Heat dissipation structure and electronic device

Abstract

The application discloses a heat dissipation structure and electronic equipment. The heat dissipation structure comprises a first heat dissipation module and a second heat dissipation module. The first heat dissipation module has a first space for accommodating a heat source. At least one air inlet is arranged on the first side of the first heat dissipation module and is communicated with the first space. The second heat dissipation module is arranged on the second side of the first heat dissipation module. The second heat dissipation module comprises a shell. The shell has a second space. A first opening is arranged on the third side of the shell and is communicated with the second space for air inlet. At least one second opening is arranged on the fourth side of the shell. The fourth side of the shell faces the first heat dissipation module. The second opening is respectively communicated with the second space and the first space. The airflow in the second space can be discharged to any air inlet of the first heat dissipation module through the at least one second opening. The third side of the shell is different from the fourth side of the shell.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a heat dissipation structure and electronic equipment. Background Technology

[0002] The distribution of the graphics card's multiple fans at varying distances from the case's air intake creates differences in air intake, resulting in uneven airflow and cooling performance from each fan, ultimately affecting the graphics card's cooling efficiency and overall cooling effect. Utility Model Content

[0003] The first aspect of this application provides a heat dissipation structure, which includes:

[0004] A first heat dissipation module, the first heat dissipation module having a first space for accommodating a heat source, and a first side of the first heat dissipation module having at least one air inlet connected to the first space;

[0005] A second heat dissipation module is disposed on a second side of the first heat dissipation module, and the second heat dissipation module includes:

[0006] The housing has a second space inside, and a first opening is provided on the third side of the housing, which communicates with the second space for air intake into the second space; the fourth side of the housing has at least one second opening facing the first heat dissipation module, and the second opening is connected to the second space and the first space respectively, so that the airflow in the second space can be discharged to any air intake of the first heat dissipation module through at least one second opening.

[0007] The third side of the housing is different from the fourth side of the housing.

[0008] In some modified embodiments of the first aspect of this application, in the aforementioned heat dissipation structure, at least one of the air inlets is arranged sequentially along the air intake direction of the first opening;

[0009] At least one of the second openings is provided in a one-to-one correspondence with at least one of the air inlets;

[0010] The size of the second space gradually decreases along the air intake direction of the first opening.

[0011] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation structure includes a guide component within the second space;

[0012] The guide component is provided with at least one of the second openings so that the airflow in the second space can be discharged to any of the air inlets of the first heat dissipation module through at least one of the second openings.

[0013] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation structure, wherein the guiding component includes a first guide member;

[0014] The second opening and the first guide are arranged sequentially along the air intake direction of the first opening. The first guide is tilted at a target angle toward the direction of the first opening so that the air intake of the first opening is guided to the second opening.

[0015] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation structure further includes a second guide member in the guide component;

[0016] The second guide is disposed on the inner wall of the housing opposite to the first guide. The second guide and the first guide are arranged alternately along the air intake direction of the first opening. The second guide is tilted to a second target angle away from the first opening so as to guide the air intake of the first opening to the first guide in sequence.

[0017] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation structure further includes a third space isolated from the second space within the housing;

[0018] The second side of the first heat dissipation module faces the second heat dissipation module, and the second side of the first heat dissipation module is provided with an air outlet that communicates with the first space;

[0019] The fifth and sixth sides of the third space are respectively provided with a third opening and a fourth opening. The third opening is opposite to and connected to the air outlet. The fourth outlet is used to discharge the airflow in the third space.

[0020] The fifth side of the third space is on the same side as the third side of the second space, and the sixth side of the third space is different from the third side and the fourth side of the second space.

[0021] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation structure includes a first partition inside the housing;

[0022] The first partition extends along the air intake direction of the first opening to divide the interior of the housing into the second space and the third space;

[0023] The first partition is inclined so that the size of the second space gradually decreases along the air intake direction of the first opening.

[0024] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation structure further includes a second partition inside the housing;

[0025] The second partition is symmetrically arranged with the first partition on the side of the first partition away from the third space, so that the second space is located between the first partition and the second partition.

[0026] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation structure, wherein the second heat dissipation module further includes a current regulation drive component.

[0027] The flow control drive component is disposed in the third space, and the flow control drive component can draw in the air from the air outlet through the third opening and discharge it through the fourth opening;

[0028] The third space has a fifth opening on its seventh side, through which the flow control drive component can discharge the airflow in the third space;

[0029] The seventh side of the third space is different from the fifth side and the sixth side of the third space.

[0030] A second aspect of this application provides an electronic device comprising:

[0031] The enclosure has a fourth space for accommodating at least one system heat source, and the eighth and ninth sides of the enclosure are respectively provided with a system air inlet and a system air outlet.

[0032] A heat dissipation structure is disposed within the fourth space, and the heat dissipation structure includes a first heat dissipation module and a second heat dissipation module.

[0033] The first heat dissipation module has a first space for accommodating a heat source connected to the system heat source. The first side of the first heat dissipation module is provided with at least one air inlet that communicates with the first space. The air inlet direction is perpendicular to the air inlet direction of the system air inlet.

