A heat sink cover mounting assembly for a conventional SMT pick-and-place machine

Abstract

The utility model provides a kind of heat dissipation cover mounting assembly for traditional SMT chip mounter, for traditional SMT chip mounter's heat dissipation cover mounting assembly, including vacuum adsorption platform, chip carrier, heat dissipation cover carrier and suction nozzle placement platform, suction nozzle placement platform makes suction nozzle with predetermined angle be placed and fetch. When using, chip is placed in the first clamping groove of chip carrier, heat dissipation cover is placed in the second clamping groove of heat dissipation cover carrier, chip carrier is adsorbed to workbench surface, heat dissipation cover carrier, suction nozzle placement platform are fixed on the workbench of SMT chip mounter;Mechanical hand picks up suction nozzle from suction nozzle placement platform, operates suction nozzle to suck heat dissipation cover and is mounted to chip substrate.The utility model provides a kind of heat dissipation cover mounting assembly compatible traditional SMT chip mounter.Using vacuum adsorption platform to fix chip carrier, solve the clamping problem of small size substrate.Suction nozzle placement platform guarantees suction nozzle angle, improves the stability and precision of suction nozzle work, ensures the accurate suction and placement of heat dissipation cover.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a heat sink mounting component for a traditional SMT pick and place machine. Background Technology

[0002] FCBGA (Flip Chip Ball Grid Array) packaging is an advanced packaging technology that mounts bare chips onto a substrate in a flip-chip configuration and uses ball-shaped solder as electrical connection points. This packaging method achieves mechanical protection and heat dissipation for the bare chips by flip-chip bonding of the bare chips to the substrate, using ball-shaped solder for electrical connection, and then attaching a heat sink to the substrate.

[0003] The typical process for mounting heat sinks on FCBGA chips involves dispensing, mounting, pressure holding, and high-temperature baking for curing. While the heat sink mounting process is of moderate difficulty, its precision directly impacts heat dissipation performance and chip lifespan, making equipment selection a crucial factor in determining mounting quality. Currently, the industry primarily relies on custom-designed automatic heat sink mounting machines, standardized chip packaging placement machines, and traditional SMT placement machines. Custom-designed automatic heat sink mounting machines and standardized chip packaging placement machines offer high mounting accuracy and stability, but their high purchase and maintenance costs result in a significant proportion of equipment costs in the overall production cost, leading to low cost-effectiveness and limited economic benefits. While traditional SMT placement machines have lower equipment costs, they present the following problems when mounting heat sinks for FCBGA packaged chips:

[0004] 1. Traditional SMT placement machines use a mechanical clamping mode for PCB boards. The small-sized substrates of FCBGA packaged chips cannot be matrix-clamped for capping. If the capping is placed directly, there will be chip vibration and displacement problems during the automatic capping process.

[0005] 2. Traditional SMT pick-and-place machines use round nozzles, and the angle of the nozzles is not fixed during use. This can easily lead to unstable placement accuracy due to issues with nozzle concentricity.

[0006] 3. Traditional SMT placement machines have poor placement accuracy and angle control accuracy.

[0007] Therefore, there is an urgent need to provide a heat sink mounting component for traditional SMT pick and place machines that is compatible with existing SMT production lines and can achieve high-precision mounting. Utility Model Content

[0008] Therefore, the technical problem to be solved by this utility model is to overcome the low cost-effectiveness and insignificant economic benefits of non-standard customized automatic cover placement machines and standardized chip packaging placement machines in the prior art, as well as the technical defects of traditional SMT placement machines such as difficult clamping, unstable placement accuracy and poor angle control accuracy. Thus, a heat sink cover placement component for traditional SMT placement machines is provided that can be compatible with existing SMT production lines and achieve high-precision cover placement.

[0009] Therefore, this utility model provides a heat sink mounting assembly for a traditional SMT pick-and-place machine, comprising:

[0010] A vacuum adsorption platform has a worktable for supporting and adsorbing workpieces.

[0011] A chip carrier is capable of being placed and magnetically fixed on the worktable; the chip carrier has a plurality of first slots for placing chips, and the plurality of first slots are arranged in a matrix.

[0012] The heat dissipation cover carrier is provided with several second slots for placing the heat dissipation cover, and the several second slots are arranged in a matrix.

[0013] A nozzle placement platform is used to support nozzles and can position the supported nozzles using an angle positioning component, so that the nozzles can be placed and picked up at a predetermined angle.

[0014] Furthermore, the vacuum adsorption platform has a negative pressure chamber inside; the work surface is provided with several negative pressure holes that communicate with the negative pressure chamber; the side wall of the vacuum adsorption platform is provided with a negative pressure interface, and the negative pressure chamber is connected to a negative pressure source through an air pipe installed on the negative pressure interface.

[0015] Furthermore, several of the negative pressure holes are arranged in a matrix on the worktable surface.

[0016] Furthermore, the vacuum adsorption platform includes:

[0017] The base has a negative pressure chamber formed inside and an opening at the top;

[0018] A cover plate is fixedly fitted to the opening, and the upper surface of the cover plate forms the work surface.

