A heat dissipation structure of a graphics card fan

By separating the heat sink and the water cooling block, and bending the right-angled edge of the heat sink at the bottom to abut against the water cooling block, the problems of small contact area and high manufacturing cost in the prior art are solved, achieving rapid heat transfer and efficient heat dissipation.

CN224304137UActive Publication Date: 2026-05-29DONGGUAN ZHENHUI TECHNOLOGY CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN ZHENHUI TECHNOLOGY CO LTD
Filing Date
2025-06-07
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing graphics card coolers have a small contact area between the heatsink and the water cooling pipes, resulting in poor heat conduction, and the unibody design increases manufacturing costs.

Method used

The heat sink and water cooling block are set up separately. The bottom side of the heat sink is bent into a right angle and rests against the water cooling block to increase the heat conduction area. Heat is transferred through water cooling pipes and cooling fans.

Benefits of technology

It achieves rapid heat transfer, reduces manufacturing costs, and improves thermal conductivity and heat dissipation uniformity.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224304137U_ABST
    Figure CN224304137U_ABST
Patent Text Reader

Abstract

The utility model discloses a kind of heat dissipation structure of graphic card fan, it is related to graphic card heat dissipation technical field, including graphic card chip, radiator and radiating fan, radiator is fixedly installed on graphic card chip, radiating fan is fixedly installed on radiator;Radiator includes several spliced and assembled radiating fins, several radiating fins are arranged with equal distance array mutually, and there is ventilation gap between two adjacent radiating fins, radiating fan blows into ventilation gap and has the heat of radiating fin surface;Water cooling block is fixedly installed on graphic card chip, the bottom side of several radiating fins is on water cooling block, and the bottom side of radiating fin is bent and formed with multiple lower right-angle edges, and the bottom side of radiating fin is transferred heat by being on water cooling block through lower right-angle edge;The utility model does not need to be integrally formed, it is convenient for rapid production and processing, and manufacturing cost is reduced;Lower right-angle edge is set on the bottom side of radiating fin, can effectively increase heat conduction area, cooperate radiating fan, realize rapid heat dissipation.
Need to check novelty before this filing date? Find Prior Art