Camera module

Abstract

A camera module is disclosed. The camera module includes a lens barrel, and a housing including an upper housing and a lower housing coupled to each other and surrounding at least a portion of the lens barrel. The lower housing includes a lower coupling portion coupled to the upper housing, and the lower coupling portion includes a first coupling portion in direct contact with the upper housing and a second coupling portion coupled to the upper housing by an adhesive, and the first coupling portion is electrically connected to the upper housing.

Description

Technical Field

[0001] The following description pertains to the camera module. Background Technology

[0002] The development and implementation of ultra-miniature camera modules in vehicles are growing rapidly. For example, ultra-miniature cameras can be implemented as black box cameras, which can be used for vehicle protection or to capture objective data about traffic accidents; ultra-miniature cameras can also operate as rear monitoring cameras, which allow drivers to monitor blind spots behind the vehicle on a screen to ensure safety when reversing; ultra-miniature cameras can also be implemented as perimeter detection cameras, which monitor the vehicle's surrounding environment or perform similar operations.

[0003] For cameras installed in vehicles to operate stably, electromagnetic interference (EMI) performance and electromagnetic compatibility (EMC) performance are important. To improve EMI and EMC performance, shielding electrical signals is beneficial, and current conduction (or electrical conduction) between the upper and lower housings should be maintained to shield electrical signals.

[0004] To maintain current conduction during the typical assembly of the upper and lower housings, the surface treatments applied to the upper and lower housings for corrosion protection are removed, and then a conductive adhesive is used to bond the upper and lower housings together. This method suffers from the following problems: low process efficiency, increased cost due to the use of conductive adhesives, and relatively low EMI and EMC performance. Utility Model Content

[0005] This summary portion is provided to briefly introduce the selection of concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0006] In one general aspect, the camera module includes: a lens barrel; and a housing surrounding at least a portion of the lens barrel, and the housing includes an upper housing and a lower housing connected to each other, wherein the lower housing includes a lower connecting portion connected to the upper housing, and the lower connecting portion includes: a first connecting portion and a second connecting portion, the first connecting portion being in direct contact with the upper housing, the second connecting portion being connected to the upper housing by an adhesive, and wherein the first connecting portion is electrically connected to the upper housing.

[0007] The adhesive can be a non-conductive adhesive.

[0008] The lower housing may include a first inner metal layer and a first insulating film layer disposed on the surface of the first inner metal layer, and the first inner metal layer is exposed through the surface of the first connecting portion.

[0009] The second connecting part may have a first insulating film layer on its surface, and the lower housing is connected to the upper housing through the first insulating film layer and an adhesive.

[0010] The upper housing may include a second inner metal layer, a second insulating film layer disposed on the surface of the second inner metal layer, and an upper connecting portion corresponding to the lower connecting portion. The upper connecting portion may include a third connecting portion, which corresponds to the first connecting portion of the lower connecting portion, and the second inner metal layer is exposed on the surface of the lower connecting portion.

[0011] The upper connecting portion may also include a fourth connecting portion, which corresponds to the second connecting portion, and the fourth connecting portion has a second insulating film layer on its surface.

[0012] The upper connecting part can be configured to accommodate the lower connecting part.

[0013] The upper connecting part can be configured as a groove on the upper housing.

[0014] The first connecting part can be located above the second connecting part.

[0015] The second connecting part may have a portion whose width gradually decreases toward the first connecting part.

[0016] The upper housing may include: an upper surface portion; an upper side surface portion extending from the upper surface portion toward the lower housing; and an upper connecting portion disposed on the lower surface of the upper side surface portion.

[0017] The lower housing may also include a lower surface portion and a lower side surface portion, the lower side surface portion extending from the lower surface portion toward the upper housing, and the lower connecting portion protruding from the upper surface of the lower side surface portion.

[0018] Other features and aspects will be apparent from the claims, the accompanying drawings, and the detailed description below. Attached Figure Description

[0019] Figure 1 A schematic exploded perspective view of an exemplary camera module according to one or more embodiments is shown.

[0020] Figure 2 It is shown Figure 1 The three-dimensional view of the upper shell shown.

[0021] Figure 3 It is shown Figure 1 The image shows a bottom-view perspective view of the upper casing.

[0022] Figure 4 It is shown Figure 1 The figure shows a perspective view of the lower housing.

[0023] Figure 5 A cross-sectional view of the upper and lower housings connected to each other is shown.

