the performance of the electronic device and the user experience. Using conventional heat dissipation devices to uniformly cool both sides of the integrated electronic device can lead to an unreasonable distribution of heat dissipation resources.

[0044] In view of the above problems, such as Figure 1-5As shown, this disclosure provides an electronic device, comprising: a first housing 1, a heat-generating component 2, and a heat-dissipating component 3; the first housing 1 has a first inner wall D and a second inner wall E opposite to each other along a preset direction A, the preset direction A being the thickness direction of the first housing 1; the heat-generating component 2 is disposed between the first inner wall D and the second inner wall E, the space between the heat-generating component 2 and the first inner wall D is a first region B, the region between the heat-generating component 2 and the second inner wall E is a second region C, the heat-generating component 2 is capable of dissipating heat so that the internal temperature of the first region B is greater than the internal temperature of the second region C; the heat-dissipating component 3 is disposed inside the first housing 1, and the heat dissipation rate of the heat dissipation component 3 on the first region B is greater than the heat dissipation rate of the heat dissipation component 3 on the second region C.

[0045] The first housing 1 can be the housing of a conventional laptop's processing unit, or the outer shell of a computer host, etc., without specific limitations. Its thickness can be in the direction parallel to the vertical direction under normal working conditions, and this direction can be taken as the vertical direction. The first inner wall D and the second inner wall E can be two opposing inner walls disposed inside the first housing 1, which can be two opposing planes inside the first housing 1 and perpendicular to the preset direction A.

[0046] The heating component 2 can be a power control board or a driver board in an electronic device. In this embodiment, the heating component 2 can be a motherboard installed inside the electronic device. The heating component 2 also has a thickness along a preset direction A. The heating component 2 can be disposed between the first inner wall D and the second inner wall E. Its fixing method can be to be connected to the first housing 1 through a connecting groove, or to be fixed to the inside of the first housing 1 by bolts, etc. The specific fixing method of the heating component 2 inside the first housing 1 is not limited. The interval area between the heating component 2 and the first inner wall D can be understood as the space area relatively enclosed by the heating component 2 and the first inner wall D. In this embodiment, the boundary of this space area can be based on the boundary of the heating component 2, or it can be not limited to this boundary. Similarly, the area between the heating component 2 and the second inner wall E, the second area C, can be understood as the space area relatively enclosed by the heating component 2 and the second inner wall E. In this embodiment, the corresponding space area can also be based on the boundary of the heating component 2, or it can be not limited to this boundary. The first area B and the second area C are not specifically limited.

[0047] The heating element 2 generates heat during operation. The reason why the temperature inside the first region B is higher than the temperature inside the second region C could be due to differences in the heating capabilities of the electronic components on both sides of the heating element 2 along the preset direction A, or it could be due to the distance between the heating element 2 and the first inner wall D and the second inner wall E. For example, if the heating element 2 is too close to the first inner wall D, there will not be enough space for the heat to dissipate to other locations, causing the heat to accumulate in the first region B, leading to a continuous increase in the temperature of the first region B, resulting in severe overheating of the first casing 1 and affecting user experience. If the heating element 2 is too far from the second inner wall E, there will be sufficient space for heat dissipation, resulting in a lower temperature inside the second region E than inside the first region D. No specific limitation is made regarding this.

[0048] The heat dissipation component 3 can be a cooling fan, a water-cooled heat dissipation device, or a solid heat dissipation material, etc., without specific limitations. The method by which the heat dissipation component 3 achieves a greater heat dissipation rate for the first region B than for the second region C can be selected based on the specific form of the heat dissipation component 3. The heat dissipation rate can be understood as the temperature decrease per unit time; that is, it can be calculated using the temperature decrease as the numerator and the cooling time as the denominator. When using a water-cooled heat dissipation device, different heat dissipation efficiencies can be achieved by controlling the different sizes of the water-cooling pipes installed in the first region B and the second region C. When using a cooling fan, the airflow velocity and flow rate into the first region B and the second region C can be controlled. Different solid heat dissipation materials can achieve different heat dissipation efficiencies, without specific limitations. The heat dissipation component 3 can be fixed to the first housing 1 by a bracket or screws, without limitations on the specific connection method.