[0019] Furthermore, the opening of the base is expanded outward to form a stepped surface, and the cover plate is detachably fixedly installed on the stepped surface.

[0020] Furthermore, it also includes a positioning structure for positioning the chip carrier placed on the worktable, the positioning structure comprising:

[0021] The first baffle is formed on the top of the base along the first direction and is disposed in accordance with the edge of the worktable surface;

[0022] The second baffle is formed on the top of the base along the second direction and is disposed in contact with the edge of the workbench surface; the first direction and the second direction are perpendicular to each other.

[0023] Furthermore, the inner wall of the negative pressure interface is provided with internal threads, and it also includes:

[0024] The air pipe connector has an external thread at one end that can be screwed into the negative pressure interface, and the other end is fixedly connected to the air pipe.

[0025] Furthermore, the angle positioning component includes:

[0026] A positioning protrusion is formed on the upper surface of the nozzle placement platform;

[0027] A positioning plate is fixedly installed on the suction nozzle and has a positioning groove; when the suction nozzle is placed on the suction nozzle placement platform, the positioning groove can engage with the positioning protrusion for positioning.

[0028] Furthermore, when the chip is placed in the first card slot, a gap of 50-100μm is formed between the inner wall of the first card slot and the outer edge of the chip.

[0029] Furthermore, when the heat sink is placed in the second slot, a gap of 50-100μm is formed between the inner wall of the second slot and the outer edge of the heat sink.

[0030] The technical solution provided by this utility model has the following advantages:

[0031] This utility model discloses a heat sink mounting assembly for a traditional SMT pick-and-place machine. The assembly includes a vacuum adsorption platform, a chip carrier, a heat sink carrier, and a nozzle placement platform. The vacuum adsorption platform has a worktable for supporting and adsorbing workpieces. The chip carrier can be placed and fixed to the worktable. The chip carrier has several first slots for placing chips, arranged in a matrix. The heat sink carrier has several second slots for placing heat sinks, also arranged in a matrix. The nozzle placement platform supports nozzles and can position the supported nozzles using an angle positioning component, allowing the nozzles to be placed and removed at a predetermined angle.

[0032] This utility model discloses a heat sink mounting assembly for a traditional SMT pick-and-place machine. In use, the chip is placed in the first slot of the chip carrier, ensuring correct chip placement in each slot. The heat sink is then placed in the second slot of the heat sink carrier, ensuring correct heat sink placement in each slot. The chip carrier with the chip placed is placed on the worktable of the vacuum adsorption platform. The vacuum adsorption function of the platform is activated to adsorb and fix the chip carrier, preventing movement during the mounting process. The heat sink carrier is then fixedly mounted on the worktable of the SMT pick-and-place machine or on a dedicated clamping and positioning device. The nozzle is placed on the nozzle placement platform, where an angle positioning component ensures the nozzle is fixed at a predetermined angle, guaranteeing the accuracy of the nozzle angle. The SMT pick-and-place machine uses a downward-viewing camera to identify and position the chip substrate. The control system drives a robotic arm to pick up the nozzle from the nozzle placement platform, and the nozzle extracts the heat sink from the heat sink carrier. The heat sink is then placed above the upward-viewing camera for bottom identification and positioning, and subsequently precisely mounted onto the chip substrate on the chip carrier.

[0033] This invention relates to a heatsink mounting assembly for traditional SMT pick-and-place machines, providing a component that is both compatible with traditional SMT pick-and-place machines and enables high-precision heatsink mounting. By using a vacuum adsorption platform to fix the chip carrier and heatsink carrier, it solves the problem that small-sized FCBGA chip substrates cannot be mechanically clamped by traditional SMT pick-and-place machines, ensuring compatibility with existing SMT production lines and reducing the risk of chip vibration and displacement during the mounting process. Simultaneously, the nozzle placement platform ensures the accuracy of the nozzle angle, creating conditions for high-precision mounting, thereby significantly improving mounting quality and production efficiency. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the prior art or specific embodiments of this utility model, the accompanying drawings used in the description of the prior art or specific embodiments are briefly introduced below.

[0035] Figure 1 This is a schematic diagram of the overall structure of the heat sink mounting assembly for a traditional SMT pick and place machine.

[0036] Figure 2 This is a schematic diagram of a vacuum adsorption platform.

[0037] Figure 3 yes Figure 2 Exploded view.

[0038] Figure 4 This is a diagram showing the nozzle placed on the nozzle placement platform.

[0039] Figure 5 This is a partial view showing the chip placed on a chip carrier.

[0040] Figure 6 This is a partial view showing the heat sink placed on the heat sink carrier.