[0034] The second heat dissipation module is disposed on the second side of the first heat dissipation module, and the second heat dissipation module includes:

[0035] The housing has a second space inside. The housing has a first opening on the third side corresponding to the air inlet of the system. The first opening communicates with the second space for air intake into the second space. The fourth side of the housing has at least one second opening facing the first heat dissipation module. The second opening communicates with the second space and the first space respectively, so that the airflow in the second space can be discharged to any air inlet of the first heat dissipation module through at least one second opening.

[0036] The third side of the housing is different from the fourth side of the housing. Attached Figure Description

[0037] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0038] Figure 1 A schematic diagram illustrating the internal structure of a common server is shown.

[0039] Figure 2 A schematic diagram of the heat dissipation structure provided in this embodiment is shown.

[0040] Figure 3 A schematic diagram of the heat dissipation structure in its split state provided in this embodiment is shown.

[0041] Figure 4 A schematic diagram of the structure of the first heat dissipation module in the heat dissipation structure provided in this embodiment is shown.

[0042] Figure 5 A schematic diagram of the second heat dissipation structure in the heat dissipation structure provided in this embodiment is shown.

[0043] Figure 6 The diagram illustrates the internal structure of the second heat dissipation structure in the heat dissipation structure provided in this embodiment.

[0044] Figure 7 schematically shown Figure 5 A schematic diagram of the cross-section of the second heat dissipation module along AA;

[0045] Figure 8 schematically shown Figure 5 A schematic diagram of the cross-section of the second heat dissipation module along BB;

[0046] Figure 9 A schematic diagram of the structure of the electronic device provided in this embodiment is shown.

[0047] Figure 10 Schematic diagram 4 shows the internal structure distribution of the electronic device provided in this embodiment;

[0048] Reference numerals: First heat dissipation module 1, First space 11, Air inlet 12, Air outlet 13, Second heat dissipation module 2, Housing 21, Second space 22, First opening 23, Second opening 24, Third space 25, Third opening 26, Fourth opening 27, Fifth opening 28, System air inlet 3, Guide assembly 4, First guide 41, Second guide 42, First partition 5, Second partition 6, Flow control drive assembly 7, System air outlet 8, Cabinet 9, Fourth space 91, System heat source 92, Motherboard 10, System intake fan 14, Power supply fan 15, Heat dissipation module 1 ， Module air inlet 12 ， Module air outlet 13 ， 3 air inlets for the whole unit ， 8 system exhaust fans ， . Detailed Implementation

[0049] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0050] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0051] The technical solution of this application embodiment is to solve the above-mentioned technical problems, and the general idea is as follows:

[0052] Example 1

[0053] Reference Appendix Figure 2The heat dissipation structure provided in this application embodiment includes a first heat dissipation module 1 and a second heat dissipation module 2. The first heat dissipation module 1 has a first space 11 for accommodating a heat source. The first side of the first heat dissipation module 1 is provided with at least one air inlet 12 communicating with the first space 11. The second heat dissipation module 2 is disposed on the second side of the first heat dissipation module 1. The second heat dissipation module 2 includes a housing 21. The housing 21 has a second space 22 inside. The third side of the housing 21 is provided with a first opening 23, which communicates with the second space 22 for air intake into the second space 22. The fourth side of the housing 21 is provided with at least one second opening 24, which faces the first heat dissipation module 1. The second opening 24 communicates with the second space 22 and the first space 11 respectively, so that the airflow in the second space 22 can be discharged to any air inlet 12 of the first heat dissipation module 1 through at least one second opening 24. The third side of the housing 21 is different from the fourth side of the housing 21.

[0054] Specifically, in order to solve the problem of poor heat dissipation caused by uneven heat dissipation of graphics card modules in existing servers, the heat dissipation structure provided in this embodiment can guide air to the designated air inlet 12 in the first heat dissipation module 1 through the second opening 24 of the second heat dissipation module 2, so that the air inlet 12 with less air supply can obtain more air supply, thereby achieving targeted air supply and improving the heat dissipation effect. When there are many air inlets 12, the air volume between multiple air inlets 12 can be balanced by the directional airflow of the second opening 24, the heat dissipation efficiency of the corresponding areas of each air inlet 12 on the first heat dissipation module 1 can be balanced, and the overall heat dissipation efficiency of the heat dissipation structure can be improved.

[0055] The heat dissipation structure provided in this embodiment can be applied to, but is not limited to, computer electronic devices such as server chassis, desktop chassis, and all-in-one chassis. The following description will detail the setup and use of the heat dissipation structure in a server chassis. The first heat dissipation module 1 and the second heat dissipation module 2 in this embodiment can be disassembled and installed separately, or they can be assembled into modules and then installed with the chassis.

