Camera module

Abstract

A camera module includes an image sensor configured to convert incident light into an electrical signal, a substrate electrically connected to the image sensor and including a main circuit layer, and a reinforcing member configured to support the substrate and having a strength reinforcing portion, wherein the main circuit layer includes a main signal layer forming a path for transmitting a signal, wherein the reinforcing member includes a first region and a second region having different thicknesses, and wherein the second region is disposed to overlap the main signal layer in a vertical direction.

Description

Technical Field

[0001] This disclosure relates to camera modules. Background Technology

[0002] Due to the trend towards miniaturization and thinning of portable electronic devices, including mobile phones, there is current focus on reducing the size of components installed in these devices. Furthermore, technologies for integrating electronic components are being continuously researched and developed. Specifically, camera modules (one type of electronic component) are being used in smartphones, laptops, and vehicles.

[0003] As video recording increases, the use of camera modules in portable smartphones is also increasing. Additionally, vehicles require high-performance camera modules to enable cutting-edge Advanced Driver Assistance Systems (ADAS) for autonomous driving functions.

[0004] However, as camera modules become smaller and have higher pixel counts, the risk of damage to the camera modules during manufacturing or use also increases.

[0005] The above information is presented as background information and is intended to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content can be used as prior art with respect to this disclosure. Summary of the Invention

[0006] The summary portion of this invention is intended to provide a brief overview of the chosen concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0007] In one general aspect, the camera module includes: an image sensor configured to convert incident light into an electrical signal; a substrate electrically connected to the image sensor and including a main circuit layer; and a reinforcing member configured to support the substrate and having a strength-reinforcing portion, wherein the main circuit layer includes a main signal layer forming a path for transmitting signals, wherein the reinforcing member includes a first region and a second region with different thicknesses, and wherein the second region is configured to overlap the main signal layer in a vertical direction.

[0008] The substrate may include an upper conductive layer disposed on the upper side of the main circuit layer, and the upper conductive layer may include an upper mesh layer.

[0009] The upper grid layer can be configured to overlap with the second region of the main signal layer and the reinforcing member in the vertical direction.

[0010] The substrate may include a lower conductive layer disposed below the main circuit layer, and the lower conductive layer may include a lower mesh layer.

[0011] The lower grid layer can be configured to overlap with the second region of the main signal layer and the reinforcing member in the vertical direction.

[0012] The thickness of the first region can be thinner than the thickness of the second region.

[0013] The thickness of the first region can be greater than the thickness of the second region.

[0014] The main circuit layer may also include non-signal layers disposed around the main signal layer.

[0015] Non-signal layers can be grounded.

[0016] In another general aspect, the camera module includes: an image sensor configured to convert incident light into an electrical signal; a substrate electrically connected to the image sensor; and a reinforcing member configured to support the substrate and having a strength-reinforcing portion, wherein the reinforcing member includes a first region and a second region with different thicknesses, and wherein the entire area of ​​the first region and the entire area of ​​the second region overlaps with the substrate in the vertical direction.

[0017] The substrate may include a main circuit layer, which may include a main signal layer forming a path for transmitting signals, and the second region may be configured to overlap with the main signal layer in the vertical direction.

[0018] The thickness of the first region can be thinner than the thickness of the second region.

[0019] The thickness of the first region can be greater than the thickness of the second region.

[0020] In another general aspect, the camera module includes: an image sensor configured to convert incident light into an electrical signal; a substrate electrically connected to the image sensor and having a central region in which an opening is formed; and a reinforcing member configured to support the substrate and having a strength-reinforcing portion, wherein the reinforcing member includes a first region and a second region with different thicknesses, and wherein a portion of the first region overlaps the substrate in a vertical direction, and the remaining portion of the first region overlaps the opening in a vertical direction.

[0021] The substrate may include a main circuit layer, which may include a main signal layer forming a path for transmitting signals, and the second region may be configured to overlap with the main signal layer in the vertical direction.

