A computing power distribution acceleration device

Abstract

The utility model relates to information technology field especially is a kind of computing power distribution acceleration device, it includes computing power board module, heat dissipation component, dust fall component, shock-absorbing component, outer box and bottom plate, the computing power board module fixed connection heat dissipation component, the outer box engages and connects bottom plate, the heat dissipation component is used for computing power board module heat dissipation efficiency, the dust fall component is used to prevent heat dissipation mouth block, the shock-absorbing component is used to device shock absorption noise reduction, the utility model is cooled by air to computing power board module by heat dissipation component, avoid element damage, prolong service life, dust can be attached to air inlet and air outlet with airflow at this time, to affect the heat dissipation efficiency of heat dissipation component, dust fall component can absorb dust, it is convenient to disassemble and clean, to further reduce the probability of dust block, shock-absorbing component provides buffer space for device, can prevent damage.

Description

Technical Field

[0001] This utility model relates to the field of information technology, and in particular to a computing power distribution acceleration device. Background Technology

[0002] Currently, control boards typically distribute subtask data to computing boards via a Universal Asynchronous Receiver / Transmitter (UART) within a System on Chip (SOC) chip (where one UART corresponds to one computing board). When the data length in the UART's transmit queue (e.g., a 64-byte First-In-First-Out (FIFO)) is not greater than a predetermined number of bytes, a Transmitter Holding Register Empty (THRE) interrupt is triggered to notify the software to write data into the FIFO.

[0003] Currently, Chinese utility model application number 202011443354.5 discloses a method, apparatus and digital currency mining machine for distributing subtasks to computing boards. The subtasks are distributed to multiple computing boards through a controller, thereby accelerating the information distribution speed and achieving dynamic load balancing.

[0004] However, the high load operation of the computing board will cause the chip temperature to rise. If the large amount of heat generated by the computing server during long-term use is not dissipated in time, it will damage the internal components. The heat dissipation mechanism of the computing server currently used on the market cannot effectively dissipate heat from the computing server body, and the heat dissipation efficiency is low. Utility Model Content

[0005] The technical problem to be solved by this utility model is that the chip temperature of the computing board will rise due to high load operation. If the large amount of heat generated by the computing board during long-term use is not dissipated in time, it will damage the internal components. The heat dissipation mechanism of the computing board currently used in the market cannot effectively dissipate heat from the computing board body, and the heat dissipation efficiency is low.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a computing power distribution acceleration device, which includes a computing power board module, a heat dissipation component, a dust reduction component, a shock absorption component, an outer box and a bottom plate;

[0007] The computing board module is fixedly connected to the heat dissipation component, and the heat dissipation component, dust reduction component and shock absorption component are fixedly connected to the outer box, and the outer box is snapped into the base plate;

[0008] The heat dissipation component is used to improve the heat dissipation efficiency of the computing board module;

[0009] The dust-reducing component is used to prevent the heat dissipation vents from becoming blocked;

[0010] The vibration damping components are used to reduce vibration and noise in the device.

[0011] In a preferred embodiment of the computing power distribution acceleration device of this utility model, the heat dissipation component includes a heat dissipation plate, a metal guide plate, a positive pressure fan, a negative pressure fan, an air inlet, and an air outlet. The computing power board module is fixedly connected to the metal guide plate, the metal guide plate is fixedly connected to the heat dissipation plate, the heat dissipation plate is fixedly connected to the base plate, and the metal guide plate has air inlets and air outlets respectively opened on both sides of the outer box. The air inlet is equipped with a positive pressure fan, and the air outlet is equipped with a negative pressure fan.

[0012] In a preferred embodiment of the computing power distribution acceleration device of this utility model, the dust-reducing component includes a filter screen, a cover plate, a hook, and a dust-absorbing cotton strip. The filter screen is slidably connected to the outer box, the cover plate is snapped into the outer box, the top of the cover plate is fixedly connected to the hook, and the bottom of the cover plate is fixedly connected to the dust-absorbing cotton strip.