[0056] The first heat dissipation module 1 can be a rigid module, and its shape and size are not limited. It can be designed and adjusted according to the heat dissipation object it is adapted to, such as cylindrical, conical, trapezoidal, or other shapes. Figure 4The prisms shown are examples of heat dissipation devices. The first heat dissipation module 1 can at least provide air cooling for heat-generating components such as graphics cards, GPUs, and CPUs. Since the graphics cards, GPUs, and CPUs are all mounted on the motherboard 10 structure, and due to space limitations, the first heat dissipation module 1 needs to indirectly provide air cooling, in this embodiment, the first heat dissipation structure 1 is configured to have a first space 11, which can accommodate a heat source. This heat source can be the heat transfer structure of the aforementioned heat-generating components, such as heat pipes, fins, heat spreaders, etc. The air inlet 12 is connected to the first space 11, so that the heat source can be cooled by the airflow entering through the air inlet 12 within the first space 11. In this embodiment, the first space 11 can be a relatively enclosed space with only an air inlet 12 and an air outlet 13, or it can be a relatively open space, for example... Figure 4 As shown, the first heat dissipation module 1 has a first space 11 inside its outer casing. An air inlet 12 is provided on the first side of the outer casing. The number of air inlets 12 can be adjusted according to actual needs. For example, if the size of the heat source is large, the number of air inlets 12 can be increased accordingly. Of course, in this embodiment, a fan can also be provided at the air inlet 12, such as... Figure 4 As shown, this is to achieve air cooling of the heat source within the first space 11; when there are many air inlets 12, their arrangement can also be designed and adjusted according to the actual distribution of the heat source, for example: Figure 4 The multiple air inlets 12 shown are arranged sequentially in the vertical direction. Openings can be provided on other sides of the casing, facilitating both the continuity of the heat transfer structure installation and connection for the heating elements and the dissipation of air. In this embodiment, the first side of the first heat dissipation module 1 can be any side, as long as it can receive airflow from the system air inlet 3 of the entire device. For example, when the system air inlet 3 receives air from top to bottom, the airflow direction of the air inlet 12 can be the same as the airflow direction of the system air inlet 3 or it can be perpendicular to the airflow direction of the system air inlet 3, for example, perpendicular or approximately perpendicular. In this embodiment, the first heat dissipation module 1 can serve as the main heat dissipation device for electronic equipment. (See attached diagram.) Figure 3 and attached Figure 4 In this embodiment, the air outlet 13 of the first heat dissipation module 1 can be set on any side different from its first side. The air outlet 13 can be specially set or the opening position on the aforementioned housing can be utilized. For example, the air outlet 13 can be set on at least the side facing the second heat dissipation module 2. This setting can be designed and adjusted according to actual installation needs, which will not be elaborated here.

[0057] The second heat dissipation module 2 can be a rigid module, and its shape and size are not limited. It can be designed and adjusted according to the internal space of the first heat dissipation module 1 and the electronic device. Its shape and size can be defined by the housing 21. The housing 21 is a rigid structure, which can be a cover structure, a cavity structure, etc. The second heat dissipation module 2 can guide air for the first heat dissipation module 1, specifically guiding air to a designated air inlet 12. It is easy to understand that the number of second openings 24 is related to the air inlet 12. For example, when only one air inlet 12 is set, only one second opening 24 corresponding to the air inlet 12 can be set. The second opening 24 can guide air to the air inlet 12 to increase the air volume of the air inlet 12 and improve the heat dissipation effect. For another example: refer to the appendix. Figure 1 It shows the internal structure of a server, with the top of the server serving as the air intake. ， It is equipped with a system intake fan, and the vertical structure in the middle of the interior is the graphics card's cooling module 1. ， The graphics card on motherboard 10 is connected to the heatsink module 1 via a heat transfer structure. ， Within the space, heat dissipation module 1 ， Multiple module air inlets are distributed from top to bottom 12 ， 3 air inlets for the whole machine ， Air enters from top to bottom through module air inlet 12 ， Entering the heat dissipation module 1 ， The heat dissipation structure of the graphics card is cooled within the space, and the cooling airflow passes through the cooling module 1. ， Side module air vent 13 ， After passing through the system's exhaust fan 8 ， Air is discharged and passes through the system's exhaust fan 8 ， Excluded from the server; during this process, the entire machine's air intake 3 ， From top to bottom, there are multiple module air inlets 12 ， Air supply, due to multiple module air inlets 12 ， Relative to the air inlet of the whole machine in the vertical direction 3 ， There is a distance difference, closer to the air inlet of the whole machine 3 ， The heat dissipation module air inlet 12 ， The more air is supplied, the further away from the air inlet of the whole unit 3 ， The heat dissipation module air inlet 12 ， The less air supply received, the worse the cooling module 1 will be. ， The uneven heat dissipation efficiency of the heat transfer structure in the vertical direction within the space not only affects the heat dissipation effect of the graphics card but may also cause high power consumption of the fan. Therefore, in response to the above situation, the heat dissipation structure provided in this embodiment can be equipped with multiple second openings 24, which are located away from the main air intake 3. ， The heat dissipation module air inlet 12 ，One-to-one airflow is directed to keep the airflow away from the main unit's air inlet 3 ， The heat dissipation module air inlet 12 ， It can obtain more air supply and balance the air intake of the whole unit 3 ， Air inlets of each heat dissipation module with distance differences 12 ， Increase the air intake volume and raise the air intake 3 meters away from the main unit. ， The heat dissipation module air inlet 12 ， The heat dissipation efficiency is improved. In this embodiment, the second heat dissipation module 2 is disposed on the second side of the first heat dissipation module 1. The second side of the first heat dissipation module 1 can be its exhaust side or any other side except the side where the air inlet 12 is located. In this embodiment, the third side of the housing 21 is provided with a first opening 23 as the air inlet of the second heat dissipation module 2. The shape and size of the first opening 23 can be designed and adjusted according to actual needs, such as rectangular, circular, irregular, etc. Figure 2 As shown in the polygon, etc., in this embodiment, the first opening 23 can be set as the system air inlet 3 of the corresponding electronic device, i.e., refer to the attached diagram. Figure 10 When the heat dissipation structure is installed inside an electronic device, the first opening 23 is directly opposite the system air inlet 3 of the electronic device to obtain as much air intake as possible. Therefore, it is easy to understand that the third side of the housing 21 does not face the first heat dissipation module 1. The fourth side of the housing 21, that is, the side facing the first heat dissipation module 1, is provided with at least one second opening 24. The shape and size of the second opening 24 can be designed and adjusted according to actual needs, for example: Figure 2 and Figure 3 The rectangle shown, etc.; the number of second openings 24 can be designed and adjusted according to actual needs. For example, when the air inlet 12 includes three relative to the system air inlet 3 from near to far, then two second openings 24 can be set to correspond to the two relatively far air inlets 12 respectively, balancing the air intake of the two relatively far air inlets 12 relative to the air inlet 12 closer to the system air shaft 3, and so on without further explanation. In this embodiment, the second heat dissipation module 2 can be set to have only the first opening 23 and the second opening 24, so that the airflow entering the second space 22 through the first opening 23 can only be discharged through the second opening 24 to achieve air guidance; in this embodiment, a flow guiding structure can also be set in the second space 22 to guide the airflow corresponding to the second opening 24 to achieve air guidance.