[0022] Other features and aspects will become apparent from the accompanying drawings and the detailed description below. Attached Figure Description

[0023] Figure 1 This is an exploded perspective view of the camera module according to the implementation method.

[0024] Figure 2 It is shown Figure 1 A diagram of the reinforcing components.

[0025] Figure 3 This is a diagram showing a substrate with a reinforcing member attached.

[0026] Figure 4 It is along Figure 3 A cross-sectional view taken from line A-A'.

[0027] Figure 5 This is a diagram showing a reinforcing member according to another embodiment.

[0028] Figure 6 It shows that it is attached Figure 5 A diagram of the substrate for the reinforcing member.

[0029] Figure 7 It is along Figure 6 The cross-sectional view taken by line B-B'.

[0030] Figure 8 This is a diagram illustrating a camera module according to another embodiment.

[0031] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0032] In the following description, although examples of this disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.

[0033] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein, except for operations that must occur in a specific order, as will become apparent upon understanding this disclosure. Furthermore, for clarity and brevity, descriptions of features well-known in the art may be omitted.

[0034] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatuses, and / or systems described herein will become apparent upon understanding this disclosure.

[0035] Throughout this specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, the element may be directly "on," directly "connected to," or directly "attached to" the other element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, there are no other elements between the element and the other element.

[0036] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items; similarly, “at least one” includes any one of the associated listed items and any combination of any two or more items.

[0037] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as a second component, second part, second region, second layer, or second section.

[0038] Spatial relative terms such as “above,” “above,” “below,” and “under” may be used herein for descriptive convenience to describe the relationship of one element relative to another, as shown in the accompanying drawings. In addition to covering the orientation depicted in the drawings, these spatial relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” another element would be located “below” or “under” that other element. Thus, depending on the spatial orientation of the device, the term “above” covers both orientations of “above” and “below”. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0039] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0040] Due to manufacturing techniques and / or tolerances, the shapes shown in the accompanying drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include shape variations that occur during manufacturing.

[0041] It should be noted that in this document, the term "may" is used relative to examples, such as regarding what an example may include or implement, meaning that there exists at least one example that includes or implements such a feature, but not all examples are limited to this.

[0042] The features of the examples described herein can be combined in various ways that will become apparent upon understanding this disclosure. Furthermore, although the examples described herein have multiple configurations, other configurations that will become apparent upon understanding this disclosure are also possible.

[0043] Furthermore, throughout the instruction manual, the phrase "in a plan view" or "on a plane" refers to the target portion viewed from the top, and the phrase "in a cross-sectional view" or "on a cross-section" refers to the cross-section formed by vertically cutting the target portion viewed from the side.

[0044] This disclosure provides a camera module capable of preventing or minimizing substrate distortion.

[0045] However, the purpose of this disclosure is not limited to the one mentioned above, and may be extended in various ways within the spirit and scope of this disclosure.

[0046] In the following text, the optical axis OA (which is parallel to the central axis of the lens housed in the lens barrel 10) may refer to the z-axis direction in the accompanying drawings. Furthermore, the direction intersecting the optical axis OA may refer to the x-axis direction in the accompanying drawings, and the direction intersecting both the optical axis OA and the x-axis may refer to the y-axis direction in the accompanying drawings. For example, the z-axis, x-axis, and y-axis may be orthogonal to each other.

[0047] Figure 1 This is an exploded perspective view of camera module 1 according to the embodiment.

[0048] refer to Figure 1 According to the embodiments, the camera module 1 may include a lens barrel 10, a housing 20, an image sensor 30, a substrate 40, and a reinforcing member 50.

[0049] The lens barrel 10 can house at least one lens. The lens barrel 10 can have a hollow cylindrical shape, allowing at least one lens for photographing the subject to be housed within it. When multiple lenses are arranged, they can be mounted along the optical axis OA within the lens barrel 10. The multiple lenses can be arranged in the desired number according to the design of the lens barrel 10, and each lens can have the same or different optical properties such as refractive index.