[0049] The electronic device provided in this embodiment includes a first housing 1, a heating element 2, and a heat dissipation element 3. The first housing 1 has a first inner wall D and a second inner wall E arranged along a preset direction A. The heating element 2 is disposed between the first inner wall D and the second inner wall E. A first region B is spaced apart from the heating element 2 and the first inner wall D, and a second region C is spaced apart from the heating element 2 and the first inner wall D. During operation, the heating element 2 can generate heat, and the heating element 2 can make the temperature of the first region B greater than that of the second region C. The heat dissipation element 3 is disposed inside the first housing 1 and can dissipate heat from the first region B and the second region C. The heat dissipation rate of the heat dissipation element 3 on the first region B is greater than the heat dissipation rate of the heat dissipation element 3 on the second region C. The first region B, which has a higher temperature, experiences a greater temperature drop, while the second region C experiences a relatively smaller temperature drop, bringing both regions to a similar safe temperature. Compared to some solutions that use heat dissipation components 3 to cool the first region B and the second region C at the same heat dissipation rate, this solution uses a higher heat dissipation rate to cool the first region B, allowing it to cool down sufficiently, while using a lower heat dissipation rate for the second region C, which avoids excessive heat dissipation in the second region C and allows the first region B to receive more heat dissipation resources. This optimizes the utilization of heat dissipation resources and makes the heat dissipation resource allocation of the electronic device provided by this disclosure more reasonable.

[0050] like Figure 1 , 2 As shown, in some embodiments, the distance between the heating element 2 and the first inner wall D can be smaller than the distance between the heating element 2 and the second inner wall E. The heat dissipation element 3 can release a first heat dissipation fluid to the first region B and a second heat dissipation fluid to the second region C. The flow rate of the first heat dissipation fluid can be greater than the flow rate of the second heat dissipation fluid.

[0051] The distance between the heating element 2 and the first inner wall D can be the minimum straight-line distance between the first inner wall D and the heating element 2. Similarly, the distance between the heating element 2 and the second inner wall E can be the minimum straight-line distance from the second inner wall E to the heating element 2. Therefore, in this embodiment, since the distance between the heating element 2 and the second inner wall E is less than the distance between the heating element 2 and the first inner wall D, the temperature of the first region B will be higher during the heat generation process of the heating element 2, resulting in an increase in the temperature of the first outer shell portion corresponding to the first inner wall D. While the temperature of the second outer shell portion corresponding to the second inner wall E also increases, it is lower than the temperature at the first inner wall D. The distance between the heating element 2 and the first inner wall D and the second inner wall E can be controlled by a bracket or fixed by a mounting block, etc., without limiting the specific connection method.

[0052] The heat dissipation component 3 can release a first cooling fluid and a second cooling fluid to the first region B and the second region C, respectively. Specifically, this can be achieved by including two cooling fans in the heat dissipation component 3, with each fan releasing one cooling fluid. Alternatively, the heat dissipation component 3 can be a fan with a single air outlet, releasing the first and second cooling fluids to different air outlet areas. The specific structure of the heat-generating component 2 is not limited. The flow rate of the first cooling fluid being greater than that of the second cooling fluid can be achieved by controlling the power of the heat dissipation component 3; the specific method of flow rate control is not limited. The flow rates of the first and second cooling fluids can be understood as the amount of fluid passing through a certain cross-section or region per unit time. It is an important parameter describing fluid motion. A flow rate greater than that of the second cooling fluid can be understood as the amount of the first cooling fluid flowing through the first region per unit time being greater than the amount of the second cooling fluid flowing through the second region per unit time.

[0053] like Figure 1 As shown, in some embodiments, the heat dissipation component 3 has a first air outlet 301 facing the heat-generating component 2. The first air outlet 301 may have a first air outlet region H relative to the first region B and a second air outlet region I relative to the second region C. The cross-section of the first air outlet region H along a preset direction A may be larger than the cross-section of the second air outlet region I along the preset direction A.