[0013] In a preferred embodiment of the computing power distribution acceleration device of this utility model, the shock absorption component includes a telescopic rod and a spring. One end of the telescopic rod is fixedly connected to the outer box, and the other end of the telescopic rod is fixedly connected to the base plate. The telescopic rod is fitted with a spring.

[0014] As a preferred embodiment of the computing power distribution acceleration device of this utility model, the outer box is provided with heat dissipation holes and a sliding groove.

[0015] In a preferred embodiment of the computing power distribution acceleration device of this utility model, the filter screen is provided with a sliding key.

[0016] In a preferred embodiment of the computing power distribution acceleration device of this utility model, the metal guide plate is curved.

[0017] In a preferred embodiment of the computing power distribution acceleration device of this utility model, the bottom plate has through slots at all four corners.

[0018] The beneficial effects of this utility model are as follows: This utility model uses heat dissipation components to provide air cooling for the computing board module, avoiding component damage and extending service life. At this time, dust will adhere to the air inlet and outlet with the airflow, thereby affecting the heat dissipation efficiency of the heat dissipation components. The dust-absorbing components can absorb dust, making it easy to disassemble and clean, thereby reducing the probability of dust blockage. The shock-absorbing components provide a buffer space for the device, which can prevent damage. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the computing power distribution acceleration device in the embodiments of this disclosure.

[0020] Figure 2 This is a schematic diagram of the heat dissipation component structure of the computing power distribution acceleration device in this embodiment of the present disclosure.

[0021] Figure 3 This is a schematic diagram of the heat dissipation hole structure of the computing power distribution acceleration device in the embodiments of this disclosure.

[0022] Figure 4 This is a schematic diagram of the dust removal component structure of the computing power distribution acceleration device in this embodiment of the present disclosure.

[0023] Figure 5 This is a schematic diagram of the vibration damping component structure of the computing power distribution acceleration device in this embodiment of the present disclosure.

[0024] Figure 6 This is a schematic diagram of the through-slot structure of the computing power distribution acceleration device in an embodiment of this disclosure.

[0025] Reference numerals: Computing board module 1; Heat dissipation component 2; Heat dissipation plate 21; Metal guide plate 22; Positive pressure fan 23; Negative pressure fan 24; Air inlet 25; Air outlet 26; Dust collection component 3; Filter screen 31; Slide key 311; Cover plate 32; Hook 33; Dust collection strip 34; Shock absorption component 4; Telescopic rod 41; Spring 42; Outer box 5; Heat dissipation hole 51; Slide groove 52; Base plate 6; Through groove 61. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Example, refer to Figures 1-6 This embodiment provides a computing power distribution acceleration device, including a computing power board module 1, a heat dissipation component 2, a dust reduction component 3, a shock absorption component 4, an outer box 5, and a base plate 6;

[0028] The computing board module 1 is fixedly connected to the heat dissipation component 2. The heat dissipation component 2, the dust reduction component 3 and the shock absorption component 4 are fixedly connected to the outer box 5. The outer box 5 is snapped into the base plate 6.

[0029] Heat dissipation component 2 is used to improve the heat dissipation efficiency of computing board module 1;

[0030] Dust-reducing component 3 is used to prevent the heat dissipation vents from becoming blocked;

[0031] The damping component 4 is used for buffering and damping.

[0032] In this preferred embodiment, the computing board will cause the chip temperature to rise due to high load operation. The heat dissipation component 2 will cool it with air. At this time, dust will adhere to the air inlet and air outlet with the airflow, thereby affecting the heat dissipation efficiency of the heat dissipation component 2. The dust removal component 3 can absorb dust, which is convenient to disassemble for cleaning, thereby reducing the probability of dust blockage. The shock absorption component 4 provides a buffer space for the device and can prevent damage.

