Anti-deviation solid state disk manual test seat

Abstract

The utility model relates to a kind of anti-deviation solid state disk manual test seat, including base, the base bottom is equipped with aluminium heat dissipation fin, the base center position is equipped with through-hole, the through-hole left and right sides are equipped with heat conduction push rod, the base upper end is equipped with test base, the test base center position is equipped with recess, the recess upper surface center position is equipped with contact probe array, the contact probe array left and right sides are equipped with heat conduction push rod hole, the recess inside is embedded with stage, the stage lower end four corners are equipped with spring post, the spring post lower end peg is fixed in the recess upper end four corners, the test base front end center position is equipped with clamping block, the test base rear end inside center is equipped with pivot, the pivot rotation type connection gland, with the temperature fluctuation of solid state disk in testing process can be effectively reduced, avoid the test misjudgment caused by temperature fluctuation, effectively prevent the advantages that solid state disk is deviated in testing process due to external force.

Description

Technical Field

[0001] This utility model relates to the field of test socket technology, and in particular to a manual test socket for anti-offset solid-state drives. Background Technology

[0002] Test sockets are key equipment used in the electronics manufacturing process to test the electrical performance and electrical connections of components. They ensure the functional reliability of circuit boards through precise measurements. Types of test sockets include ICT test fixtures, FCT functional test fixtures, RF test sockets, and chip test sockets, which are used to verify electrical parameters, signal transmission, and integrated circuit performance, respectively. They are widely used in semiconductor manufacturing, communication equipment, and consumer electronics, and can significantly improve product yield and production efficiency.

[0003] Patent application number CN202020242266.8 is a Chinese utility model patent, disclosing a chip testing socket. The chip testing socket includes: a chip holder for mounting the chip to be tested / programmed, the chip holder being a first color; and an identifier disposed on the chip holder, the identifier being a second color, different from the first color, allowing a vision device to accurately identify whether a chip to be tested / programmed is placed on the chip testing socket. However, this device has the following problems: firstly, its heat dissipation performance for the tested chip is poor; secondly, its anti-displacement positioning performance is poor. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by combining aluminum heat dissipation fins at the bottom of the base with a heat-conducting push rod to quickly and effectively dissipate heat generated by the solid-state drive (SSD) during testing. This solves the technical problem of poor heat dissipation performance for the test chip in the existing device. By using a spring column connection structure between the stage and the test base, and combining the design of the stage pressure block and the chip pressure block, the invention effectively prevents the SSD from shifting due to external forces during testing, thus solving the technical problem of poor anti-shift positioning performance in the existing device.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A manual test stand for anti-offset solid-state drives includes a base with aluminum heat dissipation fins at the bottom and a through hole at the center. Heat-conducting push rods are located on both sides of the through hole. A test base is located at the top of the base, with a groove at its center. A contact probe array is located at the center of the upper surface of the groove, and heat-conducting push rod holes are located on the left and right sides of the contact probe array. A platform is embedded inside the groove, with spring posts at each of the four lower corners of the platform. The lower ends of the spring posts are fixed to the four upper corners of the groove with pins. A locking block is located at the center of the front end of the test base, and a rotating shaft is located at the center of the rear end of the test base, with the rotating shaft rotatably connected to a pressure cap.

[0007] As a preferred embodiment, the front end of the pressure cap is provided with an elastic buckle, which is adapted to the locking block. The upper front side of the elastic buckle is provided with an anti-slip groove. The lower end of the pressure cap is provided with a platform pressing block, which is adapted to the overall size of the platform. The lower end of the platform pressing block is provided with a chip pressing block.

[0008] As a preferred embodiment, the stage has a test channel hole at its center, the test channel hole is cross-shaped, and a chip placement platform is provided at the upper end of the test channel hole, the chip placement platform being lower than the upper surface of the stage.

[0009] As a preferred embodiment, the position of the through hole corresponds exactly to the position of the contact probe array, and the contact probe array can protrude from the bottom of the base through the through hole.

[0010] As a preferred embodiment, the thermally conductive push rod includes a high thermal conductivity metal rod, the upper end of which is provided with a silicone layer, and the lower end of which is elastically connected to the base via a spring.