[0050] The housing 20 can house the lens barrel 10. For example, the housing 20 can have an open structure at the top and bottom. The housing 20 can be used to protect the internal components of the camera module 1. In addition, the housing 20 can be used to shield electromagnetic waves so that electromagnetic waves present in the camera module 1 do not affect other electronic devices. The substrate 40 on which the image sensor 30 is mounted can be disposed on the lower side of the housing 20.

[0051] Image sensor 30 can be disposed on a first side of lens barrel 10 in the direction of optical axis OA. Image sensor 30 can convert incident light that has passed through the lens into an electrical signal. For example, image sensor 30 can be a charge-coupled device (CCD), complementary metal-oxide-semiconductor (CMOS), etc. The electrical signal converted by image sensor 30 can be output as an image through the display unit of an electronic device such as a smartphone. Image sensor 30 can be mounted on substrate 40.

[0052] Image sensor 30 can be electrically connected to substrate 40. For example, image sensor 30 can be directly connected to substrate 40 via wire bonding or the like. The two ends of the wire can be attached to the connection terminals of image sensor 30 and the connection terminals of substrate 40, respectively.

[0053] The first end of the substrate 40 may have a structure extending outward toward the housing 20 for connection to an external circuit. The substrate 40 may be a flexible printed circuit board (FPCB) or the like. For example, the substrate 40 may be one of a flexible resin substrate such as polyimide, a rigid-flex PCB (RFPCB), and a double-layer flexible printed circuit board (double-layer FPCB), but is not limited thereto.

[0054] The reinforcing member 50 can be disposed on a first side of the substrate 40. Based on the substrate 40, the reinforcing member 50 can be disposed on the opposite side to the side where the lens barrel 10 is located. Along the optical axis OA, the reinforcing member 50 can be disposed on the lower side of the substrate 40. The reinforcing member 50 can be bonded to the lower surface of the substrate 40. For example, the reinforcing member 50 can be bonded via an adhesive layer 55 (see...). Figure 4It is joined to the lower surface of the substrate 40. The reinforcing member 50 supports the substrate 40, thereby preventing the substrate 40 from deforming or being damaged due to external forces. The reinforcing member 50 may have a strength-enhancing portion. The reinforcing member 50 may be made of stainless steel or the like.

[0055] Figure 2 It is shown Figure 1 The diagram shows the reinforcing member 50.

[0056] refer to Figure 2 The reinforcing member 50 can be configured to have different thicknesses depending on the region. For example, the reinforcing member 50 may include a first region 510 and a second region 520. The first region 510 and the second region 520 may have predetermined thicknesses. The first region 510 and the second region 520 may have different thicknesses. The thickness of the second region 520 may be set to be greater than the thickness of the first region 510. Figure 2 An example is shown in which the second region 520 is located in each edge region of the reinforcing member 50, thus providing four second regions 520. However, this is merely an example, and the number of second regions 520, the location of the second regions 520, and the area of ​​the second regions 520 can vary. That is, the second regions 520 can be positioned in the main signal layer 411, which will be described later (see [link to documentation]). Figure 3 The main signal layer 411 can be disposed as a single region within the main circuit layer 410, or it can be disposed as multiple regions separated from each other. In other words, the position, area, and number of the main signal layer 411 can vary depending on the design conditions of the substrate 40. Furthermore, at least one second region 520 can be located on the reinforcing member 50, positioned below the main signal layer 411.

[0057] Figure 3 This is a diagram showing a base plate 40 with a reinforcing member 50 attached, and Figure 4 It is along Figure 3 A cross-sectional view taken from line A-A'.

[0058] refer to Figure 3 and Figure 4 The substrate 40 may include a main circuit layer 410, an upper conductive layer 420, and a lower conductive layer 430.

