A heat dissipation module, computing power module and data processing device

Abstract

The utility model provides a kind of heat dissipation module, the computing power board has opposite first end and second end, in the first end and the second end of the computing power board respectively setting exhaust device, and then form the air inlet located in the first end and the air outlet located in the second end;Multiple rows of chips are provided on the computing power board;The heat dissipation module includes first heat dissipation piece and heat conduction plate, the heat conduction plate is fixed between the first heat dissipation piece and the computing power board;Heat pipe is embedded in the heat conduction plate, the vertical projection of the heat pipe on the computing power board covers at least part of the chip, and the extension direction of the heat pipe is parallel to the exhaust direction, the exhaust direction is directed from the first end to the second end of the computing power board.The heat dissipation module, computing power module and data processing equipment provided by the utility model can provide good heat dissipation for the computing power board, and the temperature consistency of the chip is good.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202420642324.4, filed on March 29, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This utility model relates to the field of heat dissipation, and in particular to a heat dissipation module, a computing module, and a data processing device. Background Technology

[0004] Data processing equipment demands massive computational power, typically requiring hundreds or even thousands of chips on a computing board to meet these requirements. These chips generate significant heat during prolonged operation, resulting in extremely high temperatures within the computing board's enclosure—currently exceeding 100°C. Prolonged exposure to such high temperatures shortens the lifespan of electronic components and increases the risk of malfunctions. Therefore, computing boards generally require dedicated heatsinks to dissipate heat and reduce the temperature of their surrounding environment.

[0005] Existing cooling solutions for computing boards typically involve fixing a heatsink to the side of the board where no components are located. Heat is absorbed onto the heatsink, and then exhausted by a fan or other ventilation system. However, because the air entering from the inlet is at a low temperature, chips near the inlet experience good cooling. Conversely, the air near the outlet has already absorbed a significant amount of heat, resulting in relatively poor cooling for chips near the outlet. This leads to large temperature differences (even exceeding 10°C) among chips on the same computing board, resulting in poor temperature uniformity – a situation undesirable to those skilled in the art. Utility Model Content

[0006] Based on the above situation, the main purpose of this utility model is to provide a heat dissipation module, computing module and data processing device with good heat dissipation effect.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a heat dissipation module for heat dissipation of a computing board, the computing board having a first end and a second end opposite to each other, and exhaust devices respectively provided at the first end and the second end of the computing board, thereby forming an air inlet at the first end and an air outlet at the second end; multiple rows of chips are provided on the computing board; the heat dissipation module includes a first heat sink and a heat-conducting plate, the heat-conducting plate being fixed between the first heat sink and the computing board;

[0008] The heat-conducting plate has a groove on its surface away from the computing board. The groove contains a heat pipe. The vertical projection of the heat pipe onto the computing board covers at least a portion of the chip. The extension direction of the heat pipe is parallel to the exhaust direction, which points from the first end of the computing board to the second end.

[0009] Preferably, the heat-conducting plate is welded and fixed to the first heat sink;

[0010] The heat pipe is welded and fixed in the groove by a flux layer;

[0011] The surface of the heat pipe is flush with the surface of the heat-conducting plate near the first heat sink, or the surface of the heat pipe is lower than the surface of the heat-conducting plate near the first heat sink, and the surface of the flux layer in the groove is flush with the surface of the heat-conducting plate near the first heat sink.

[0012] Preferably, the heat-conducting plate has multiple protrusions on its surface near the computing board. The protrusions are positioned corresponding to the chip, and the protrusions are in direct contact with the chip, and / or the protrusions are in contact with the chip through a heat-conducting layer.

[0013] Preferably, the height difference between the boss and the surface in direct contact with the chip is less than 0.1 mm;

[0014] The thermally conductive layer is formed from one or more of thermally conductive grease, thermally conductive gel, or thermally conductive pad.

[0015] Preferably, the chips are arranged along the exhaust direction to form several chip columns; the number and position of the grooves correspond to the number and position of the chip columns; the vertical projection of the heat pipe on the computing board completely covers the chip columns.

[0016] Preferably, a second heat sink is fixed on the side of the computing board away from the heat-conducting plate;

[0017] The heat dissipation module includes a through-hole and a locking component. The through-hole passes through the first heat dissipation component, the heat conduction plate, the computing board and the second heat dissipation component, and is locked with the locking component.