[0011] As another preferred embodiment, the size of the heat-conducting push rod hole is adapted to that of the heat-conducting push rod, and the heat-conducting push rod protrudes from the upper surface of the groove through the heat-conducting push rod hole.

[0012] The beneficial effects of this utility model are:

[0013] (1) In this utility model, the aluminum heat dissipation fins set at the bottom of the base are combined with the heat conduction push rod system to realize the rapid export and effective heat dissipation of the heat generated by the solid-state drive (SSD) during the test. The heat conduction push rod is made of a high thermal conductivity metal rod. The silicone layer at the top can provide buffer protection when in contact with the solid-state drive, and at the same time effectively conduct heat. The heat generated by the solid-state drive during operation is conducted to the base through the high thermal conductivity metal rod, and then the heat is quickly dissipated into the air through the aluminum heat dissipation fins, thereby realizing the heat dissipation of the solid-state drive (SSD). This can effectively reduce the temperature fluctuation of the solid-state drive during the test and avoid test misjudgment caused by temperature fluctuation.

[0014] (2) In this utility model, the platform is embedded in the groove of the test base and connected to the groove by the spring pillars at the four corners. It has a certain elastic floating space in the vertical direction, so as to adapt to solid-state hard disk modules of different thicknesses. At the same time, after the cover is closed, the platform pressing block at the lower end of the cover applies uniform pressure to the platform to press down, thereby improving the stability of the platform. Meanwhile, the chip pressing block in the center of the platform pressing block is specifically used to apply vertical pressure to the chip, ensuring that the chip and the contact probe array maintain stable and reliable electrical contact, effectively preventing the solid-state hard disk from shifting due to external force during the test.

[0015] In summary, this device has the advantages of effectively reducing temperature fluctuations of solid-state drives (SSDs) during testing, avoiding test misjudgments caused by temperature fluctuations, and effectively preventing SSDs from shifting due to external forces during testing. It is particularly suitable for the field of test socket technology. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is an exploded view of the base, test base, and platform in this utility model.

[0019] Figure 3 This is a schematic diagram of the heat-conducting push rod structure in this utility model. Detailed Implementation

[0020] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0021] Example 1

[0022] like Figures 1 to 3As shown, this utility model provides a manual test stand for anti-offset solid-state drives, including a base 1. The bottom of the base 1 is provided with aluminum heat dissipation fins, which are fixed to the bottom of the base 1 by welding. The surface of the aluminum heat dissipation fins has multiple parallel-arranged fin structures to increase the contact area with air. Screw posts are provided at the four corners of the lower end of the base 1. The screw posts pass through the mounting holes of an external PCB test board. Nuts are then tightened onto the screw posts on the underside of the PCB test board to fix the base 1 to the PCB test board. A spacer is provided at the contact position between the screw posts and the external PCB test board, providing a gap between the lower end of the base 1 and the upper end of the PCB test board. The ends are not tightly fitted, and this gap provides space for the aluminum heat sink fins to dissipate heat. A through hole 11 is provided at the center of the base 1. The through hole 11 is a hollow structure penetrating the base 1 to avoid the lower part of the contact probe array 211, allowing it to connect to an external test PCB board through the bottom of the base 1. Thermally conductive push rods 12 are provided on both sides of the through hole 11. A test base 2 is provided at the upper end of the base 1. The test base 2 is the core load-bearing component of this device. A groove 21 is provided at the center of the test base 2. The groove 21 is a rectangular recessed structure at the center of the test base 2. The size of the groove 21 matches the platform 3, ensuring that the platform 3 can be stably embedded and achieve vertical floating functionality. The upper surface of the groove 21... A contact probe array 211 is located at the center of the surface. This contact probe array 211 is a highly conductive spring probe array. It is used to electrically connect the solid-state drive (SSD) and the test solder joints on the PCB board, ensuring the stability and reliability of signal transmission. The contact probe array 211 has heat-conducting push rod holes 22 on its left and right sides. These holes are through-holes on the upper surface of the groove 21, corresponding to the heat-conducting push rods 12 on the base 1, allowing the upper ends of the heat-conducting push rods 12 to pass through and directly contact the SSD for heat conduction. A platform 3 is embedded inside the groove 21, serving as the main support platform for testing the SSD. Spring posts 31 are located at the four corners of the lower end of the platform 3. The spring column 31 is composed of a metal spring and a plastic guide sleeve, ensuring the elastic floating capability of the platform 3 in the vertical direction while preventing its lateral displacement. The lower end of the spring column 31 is fixed to the four corners of the upper end of the groove 21 by pins. The front center of the test base 2 is provided with a locking block 23, which is a protruding structure used to achieve positioning and locking with the elastic buckle 41 at the front end of the pressure cover 4, thereby improving the stability of the overall structure. The rear center of the test base 2 is provided with a rotating shaft 24, which is rotatably connected to the pressure cover 4. The rotating shaft 24 adopts a metal shaft core and plastic bearing structure to realize the rotational connection between the pressure cover 4 and the test base 2, which facilitates the opening and closing operation of the pressure cover 4 to apply downward pressure to the platform 3 during the test.

