A case structure facilitating heat dissipation of a display card
By installing tilting fans at the bottom and sides of the chassis, the heat dissipation structure of the graphics card is improved, solving the problem of insufficient heat dissipation in the three-glass structure chassis, and achieving both efficient heat dissipation and aesthetics for the graphics card.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 广东迅扬科技股份有限公司
- Filing Date
- 2025-04-21
- Publication Date
- 2026-05-29
AI Technical Summary
The heat dissipation efficiency of a three-glass chassis is insufficient, especially during long-term high-load operation. The poor thermal conductivity of the glass causes the internal temperature of the chassis to rise rapidly, threatening the stability and lifespan of the hardware.
An inclined fan is installed at the bottom and side of the chassis frame. The fan blows external air towards the middle of the chassis and draws it in from below for cooling the graphics card. Combined with the inclined bottom and side mounting plates, the air is dissipated from the top through the transition heatsink, improving the heat dissipation structure.
It effectively improves the heat dissipation efficiency of the graphics card, while also maintaining aesthetics, and avoids hardware stability and lifespan issues caused by insufficient heat dissipation.
Smart Images

Figure CN224304108U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of chassis technology, specifically relating to a chassis structure that facilitates heat dissipation for graphics cards. Background Technology
[0002] The computer case is the outer shell of a computer hardware system, used to house and protect core components such as the motherboard, CPU, graphics card, hard drive, and power supply, while also providing heat dissipation, expansion interfaces, and overall structural support. It is not only the "skeleton" of the computer but also an important carrier for its appearance design and functional expansion.
[0003] Among computer cases on the market, the three-glass structure (often referred to as the "sea view room case") is becoming increasingly popular. The main feature of this type of case is its unique glass panel layout, specifically, the two sides and the top of the case are all made of glass. This design not only gives the case extremely high transparency and visual appeal, allowing users to clearly see the internal hardware configuration and lighting effects, but also greatly enhances the overall aesthetics.
[0004] However, the three-glass chassis design also presents certain heat dissipation challenges. Due to the relatively poor thermal conductivity of glass, heat inside the chassis is difficult to dissipate effectively through the glass panels. Especially during prolonged high-load operation, the internal temperature of the chassis may rise rapidly, posing a potential threat to the stability and lifespan of the hardware. Utility Model Content
[0005] The purpose of this invention is to provide a chassis structure that facilitates heat dissipation for graphics cards, thereby addressing the problem of insufficient heat dissipation efficiency in existing three-glass chassis structures mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a chassis structure for facilitating graphics card heat dissipation, including a chassis frame; the rear surface of the chassis frame and one side adjacent to the rear surface are closed, while the front surface of the chassis frame and one side adjacent to the front surface are open, wherein the chassis frame is the skeleton of the entire chassis; it also includes a main glass plate; the main glass plate is placed inside the chassis frame and completely closes the open area of the chassis frame; an inclined bottom mounting frame is provided at the bottom of the chassis frame, on which a fan is mounted, and an inclined side mounting frame is also installed inside the chassis frame, on which a fan is mounted, the bottom mounting frame and the side mounting frame do not contact each other, the fan on the side mounting frame can drive external air to blow towards the middle of the chassis to dissipate heat from the graphics card, and the fan on the inclined bottom mounting frame can draw air in from below to further dissipate heat from the graphics card, and the air dissipates from the transition heat dissipation plate at the top of the chassis after being cooled.
[0007] Preferably, the bottom mounting frame plate is inclined upward from the opening area of the chassis frame toward the rear surface, while the side mounting frame plate is vertically arranged inside the chassis frame and is inclined toward the rear surface of the chassis frame.
[0008] Preferably, a gap is formed between the bottom mounting frame and the bottom end face of the chassis frame, which ensures that external air is drawn in, and the fan is tilted at the same angle as the bottom mounting frame.
[0009] Preferably, a connection port is also installed on the bottom inner side of the chassis frame. The connection port is located at one end of the interlayer and is spaced apart from the fan.
[0010] Preferably, a transition heat sink and a transition glass plate are installed on the top of the chassis frame. The vertical projections of the transition glass plate and the transition heat sink coincide with the vertical projection of the chassis frame, thereby sealing the top of the chassis frame through the transition heat sink and the transition glass plate, while ensuring normal heat dissipation efficiency.
[0011] Preferably, the connecting end of the transition heat dissipation plate is tilted towards the top of the chassis frame, making the top structure of the entire chassis tilted, which can improve the overall aesthetics. The top of the transition glass plate is attached to the top of the main glass plate to avoid the formation of gaps.
[0012] Preferably, a third fan is installed on one side of the chassis frame, and a heat dissipation hole is provided on one side surface of the chassis frame; a graphics card is installed in the middle of the inside of the chassis frame, and the first fan is located below the graphics card, while the second fan is located on one side of the graphics card.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] In this invention, the top of the original three-glass structure is changed from a single piece of glass to a transitional glass panel and heat sink, which balances aesthetics and heat dissipation. Meanwhile, commercially available computer cases typically place the case fan on the top and back panel. This case, to further improve heat dissipation, places the fan on both the bottom and side mounting plates, both of which are inclined. The inclined side mounting plate allows the fan to blow external air towards the center of the case to cool the graphics card, while the inclined bottom mounting plate draws air in from below for further cooling. The cooled air then dissipates through the transitional heat sink at the top of the case, achieving both aesthetics and heat dissipation. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of this utility model;
[0016] Figure 2 This is a side view of the present invention;
[0017] Figure 3 This is a schematic diagram of the structure of this utility model after removing the transition glass plate and the main glass plate;
[0018] Figure 4 This is a schematic diagram of the installation of the side mounting frame plate of this utility model inside the chassis frame.