[0059] The substrate 40 may include a first surface 41 and a second surface 42 located in opposite directions. The first surface 41 may face the lens barrel 10. The second surface 42 may face the reinforcing member 50. Hereinafter, the first surface 41 may be referred to as the upper surface of the substrate 40, and the second surface 42 may be referred to as the lower surface of the substrate 40. Furthermore, the direction in which the first surface 41 is positioned relative to the second surface 42 may be referred to as the upper side.

[0060] The main circuit layer 410 may be located inside the substrate 40. The main circuit layer 410 may include a main signal layer 411 and a non-signal layer 412. The main signal layer 411 may form a path for transmitting signals. For example, the main signal layer 411 may provide a path along which signals transmitted from the image sensor 30 move. The main signal layer 411 may include multiple line structures. In addition, the main signal layer 411 may include at least one board structure in a certain region.

[0061] Non-signal layer 412 may be located around main signal layer 411. Non-signal layer 412 may be coplanar with main circuit layer 410. Non-signal layer 412 may be electrically grounded.

[0062] The upper conductive layer 420 may be located above the main circuit layer 410. The upper conductive layer 420 may include an upper mesh layer 421. The upper mesh layer 421 may be positioned to overlap the main signal layer 411 in the vertical direction. The upper mesh layer 421 may have a lattice structure or a porous structure of a metallic material. Furthermore, an insulating layer positioned to fill the space between the upper mesh layers 421 may be provided with a mesh structure or a porous structure, and the upper mesh layer 421 may have a dotted structure. The impedance value around the main signal layer 411 can be adjusted through the upper mesh layer 421.

[0063] The lower conductive layer 430 may be located below the main circuit layer 410. The lower conductive layer 430 may include a lower mesh layer 431. The lower mesh layer 431 may be positioned to overlap the main signal layer 411 in the vertical direction. The lower mesh layer 431 may have a lattice structure or a porous structure of a metallic material. Furthermore, an insulating layer positioned to fill the space between the lower mesh layers 431 may be provided in a mesh structure or a porous structure, and the lower mesh layer 431 may have a dotted structure. The impedance value around the main signal layer 411 can be adjusted through the lower mesh layer 431.

[0064] When the reinforcing member 50 is attached to the substrate 40, the second region 520 can overlap with the lower surface 42 of the substrate 40 in the vertical direction. That is, the entire area of ​​the second region 520 can overlap with the lower surface of the substrate 40 in the vertical direction. Furthermore, at least a portion of the first region 510 can overlap with the lower surface 42 of the substrate 40 in the vertical direction. For example, the entire area of ​​the first region 510 can overlap with the lower surface 42 of the substrate 40 in the vertical direction.

[0065] The second region 520 may be located below the region where the main signal layer 411 is located. The second region 520 may be positioned to overlap with the main signal layer 411 in the vertical direction. The second region 520 may be positioned to align with the main signal layer 411 in the vertical direction. Furthermore, the second region 520 may be positioned to overlap with the upper grid layer 421 in the vertical direction. The second region 520 may be positioned to align with the upper grid layer 421 in the vertical direction. Furthermore, the second region 520 may be positioned to overlap with the lower grid layer 431 in the vertical direction. The second region 520 may be positioned to align with the lower grid layer 431 in the vertical direction.

[0066] The thickness of the adhesive layer 55 can vary depending on the region. The thickness of the adhesive layer 55 in the region located on the second region 520 of the reinforcing member 50 can be thinner than the thickness in the region located on the first region 510 of the reinforcing member 50.

[0067] Figure 4 An example of a substrate 40 including an upper mesh layer 421 and a lower mesh layer 431 is shown, but one of the upper mesh layer 421 and the lower mesh layer 431 may be omitted.