[0018] The heat-conducting plate between adjacent bosses is provided with through holes for the insert to pass through.

[0019] Preferably, the heat pipe is a hollow junction, and the hollow structure contains a liquid capable of phase change and heat transfer;

[0020] The heat pipe is flat and has a uniform thickness along its extension direction perpendicular to the heat-conducting plate.

[0021] This utility model also provides a computing power module, including the heat dissipation module and the computing power board as described above, wherein the computing power board is fixed to the heat dissipation module.

[0022] This utility model also provides a data processing device, including a chassis and a computing module as described above, wherein the computing module is at least partially housed within the chassis.

[0023] Preferably, the top and bottom of the chassis are provided with sliding grooves, and the computing board is located in the top and bottom of the chassis and accommodated in the sliding grooves to realize the sliding and fixing of the computing module in the chassis;

[0024] Each of the aforementioned slides includes multiple sub-slides arranged in parallel, and different sub-slides are adapted to the sliding and fixing of different computing modules within the chassis.

[0025] The heat dissipation module, computing module, and data processing device provided by this utility model feature a heat-conducting plate with a groove on the side away from the computing board. A heat pipe is housed within the groove, and its vertical projection onto the computing board covers at least a portion of the chip. The heat pipe extends parallel to the exhaust direction. Therefore, the heat pipe effectively balances the overall temperature of the computing board, transferring heat from high-temperature areas to lower-temperature areas, resulting in better temperature uniformity. Furthermore, because the heat pipe is embedded in the groove on the side of the heat-conducting plate away from the computing board, its presence does not affect the contact between the heat-conducting plate and the chip. This avoids situations where poor surface flatness of the heat pipe leads to uneven pressure during installation, potentially damaging the chip, and / or increases the thickness of thermally conductive materials such as interface thermal adhesive, thus deteriorating heat dissipation.

[0026] Other beneficial effects of this utility model will be explained in detail through the introduction of specific technical features and technical solutions in the specific embodiments. Those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions through the introduction of these technical features and technical solutions. Attached Figure Description

[0027] The preferred embodiments of the thrombus removal component and thrombus removal device according to the present invention will be described below with reference to the accompanying drawings. In the drawings:

[0028] Figure 1 This is a three-dimensional structural diagram of the data processing device according to an embodiment of the present utility model.

[0029] Figure 2 This is a three-dimensional structural diagram of the computing box included in the data processing device of this utility model embodiment.

[0030] Figure 3This is a three-dimensional structural diagram of the chassis included in the data processing equipment of this utility model embodiment.

[0031] Figure 4 This is a schematic diagram of the structure of the computing module and the exhaust device in an embodiment of the present invention.

[0032] Figure 5 and Figure 6 The figure shown is an exploded structural diagram of the computing module in an embodiment of this utility model.

[0033] Figure 7 and Figure 8 This is a schematic diagram of the front and back structures of the heat-conducting plate in an embodiment of this utility model.

[0034] Figure 9 for Figure 7 A magnified structural diagram of point A in the middle.

[0035] Figure 10 This is a simulation diagram of the heat dissipation effect of the computing board directly dissipating heat through the first heat sink.

[0036] Figure 11 Simulation diagram of the heat dissipation effect of the heat dissipation solution of this utility model for the computing board.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Data processing equipment; 10. Computing power box; 20. Power supply box; 30. Control box; 12. Chassis; 121. Slide rail; 1211. First sub-slide rail; 1212. Second sub-slide rail; 122. Notch; 11. Computing power module; 11a. First end; 11b. Second end; 13. First exhaust device; 14. Second exhaust device; X. Exhaust direction; 111. Computing power board; Chip; 1110; 112. Heat dissipation module; 1120. First heat sink; 1121. Heat dissipation fins; 1122. First part; 1123. Second part; 1124. Heat conduction plate; 1125. Heat pipe; 1126. Groove; 1127. Boss; 1128. Second heat sink; 1129. Through-hole; 1130. Through hole; 1131. Spring. Detailed Implementation

[0039] The present invention will now be described based on embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail, but well-known methods, processes, procedures, and elements are not described in detail in order to avoid obscuring the essence of the present invention.

[0040] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0041] Unless the context explicitly requires it, the words "comprising," "including," and similar terms throughout the specification and claims should be interpreted as encompassing rather than being exclusive or exhaustive; that is, meaning "including but not limited to."