[0023] Furthermore, the front center of the pressure cover 4 is provided with an elastic buckle 41, which is adapted to the locking block 23. The cooperation between the elastic buckle 41 and the locking block 23 realizes the quick locking of the pressure cover 4, improving the operation efficiency. The upper front end of the elastic buckle 41 is provided with an anti-slip groove 411. The lower center of the pressure cover 4 is provided with a platform pressure block 42, which is adapted to the overall size of the platform 3. The platform pressure block 42 is a solid block structure at the lower end of the pressure cover 4, and its size matches the upper surface contour of the platform 3. It can apply uniform pressure to the platform 3 when the pressure cover 4 is closed, preventing the platform 3 from shifting due to external force during the test. The lower center of the platform pressure block 42 is provided with a chip pressure block 421, which is shaped to match the solid-state drive chip area and is used to apply vertical pressure to the chip area to ensure good electrical contact between the chip solder joints and the contact probe array 211.

[0024] Furthermore, a test channel hole 32 is provided at the center of the stage 3. The test channel hole 32 is cross-shaped and is a cross-shaped through-hole structure. Its design purpose is to provide a vertically penetrating path for the contact probe array 211, so that the contact probe array 211 can smoothly contact the test points of the solid-state drive PCB board when the stage 3 is pressed. A chip placement platform 33 is provided at the upper end of the test channel hole 32. The chip placement platform 33 is lower than the upper surface of the stage 3. The chip placement platform 33 is a platform set around the test channel hole 32. The height of the chip placement platform 33 is lower than the upper surface of the stage 3. The chip placement platform 33 is used to place solid-state drive chips to prevent the chips from tilting or shifting due to height differences during the test.

[0025] Furthermore, the position of the through hole 11 corresponds exactly to the position of the contact probe array 211. The contact probe array 211 can protrude from the bottom of the base 1 through the through hole 11. The lower end of the contact probe array 211 can pass through the through hole 11 of the base 1 and be electrically connected to an external test circuit board, thereby realizing the signal input and output test of the solid-state drive.

[0026] Furthermore, the thermally conductive push rod 12 includes a high thermal conductivity metal rod 121 made of copper to achieve rapid heat conduction. The upper end of the high thermal conductivity metal rod 121 is provided with a silicone layer 122, which has good thermal conductivity and elastic buffering performance. When the solid-state drive is placed on the stage 3, it can contact the chip area, providing buffering protection while conducting heat to the metal rod 121. The lower end of the thermally conductive metal rod 121 is elastically connected to the base 1 by a spring, allowing the thermally conductive metal rod 121 to float in the vertical direction to adapt to solid-state drive modules of different thicknesses and ensure good contact with the chip area at all times.

[0027] Furthermore, the size of the heat-conducting push rod hole 22 is adapted to the size of the heat-conducting push rod 12. The heat-conducting push rod 12 protrudes from the upper surface of the groove 21 through the heat-conducting push rod hole 22. The heat-conducting push rod hole 22 is a circular hole structure opened on the upper surface of the groove 21, and its diameter is slightly larger than the outer diameter of the heat-conducting push rod 12, ensuring that the heat-conducting push rod 12 can move smoothly up and down, so that the upper end of the heat-conducting push rod 12 can protrude from the groove 21 and directly contact the solid-state drive module, thereby achieving a highly efficient heat conduction effect. The fit between the heat-conducting push rod 12 and the heat-conducting push rod hole 22 has good guiding performance, preventing the heat-conducting push rod 12 from tilting or getting stuck during movement, thereby ensuring good contact and stable heat conduction with the solid-state drive.