[0068] According to an embodiment, distortion of the substrate 40 can be prevented or minimized in the camera module 1. The substrate 40 may include regions provided with a conductive material such as copper and regions provided with an insulating material. In this case, the arrangement and distribution ratio of the conductive and insulating regions in the substrate 40 can vary depending on the region. Therefore, stress may occur within the substrate 40 depending on the material distribution ratio based on the region. Furthermore, depending on the distribution of the conductive and insulating regions, the substrate 40 may exhibit varying levels of thermal expansion due to heat generated during operation. Moreover, differences in thermal expansion levels based on the region may cause distortion of the substrate 40. According to the camera module 1 based on the embodiment, the reinforcing member 50 can compensate for the distortion of the substrate 40. Specifically, the material distribution differences of the substrate 40 based on the region may primarily occur between the main signal layer 411 and other regions. For example, mesh layers 421 and 431 may be located above or below the main signal layer 411. Compared to adjacent regions coplanar with mesh layers 421 and 431, mesh layers 421 and 431 can increase the distribution density of the conductive material. Correspondingly, the reinforcing member 50 may have a thickness difference between the region located below the main signal layer 411 and the region elsewhere, thereby adjusting the force acting between the reinforcing member 50 and the substrate 40 to prevent or minimize the twisting of the substrate 40.

[0069] Figure 5 This is a view showing the reinforcing member 50a according to another embodiment. Figure 6 It shows the attachment Figure 5A view of the substrate 40a of the reinforcing member 50a, and Figure 7 It is along Figure 6 The cross-sectional view taken by line B-B'.

[0070] refer to Figures 5 to 7 The reinforcing member 50a can be configured to have different thicknesses depending on the region. For example, the reinforcing member 50a may include a first region 510a and a second region 520a. The first region 510a and the second region 520a may have predetermined thicknesses. The first region 510a and the second region 520a may have different thicknesses. The thickness of the second region 520a may be configured to be thinner than the thickness of the first region 510a. Figure 5 An example is shown in which the second region 520a is located in each edge region of the reinforcing member 50a, thus providing four second regions 520a. However, this is merely an example and is not consistent with the above. Figure 2 In the same or similar manner, the number of second regions 520a, the position of the second regions 520a, and the area of ​​the second regions 520a can vary depending on the design conditions of the substrate 40a.

[0071] The substrate 40a may include a main circuit layer 410a, an upper conductive layer 420a, and a lower conductive layer 430a.

[0072] The main circuit layer 410a may include the main signal layer 411a and the non-signal layer 412a.

[0073] The upper conductive layer 420a may include the upper mesh layer 421a.

[0074] The lower conductive layer 430a may include the lower mesh layer 431a.

[0075] Figure 7 An example is shown in which substrate 40a includes an upper mesh layer 421a and a lower mesh layer 431a, but one of the upper mesh layer 421a and the lower mesh layer 431a may be omitted. The structure of substrate 40a is the same as that referenced above. Figure 3 and Figure 4 The structures of the substrates 40 described are the same or similar, and will not be repeated here.

[0076] When the reinforcing member 50a is attached to the substrate 40a, the second region 520a can overlap with the lower surface of the substrate 40a in the vertical direction. That is, the entire area of ​​the second region 520a can overlap with the lower surface of the substrate 40a in the vertical direction. Furthermore, at least a portion of the first region 510a can overlap with the lower surface of the substrate 40a in the vertical direction. For example, the entire area of ​​the first region 510a can overlap with the lower surface of the substrate 40a in the vertical direction.

[0077] The second region 520a can be located below the region where the main signal layer 411a is located. The second region 520a can be positioned to overlap with the main signal layer 411a in the vertical direction. The second region 520a can be positioned to be aligned with the main signal layer 411a in the vertical direction. Furthermore, the second region 520a can be positioned to overlap with the upper grid layer 421a in the vertical direction. The second region 520a can be positioned to be aligned with the upper grid layer 421a in the vertical direction. Furthermore, the second region 520a can be positioned to overlap with the lower grid layer 431a in the vertical direction. The second region 520a can be positioned to be aligned with the lower grid layer 431a in the vertical direction.