[0042] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0043] Please see Figure 1 This utility model provides a data processing device 1, which includes a computing power box 10, a power supply box 20, and a control box 30. The computing power box 10 and the power supply box 20 are arranged side by side and fixedly connected. The control box 30 is fixedly installed on the top of the computing power box 10 and the power supply box 20. The computing power box 10 provides computing power to the data processing device 1, the power supply box 20 contains a power supply to provide electrical energy to the data processing device 1, and the control box 30 is used to control the operation of the data processing device 1.

[0044] It is understood that the relative positions of the computing power box 10, the power supply box 20, and the control box 30 can be adjusted. For example, the positions of the power supply box 20 and the computing power box 10 can be interchanged, and the control box 30 can be placed only on top of the computing power box 10, etc. In some embodiments, the computing power box 10, the power supply box 20, and the control box 30 can be integrated together. For example, the control components inside the control box 30 can be integrated into the power supply box 20 or the control box 30, and the components inside the power supply box 20 can be directly integrated into the computing power box 10, etc. It is understood that there are no limitations on the relative positions and integration methods of the computing power box 10, the power supply box 20, and the control box 30, as long as the function of the data processing device 1 can be achieved.

[0045] Please see Figure 2 The computing power box 10 includes a chassis 12 and three computing power modules 11 housed within the chassis 12. It is understood that the number of computing power modules 11 housed within the chassis 12 can be adjusted according to actual needs, and can be one or more (including two or more). This invention uses three computing power modules 11 as an example for illustrative purposes.

[0046] Please see Figure 3 The top and bottom of the chassis 12 are provided with sliding grooves 121, and the number and position of the sliding grooves 121 on the top and bottom correspond one-to-one. During installation, the bottom and top of one end of the computing module 11 can be inserted into the bottom and top sliding grooves 121 respectively. By pushing the computing module 11, the computing module 11 can move along the sliding grooves 121 and then be completely inserted into the chassis 12.

[0047] In some embodiments, a portion of the computing module 11 is located outside the chassis 12. Specifically, a recess 122 is provided on the top of the chassis 12, and a portion of the top of the computing module 11 extends from the recess 122, thereby facilitating electrical connection with control components inside the control box 30. In some embodiments, the computing module 11 may also be completely housed inside the chassis 12, and the recess 122 facilitates the routing of wiring (such as cables, FPCs, etc.) between the control module and the computing module 11.

[0048] It is understood that the top and bottom of the computing power module 11 located within the chassis 12 are accommodated in the slide groove 121 to enable the computing power module 11 to slide and be fixed within the chassis 12. It is also understood that the top or bottom of the computing power module 11 in this invention is located in the slide groove, including partial or complete location of the top or bottom of the computing power module 11 within the slide groove 121.

[0049] As one embodiment, each slide 121 includes a first sub-slide 1211 and a second sub-slide 1212 arranged parallel to each other. The first sub-slide 1211 and the second sub-slide 1212 are adapted to different computing power modules 11 (such as computing power modules 11 with different thicknesses). It can be understood that the second sub-slide 1212 can be omitted, that is, the remaining first sub-slide 1211 is the slide 121.

[0050] As one embodiment, the distance between adjacent computing modules 11 is greater than or equal to 2mm to facilitate heat dissipation of the computing modules 11.

[0051] As one embodiment, the computing module 11 includes a computing board 111 (which will be described in detail later). The top and bottom of the computing module 11 are the top and bottom of the computing board 111. The top and bottom of the computing board 111 are located in the chassis 12 and are accommodated in the slide groove 121 to fix the computing module 11 in the chassis 12.

[0052] Please see Figure 4 The computing module 11 has exhaust devices at its two opposite ends. Specifically, the computing module 11 includes a first end 11a and a second end 11b, which are respectively provided with a first exhaust device 13 and a second exhaust device 14. The first exhaust device 13 is operational and forms an air inlet at the first end 11a; the second exhaust device 14 is operational and forms an air outlet at the second end 11b. The air entering from the air inlet passes through the computing module 11 and is discharged from the air outlet, thereby carrying away the heat from the computing module 11. That is, the exhaust direction X points from the first end 11a to the second end 11b. In actual products, the exhaust direction X is not an absolute straight line, but in this utility model, for ease of defining the direction, the exhaust direction X is defined as the direction from the first end 11a to the second end 11b.