[0024] Figure 6 It is shown Figure 5 A view of part A of the examples.

[0025] Figure 7 It is shown Figure 5 Another example view of part A.

[0026] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0027] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding the disclosure of this application. For example, the order of operations described herein and / or the sequence of operations described herein are merely examples and are not limited to the order set forth herein, except for the order of operations and / or the order of operations which must occur in a specific sequence, but can be changed, as will become apparent upon understanding the disclosure of this application. As another example, the order of operations and / or the order of operations can be performed in parallel, except for the order of operations and / or at least a portion of the order of operations which must occur in a sequence (e.g., a specific sequence). Furthermore, for clarity and conciseness, descriptions of features known upon understanding the disclosure of this application may be omitted.

[0028] Although terms such as “first,” “second,” and “third,” or A, B, (a), (b), may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Each of these terms is not intended to define, for example, the importance, sequence, or order of the corresponding component, part, region, layer, or section, but only to distinguish the corresponding component, part, region, layer, or section from other components, parts, regions, layers, or sections. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as the second component, second part, second region, second layer, or second section.

[0029] Throughout this specification, when a component, element, or layer is described as "on another component, element, or layer," "connected to," "attached to," or "joined to" another component, element, or layer, it may be directly "on another component, element, or layer," directly "connected to," "attached to," or "joined to" another component, element, or layer (e.g., in contact with another component, element, or layer), or one or more other components, elements, or layers may reasonably be present between that component, element, or layer and that other component, element, or layer. When a component, element, or layer is described as "directly on another component, element, or layer," "directly connected to," "directly attached to," or "directly joined to" another component, element, or layer, then there are no other components, elements, or layers between that component, element, or layer and that other component, element, or layer. Similarly, expressions such as "between" and "directly between," and "adjacent" and "directly adjacent" may also be interpreted as described above.

[0030] The terminology used herein is for illustrative purposes only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to include the plural forms as well. As non-limiting examples, the terms “comprising,” “including,” and “having” indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof, or alternatives to the stated features, quantities, operations, components, elements, and / or combinations thereof. Furthermore, while one embodiment may describe the presence of the terms “comprising,” “including,” and “having” to indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, other embodiments may exist in which one or more of the stated features, quantities, operations, components, elements, and / or combinations thereof are absent. As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items. The phrases “at least one of A, B, and C” are intended to have a disjunctive meaning, and these phrases “at least one of A, B, and C” also include examples in which one or more of A, B, and C may be present (e.g., any combination of one or more of A, B, and C), unless the corresponding description and implementation require that the enumeration (e.g., “at least one of A, B, and C”) be interpreted as having a conjunctive meaning.

[0031] Throughout the instruction manual, the phrases "in a plan view" or "on a plane" can refer to the view of a part of an object from above, and the phrases "in a cross-sectional view" or "on a cross-section" can refer to the view of a cross-section obtained by vertically cutting a part of an object from the side.

[0032] The features described herein may be embodied in various forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatus, and / or systems described herein will be apparent upon understanding the disclosure of this application. In this document, the use of the term “may” (e.g., regarding what an example or implementation may include or implement) with respect to an example or implementation means that there exists at least one example or implementation that includes or implements such a feature, and that all examples or implementations are not limited thereto. The terms “example” or “implementation” as used herein have the same meaning (e.g., the phrase “in one example” has the same meaning as “in one implementation,” and “in one or more examples” has the same meaning as “in one or more implementations”).

[0033] In the following text, the optical axis can be defined as the central axis of the lens, perpendicular to the lens surface, and the direction of the optical axis can represent a direction parallel to the central axis. In the accompanying drawings, the optical axis can be defined as the Z-axis, and the X-axis and Y-axis can be defined in directions perpendicular to the optical axis. In this example, the X-axis and Y-axis can be perpendicular to each other, and the XY plane formed by the X-axis and Y-axis can be a plane perpendicular to the optical axis.

[0034] One or more examples can provide camera modules that improve processing efficiency, reduce costs, and enhance electromagnetic interference (EMI) and electromagnetic compatibility (EMC) performance.

[0035] Based on one or more examples, non-conductive adhesives, which are cheaper than conductive adhesives, can be used, thus achieving the effect of reducing costs.

[0036] Based on one or more examples, the amount of stripping required for surface treatment of the upper and lower housings can be reduced, thereby improving processing efficiency.