[0028] Working process: First, the operator places the solid-state drive to be tested on the chip placement stage 33 of the stage 3, ensuring that the chip area of ​​the hard drive is aligned with the test channel hole 32. Next, the operator presses down the cover 4 to rotate it around the pivot 24 and close it. The elastic buckle 41 at the front end of the cover 4 locks with the locking block 23 of the test base 2, emitting a "click" sound to indicate that it is locked. At this time, the stage pressing block 42 at the lower end of the cover 4 evenly presses the stage 3, while the chip pressing block 421 precisely abuts against the chip area of ​​the hard drive. After being pressed, the stage 3 elastically sinks through the spring column 31, adapting to the thickness of the hard drive and preventing displacement. The test point at the bottom of the hard drive chip is in close contact with the contact probe array 211 on the surface of the groove 21. The probe signal is transmitted to the test point on the external test circuit board through the through hole 11. At the same time, the heat generated by the hard drive is buffered and absorbed by the silicone layer 122 of the thermal push rod 12, and then conducted to the base 1 through the high thermal conductivity metal rod 121. Finally, it is quickly dissipated by the aluminum heat sink fins. After the test is started, the external device sends commands and collects data through the contact probe array 211. The spring at the bottom of the thermal push rod 12 continuously adjusts the pressure to ensure stable heat dissipation contact until the test is completed.

[0029] In the description of this utility model, it should be understood that the terms "front and back", "left and right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0030] Of course, those skilled in the art should understand that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be understood as a limitation on the quantity.

[0031] The above description is merely a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art under the technical guidance of this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A manual test socket for anti-offset solid-state drives, characterized in that: The device includes a base (1), with aluminum heat dissipation fins at the bottom. A through hole (11) is provided at the center of the base (1), and heat-conducting push rods (12) are provided on the left and right sides of the through hole (11). A test base (2) is provided at the upper end of the base (1), with a groove (21) at the center of the test base (2). A contact probe array (211) is provided at the center of the upper surface of the groove (21), and heat-conducting push rod holes (22) are provided on the left and right sides of the contact probe array (211). A platform (3) is embedded inside the groove (21), and spring posts (31) are provided at the four corners of the lower end of the platform (3). The lower ends of the spring posts (31) are fixed to the four corners of the upper end of the groove (21) by pins. A locking block (23) is provided at the center of the front end of the test base (2), and a rotating shaft (24) is provided at the center of the rear end of the test base (2). The rotating shaft (24) is rotatably connected to the pressure cover (4).

2. The anti-offset solid-state drive manual test socket according to claim 1, characterized in that, The front end of the pressure cap (4) is provided with an elastic buckle (41), which is adapted to the buckle block (23). The upper front end of the elastic buckle (41) is provided with an anti-slip groove (411). The lower end of the pressure cap (4) is provided with a platform pressure block (42), which is adapted to the overall size of the platform (3). The lower end of the platform pressure block (42) is provided with a chip pressure block (421).

3. The anti-offset solid-state drive manual test socket according to claim 1, characterized in that, The stage (3) has a test channel hole (32) at its center. The test channel hole (32) is cross-shaped. A chip placement platform (33) is provided at the upper end of the test channel hole (32). The chip placement platform (33) is lower than the upper surface of the stage (3).

4. The anti-offset solid-state drive manual test socket according to claim 1, characterized in that, The position of the through hole (11) corresponds exactly to the position of the contact probe array (211), and the contact probe array (211) can protrude from the bottom of the base (1) through the through hole (11).

5. A manual test socket for anti-offset solid-state drives according to claim 1, characterized in that, The heat-conducting push rod (12) includes a high thermal conductivity metal rod (121), the upper end of which is provided with a silicone layer (122), and the lower end of which is elastically connected to the base (1) by a spring.

6. The anti-offset solid-state drive manual test socket according to claim 1, characterized in that, The size of the heat-conducting push rod hole (22) is adapted to the size of the heat-conducting push rod (12), and the heat-conducting push rod (12) protrudes from the upper surface of the groove (21) through the heat-conducting push rod hole (22).

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