[0053] Please see Figure 5 and Figure 6 The computing power module 11 specifically includes a heat dissipation module 112 and a computing power board 111. The computing power board 111 is fixed to the heat dissipation module 112, and the heat dissipation module 112 dissipates heat from the computing power board 111.

[0054] The computing board 111 is equipped with several chips 1110, which are arranged along the exhaust direction X to form several chip columns. In one embodiment, all chips 1110 are located on the upper surface of the computing board 111. Figure 5 In this application, the directional terms such as "upper," "lower," "top," and "bottom" refer to relative positions in a specified view, not absolute positions. It can be understood that "upper" becomes "lower" after the specified drawing is rotated 180° within the plane of the paper. The lower surface of the computing board 111 is a relatively flat surface, and no chip 1110 is disposed on it. In some embodiments, a chip 1110 may also be disposed on the lower surface of the computing board 111.

[0055] In one embodiment, the chips 1110 are arranged from dense to sparse along the exhaust direction X. That is, the chips 1110 near the first end 11a of the computing board 111 (i.e., the first end 11a of the computing module 11) are arranged more densely, while the chips 1110 near the second end 11b of the computing board 111 (i.e., the second end 11b of the computing module 11) are arranged more sparsely. With this arrangement, although the chips 1110 located at the air inlet are densely arranged, the temperature of the air entering from the air inlet is still relatively low, which can effectively remove their heat. On the other hand, the chips 1110 near the air outlet are relatively sparsely arranged. Even if the air has heated up when it moves to this position, the heat generated at this position is relatively small. Therefore, the temperature of the chips 1110 at this position after heat dissipation is the same as or close to the temperature of the chips 1110 located at the air inlet after heat dissipation, resulting in good temperature consistency of the chips 1110 in the chip row.

[0056] As one embodiment, the arrangement of the chip 1110 is not limited. The chip 1110 can also be arranged evenly on the computing board 111, or arranged according to certain rules or irregularities.

[0057] Please continue reading. Figure 5 and Figure 6 The heat dissipation module 112 includes a first heat sink 1120 and a heat-conducting plate 1124, with the heat-conducting plate 1124 fixed between the first heat sink 1120 and the computing board 111. Heat generated by the computing board 111 during operation is conducted to the first heat sink 1120 via the heat-conducting plate 1124, and the heat is carried away by airflow through the heat dissipation channel. As one embodiment, both the first heat sink 1120 and the heat-conducting plate 1124 are made of aluminum, providing excellent heat dissipation performance.

[0058] In one embodiment, the first heat sink 1120 includes a plurality of heat sink fins 1121 extending along the exhaust direction X. Viewed perpendicular to the heat dissipation channel, the heat sink fins 1121 are right-angled trapezoids. The heat sink fins 1121 are divided into a first part 1122 and a second part 1123 along the exhaust direction X. Viewed perpendicular to the heat sink fins 1121, the first part 1122 is rectangular, and the second part 1123 is a right-angled triangle. The chip 1110 on the computing board 111 is located in the area corresponding to the second part 1123 of the heat sink fins 1121. That is, there is no chip 1110 in the area corresponding to the first part 1122 of the heat sink fins 1121. Specifically, no chip 1110 is located at the end of the computing board 111 near the air inlet. Preferably, wiring is provided in the area of ​​the computing board 111 corresponding to the first part 1122 for wiring the chip 1110. Because the first part 1122 is positioned in the corresponding wiring area, it does not reduce the heat dissipation effect on the chip 1110. Furthermore, the presence of the first part 1122 itself increases the heat dissipation area, which is beneficial for heat dissipation. In addition, the presence of the first part 1122 effectively prevents dust from clogging the gaps between the heat dissipation fins 1121. When large dust particles enter from the air inlet, the dust is blown onto the inclined surface, which guides the dust towards the side of the first heat sink 1120 away from the computing board 111, where the larger dust particles are expelled by the airflow. Fine dust entering from the air inlet is directly discharged through the gaps between the heat dissipation fins 1121. The inclined surface also helps guide the airflow, providing better heat dissipation. Furthermore, the inclined surface design of the first part 1122 can reduce system obstruction; the airflow is guided by the inclined surface, reducing turbulence, thus reducing noise and improving auditory comfort.