[0058] According to the above, the heat dissipation structure provided in this application has at least one second opening 24 on the second heat dissipation module 2 corresponding to the first heat dissipation module 1, so that the second opening 24 can selectively exhaust air to the target air inlet 12 to increase the air intake of the target air inlet 12. This not only selectively guides air to a single air inlet 12 to improve its heat dissipation effect, but also balances the air intake of multiple air inlets 12, thereby balancing the air intake and uniform heat dissipation effect, and ultimately improving the overall heat dissipation efficiency and effect of the heat dissipation structure; thus solving the problem of poor heat dissipation caused by uneven heat dissipation of graphics card modules in the prior art.

[0059] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships, such as A and / or B. Specifically, it can be understood as: A and B can be included at the same time, A can exist alone, or B can exist alone, and any of the above three situations can be met.

[0060] Further, see attached document. Figure 2 In the heat dissipation structure provided in this embodiment, at least one of the air inlets 12 is arranged sequentially along the air intake direction of the first opening 23; at least one second opening 24 is arranged in a one-to-one correspondence with at least one of the air inlets 12; and the size of the second space 22 gradually decreases along the air intake direction of the first opening 23.

[0061] It is understandable that, given that the first heat dissipation module 1 has multiple air inlets 12, in order to improve the directional airflow effect of the second opening 24 towards the designated air inlet 12, in this embodiment, the air inlets 12 on the first heat dissipation module 1 are sequentially arranged along the airflow direction of the first opening 23. This direction can be, but is not limited to, the top-to-bottom direction of the electronic device after actual installation. Correspondingly, the second opening 24 can be arranged one-to-one with the air inlets 12. It should be noted that for the air inlet 12 closest to the first opening 23, the second opening 24 may not be arranged accordingly, or it may be arranged accordingly, but the degree of correspondence between the second opening 24 and the air inlet 12 is small, so as to reduce or avoid airflow towards the air inlet 12 and improve the balance effect. Furthermore, in this embodiment, the size of the second space 22 can be gradually reduced along the air inlet direction of the first opening 23, so that the airflow entering the second space 22 can gradually increase along the air inlet direction of the first opening 23, thereby gradually increasing the air outlet velocity and flow rate of the second opening 24 which is far away from the first opening 23, and improving the balancing effect.

[0062] Further, see attached document. Figure 5In the heat dissipation structure provided in this embodiment, in a specific implementation, a guide component 4 is provided in the second space 22; the guide component 4 is provided corresponding to at least one second opening 24 so that the airflow in the second space 22 can be discharged to any of the air inlets 12 of the first heat dissipation module 1 through at least one second opening 24.

[0063] It is understandable that, in order to improve airflow efficiency and balance, a guide component 4 can be provided in the second space 22 in this embodiment. The guide component 4 can be a rigid structure or an elastic structure, such as a guide plate, a flow guide, etc. The number and position of the guide components 4 can correspond to the second opening 24. For example, the guide components 4 can be provided one-to-one with the second opening 24 on the side of the second opening 24 away from the first opening 23, so as to guide the airflow entering from the first opening 23 to the second opening 24. For another example, the guide components 4 can also be provided for a specific second opening 24, instead of providing them for all second openings 24. In this configuration, the guide component 4 can have a blocking part and a guiding part. The blocking part prevents the airflow from going to other second openings 24, and the guiding part guides the airflow to the specific second opening 24.

[0064] Further, see attached document. Figure 5 and attached Figure 6 In the heat dissipation structure provided in this embodiment, the guiding component 4 includes a first guide 41; the second opening 24 and the first guide 41 are arranged sequentially along the air intake direction of the first opening 23, and the first guide 41 is inclined at a target angle toward the direction of the first opening 23 so that the air intake of the first opening 23 is guided to the second opening 24.