[0054] The first air outlet 301 of the heat dissipation component 3 faces the heat-generating component 2 so that heat dissipation can be achieved from the first air outlet 301. The first air outlet 301 relative to the first air outlet area H of the first region B can be understood as the portion of the first air outlet 301 facing the first region B, or as the portion of the heat dissipation airflow released from the first air outlet area H being able to enter the first region B. Similarly, the first air outlet 301 relative to the second air outlet area I of the second region C can be understood as the portion of the second air outlet area I facing the second region C, or as the portion of the heat dissipation airflow from the second air outlet area I being able to enter the second region C. In this embodiment, the orientation direction of the first air outlet 301 can be perpendicular to a preset direction A, the projection of the first air outlet area H of the first air outlet 301 along the orientation direction can be completely located within the first region B, and the projection of the second air outlet area I of the first air outlet 301 along the orientation direction can be completely located within the second region C. The cross-section of the first air outlet region H along the preset direction A can be larger than the cross-section of the second air outlet region I along the preset direction A. Therefore, along this direction, more heat dissipation fluid can be released in the first air outlet region H, while the flow rate of heat dissipation fluid in the second air outlet region I is less than that in the first air outlet region H. This allows the first region B, which has a higher temperature, to dissipate heat more quickly and reduce its temperature more significantly, cooling it to any temperature—a safe temperature or the temperature at which the electronic device maintains optimal operation—without specific limitations on the temperature it reaches. Simultaneously, although the heat dissipation rate of the second region C is slower than that of the first region B, the temperature of the second region C is lower than that of the first region B. Therefore, the second region C can also be reduced to a safe temperature or a preset temperature similar to that of the first region B.

[0055] like Figure 1-4 As shown, in some embodiments, the heat dissipation component 3 includes: a fan body 303 and a functional component 302; the fan body 303 may have a first flow channel F; the functional component 302 may be disposed in the first flow channel F to form a first air outlet 301 with the first flow channel F, and the functional component 302 can adjust the flow direction of the heat dissipation fluid released by the fan body 303.

[0056] The fan body 303 can be a centrifugal fan, an axial fan, etc., without specific limitations. The first flow channel F of the fan body 303 can be the space through which airflow flows within the casing of the fan body 303, without specific limitations. The functional component 302 can be a blocking block, a flow-guiding structure, etc., without specific limitations. The functional component can guide the cooling airflow released from the fan body 303 to adjust the direction of the airflow, so that more cooling airflow is released to the first region B, and less cooling airflow is released to the second region C relative to the first region B, thereby achieving a reasonable allocation of cooling resources. The functional component 302 can also be a flow-guiding plate with an adjustable angle. By adjusting the angle of the flow-guiding plate, the flow direction of the cooling fluid can be dynamically adjusted. For example, when an electronic device is charging, the heat generated by the charging module located in the second region C will increase. In this case, the angle of the flow-guiding plate can be adjusted to allow more cooling fluid to be allocated to the second region C, thereby adjusting the cooling of the second region C. The specific structure of the functional component is not limited.

[0057] like Figure 1-4 As shown, in some embodiments, the functional component 302 includes: a blocking part 3021 and a diverting part 3022; the blocking part 3021 can be disposed inside the first flow channel F and can block part of the first outlet of the first flow channel F so that the side wall of the blocking part 3021 in the first flow channel F forms a first air outlet 301; the diverting part 3022 can be disposed inside the first flow channel F, the first end of the diverting part 3022 can be connected to the blocking part 3021, the second end of the diverting part 3022 can extend in the first flow channel F away from the first outlet of the first flow channel F, the diverting part 3022 and the inner wall of the first flow channel F can form a second flow channel G, the second flow channel G can be connected to the first air outlet 301, and the size of the second flow channel G along the preset direction A can decrease in the direction from the second end to the first end of the diverting part 3022.

[0058] The blocking part 3021 can be a blocking block or a blocking plate disposed inside the first flow channel F, and is not specifically limited thereto. The blocking part 3021 can block part of the first flow channel F so that the heat dissipation fluid can be blocked by the blocking part 3021, and the blocked heat dissipation airflow can be guided to the unblocked part and released at the outlet of the unblocked first flow channel F. The blocking part 3021 can be disposed at a position relative to the second region C. In this embodiment, it can be understood that the projection of the blocking part 3021 along the orientation direction can be located inside the second region C. When the fan body 303 releases heat dissipation airflow, the heat dissipation airflow that should be released to the second region C can be blocked and flow to the unblocked position for release, so as to achieve the distribution of more airflow to the first region B and less airflow to the second region C.