[0059] As one embodiment, the distance between the end of the first heat sink 1120 away from the heat conduction plate 1124 and an adjacent component (chassis 12 and / or another computing module 11) is greater than or equal to the distance between adjacent heat sink fins 1121. Specifically, the distance between computing modules 11 is greater than or equal to the distance between adjacent heat sink fins 1121 to facilitate the discharge of larger dust particles through the gaps between the computing modules 11. Figure 2 The distance between the rightmost computing module 11 and the chassis 12 is greater than or equal to the distance between adjacent heat sink fins 1121.

[0060] Please see Figures 6 to 9 The heat-conducting plate 1124 has a heat pipe 1125 embedded in it. The vertical projection of the heat pipe 1125 on the computing board 111 covers at least part of the chip 1110, and the extension direction of the heat pipe 1125 is parallel to the exhaust direction X.

[0061] It can be understood that the heat-conducting plate 1124 is a flat plate-shaped body with a heat pipe 1125 embedded inside it. Here, "embedded" means that the heat pipe 1125 is located inside the heat-conducting plate 1124 and does not protrude from the heat-conducting plate 1124. That is, the heat pipe 1125 is completely contained in the heat-conducting plate 1124, or it is contained in the heat-conducting plate 1124 but both surfaces are flush.

[0062] In one embodiment, a groove 1126 is formed on the surface of the heat-conducting plate 1124 near the first heat sink 1120, that is, on the surface away from the computing board 111, and the heat pipe 1125 is accommodated in the groove 1126. Since the heat pipe 1125 is embedded in the groove 1126 on the side of the heat-conducting plate 1124 away from the computing board 111, the presence of the heat pipe 1125 does not affect the contact between the heat-conducting plate 1124 and the chip 1110. This avoids the situation where the surface flatness of the heat pipe 1125 is poor (the surface flatness of heat pipes manufactured by existing processes is poor, and the surface height difference is usually greater than 0.5mm), which could easily lead to uneven pressure and damage to the chip 1110 during installation. To prevent the heat pipe 1125 from directly contacting the chip 1110 and damaging it, thermally conductive materials such as thermally conductive silicone are usually filled between the heat pipe 1125 and the chip 1110. However, due to the poor flatness of the heat pipe 1125, the thicker thermal conductive silicone, and the significantly lower thermal conductivity of the silicone compared to metal materials (typically copper or aluminum) for the heat pipe 1125, heat-conducting plate 1124, and first heat sink 1120, this design significantly impacts heat dissipation. In simulation tests, the temperature of chip 1110 using this design was 18°C ​​higher than that using the design described in this application, representing a 35% deterioration in heat dissipation. The surface heat flux density of heat pipe 1025 was also 20 W / cm² higher. 2 There is a risk that the cooling medium inside the heat pipe 1025 may dry out, resulting in poor temperature uniformity. There is only a layer of thermally conductive silicone between the heat pipe 1025 and the chip 1110. The heat flux density on the surface of the heat pipe 1025 is relatively high, and the risk of the heat pipe 1025 drying out is high.

[0063] As a modified embodiment, the heat pipe 1125 can also be embedded in the heat-conducting plate 1124 through other processes or structural designs, such as fixing two plate-shaped bodies with grooves together, and splicing the grooves on the two plate-shaped bodies to form a space to accommodate the heat pipe 1125.

[0064] As one embodiment, the heat-conducting plate 1124 is welded and fixed to the first heat sink 1120.

[0065] In one embodiment, the heat pipe 1125 is soldered and fixed within the groove 1126 via a flux layer (not shown), and the surface of the heat pipe 1125 is flush with the surface of the heat-conducting plate 1124 near the first heat sink 1120. In another embodiment, the surface of the heat pipe 1125 is lower than the surface of the heat-conducting plate 1124 near the first heat sink 1120, and the surface of the flux layer within the groove 1126 is flush with the surface of the heat-conducting plate 1124 near the first heat sink 1120. This eliminates air gaps between the heat-conducting plate 1124 and the first heat sink 1120, allowing for more efficient heat conduction. It is understood that the flux layer is formed by heating solder (such as solder paste) and / or flux.