[0065] It is understandable that, in order to guide the airflow of the guide component 4 to the second opening 24, in this embodiment, the guide component 4 can be configured to include a first guide member 41. The first guide member 41 can be a plate, a block, etc. The first guide member 41 and the second opening 24 are jointly disposed on the fourth side of the housing 21, and the first guide member 41 is disposed on the side of the second opening 24 away from the first opening 23. The first guide member 41 is tilted towards the first opening 23 at a target angle, which is the angle between the first guide member 41 and the housing 21. This angle can be, but is not limited to, 30 degrees to 45 degrees and can be designed and adjusted according to actual needs. For example, if the width of the second space 22 is large, the angle can be appropriately reduced; if the width of the second space 22 is small, the angle can be appropriately increased. The first guide member 41 can be a straight plate structure, an arc plate structure, a wave plate structure, etc. (Refer to the attached diagram). Figure 7When the first guide member 41 is an arc-shaped plate, it can bend into an arc in the direction away from the first opening 23, thereby buffering and guiding the airflow introduced into the first opening 23 and reducing airflow resistance. The specific arc can be designed and adjusted according to actual needs. It should be noted that, in order to avoid the first guide member 41 affecting the airflow of the subsequent second opening 24, in this embodiment, the effective length of the first guide member 41 in the width direction of the second space 22 can be set to be less than or equal to 1 / 2 of the width of the second space 22. The width of the second space 22 is the dimension of the fourth side of the shell 21 pointing to the opposite side, so that a part of the airflow entering the first opening 23 can be guided to the second opening 24 by the first guide member 41, and the other part of the airflow can pass over the first guide member 41 and flow to the subsequent second opening 24 to supply airflow to the subsequent second opening 34. Figure 7 As the saying goes, "The wind and the flow are evident."

[0066] Further, see attached document. Figure 5 and attached Figure 7 In the heat dissipation structure provided in this embodiment, the guiding component 4 further includes a second guiding member 42. The second guiding member 42 is disposed on the inner wall of the housing 21 opposite to the first guiding member 41. The second guiding member 42 and the first guiding member 41 are arranged alternately along the air intake direction of the first opening 23. The second guiding member 42 is tilted to a second target angle in a direction away from the first opening 23 so as to guide the air intake of the first opening 23 to the first guiding member 41 in sequence.

[0067] It is understandable that, in order to improve the guiding effect of the guiding component 4, a second guiding member 42 can also be provided in this embodiment. The second guiding member 42 can be a plate, a block, etc. The second guiding member 42 is located on the side opposite to the first guiding member 41, and the second guiding member 42 and the first guiding member 41 are staggered. For the second opening 24 or the first guiding member 41 that is closest to the first opening 23, a second guiding member 42 can be provided on the side facing the first opening 23, or no second guiding member 42 can be provided. For the other second openings 24, the side facing the first opening 23... A second guide member 42 can be provided so that the air entering through the first opening 23 can be guided by the second guide member 42 to the first guide member 41, and then by the first guide member 41 to the second opening 24 to achieve targeted airflow. Furthermore, to improve the guiding effect, in this embodiment, the second guide member 42 can be set to tilt towards a second target angle away from the first opening 23. This angle is the angle between the second guide member 42 and the housing 21, and can be, but is not limited to, 30-45 degrees. In this embodiment, the second guide member 42 can be a straight plate structure, an arc plate structure, a wave plate structure, etc. (Refer to the attached diagram). Figure 7When the second guide 42 is an arc-shaped plate, it can be bent into an arc in the direction of the first opening 23, thereby playing a role in buffering and guiding the airflow introduced into the first opening 23. It should be noted that the effective size design of the second guide 42 in the width direction of the second space 22 can refer to the first guide 41, and will not be elaborated here.

[0068] Further, see attached document. Figure 6 In this embodiment, the heat dissipation structure further includes a third space 25 isolated from the second space 22 within the housing 21. The second side of the first heat dissipation module 1 faces the second heat dissipation module 2, and the second side of the first heat dissipation module 1 is provided with an air outlet 13 connected to the first space 11. The fifth and sixth sides of the third space 25 are respectively provided with a third opening 26 and a fourth opening 27. The third opening 26 is opposite to and connected to the air outlet 13, and the fourth outlet 27 is used to discharge the airflow in the third space 25. The fifth side of the third space 25 is on the same side as the third side of the second space 22, and the sixth side of the third space 25 is different from the third side and the fourth side of the second space 22.