[0078] The thickness of the adhesive layer 55a can vary depending on the region. The thickness of the adhesive layer 55a in the region located on the second region 520a of the reinforcing member 50a can be greater than the thickness in the region located on the first region 510a of the reinforcing member 50a.

[0079] Twisting in the substrate 40a to which the reinforcing member 50a according to this embodiment is attached can be prevented or minimized. The substrate 40a may have twisting depending on the material used in different regions. Furthermore, the substrate 40a may exhibit different twisting patterns depending on the material used in the conductive region and the material used in the insulating region. Therefore, the thickness of the reinforcing member 50a according to this embodiment in the region located below the main signal layer 411a can be thinner than its thickness in other regions.

[0080] Figure 8 This is a diagram showing a camera module 1b according to another embodiment.

[0081] refer to Figure 8 According to another embodiment, the camera module 1b may include a lens barrel 10b, a housing 20b, an image sensor 30b, a substrate 40b, and a reinforcing member 50b.

[0082] The lens barrel 10b, housing 20b, and image sensor 30b are the same as those referenced above. Figure 1 The lens barrel 10, housing 20 and image sensor 30 described are the same or similar, and will not be repeated here.

[0083] The first end of the substrate 40b may have a structure extending outward toward the housing 20b for connection to an external circuit. The substrate 40b may be a flexible printed circuit board (FPCB) or the like. For example, the substrate 40b may be one of a flexible resin substrate such as polyimide, a rigid-flex PCB (RFPCB), or a double-layer flexible printed circuit board (double-layer FPCB), but is not limited thereto.

[0084] The substrate 40b may have an opening 43b in its central region. The opening 43b may be configured to penetrate both surfaces of the substrate 40b. Therefore, spaces located on the two surfaces of the substrate 40b along the optical axis OAb can be connected to each other through the opening 43b. The opening 43b may have a shape corresponding to that of the image sensor 30b. The area of ​​the opening 43b may be greater than or equal to the area of ​​the image sensor 30b. Therefore, the image sensor 30b can be disposed within the opening 43b.

[0085] After the image sensor 30b is placed in the opening 43b of the substrate 40b, the image sensor 30b and the substrate 40b can be electrically connected, thereby maximizing space efficiency and reducing the size of the camera module 1b.

[0086] A reinforcing member 50b can be disposed on a first side of the substrate 40b. Based on the substrate 40b, the reinforcing member 50b can be disposed on the opposite side of the lens barrel 10b. Along the optical axis OAb, the reinforcing member 50b can be disposed on the lower side of the substrate 40b. The reinforcing member 50b can be bonded to the lower surface of the substrate 40b. For example, the reinforcing member 50b can be bonded to the lower surface of the substrate 40b via an adhesive layer. The reinforcing member 50b supports the substrate 40b, thereby preventing the substrate 40b from deforming or being damaged due to external forces. The reinforcing member 50b can be made of materials such as stainless steel.

[0087] The reinforcing member 50b can be configured to have different thicknesses depending on the region. For example, the reinforcing member 50b may include a first region 510b and a second region 520b. The first region 510b and the second region 520b can have different thicknesses. In this case, the second region 520b can be configured to be thicker than the first region 510b. In this case, the reinforcing member 50b can have the same thickness as the above reference. Figures 2 to 4 The reinforcing member 50 described herein has the same or similar structure, and will not be repeated here.

[0088] Furthermore, the second region 520b can be made thinner than the first region 510b. In this case, the reinforcing member 50b can have the same characteristics as the above-mentioned reference. Figures 5 to 7 The reinforcing member 50a described herein has the same or similar structure, and will not be repeated here.

[0089] When the reinforcing member 50b is attached to the substrate 40b, a portion of the first region 510b may overlap with the lower surface of the substrate 40b in the vertical direction, and the remaining portion of the first region 510b may overlap with the opening 43b in the vertical direction. Therefore, when the reinforcing member 50b is attached to the substrate 40b, the image sensor 30b disposed in the opening 43b may be located on the first region 510b of the reinforcing member 50b.