[0037] Figure 1 This is a schematic exploded perspective view of an exemplary camera module 10 according to one or more embodiments.

[0038] Reference Figure 1 A camera module 10 according to one or more embodiments may include a lens barrel 100, a substrate 600, an image sensor 610, and a housing 700. Furthermore, a camera module 10 according to one or more embodiments may also include a heating element and a heat insulation element. A camera module 10 according to one or more embodiments may be implemented without some of the aforementioned components, and additional components are not excluded.

[0039] The camera module 10 may include a lens barrel 100. At least a portion of the lens barrel 100 may be housed in a housing 700. The housing 700 may be configured to surround at least a portion of the lens barrel 100. A portion of the lens barrel 100 may be inserted into the interior space of the housing 700 through an opening formed on the housing 700, and another portion of the lens barrel 100 may be disposed on the housing 700.

[0040] The lens barrel 100 can accommodate at least one lens. Each lens accommodated in the lens barrel 100 can be made of synthetic resin, glass, quartz or similar materials, but is not limited thereto, and can be made of various other materials.

[0041] The substrate 600 may be disposed within the housing 700. The substrate 600 may be disposed below the lens barrel 100. As an example, the substrate 600 may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0042] Although not shown in the accompanying drawings, camera module 10 may include a heating element and a connecting element coupled to the heating element. The connecting element may be electrically connected to substrate 600.

[0043] Image sensor 610 can be disposed within housing 700. Image sensor 610 converts light incident through lens barrel 100 into electrical signals. Image sensor 610 can be mounted on substrate 600. Image sensor 610 can be electrically connected to substrate 600. Image sensor 610 can be disposed on the front or top surface of substrate 600. For example, surface mount technology (SMT) can be used to mount image sensor 610 to substrate 600. As another example, flip chip technology can be used to mount image sensor 610 to substrate 600. For example, image sensor 610 can be any of, but is not limited to, charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CMOS photodetector (CPD), and charge injection device (CID). The electrical signal converted by image sensor 610 can be output as an image through display unit (or display) of electronic device. Image sensor 610 and lens can be aligned in the optical axis direction (Z-axis direction).

[0044] Although not shown in the accompanying drawings, an optical filter may be disposed between the lens barrel 100 and the image sensor 610. The optical filter can block light of a specific frequency band passing through the lens from entering the image sensor 610. The optical filter may be disposed parallel to a direction perpendicular to the optical axis (Z-axis direction). As an example, the optical filter may include an infrared blocking filter. The image sensor 610, the lens, and the optical filter may be aligned in the optical axis (Z-axis direction).

[0045] Figure 2 It is shown Figure 1 The figure shows a perspective view of the upper housing 800. Figure 3 It is shown Figure 1 and Figure 2 A bottom-view perspective of the bottom surface of the upper shell 800. Figure 4 It is shown Figure 1 The figure shows a perspective view of the lower housing 900. Figure 5 This is a cross-sectional view showing the upper housing 800 and the lower housing 900 connected to each other. Figure 6 It is shown Figure 5 An enlarged view of an example of the connecting part (i.e., part A). Figure 7 It is shown Figure 5 An enlarged view of another example of the connecting part (i.e., part A).

[0046] The housing 700 protects the internal components of the camera module 10. The housing 700 also serves to shield electromagnetic waves. For example, the housing 700 can shield electromagnetic waves so that electromagnetic waves generated by the camera module 10 do not affect other electronic components within the electronic device. The housing 700 may include an upper housing 800 and a lower housing 900. The upper housing 800 and the lower housing 900 can be connected to each other to form an internal space accommodating the components of the camera module 10.

[0047] Reference Figure 6 The housing 700 may include an inner metal layer ML and an insulating film layer SP disposed on the surface of the inner metal layer ML.

[0048] Reference Figure 1 and Figure 4 The lower housing 900 can be disposed below the substrate 600. The lower housing 900 can support the substrate 600 from below. The lower housing 900 can be connected to the upper housing 800. The lower housing 900 can have a shape corresponding to the upper housing 800. The lower housing 900 can have a box shape, which has an open upper part and four corners. The lower housing 900 can be connected to the upper housing 800 to shield electrical signals or electromagnetic waves.

[0049] Reference Figure 5 The lower housing 900 may include an inner metal layer ML and an insulating film layer SP disposed on the surface of the inner metal layer ML. The inner metal layer ML of the lower housing 900 may be formed of a metal material plate, or may be formed of a material with a low corrosion rate, such as stainless steel.