[0069] Understandably, to improve the heat dissipation efficiency of the heat dissipation structure, a third space 25 is provided within the housing 21 in this embodiment. Correspondingly, the second space 22 serves as the air inlet side of the first heat dissipation module 1, increasing the air intake volume, and the third space 25 serves as the air outlet side of the first heat dissipation module 1, improving the air outlet efficiency. The second space 22 and the third space 25 can be arranged sequentially along the air intake direction of the air inlet 12. Thus, after the first heat dissipation module 1 and the second heat dissipation module 2 are assembled in a relatively fixed manner, the outer wall of the first heat dissipation module 1 abuts against the outer wall of the second heat dissipation module 2, i.e., attached... Figure 3 To the attached Figure 2In this state, the air inlet 12 and the air outlet 13 are separated. The second opening 24 supplies air to the air inlet 12, and the third opening 26 receives the air from the air outlet 13 and discharges it outward. This avoids the problem of the air outlet 13 being blocked, which affects the heat dissipation efficiency. At the same time, it can concentrate and unify the air outlet, preventing the air outlet of the first heat dissipation module 1 from being directly discharged into the electronic device and affecting the heat dissipation effect of the whole machine. Correspondingly, the shape and size of the third space 25 are not limited here and can be designed and adjusted according to actual needs. The third space 25 can be integrally formed with the outer shell 21 or formed by setting additional partitions. The third space 25 can also be arranged in a way that gradually decreases in size along the air intake direction of the second space 22 along the first opening 23. The fifth side of the third space 25 is on the same side as the second opening 24, and the sixth side is on the side of the second heat dissipation module 2 that is away from the air inlet 12 or away from the first opening 23. The shape and size of the third opening 26 and the fourth opening 27 are not limited here and can be designed and adjusted according to actual needs. The third opening 26 can completely correspond to the air outlet 13, or it can be larger than the third opening 26 to ensure complete coverage of the third opening 26. The third opening 26 can also be partially connected to the air outlet 13.

[0070] Further, see attached document. Figure 6 and attached Figure 8 In the heat dissipation structure provided in this embodiment, in a specific implementation, the housing 21 is provided with a first partition 5; the first partition 5 extends along the air intake direction of the first opening 23 to divide the housing 21 into a second space 22 and a third space 25; wherein, the first partition 5 is inclined so that the size of the second space 22 gradually decreases along the air intake direction of the first opening 23.

[0071] It is understandable that, in order to achieve the isolation between the third space 25 and the second space 22, a first partition 5 can be provided in this embodiment. The first partition 5 is a rigid structure, which can be, but is not limited to, a plate, a block, a cavity, etc. In this embodiment, a plate is used as an example for detailed explanation. The first partition 5 extends along the air intake direction of the first opening 23, and both sides of the first partition 5 in the width direction of the second space 22 abut against and adhere to the inner wall of the housing 21. Both ends of the first partition 5 along the air intake direction of the first opening 23 abut against and adhere to the inner wall of the housing 21, thereby cooperating with the housing 21 and the second space 22. A partition 25 forms a third space 25. The end of the first partition 5 facing the first opening 23 can abut against the inner wall of the housing 21 within the first opening 23. For example, it can extend from the inner wall of the housing 21 opposite to the air inlet 12 towards the direction away from the first opening 23 within the first opening 23. The end of the first partition 5 away from the first opening 23 can abut against the bottom wall of the housing 21. Therefore, it is easy to understand that the side of the housing 21 away from the first opening 23 can be closed, ensuring the independence of the second space 22 and facilitating the arrangement of the first partition 5. The first partition 5 can be a straight plate, an inclined plate, an arc-shaped plate, an irregularly shaped plate, etc., as long as the size of the second space 22 gradually decreases along the air inlet direction of the first opening 23. For example, refer to the attached diagram. Figure 8 As shown, the first partition 5 gradually tilts towards the second space 22 along the air inlet direction of the first opening 23, that is, the size of the third space 25 gradually increases along the air inlet direction of the first opening 23, thereby causing the size of the second space 22 to gradually decrease in the same direction. For example, the first partition 5 can also be set as a step extending towards the second space 22, that is, the size of the third space 25 gradually increases along the air inlet direction of the first opening 23.

[0072] Further, see attached document. Figure 6 and attached Figure 8 In the heat dissipation structure provided in this embodiment, in a specific implementation, the housing 21 is further provided with a second partition 6; the second partition 6 is symmetrically arranged with the first partition 5 on the side of the first partition 5 away from the third space 25, so that the second space 22 is located between the first partition 5 and the second partition 6.

[0073] Understandably, in order to effectively improve the air volume and air velocity of the second opening 24, a second partition 6 is provided in this embodiment. The second partition 6 can be a rigid structure, and can be, but is not limited to, a plate, a block, a cavity, etc. The area between the second partition 6 and the shell 21 can form a spatial structure similar to the third space 25, or it can be directly formed as a solid structure, i.e. Figure 8In the state shown, under this configuration, the second partition 6 can be integrally formed with the housing 21 and located inside the housing 21. The second partition 6 can also serve as the outermost shell wall of the housing 21. The second partition 6 is symmetrically arranged with the first partition 5, and the second space 22 is located between the two partitions. Consequently, the size reduction of the second space 22 along the air intake direction of the first opening 23 is relatively consistent, avoiding uneven positions that may affect the airflow direction. It is not difficult to understand that the size of the second opening 24 is related to the distance between the two partitions. This distance can be the distance between the power supply fan 15 and the first heat dissipation module 1 in the air intake direction of the air inlet 12 during actual installation. Figure 10 As shown.

[0074] Further, see attached document. Figure 5 Appendix Figure 6 and attached Figure 8 In the heat dissipation structure provided in this embodiment, the second heat dissipation module 2 further includes a flow regulation drive component 7. The flow regulation drive component 7 is disposed in the third space 25. The flow regulation drive component 7 can draw in the air from the air outlet 13 through the third opening 26 and discharge it through the fourth opening 27. The seventh side of the third space 25 is provided with a fifth opening 28. The flow regulation drive component 7 can discharge the airflow in the third space 25 through the fifth opening 28. The seventh side of the third space 25 is different from the fifth side and the sixth side of the third space 25.