[0066] It is understood that the heat pipe 1125 has a hollow structure, containing a liquid inside. This liquid can switch between liquid and vapor phases, thus undergoing phase change heat transfer to maintain or tend to maintain the temperature within the heat pipe 1125 at a uniform level. Therefore, the heat pipe 1125 can effectively equalize the temperature of the chips 1110 on the chip array, efficiently transferring heat from high-temperature areas to low-temperature areas, resulting in a more consistent temperature for the chips 1110 on the chip array.

[0067] As one embodiment, in this application, the heat pipe 1125 is flat, and the thickness of the heat pipe 1125 is uniform in the plane extension direction perpendicular to the heat-conducting plate 1124.

[0068] It is understandable that the amount of heat carried away by the wind when it moves to the air outlet is limited, resulting in a higher temperature at the air outlet. Whether the chips 1110 are arranged in a regular or irregular pattern, the heat pipes 1125 embedded in the heat-conducting plate 1124 can bring the temperatures of the first end 11a and the second end 11b of the computing board 111 closer together, thereby ensuring temperature consistency across the entire computing board 111.

[0069] It is understandable that the heat-conducting plate 1124 is a plate-shaped object. As a whole, it is also conducive to heat exchange between different locations, which helps to maintain the temperature consistency of the computing board 111.

[0070] In one embodiment, the chips 1110 are arranged in a plurality of chip columns along the exhaust direction X; the number and position of the grooves 1126 correspond to the number and position of the chip columns; the vertical projection of the heat pipes 1125 on the computing board 111 completely covers the chip columns. This helps to ensure the temperature uniformity of all chips 1110.

[0071] Please continue reading. Figures 6 to 9 As one embodiment, the heat-conducting plate 1124 has a plurality of protrusions 1127 on its surface near the computing board 111. The protrusions 1127 are positioned corresponding to the chip 1110, and the heat-conducting plate 1124 directly contacts the chip 1110 through the protrusions 1127.

[0072] It is understandable that the boss 1127 is a protrusion formed on the surface of the heat-conducting plate 1124. The boss 1127 is set corresponding to the position of the chip 1110, and the heat-conducting plate 1124 directly contacts the chip 1110 through the boss 1127. Since there are a large number of chips 1110 on the computing board 111, if the surface flatness of the component in contact with the chip 1110 is poor during the fixing process of the computing board 111 and the heat dissipation module 112, it will cause excessive local stress and damage the chip 1110. As a plate-shaped body, the heat-conducting plate 1124 has a large area. If its entire surface near the computing board 111 is made into a plane, it is difficult to ensure its flatness in the process. Therefore, when fixing the heat-conducting plate 1124 to the computing board 111, it is easy to cause damage to the chip 1110. In this application, by setting a boss 1127 on the surface of the heat-conducting plate 1124, the boss 1127 is set corresponding to the chip 1110. Its size can be much smaller than the area of ​​the entire heat-conducting plate 1124. In the manufacturing process, it is also easier to ensure the flatness of the surface of the boss 1127, and reduce or eliminate the possibility of damaging the chip 1110.

[0073] As one embodiment, the height difference between the protrusion 1127 and the surface in direct contact with the chip is less than 0.1 mm. Preferably, the height difference between the protrusion 1127 and the surface in direct contact with the chip is less than or equal to 0.05 mm.

[0074] In some embodiments, a thermally conductive layer is disposed between the boss 1127 and the chip. The thermally conductive layer material can be one or more of thermal grease, thermal gel, or thermal pad. The height difference between the boss 1127 and the chip at different locations can be filled by the thermally conductive layer. The thermally conductive layer may be filled between a portion of the surface of the boss 1127 and the chip, or between the entire surface of the boss 1127 and the chip. Because the boss 1127 itself has good flatness, the thickness of the thermally conductive layer is thin, and its impact on heat dissipation is small (the thicker the thermally conductive layer, the worse the heat dissipation effect).

[0075] It is understood that the boss 1127 is in direct contact with the chip 1110, and / or the boss 1127 is in contact with the chip 1110 through a thermally conductive layer.

[0076] In some embodiments, the number of protrusions 1127 is consistent with the number of heat pipes 1125 and recesses 1126. That is, in some embodiments, the protrusions 1127 can be arranged corresponding to a chip row, and one protrusion 1127 can be arranged corresponding to one chip row. This is more conducive to the heat conduction of the chip row and the heat balance of the heat pipes 1125. In other embodiments, the protrusions 1127 can also be arranged corresponding to the number of chips 1110, such as one protrusion 1127 corresponding to one chip 1110, or multiple chips 1110 corresponding to one protrusion 1127.