[0050] Reference Figure 4 The lower housing 900 may include a lower surface portion 910 and a lower side surface portion 930.

[0051] The lower surface portion 910 can be arranged along a planar direction (i.e., the XY axis direction). The lower surface portion 910 can also be arranged along a direction perpendicular to the optical axis (Z-axis direction). The lower surface portion 910 can have a quadrilateral shape, and the corners of the lower surface portion 910 can have rounded shapes. The lower side surface portion 930 can be connected to the upper side surface portion 830. The lower side surface portion 930 can extend upward from the lower surface portion 910 along the optical axis direction (Z-axis direction). That is, the lower side surface portion 930 can extend in a direction from the lower surface portion 910 toward the upper housing 800. For example, the lower side surface portion 930 can have four surfaces, and adjacent surfaces of the four surfaces can be perpendicular to each other. The corners of the surfaces connected to the lower side surface portion 930 can have rounded shapes to correspond to the shape of the corners of the lower surface portion 910. The lower housing 900 can have a quadrilateral box shape with an open upper portion and rounded corners. However, the shape of the lower housing 900 is not limited to this.

[0052] The lower housing 900 may have a lower connecting portion 931. The lower connecting portion 931 may be a connecting protrusion projecting upward from the upper end of the lower surface portion 930. The lower connecting portion 931 may be disposed inside the upper surface of the lower surface portion 930. The lower connecting portion 931 may project upward from the inside of the upper surface of the lower surface portion 930. The lower connecting portion 931 may be shaped such that the entire interior of the upper surface of the lower surface portion 930 protrudes in a direction toward the upper housing 800. The lower connecting portion 931 may be a portion connected to the upper housing 800. The lower connecting portion 931 may have a portion that makes line contact with the upper housing 800. For example, the lower connecting portion 931 may have a connecting protrusion shape that connects to the portion of the upper housing 800 corresponding to the lower connecting portion 931, and the end of the lower connecting portion 931 may be formed as a sharp point. The lower connecting portion 931 may have a portion whose width narrows toward its end. The lower connecting portion 931 can be formed on the entire inner side of the upper surface of the lower surface portion 930. That is, the lower connecting portion 931 can have a closed-loop shape.

[0053] Reference Figure 1 , Figure 2 and Figure 3 The upper housing 800 may be configured to surround at least a portion of the lens barrel 100. The upper housing 800 may have a box shape with an open lower portion and four corners. The upper housing 800 may have a central opening. The central openings of the lens barrel 100 and the upper housing 800 may be aligned along the optical axis (Z-axis direction).

[0054] Reference Figure 5The upper housing 800 may include an inner metal layer ML and an insulating film layer SP disposed on the surface of the inner metal layer ML. The inner metal layer ML of the upper housing 800 may be formed of a metal material plate, or may be formed of a material with a low corrosion rate, such as stainless steel.

[0055] Reference Figure 2 The upper housing 800 may include an upper surface portion 810 and an upper side surface portion 830.

[0056] The upper surface portion 810 can be arranged along a planar direction (XY axis direction). The upper surface portion 810 can also be arranged along a direction perpendicular to the optical axis (Z axis direction). The upper surface portion 810 can face the lower surface portion 910. The upper surface portion 810 can have a quadrilateral shape, and its corners can be rounded. A cover opening 811 can be formed at the center of the upper surface portion 810. The center of the lens barrel 100 can be exposed through the cover opening 811, and the lens can also be exposed, allowing light to enter the lens.

[0057] The upper surface portion 830 may extend downward from the upper surface portion 810 along the optical axis direction (Z-axis direction). That is, the upper surface portion 830 may extend in a direction from the upper surface portion 810 toward the lower housing 900. For example, the upper surface portion 830 may have four surfaces, and adjacent surfaces of the four surfaces may be perpendicular to each other. The corners of the surfaces connected to the upper surface portion 830 may have a rounded shape to correspond to the shape of the corners of the upper surface portion 810. The upper housing 800 may have a quadrilateral box shape with an open lower portion and rounded corners. However, the shape of the upper housing 800 is not limited to this.