[0075] Understandably, to improve the heat dissipation efficiency of the heat dissipation structure, a flow regulation drive component 7 is provided in the third space 25 in this embodiment. The flow regulation drive component 7 can be, but is not limited to, a centrifugal fan or a pump body. It can control the intake and exhaust of airflow in the third space 25. Correspondingly, the exhaust air from the exhaust port 13 of the first heat dissipation module 1 is drawn into the third space 25 through the third opening 26 and discharged through the fourth outlet 27. At the same time, a fifth opening 28 is provided on the seventh side of the third space 25 in this embodiment. The seventh side can be the side of the third space 25 that is away from the second space 22 or the side that is away from the first opening 23, as long as it is adapted to the fourth opening 27. For example, refer to the attached figure. Figure 6 When the fourth opening 27 is opposite to the second space 22, then the fifth opening 28 is opposite to the first opening 23. Conversely, the fourth opening 27 can also be set to be opposite to the first opening 23, and the fifth opening 28 to be opposite to the second space 22. (See attached reference.) Figure 9 In actual installation, the fourth opening 27 can face the system air outlet 8 of the electronic equipment to achieve uniform and targeted airflow and avoid clogging the heat dissipation module 1. ，Directly exhausting air into the electronic device affects the overall heat dissipation efficiency. This design incorporates two air outlets in different directions to increase both airflow and heat dissipation efficiency. In this embodiment, the flow control drive 7 can be fixedly installed on the third space 25 and the housing 21, or it can be fixedly installed on the inner wall of the electronic device.

[0076] Example 2

[0077] Reference Appendix Figure 9 and attached Figure 10 This embodiment provides an electronic device, which includes a housing 9 and a heat dissipation structure. The housing 9 has a fourth space 91 for accommodating at least one system heat source 92. The eighth and ninth opposite sides of the housing 9 are respectively provided with a system air inlet 3 and a system air outlet 8. The heat dissipation structure is disposed in the fourth space 91 and includes a first heat dissipation module 1 and a second heat dissipation module 2.

[0078] The first heat dissipation module 1 has a first space 11 for accommodating the heat source connected to the system heat source 92. The first side of the first heat dissipation module 1 is provided with at least one air inlet 12 connected to the first space 11. The air inlet direction of the air inlet 12 is perpendicular to the air inlet direction of the system air inlet 3.

[0079] The second heat dissipation module 2 is disposed on the second side of the first heat dissipation module 1. The second heat dissipation module 2 includes a housing 21, the housing 21 having a second space 22 inside, and the housing 21 having a first opening 23 on the third side corresponding to the system air inlet 3. The first opening 23 communicates with the second space 22 for air intake into the second space 22. The fourth side of the housing 21 has at least one second opening 24, the fourth side of the housing 21 facing the first heat dissipation module 1. The second opening 24 communicates with the second space 22 and the first space 11 respectively, so that the airflow in the second space 22 can be exhausted to any air inlet 12 of the first heat dissipation module 1 through at least one second opening 24. The third side of the housing 21 is different from the fourth side of the housing 21.

[0080] It is understood that the electronic devices provided in this embodiment may be, but are not limited to, computer-related electronic devices such as server chassis, desktop chassis, and all-in-one chassis. This embodiment will take a server as an example for detailed description.

[0081] The heat dissipation structure is the same as that in Example 1. Please refer to the detailed description of Example 1 for its structure and working principle, which will not be repeated here.

[0082] Among them, box 9 is a rigid structure, which may be, but is not limited to, Figure 9The hexahedral structure shown has a system air inlet 3 at the top and a system air outlet 8 at the bottom during actual use. A system air inlet fan 14 is installed at the system air inlet 3, and a system air outlet fan is installed at the system air outlet 8. The system air outlet fan and the aforementioned system air outlet fan 8 are connected. ， They can be the same; correspondingly, the fourth opening 27 of the second heat dissipation module 2 faces the system exhaust fan, and the fifth opening 28 faces the exhaust vent 13 or opening at the bottom of the casing 9, thereby improving airflow efficiency and heat dissipation efficiency. It should also be noted that, referring to the attached... Figure 10 When the heat dissipation structure is installed inside the housing 9, the air inlet 12 and the first opening 23 share the system air inlet 3 for air intake. Therefore, to improve the airflow guiding effect of the second heat dissipation module 2 on the first heat dissipation module 1, in this embodiment, the system intake fan 14 can be positioned closer to the first opening 23, so that the airflow through the first opening 23 via the system air inlet 3 is greater than the airflow through the air inlet 12 via the system air inlet 3. For example... Figure 10 In the state shown, the orthographic projection of the system intake fan 14 along the vertical direction of the housing 9 can completely cover the first opening 23, thus partially covering the first heat dissipation module 1 and supplying air to both modules at the same time; for example, the system intake fan 14 can also be positioned to completely correspond to the first opening 23 without corresponding to the first heat dissipation module 1, and the second heat dissipation module 2 can be used to guide and supply air to the first heat dissipation module 1.