[0059] The blocking part 3021 and the airflow guiding part 3022 can be bolted to the outer shell of the fan body 303, or they can be integrally formed, etc., without specific limitations. The airflow guiding part 3022 can guide the heat dissipation airflow released by the fan body 303 to the first air outlet 301 for release. The airflow guiding part 3022 can be a guide plate, which is set inside the first flow channel F to form a ramp structure. The airflow guiding part 3022 can also be a guide block with an arc structure, etc., without specific limitations. The airflow guiding part 3022 is set inside the first flow channel F to realize the second flow channel G formed inside the first flow channel F, so that the size of the second flow channel G decreases along the preset direction A. The decreasing size of the flow channel G along the preset direction A can be understood as the size of the second flow channel G along the preset direction A decreasing along a variable value. The value of the variable value can be selected according to the size of the blocking part 3021 and the airflow guiding part 3022, or it can be adjusted according to the position of the heat-generating component, etc. The second flow channel G can also be uniformly reduced along a fixed value, or the first flow channel G can be located at a first position with a first distance of X along a preset direction A, and the second position located near the heating component at the first position with a second distance of Y along a preset direction. The dimension Y is smaller than the dimension X, so that the flow guide 3021 can guide the heat dissipation airflow to the inside of the first air outlet 301, reducing the heat dissipation fluid from colliding with other parts before entering the first air outlet 301 and causing losses, so as to achieve a better flow guide effect. No specific limitation is imposed on it.

[0060] Along the direction from the second end to the first end of the guide section 3022, the size of the second flow channel G can decrease along the preset direction A. This is to adjust the flow direction of the heat dissipation fluid along the preset direction, so that the heat dissipation fluid flows towards the first region B to match the better temperature of the first region. This allows the first air outlet 301 to release more heat dissipation fluid into the first region B, thereby achieving a better heat dissipation effect for the first region B.

[0061] like Figure 4 As shown, in some embodiments, the fan body 303 includes: a second housing 3031 and an impeller 3032; the second housing 3031 may have an arc-shaped flow guide structure 30311; the impeller 3032 may be rotatably connected to the inside of the second housing 3031, and a first flow channel F may be formed between the periphery of the impeller 3032 and the second housing 3031; wherein, the impeller 3032 is rotatable, so that the gas in the first flow channel F moves along the flow guide structure 30311 under the action of centrifugal force to generate a heat dissipation airflow.

[0062] The second housing 3031 can be a volute-shaped housing, with the arc-shaped portion forming the airflow guide structure 30311. Alternatively, the second housing 3031 can be a square housing with an arc-shaped airflow guide block inside, also serving as the airflow guide structure 30311. The impeller 3032 can be disposed inside the second housing 3031 and rotated by a regional motor. This allows the impeller 3032, the second housing 3031, the motor, and the airflow guide structure 30311 to form a centrifugal fan. The gap between the impeller 3032 and the second housing 3031 can form a first flow channel F. When the impeller 3032 rotates, the gas in the first flow channel F moves along the airflow guide structure 30311 under centrifugal force, generating a cooling airflow. The specific forms of the second housing 3031, the impeller 3032, and the airflow guide structure 30311 are not limited. The centrifugal fan can achieve efficient heat dissipation while providing precise airflow and a stable cooling airflow for the heat-generating component 2.

[0063] like Figure 4 As shown, in some embodiments, the drainage portion 3022 can be connected to the inner wall of the flow guiding structure 30311, and the extension direction of the second end of the drainage portion 3022 can be the same as the extension direction of the inner wall of the flow guiding structure 30311. The thickness of the drainage portion 3022 from the second end to the first end along the preset direction A can increase.

[0064] The arrangement and cooperation of the flow-guiding part 3022 and the inner wall of the flow-guiding structure 30311 can guide the heat dissipation airflow generated by the fan body so that the heat dissipation airflow can be released from the first air outlet 301. The function of the flow-guiding structure 30311 is to guide the heat dissipation airflow generated by the centrifugal fan along the circumferential direction to the outlet of the first flow channel F along the inner wall of the flow-guiding structure 30311, while the flow-guiding part 3022 guides the heat dissipation airflow to the first air outlet 301 for release. The increasing thickness of the drainage section 3022 along the preset direction A from the second end to the first end can be understood as the thickness of the drainage section 3022 along the preset direction A from the second end to the first end satisfying a functional relationship that causes it to increase. It can also be a uniform increase with a fixed increase value. Alternatively, the dimension of the third distance of the drainage section 3022 along the preset direction A at the third position can be Z, and the dimension of the second position located near the heating element at the third position can be O. The dimension O is greater than the dimension Z, so that the drainage section 3022 forms a second flow channel G in the first flow channel F where the dimension along the preset direction A can decrease, thereby achieving a better drainage effect for the heating fluid. No specific limitation is imposed on it.