[0058] Reference Figure 3The upper housing 800 may have an upper connecting portion 831. The upper connecting portion 831 may be provided at the lower end of the upper surface portion 830. The upper connecting portion 831 may correspond to the lower connecting portion 931. The upper connecting portion 831 may be formed at a position corresponding to the lower connecting portion 931. The upper connecting portion 831 may accommodate the lower connecting portion 931. The upper connecting portion 831 may be a connecting groove formed recessed toward the inner side of the upper surface portion 830. The upper connecting portion 831 may be a portion connected to the lower housing 900. The upper connecting portion 831 may be a groove formed at the lower end of the upper surface portion 830. The upper connecting portion 831 may be a groove along the entire lower end of the upper surface portion 830. The upper connecting portion 831 may be provided at the center portion of the lower surface of the upper surface portion 830. The upper connecting portion 831 may be recessedly formed at the center portion of the lower surface of the upper surface portion 830. The upper connecting portion 831 and the lower connecting portion 931 may have portions that are in line contact with each other. The upper connecting portion 831 may be formed along the entire central portion of the lower surface of the upper surface portion 830. That is, the upper connecting portion 831 may have a closed-loop shape.

[0059] Reference Figure 6 Adhesive 840 can be placed between the upper connecting portion 831 and the lower connecting portion 931. Adhesive 840 can bond the upper connecting portion 831 and the lower connecting portion 931. In the example, adhesive 840 can be provided only on a portion of the upper connecting portion 831 and only on a portion of the lower connecting portion 931. In the example, adhesive 840 can be a non-conductive adhesive.

[0060] Reference Figure 5 , Figure 6 and Figure 7 The lower connecting portion 931 may include a first connecting portion 931a and a second connecting portion 931b, and the upper connecting portion 831 may include a third connecting portion 831a corresponding to the first connecting portion 931a and a fourth connecting portion 831b corresponding to the second connecting portion 931b.

[0061] The first connecting portion 931a and the third connecting portion 831a can be portions where the inner metal layer ML of the lower housing 900 (e.g., a first inner metal layer) and the inner metal layer ML of the upper housing 800 (e.g., a second inner metal layer) are respectively exposed on the surfaces of the first connecting portion 931a and the third connecting portion 831a, or portions where the inner metal layer ML of the lower housing 900 and the inner metal layer ML of the upper housing 800 are interconnected between the surfaces of the first connecting portion 931a and the third connecting portion 831a. That is, the surfaces of the first connecting portion 931a and the third connecting portion 831a can be formed of a metallic material. The first connecting portion 931a and the third connecting portion 831a can each be formed by partially removing the insulating film layer SP provided on the surfaces of the lower connecting portion 931a and the upper connecting portion 831a. For example, a continuous inner metal layer ML can be formed to connect the first connecting portion 931a and the third connecting portion 831a. The portion of the lower connecting portion 931 from which the insulating film layer SP has been removed can be the first connecting portion 931a. The portion of the upper connecting part 831 from which the insulating film layer SP has been removed can be the third connecting part 831a. The first connecting part 931a and the third connecting part 831a can be in direct contact with each other via the inner metal layer ML, so that the lower housing 900 and the upper housing 800 are electrically connected.

[0062] The first connecting portion 931a may be disposed at the uppermost end of the lower connecting portion 931. The first connecting portion 931a may be disposed above the second connecting portion 931b. The second connecting portion 931b may be disposed below the first connecting portion 931a. The second connecting portion 931b may have an insulating film layer SP on its surface. The portion of the lower connecting portion 931 with the insulating film layer SP removed from its upper surface may be the first connecting portion 931a, and the portion below the first connecting portion 931a with the insulating film layer SP not removed (e.g., the first insulating film layer) may be the second connecting portion 931b. The second connecting portion 931b may have a portion whose width gradually decreases from the bottom to the top of the second connecting portion 931b. The second connecting portion 931b may have a portion whose width gradually decreases toward the first connecting portion 931a. The second connecting portion 931b may have a portion that slopes toward the first connecting portion 931a. In the example, the slope may be based on the first connecting portion 931a being formed only on one side (see...). Figure 6 Alternatively, it can be formed on both sides based on the first connecting portion 931a (see...). Figure 7 ).