[0083] The system heat source 92 may include heat-generating components such as graphics card, GPU, and CPU, all of which are mounted on the motherboard 10. They conduct heat to the first space 11 of the first heat dissipation module 1 through a heat transfer structure for air cooling.

[0084] The electronic device provided in this application has at least one second opening 24 on the second heat dissipation module 2 corresponding to the first heat dissipation module 1, so that the second opening 24 can selectively discharge air to the target air inlet 12 to increase the air intake of the target air inlet 12. It can not only selectively guide air to a single air inlet 12 to improve its heat dissipation effect, but also balance the air intake of multiple air inlets 12, thereby balancing the air intake and uniform heat dissipation effect, and ultimately improving the overall heat dissipation efficiency and heat dissipation effect of the electronic device.

[0085] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, It includes: A first heat dissipation module, the first heat dissipation module having a first space for accommodating a heat source, and a first side of the first heat dissipation module having at least one air inlet connected to the first space; A second heat dissipation module is disposed on a second side of the first heat dissipation module, and the second heat dissipation module includes: The housing has a second space inside, and a first opening is provided on the third side of the housing, which communicates with the second space for air intake into the second space; the fourth side of the housing has at least one second opening facing the first heat dissipation module, and the second opening is connected to the second space and the first space respectively, so that the airflow in the second space can be discharged to any air intake of the first heat dissipation module through at least one second opening. The third side of the housing is different from the fourth side of the housing.

2. The heat dissipation structure according to claim 1, characterized in that: At least one of the air inlets is arranged sequentially along the air intake direction of the first opening; At least one of the second openings is provided in a one-to-one correspondence with at least one of the air inlets; The size of the second space gradually decreases along the air intake direction of the first opening.

3. The heat dissipation structure according to claim 1 or 2, characterized in that: The second space is equipped with a guide assembly; The guide component is provided with at least one of the second openings so that the airflow in the second space can be discharged to any of the air inlets of the first heat dissipation module through at least one of the second openings.

4. The heat dissipation structure according to claim 3, characterized in that: The guiding assembly includes a first guide element; The second opening and the first guide are arranged sequentially along the air intake direction of the first opening. The first guide is tilted at a target angle toward the direction of the first opening so that the air intake of the first opening is guided to the second opening.

5. The heat dissipation structure according to claim 4, characterized in that: The guiding assembly further includes a second guide element; The second guide is disposed on the inner wall of the housing opposite to the first guide. The second guide and the first guide are arranged alternately along the air intake direction of the first opening. The second guide is tilted to a second target angle away from the first opening so as to guide the air intake of the first opening to the first guide in sequence.

6. The heat dissipation structure according to claim 1, characterized in that: The housing also includes a third space that is isolated from the second space; The second side of the first heat dissipation module faces the second heat dissipation module, and the second side of the first heat dissipation module is provided with an air outlet that communicates with the first space; The fifth and sixth sides of the third space are respectively provided with a third opening and a fourth opening. The third opening is opposite to and connected to the air outlet. The fourth opening is used to discharge the airflow in the third space. The fifth side of the third space is on the same side as the third side of the second space, and the sixth side of the third space is different from the third side and the fourth side of the second space.

7. The heat dissipation structure according to claim 6, characterized in that: The housing is provided with a first partition; The first partition extends along the air intake direction of the first opening to divide the interior of the housing into the second space and the third space; The first partition is inclined so that the size of the second space gradually decreases along the air intake direction of the first opening.

8. The heat dissipation structure according to claim 7, characterized in that: The housing is also provided with a second partition; The second partition is symmetrically arranged with the first partition on the side of the first partition away from the third space, so that the second space is located between the first partition and the second partition.

9. The heat dissipation structure according to claim 6, characterized in that: The second heat dissipation module also includes a current regulation drive component. The flow control drive component is disposed in the third space, and the flow control drive component can draw in the air from the air outlet through the third opening and discharge it through the fourth opening; The third space has a fifth opening on its seventh side, through which the flow control drive component can discharge the airflow in the third space; The seventh side of the third space is different from the fifth side and the sixth side of the third space.

10. An electronic device, characterized in that, It includes: The enclosure has a fourth space for accommodating at least one system heat source, and the eighth and ninth sides of the enclosure are respectively provided with a system air inlet and a system air outlet. A heat dissipation structure is disposed within the fourth space, and the heat dissipation structure includes a first heat dissipation module and a second heat dissipation module. The first heat dissipation module has a first space for accommodating a heat source connected to the system heat source. The first side of the first heat dissipation module is provided with at least one air inlet that communicates with the first space. The air inlet direction is perpendicular to the air inlet direction of the system air inlet. The second heat dissipation module is disposed on the second side of the first heat dissipation module, and the second heat dissipation module includes: The housing has a second space inside. The housing has a first opening on the third side corresponding to the air inlet of the system. The first opening communicates with the second space for air intake into the second space. The fourth side of the housing has at least one second opening facing the first heat dissipation module. The second opening communicates with the second space and the first space respectively, so that the airflow in the second space can be discharged to any air inlet of the first heat dissipation module through at least one second opening. The third side of the housing is different from the fourth side of the housing.

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