[0019] In the picture:
[0020] 100. Chassis frame; 101. Transition heat sink; 102. Connection port; 103. Fan 1; 104. Bottom mounting frame; 105. Fan 2; 106. Fan 3; 107. Side mounting frame;
[0021] 200. Main glass panel; 201. Transition glass panel. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Please see Figures 1 to 4 This utility model provides a technical solution: a chassis structure that facilitates graphics card heat dissipation, including...
[0024] Chassis frame 100; the rear surface of the chassis frame 100 and the side adjacent to the rear surface are closed, while the front surface of the chassis frame 100 and the side adjacent to the front surface are open, wherein the chassis frame 100 is the skeleton of the entire chassis.
[0025] Also includes
[0026] Main glass panel 200; The main glass panel 200 is placed inside the chassis frame 100 and completely closes the opening area of the chassis frame 100.
[0027] An inclined bottom mounting frame 104 is provided at the bottom of the chassis frame 100. A fan 103 is mounted on the bottom mounting frame 104. An inclined side mounting frame 107 is also installed inside the chassis frame 100. A fan 105 is mounted on the side mounting frame 107. The bottom mounting frame 104 and the side mounting frame 107 do not contact each other. The fan 105 on the side mounting frame 107 can drive external air to blow towards the middle of the chassis to cool the graphics card. The fan 103 on the inclined bottom mounting frame 104 can draw air from below to further cool the graphics card. After the air is cooled, it is discharged from the transition heat sink 101 at the top of the chassis.
[0028] In this embodiment, preferably, the bottom mounting frame 104 is inclined upward from the opening area of the chassis frame 100 toward the rear surface, while the side mounting frame 107 is vertically arranged inside the chassis frame 100 and is inclined toward the rear surface of the chassis frame 100.
[0029] In this embodiment, preferably, a gap is formed between the bottom mounting frame 104 and the bottom end face of the chassis frame 100. The gap ensures that external air is drawn in, and the fan 103 has the same tilt angle as the bottom mounting frame 104.
[0030] In this embodiment, preferably, a connection port 102 is also installed on the bottom inner side of the chassis frame 100. The connection port 102 is located at one end of the interlayer and has a gap between it and the fan 103.
[0031] In this embodiment, preferably, a transition heat dissipation plate 101 and a transition glass plate 201 are installed on the top of the chassis frame 100. The vertical projections of the transition glass plate 201 and the transition heat dissipation plate 101 coincide with the vertical projection of the chassis frame 100, thereby sealing the top of the chassis frame 100 through the transition heat dissipation plate 101 and the transition glass plate 201, while ensuring normal heat dissipation efficiency while having the transition glass plate 201.
[0032] In this embodiment, preferably, the connection end of the transition heat dissipation plate 101 and 202 is tilted towards the top of the chassis frame 100, so that the top structure of the entire chassis is tilted, which can improve the overall aesthetics. The top of the transition glass plate 201 is attached to the top of the main glass plate 200 to avoid the generation of gaps.
[0033] In this embodiment, preferably, a fan 106 is also installed on one side of the chassis frame 100, and a heat dissipation hole is opened on one side surface of the chassis frame 100; a graphics card is installed in the middle of the inside of the chassis frame 100, while fan 103 is located below the graphics card and fan 205 is located on one side of the graphics card.
[0034] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A chassis structure for facilitating graphics card heat dissipation, comprising: Chassis frame (100); the rear surface of the chassis frame (100) and the side adjacent to the rear surface are closed, while the front surface of the chassis frame (100) and the side adjacent to the front surface are open; Its features are: Also includes Main glass panel (200); the main glass panel (200) is placed inside the chassis frame (100) and completely closes the opening area of the chassis frame (100); An inclined bottom mounting frame (104) is provided at the bottom of the interior of the chassis frame (100). A fan (103) is mounted on the bottom mounting frame (104). An inclined side mounting frame (107) is also installed inside the chassis frame (100). A fan (105) is mounted on the side mounting frame (107). The bottom mounting frame (104) and the side mounting frame (107) do not contact each other.
2. The chassis structure for facilitating graphics card heat dissipation according to claim 1, characterized in that: The bottom mounting frame (104) is inclined upward toward the rear surface from the opening area of the chassis frame (100), while the side mounting frame (107) is vertically arranged inside the chassis frame (100) and is inclined toward the rear surface of the chassis frame (100).
3. The chassis structure for facilitating graphics card heat dissipation according to claim 1, characterized in that: A void layer is formed between the bottom mounting frame (104) and the bottom end face of the chassis frame (100), and the fan (103) has the same tilt angle as the bottom mounting frame (104).
4. The chassis structure for facilitating graphics card heat dissipation according to claim 3, characterized in that: The bottom inner side of the chassis frame (100) is also equipped with a connection port (102), which is located at one end of the interlayer and has a gap between it and the fan (103).
5. The chassis structure for facilitating graphics card heat dissipation according to claim 1, characterized in that: The top of the chassis frame (100) is equipped with a transition heat sink (101) and a transition glass plate (201), the vertical projections of the transition glass plate (201) and the transition heat sink (101) coincide with the vertical projection of the chassis frame (100).
6. The chassis structure for facilitating graphics card heat dissipation according to claim 5, characterized in that: The connection ends of the transition heat sink (101) and (202) are inclined towards the top of the chassis frame (100), and the transition glass plate (201) is attached to the top of the main glass plate (200).
7. The chassis structure for facilitating graphics card heat dissipation according to claim 1, characterized in that: Fan 3 (106) is also installed on one side of the chassis frame (100), and heat dissipation holes are opened on one side surface of the chassis frame (100); a graphics card is installed in the middle of the inside of the chassis frame (100), and fan 1 (103) is located below the graphics card, and fan 2 (105) is located on one side of the graphics card.