[0063] The third connecting portion 831a can correspond to the first connecting portion 931a. The third connecting portion 831a can be positioned corresponding to the first connecting portion 931a, allowing direct contact with it. The metal on the surface of the third connecting portion 831a and the metal on the surface of the first connecting portion 931a can be in direct contact with each other. Therefore, the upper housing 800 and the lower housing 900 can be electrically connected. The first connecting portion 931a and the third connecting portion 831a can be in line contact with each other. The fourth connecting portion 831b can correspond to the second connecting portion 931b. The fourth connecting portion 831b can be positioned corresponding to the second connecting portion 931b. The fourth connecting portion 831b can face the second connecting portion 931b, and adhesive 840 is placed between the fourth connecting portion 831b and the second connecting portion 931b. Adhesive 840 may not be placed between the third connecting portion 831a and the first connecting portion 931a, but may be placed only between the fourth connecting portion 831b and the second connecting portion 931b. The fourth connecting portion 831b may have an insulating film layer SP (e.g., a second insulating film layer) on its surface. The portion of the upper connecting portion 831 from which the insulating film layer SP has been removed may be the third connecting portion 831a, and the portions of the third connecting portion 831a on both sides of the third connecting portion 831a from which the insulating film layer SP has not been removed may be the fourth connecting portion 831b.

[0064] In one or more example camera modules, the metal portions of the upper and lower housings can be in direct contact with each other for electrical conductivity. Therefore, since it is not necessary to provide conductivity to the adhesive to bond the upper and lower housings, a non-conductive adhesive, which is cheaper than a conductive adhesive, can be used when manufacturing the camera module.

[0065] Furthermore, since it is not necessary to peel off the insulating film layer located on the remaining portions except for the first part of the upper connecting portion and the first region (or first part) of the lower connecting portion, the area requiring the peeling process can be reduced. Therefore, processing efficiency can be improved.

[0066] In addition, because the metal parts of the upper housing and the lower housing are in direct contact, the electromagnetic interference (EMI) of the camera module can be reduced, and the electromagnetic compatibility (EMC) of the camera module can be improved.

[0067] While this disclosure includes specific examples, it will be apparent upon understanding the disclosure of this application that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for purposes of limitation. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Appropriate results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in a different manner and / or replaced or supplemented by other components or their equivalents.

[0068] Therefore, in addition to the above disclosure and all the accompanying drawings, the scope of this disclosure also includes the claims and their equivalents, that is, all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.

Claims

1. A camera module, characterized in that, The camera module includes: Lens tube; and A housing that surrounds at least a portion of the lens barrel, and the housing comprising an upper housing and a lower housing connected to each other. The lower housing includes a lower connecting portion connected to the upper housing, and the lower connecting portion includes: The first connecting part is in direct contact with the upper housing, and The second connecting part is attached to the upper housing by an adhesive, and The first connecting part is electrically connected to the upper housing.

2. The camera module according to claim 1, characterized in that, The adhesive is a non-conductive adhesive.

3. The camera module according to claim 1, characterized in that, The lower housing includes a first inner metal layer and a first insulating film layer disposed on the surface of the first inner metal layer, and the first inner metal layer is exposed through the surface of the first connecting portion.

4. The camera module according to claim 1, characterized in that, The second connecting part has a first insulating film layer on its surface, and the lower housing is connected to the upper housing through the first insulating film layer and the adhesive.

5. The camera module according to claim 1, characterized in that, The upper housing includes a second inner metal layer, a second insulating film layer disposed on the surface of the second inner metal layer, and an upper connecting portion corresponding to the lower connecting portion. The upper connecting portion includes a third connecting portion, which corresponds to the first connecting portion of the lower connecting portion, and the second inner metal layer is exposed on the surface of the lower connecting portion.

6. The camera module according to claim 5, characterized in that, The upper connecting portion further includes a fourth connecting portion, which corresponds to the second connecting portion, and the fourth connecting portion has the second insulating film layer on its surface.

7. The camera module according to claim 6, characterized in that, The upper connecting portion is configured to accommodate the lower connecting portion.

8. The camera module according to claim 5, characterized in that, The upper connecting portion is configured as a groove on the upper housing.

9. The camera module according to claim 1, characterized in that, The first connecting part is disposed above the second connecting part.

10. The camera module according to claim 1, characterized in that, The second connecting portion has a portion whose width gradually decreases toward the first connecting portion.

11. The camera module according to claim 1, characterized in that, The upper housing includes: upper surface portion; The upper surface portion extends from the upper surface portion toward the lower housing; and The upper connecting part is disposed on the lower surface of the upper side surface portion.

12. The camera module according to claim 1, characterized in that, The lower housing also includes a lower surface portion and a lower side surface portion, the lower side surface portion extending from the lower surface portion toward the upper housing, and the lower connecting portion protruding from the upper surface of the lower side surface portion.

Images