[0065] like Figure 5As shown, in some embodiments, the electronic device includes: a heat exchange component 4; a first end of the heat exchange component 4 may be disposed at a preset position of the heating component 2 to exchange heat with the heating component 2; a first flow channel F may be provided with a second outlet F1, and the second outlet F1 may face the second end of the heat exchange component 4.

[0066] The heat exchange component 4 can be a heat spreader or a heat pipe, etc., without specific limitations. In this embodiment, the preset position of the heat-generating component 2 can be selected according to the specific structure of the heat-generating component 2. The preset position can be a location where the heat-generating component 2 generates more heat. If the heat-generating component 2 is a motherboard, the preset position can be the location where the central processing unit is installed. If the heat-generating component 2 is a power management module, the preset position can be the location where the transformer or power transistor is installed, without specific limitations. The first end of the heat exchange component 4 contacts the preset position of the heat-generating component 2 to achieve heat exchange and conduct the heat to the second end of the heat exchange component 4. The first flow channel F structure is provided with a second outlet F1 so that the heat dissipation airflow generated by the fan body 303 can be released from the second outlet F1 and dissipate heat to the second end of the heat exchange component 4 to achieve overall heat dissipation of the heat exchange component 4, and further dissipate heat to the heat-generating component 2.

[0067] like Figure 1-3 As shown, in some embodiments, the first housing 1 includes: a first cover plate 101 and a second cover plate 102; the second housing 3031 includes: a first sub-housing 30312 and a second sub-housing 30313; the first cover plate 101 and the second cover plate 102 can be spaced apart along a preset direction A, and the thickness of the first cover plate 101 can be greater than the thickness of the second cover plate 102; the first sub-housing 30312 and the second sub-housing 30313 can be arranged opposite to each other along a preset direction A, and the first sub-housing 30312 can be connected to the first cover plate 101.

[0068] The first cover plate 101 and the second cover plate 102 can be connected via the structural frame of the first housing 1, or they can be directly connected via slots or bolts; the specific connection method is not limited. The thickness of the first cover can be greater than the thickness of the second cover to give the first cover a stronger load-bearing capacity. The connection method between the first sub-housing 30312 and the first cover plate 101 can be a bolt connection or a slot connection, etc., without specific limitations. By installing the first sub-housing 30312 onto the first cover plate 101, the fan body 303 can be securely connected to the first housing 1, thereby increasing the structural stability of the electronic device.

[0069] like Figure 1-3As shown, in some embodiments, the first cover plate 101 may have a first inner wall D, the second cover plate 102 may have a second inner wall E, and the functional component 302 may be disposed inside the second sub-housing 30313; or

[0070] The second cover plate 102 may have a first inner wall D, the first cover plate 101 may have a second inner wall E, and the functional component 302 may be disposed inside the first sub-housing 30312.

[0071] In this embodiment, when the heating element 2 is closer to the first cover plate 101 and slightly farther from the second cover plate 102, the functional component 302 can be disposed on the second sub-shell 30313 to achieve a greater distribution of heat dissipation airflow between the heating element 2 and the first cover plate 101, while the airflow between the heating element 2 and the second cover plate 102 is less. When the heating element 2 is closer to the second cover plate 102 and slightly farther from the first cover plate 101, the functional component 302 can be disposed on the first sub-shell 30312 to achieve a less heat dissipation airflow between the heating element 2 and the first cover plate 101, while the airflow between the heating element 2 and the second cover plate 102 is greater, thus resulting in a more rational allocation of heat dissipation resources.

[0072] As shown in Table 1, the conditions in Table 1 are that the heat-generating component 2 is closer to the first cover plate 101 and slightly farther from the second cover plate 102. The standard temperature can be understood as the temperature of the first cover plate 101 and the second cover plate 102 when the electronic device only uses a fan in conjunction with a heat exchange component to dissipate heat from the heat-generating component.

[0073] In the comparative example, a standard centrifugal fan was used for heat dissipation. The side exhaust port of the centrifugal fan faced the first heat-generating component, and the centrifugal fan in the comparative example had the same heat dissipation capacity for the first region B and the second region C, meaning that the flow rate of the cooling fluid released by the centrifugal fan to the first region B and the second region C was the same. As can be seen from the comparative example, using the heat dissipation method in the comparative example, the temperature of the second cover plate 102 decreased by 1.7℃ compared to the standard temperature, while the temperature of the first cover plate 101 increased by 0.8℃.