[0033] Reference Figures 1-3 The heat dissipation component 2 includes a heat dissipation plate 21, a metal guide plate 22, a positive pressure fan 23, a negative pressure fan 24, an air inlet 25, and an air outlet 26. The computing board module 1 is fixedly connected to the metal guide plate 22, the metal guide plate 22 is fixedly connected to the heat dissipation plate 21, the heat dissipation plate 21 is fixedly connected to the base plate 6, and the metal guide plate 22 is fixed to the outer box 5 with air inlets 25 and air outlets 26 on both sides respectively. The air inlet 25 is equipped with a positive pressure fan 23, and the air outlet 26 is equipped with a negative pressure fan 24.

[0034] In this preferred embodiment, the computing board module 1 transfers heat to the metal guide plate 22, which in turn transfers heat to the heat sink 21. The positive pressure fan 23 is activated to draw in air, which passes through the metal guide plate 22 and the heat sink 21, creating a cross breeze that carries away the heat. The metal guide plate 22 extends the time it takes for the air to pass through the gap, thus fully carrying away the heat and cooling the computing board module 1. The negative pressure fan 24 draws air out of the outer box 5, thereby promoting air circulation and carrying away the heat.

[0035] Reference Figure 1 and Figure 4 The dust collection component 3 includes a filter screen 31, a cover plate 32, a hook 33, and a dust-absorbing cotton strip 34. The filter screen 31 is slidably connected to the outer box 5, the cover plate 32 is snapped into the outer box 5, the top of the cover plate 32 is fixedly connected to the hook 33, and the bottom of the cover plate 32 is fixedly connected to the dust-absorbing cotton strip 34.

[0036] In this preferred embodiment, the filter screen 31 and the dust-absorbing cotton strip 34 can absorb a large amount of dust. After a period of use, they need to be disassembled, replaced and cleaned in time to prevent clogging and affect heat dissipation efficiency. The hook 33 is manually lifted to remove the cover plate 32. The cover plate 32 moves upward, thereby causing the filter screen 31 to slide upward, so as to remove the filter screen 31 and the dust-absorbing cotton strip 34. This makes disassembly and installation convenient, and the structure is simple and easy to operate.

[0037] Reference Figure 5 and Figure 6 The shock-absorbing component 4 includes a telescopic rod 41 and a spring 42. One end of the telescopic rod 41 is fixedly connected to the outer box 5, and the other end of the telescopic rod 41 is fixedly connected to the base plate 6. The spring 42 is sleeved on the telescopic rod 41.

[0038] In this preferred embodiment, when the device is being transported or subjected to impact, the outer box 5 presses against the telescopic rod 41, the telescopic rod 41 compresses the spring 42, and the spring 42 is elastic, providing a buffer space for the outer box 5, thereby preventing damage to the device.

[0039] Reference Figure 3 The outer box 5 has a heat dissipation hole 51 and a sliding groove 52.

[0040] In this preferred embodiment, the heat dissipation hole 51 can dissipate heat, and the slide groove 52 facilitates the insertion of the filter screen 31, thereby making disassembly convenient.

[0041] Reference Figure 4 The filter 31 is equipped with a slide key 311.

[0042] In this preferred embodiment, the filter 31 is able to slide on the groove 52.

[0043] Reference Figure 3 The metal guide plate 22 is curved.

[0044] In this preferred embodiment, the curved shape of the metal guide plate 22 can increase the range and time of air passage, thereby improving the efficiency of air cooling.

[0045] Reference Figure 6 The base plate 6 has through grooves 61 at each of its four corners.

[0046] In this preferred embodiment, the through groove 61 can provide a buffer space for the shock-absorbing component 4.

[0047] Working principle: Due to high load operation, the chip temperature of the computing board will rise. The computing board module 1 transfers heat to the metal guide plate 22, and the metal guide plate 22 transfers heat to the heat sink 21. The positive pressure fan 23 is activated to draw in air. The air passes through the metal guide plate 22 and the heat sink 21, forming a through airflow that carries away the heat. The metal guide plate 22 can prolong the time that the air spends passing through the gap, thereby fully carrying away the heat and cooling the computing board module 1. The negative pressure fan 24 draws the air out of the outer box 5, thereby promoting air circulation and carrying away the heat.