[0077] Please return to the reference. Figure 5 and Figure 6 In one embodiment, a second heat sink 1128 is fixed to the side of the computing board 111 away from the heat-conducting plate 1124. The structure of the second heat sink 1128 can be consistent with the structure of the first heat sink 1120. The positional relationship between the second heat sink 1128 and the chip 1110 on the computing board 111 can also be consistent with the positional relationship between the first heat sink 1120 and the chip 1110 on the computing board 111.

[0078] As one embodiment, no chip 1110 is set on the surface of the computing board 111 away from the heat conduction plate 1124, and the second heat sink 1128 can be directly fixed to this surface.

[0079] As one embodiment, the heat dissipation module 112 further includes a through-plug 1129 and a locking member (not shown). The through-plug 1129 passes through the first heat dissipation component 1120, the heat conduction plate 1124, the computing board 111 and the second heat dissipation component 1128, and is locked with the locking member.

[0080] As one embodiment, an elastic element 1131 is fitted on the end of the insert 1129 away from the locking member, so that the fixation between the insert 1129 and the locking member is elastic, and under the condition of reliable fixation, excessive pressure between components is prevented from damaging electronic devices.

[0081] In one embodiment, the insert 1129 is a screw, the locking element is a nut, and the elastic element 1131 is a spring.

[0082] As one embodiment, a through hole 1130 is provided on the heat-conducting plate 1124 between adjacent bosses 1127 for the through plug 1129 to pass through. The through plug 1129 passing through each boss 1127 ensures tight contact between the chip 1110 and the boss 1127, thereby achieving good heat conduction.

[0083] As one embodiment, there are multiple first heat sinks 1120 above the heat conduction plate 1124, such as... Figure 6 As shown, there are two first heat sinks 1120 above the heat conduction plate 1124. It can be understood that the number of first heat sinks 1120 can be set as needed to meet the heat dissipation requirements of the computing board 111. Alternatively, there can be only one first heat sink 1120, as long as its size can at least cover the area where the chip 1110 is located.

[0084] In one embodiment, when the thickness ratio (i.e., the dimension in the direction perpendicular to the computing board 111) of the first heat sink 1120 and the second heat sink 1128 is 2:1, the top and bottom of the computing board 111 are located in the first groove 1211. When the thickness ratio of the first heat sink 1120 and the second heat sink 1128 is 1:1, the top and bottom of the computing board 111 are located in the second groove 1212. In this way, the chassis 12 can accommodate the sliding and fixing of different computing modules 11 within the chassis 12.

[0085] It is understandable that when the chip's thermal resistance RJC (the thermal resistance between the chip's heat source junction and the package casing) is much smaller than its thermal resistance RJB (the thermal resistance between the chip's heat source junction and the PCB board), heat is more easily dissipated from the front of the chip 1110. Therefore, setting the thickness of the first heat sink 1120 to be greater than the thickness of the second heat sink 1128 better ensures heat dissipation, such as setting the thickness ratio of the first heat sink 1120 to the second heat sink 1128 to 2:1. Conversely, heat is more easily dissipated from the back of the chip 1110. Therefore, setting the thickness of the first heat sink 1120 to be less than or equal to the thickness of the second heat sink 1128 is more conducive to ensuring heat dissipation, such as setting the thickness ratio of the first heat sink 1120 to the second heat sink 1128 to 1:1.

[0086] It is understood that each of the slide grooves 121 includes a first slide groove 1211 and a second slide groove 1212 arranged in parallel. Furthermore, it may also include a third slide groove or even a fourth slide groove arranged in parallel. That is, each of the slide grooves 121 includes a plurality of sub-slide grooves arranged in parallel.