[0074] In the embodiments of this disclosure, the first cover plate 101 may have a first inner wall D, and the second cover plate 102 may have a second inner wall E. Using the heat dissipation method of the embodiments of this disclosure, the temperature of the second cover plate 102 is reduced by 1.6°C compared to the standard temperature, while the temperature of the first cover plate 101 is reduced by 0.4°C compared to the standard temperature, and reduced by 1.2°C compared to the comparative example.

[0075]

[0076] Table 1 Temperature comparison between comparative examples and embodiments of this disclosure

[0077] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

[0078] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0079] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0080] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

Claims

1. An electronic device, characterized in that, include: A first housing, the first housing having a first inner wall and a second inner wall opposite each other along a preset direction, the preset direction being the thickness direction of the first housing; A heating element is disposed between the first inner wall and the second inner wall. The space between the heating element and the first inner wall is a first region, and the region between the heating element and the second inner wall is a second region. The heating element can dissipate heat so that the internal temperature of the first region is greater than the internal temperature of the second region. A heat dissipation component is disposed inside the first housing, and the heat dissipation rate of the heat dissipation component to the first region is greater than the heat dissipation rate of the heat dissipation component to the second region.

2. The electronic device according to claim 1, characterized in that, The distance between the heating element and the first inner wall is less than the distance between the heating element and the second inner wall. The heat dissipation element can release a first heat dissipation fluid to the first region and a second heat dissipation fluid to the second region. The flow rate of the first heat dissipation fluid is greater than the flow rate of the second heat dissipation fluid.

3. The electronic device according to claim 2, characterized in that, The heat dissipation component has a first air outlet facing the heat-generating component. The first air outlet has a first air outlet area relative to the first region and a second air outlet area relative to the second region. The cross-section of the first air outlet area along the preset direction is larger than the cross-section of the second air outlet area along the preset direction.

4. The electronic device of claim 3, wherein, The heat dissipation component includes: A fan body having a first flow channel; A functional component is disposed within the first flow channel to form the first air outlet together with the first flow channel. The functional component is capable of adjusting the flow direction of the heat dissipation fluid released by the fan body.

5. The electronic device according to claim 4, characterized in that, The functional components include: A blocking part is disposed inside the first flow channel and blocks part of the first outlet of the first flow channel so that the blocking part and the side wall of the first flow channel form the first air outlet. A flow guide is disposed inside the first flow channel. The first end of the flow guide is connected to the blocking part. The second end of the flow guide extends inside the first flow channel in a direction away from the first outlet of the first flow channel. The flow guide and the inner wall of the first flow channel form a second flow channel. The second flow channel is connected to the first air outlet. From the second end to the first end of the flow guide, the size of the second flow channel decreases along the preset direction.

6. The electronic device of claim 5, wherein, The fan body includes: The second housing has an arc-shaped flow-guiding structure; An impeller is rotatably connected to the inside of the second housing, and the circumference of the impeller and the second housing form the first flow channel. The impeller is rotatable, causing the gas in the first flow channel to move along the guide structure under the action of centrifugal force to generate a cooling airflow.

7. The electronic device according to claim 6, characterized in that, The drainage portion is connected to the inner wall of the flow guiding structure, and the second end of the drainage portion extends in the same direction as the inner wall of the flow guiding structure. The thickness of the drainage portion increases along the preset direction from the second end to the first end.

8. The electronic device of claim 4, wherein, include: A heat exchange component, wherein the first end of the heat exchange component is disposed at a preset position of the heating component to exchange heat with the heating component; The first flow channel is provided with a second outlet, which faces the second end of the heat exchange component.

9. The electronic device according to claim 6, characterized in that, The first housing includes: A first cover plate and a second cover plate are provided at intervals along the preset direction, and the thickness of the first cover plate is greater than the thickness of the second cover plate. The second housing includes: A first sub-shell and a second sub-shell are arranged opposite each other along a preset direction, and the first sub-shell is connected to the first cover plate.

10. The electronic device of claim 9, wherein, Choose one of the following combinations: The first cover plate has the first inner wall, the second cover plate has the second inner wall, and the functional component is disposed inside the second sub-shell; The second cover plate has the first inner wall, the first cover plate has the second inner wall, and the functional component is disposed inside the first sub-shell.

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