[0048] At this time, dust will adhere to the air inlet and outlet with the airflow. The filter 31 and the dust-absorbing cotton strip 34 can absorb a large amount of dust. After a period of use, they need to be disassembled, replaced and cleaned in time to prevent blockage and affect heat dissipation efficiency. Manually lift the hook 33 to take out the cover plate 32. The cover plate 32 moves upward, thereby driving the filter 31 to slide upward, so as to take out the filter 31 and the dust-absorbing cotton strip 34. It is convenient to disassemble and install, with simple structure and easy operation.

[0049] When the device is being transported or subjected to impact, the outer box 5 compresses the telescopic rod 41, which in turn compresses the spring 42. The spring 42 is elastic and provides a buffer space for the outer box 5, thereby preventing damage to the device.

[0050] This device has a simple structure and high heat dissipation efficiency, which avoids damage to the internal components caused by the large amount of heat generated by the computing board during long-term use. It also extends the service life and is not easy to clog the heat dissipation holes 51 and filter 31. The filter 31 and the dust-absorbing cotton strip 34 are easy to replace and clean, and the operation is convenient.

Claims

1. A computing power distribution acceleration device, characterized in that: It includes a computing board module (1), a heat dissipation component (2), a dust reduction component (3), a shock absorption component (4), an outer box (5), and a base plate (6); The computing board module (1) is fixedly connected to the heat dissipation component (2), the heat dissipation component (2), the dust reduction component (3) and the shock absorption component (4) are fixedly connected to the outer box (5), and the outer box (5) is snapped into the base plate (6). The heat dissipation component (2) is used to improve the heat dissipation efficiency of the computing board module (1); The dust-reducing component (3) is used to prevent the heat dissipation vent from being blocked; The shock-absorbing component (4) is used for vibration reduction and noise reduction of the device.

2. The computing power distribution acceleration device as described in claim 1, characterized in that: The heat dissipation component (2) includes a heat dissipation plate (21), a metal guide plate (22), a positive pressure fan (23), a negative pressure fan (24), an air inlet (25), and an air outlet (26). The computing board module (1) is fixedly connected to the metal guide plate (22). The metal guide plate (22) is fixedly connected to the heat dissipation plate (21). The heat dissipation plate (21) is fixedly connected to the base plate (6). The metal guide plate (22) is fixed to the outer box (5). The two sides of the outer box (5) are respectively provided with an air inlet (25) and an air outlet (26). The air inlet (25) is provided with a positive pressure fan (23), and the air outlet (26) is provided with a negative pressure fan (24).

3. The computing power distribution acceleration device as described in claim 1, characterized in that: The dust-reducing component (3) includes a filter screen (31), a cover plate (32), a hook (33), and a dust-absorbing cotton strip (34). The filter screen (31) is slidably connected to the outer box (5), the cover plate (32) is snapped into the outer box (5), the top of the cover plate (32) is fixedly connected to the hook (33), and the bottom of the cover plate (32) is fixedly connected to the dust-absorbing cotton strip (34).

4. The computing power distribution acceleration device as described in claim 1, characterized in that: The shock-absorbing component (4) includes a telescopic rod (41) and a spring (42). One end of the telescopic rod (41) is fixedly connected to the outer box (5), and the other end of the telescopic rod (41) is fixedly connected to the bottom plate (6). The telescopic rod (41) is fitted with a spring (42).

5. The computing power distribution acceleration device as described in claim 1, characterized in that: The outer box (5) has heat dissipation holes (51) and a sliding groove (52).

6. The computing power distribution acceleration device as described in claim 3, characterized in that: The filter (31) is provided with a slide key (311).

7. The computing power distribution acceleration device as described in claim 2, characterized in that: The metal guide plate (22) is curved.

8. The computing power distribution acceleration device as described in claim 1, characterized in that: The base plate (6) has through slots (61) at each of its four corners.

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