[0090] When the reinforcing member 50b is attached to the substrate 40b, the second region 520b can overlap with the lower surface of the substrate 40b in the vertical direction. That is, the entire area of ​​the second region 520b can overlap with the lower surface of the substrate 40b in the vertical direction.

[0091] The process of preventing or minimizing the twisting of the substrate 40b by reinforcing member 50b is referenced. Figures 1 to 7 The processes described are the same or similar, and will not be repeated here.

[0092] According to one or more embodiments disclosed herein, a camera module capable of preventing or minimizing substrate distortion can be provided.

[0093] While specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for limiting purposes. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.

Claims

1. Camera module, including: Lens tube; An image sensor configured to convert light incident through the lens barrel into an electrical signal; A substrate electrically connected to the image sensor and including a main circuit layer; as well as A reinforcing member is configured to support the substrate and has a strength-reinforcing portion. The main circuit layer includes a main signal layer that forms paths for transmitting signals. The reinforcing member includes a first region and a second region with different thicknesses, and The second region is configured to overlap with the main signal layer in the vertical direction.

2. The camera module according to claim 1, wherein: The substrate includes an upper conductive layer disposed on the upper side of the main circuit layer, and The upper conductive layer includes an upper mesh layer.

3. The camera module according to claim 2, wherein, The upper mesh layer is configured to overlap with the second region of the main signal layer and the reinforcing member in the vertical direction.

4. The camera module according to claim 1, wherein: The substrate includes a lower conductive layer disposed below the main circuit layer, and The lower conductive layer includes a lower mesh layer.

5. The camera module according to claim 4, wherein, The lower mesh layer is configured to overlap with the second region of the main signal layer and the reinforcing member in the vertical direction.

6. The camera module according to claim 1, wherein, The thickness of the first region is thinner than the thickness of the second region.

7. The camera module according to claim 1, wherein, The thickness of the first region is greater than the thickness of the second region.

8. The camera module according to claim 1, wherein, The main circuit layer also includes a non-signal layer disposed around the main signal layer.

9. The camera module according to claim 8, wherein, The non-signal layer is grounded.

10. Camera module, including: Lens tube; An image sensor configured to convert light incident through the lens barrel into an electrical signal; The substrate is electrically connected to the image sensor; as well as A reinforcing member is configured to support the substrate and has a strength-reinforcing portion. The reinforcing member includes a first region and a second region with different thicknesses, and The entire area of ​​the first region and the entire area of ​​the second region overlap with the substrate in the vertical direction.

11. The camera module according to claim 10, wherein: The substrate includes a main circuit layer. The main circuit layer includes a main signal layer that forms paths for transmitting signals, and The second region is configured to overlap with the main signal layer in the vertical direction.

12. The camera module according to claim 10, wherein, The thickness of the first region is thinner than the thickness of the second region.

13. The camera module according to claim 10, wherein, The thickness of the first region is greater than the thickness of the second region.

14. A camera module, including: Lens tube; An image sensor configured to convert light incident through the lens barrel into an electrical signal; A substrate electrically connected to the image sensor and having a central region with an opening formed thereon; as well as A reinforcing member is configured to support the substrate and has a strength-reinforcing portion. The reinforcing member includes a first region and a second region with different thicknesses, and Wherein, a portion of the first region overlaps with the substrate in the vertical direction, and the remaining portion of the first region overlaps with the opening in the vertical direction.

15. The camera module according to claim 14, wherein: The substrate includes a main circuit layer. The main circuit layer includes a main signal layer that forms paths for transmitting signals, and The second region is configured to overlap with the main signal layer in the vertical direction.

16. The camera module according to claim 14, wherein, The thickness of the first region is thinner than the thickness of the second region.

17. The camera module according to claim 14, wherein, The thickness of the first region is greater than the thickness of the second region.

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