[0087] Figure 10 In the process, the first heat sink 1120 is directly fixed to one side of the computing board 111, and the computing board 111 dissipates heat directly through the first heat sink 1120 (in the actual product, a thermally conductive material can be set between the first heat sink 1120 and the computing board 111). The simulation test shows that the temperature of the chip 1110 near the air inlet (air inlet direction is F) of the computing board 111 is 88.6℃, and the temperature of the chip 1110 near the air outlet is 101℃. Figure 11 The computing board 111 employs the heat dissipation scheme of this invention, which involves a heat-conducting plate 1124 and a first heat sink 1120 disposed on one side of the computing board 111. The computing board 111 directly contacts the protrusion 1127 on the heat-conducting plate 1124, and heat is conducted and dissipated through the heat-conducting plate 1124 and the first heat sink 1120, which have embedded heat pipes 1025. Simulation tests show that the temperature of chip 1110 near the air inlet (air inlet direction F) on the computing board 111 is 89°C, and the temperature of chip 1110 near the air outlet is 96°C. It is evident that the heat dissipation scheme provided by this invention has significantly better heat dissipation performance.

[0088] Those skilled in the art will understand that, without conflict, the above-mentioned preferred solutions can be freely combined and superimposed.

[0089] It should be understood that the above-described embodiments are merely exemplary and not restrictive. Without departing from the basic principles of this utility model, any obvious or equivalent modifications or substitutions made by those skilled in the art regarding the above details will be included within the scope of the claims of this utility model.

Claims

1. A heat dissipation module for dissipating heat from a computing board, the computing board having a first end and a second end opposite to each other, and exhaust devices respectively provided at the first end and the second end of the computing board, thereby forming an air inlet at the first end and an air outlet at the second end; the computing board is provided with multiple rows of chips; characterized in that, The heat dissipation module includes a first heat dissipation component and a heat conduction plate, wherein the heat conduction plate is fixed between the first heat dissipation component and the computing board; The heat-conducting plate has a groove on its surface away from the computing board. The groove contains a heat pipe. The vertical projection of the heat pipe onto the computing board covers at least a portion of the chip. The extension direction of the heat pipe is parallel to the exhaust direction, which points from the first end of the computing board to the second end.

2. The heat dissipation module as described in claim 1, characterized in that, The heat-conducting plate is welded and fixed to the first heat dissipation component; The heat pipe is welded and fixed in the groove by a flux layer; The surface of the heat pipe is flush with the surface of the heat-conducting plate near the first heat sink, or the surface of the heat pipe is lower than the surface of the heat-conducting plate near the first heat sink, and the surface of the flux layer in the groove is flush with the surface of the heat-conducting plate near the first heat sink.

3. The heat dissipation module as described in claim 1, characterized in that, The heat-conducting plate has multiple protrusions on its surface near the computing board. The protrusions are positioned corresponding to the chip and are in direct contact with the chip, or the protrusions are in contact with the chip through a heat-conducting layer.

4. The heat dissipation module as described in claim 3, characterized in that, The height difference between the surface of the boss that is in direct contact with the chip is less than 0.1 mm; The thermally conductive layer is formed from one or more of thermally conductive grease, thermally conductive gel, or thermally conductive pad.

5. The heat dissipation module as described in claim 1, characterized in that, The chips are arranged along the exhaust direction to form several chip columns; the number and position of the grooves correspond to the number and position of the chip columns; the vertical projection of the heat pipe on the computing board completely covers the chip columns.

6. The heat dissipation module as described in claim 3, characterized in that, A second heat sink is fixed on the side of the computing board away from the heat-conducting plate; The heat dissipation module includes a through-hole and a locking component. The through-hole passes through the first heat dissipation component, the heat conduction plate, the computing board and the second heat dissipation component, and is locked with the locking component. The heat-conducting plate between adjacent bosses is provided with through holes for the insert to pass through.

7. The heat dissipation module as described in any one of claims 1-6, characterized in that, The heat pipe is a hollow junction, and the hollow structure contains a liquid that can transfer heat through phase change. The heat pipe is flat and has a uniform thickness along its extension direction perpendicular to the heat-conducting plate.

8. A computing power module, characterized in that, It includes the heat dissipation module as described in any one of claims 1-7 and the computing board, wherein the computing board is fixed to the heat dissipation module.

9. A data processing device, characterized in that, It includes a chassis and a computing module as described in claim 8, wherein the computing module is at least partially housed within the chassis.

10. The data processing apparatus as described in claim 9, characterized in that, The top and bottom of the chassis are provided with sliding grooves, and the computing power board is located in the top and bottom of the chassis and is accommodated in the sliding grooves to realize the sliding and fixing of the computing power module in the chassis. Each of the aforementioned slides includes multiple sub-slides arranged in parallel, and different sub-slides are adapted to the sliding and fixing of different computing modules within the chassis.

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