[0041] Reference numerals: 01, suction nozzle; 02, chip; 03, heat sink cover; 1, vacuum adsorption platform; 11, base; 111, negative pressure chamber; 112, negative pressure interface; 113, opening; 114, stepped surface; 115, first baffle; 116, second baffle; 12, cover plate; 121, workbench surface; 122, negative pressure hole; 13, air pipe; 14, air pipe connector; 2, chip carrier; 21, first slot; 3, heat sink cover carrier; 31, second slot; 4, suction nozzle placement platform; 40, placement hole; 41, positioning protrusion; 42, positioning plate; 421, positioning groove. Detailed Implementation

[0042] To enable those skilled in the art to better understand this solution, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0043] It should be noted that the terms "first," "second," etc., in the claims and specification of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such as a process, method, system, product, or device that includes a series of steps or units, not limited to those steps or units explicitly listed, but may also include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices.

[0044] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better description of this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation. Furthermore, some of the above terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances. In addition, the term "multiple" should mean two or more. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0045] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0046] This embodiment provides a heat sink mounting assembly for a traditional SMT pick-and-place machine, such as... Figure 1-6 As shown, the device includes a vacuum adsorption platform 1, a chip carrier 2, a heat sink carrier 3, and a nozzle placement platform 4. The vacuum adsorption platform 1 has a worktable 121 for supporting and adsorbing workpieces. The chip carrier 2 can be placed and adsorbed and fixed on the worktable 121. The chip carrier 2 has a plurality of first slots 21 for placing chips, and the plurality of first slots 21 are arranged in a matrix. The heat sink carrier 3 has a plurality of second slots 31 for placing heat sinks, and the plurality of second slots 31 are arranged in a matrix. The nozzle placement platform 4 is used to support nozzles 01 and can position the supported nozzles 01 by means of an angle positioning component, so that the nozzles 01 can be placed and picked up at a predetermined angle.

[0047] In this embodiment, the heat sink mounting assembly for a traditional SMT pick-and-place machine uses a vacuum suction platform 1 made of aluminum alloy, such as 7075 aluminum alloy. The vacuum suction platform 1 and the nozzle placement platform 4 are fixedly mounted on the worktable of the SMT pick-and-place machine or on a dedicated clamping and positioning device, such as a mechanical clamping platform of a dedicated SMT pick-and-place machine. In use, the chip 02 is placed in the first slot 21 of the chip carrier 2, ensuring that each slot contains a correctly positioned chip. The heat sink 03 is placed in the second slot 31 of the heat sink carrier 3, ensuring that each slot contains a correctly positioned heat sink. The chip carrier 2 with the chip 02 placed is placed on the worktable 121 of the vacuum suction platform 1. The vacuum suction function of the vacuum suction platform 1 is activated to suction and fix the chip carrier 2, preventing movement during the mounting process. The heat sink carrier 3 is fixedly mounted on the worktable of the SMT pick-and-place machine or on a dedicated clamping and positioning device (e.g., a dedicated mechanical clamping platform). The SMT pick and place machine uses a mechanical clamping platform; the nozzle 01 is placed on the nozzle placement platform 4, and the angle positioning component on the nozzle placement platform 4 ensures that the nozzle 01 is fixed at a predetermined angle, ensuring the accuracy of the nozzle angle; the SMT pick and place machine identifies and positions the chip substrate through a downward-looking camera, and the control system drives the robot to pick up the nozzle 01 from the nozzle placement platform 4, and operates the nozzle 01 to pick up the heat sink cover 03 from the heat sink carrier 3, and places the heat sink cover 03 above the upward-looking camera for bottom identification and positioning, and then accurately mounts the heat sink cover 03 onto the chip substrate of the chip 02 on the chip carrier 2.

[0048] This embodiment presents a heatsink mounting assembly for a traditional SMT pick-and-place machine, providing a component that is both compatible with traditional SMT pick-and-place machines and enables high-precision heatsink mounting. By using a vacuum adsorption platform to fix the chip carrier and heatsink carrier, it solves the problem that small-sized FCBGA chip substrates cannot be mechanically clamped by traditional SMT pick-and-place machines, ensuring compatibility with existing SMT production lines and reducing the risk of chip vibration and displacement during the mounting process. Simultaneously, the nozzle placement platform ensures the accuracy of the nozzle angle, creating conditions for high-precision mounting, thereby significantly improving mounting quality and production efficiency.

[0049] The heat sink mounting assembly for a conventional SMT pick-and-place machine in this embodiment further includes, for example: Figure 3 As shown, the vacuum adsorption platform 1 has a negative pressure chamber 111 inside; the work surface 121 is provided with a plurality of negative pressure holes 122 communicating with the negative pressure chamber 111; the side wall of the vacuum adsorption platform 1 is provided with a negative pressure interface 112, and the negative pressure chamber 111 is connected to a negative pressure source through an air pipe 13 installed on the negative pressure interface 112.

[0050] In this embodiment, the negative pressure source can be a vacuum pump with a flow rate greater than 100 L / min. By setting a negative pressure chamber 111 inside the vacuum adsorption platform 1 and a negative pressure hole 122 communicating with the negative pressure chamber 111 on the worktable surface 121, stable adsorption of the workpiece can be achieved, effectively preventing displacement during the placement process and improving placement accuracy and stability. The design of the air pipe 13 connecting to the negative pressure source makes the implementation of the vacuum adsorption platform and its integration with SMT equipment easier.

[0051] The heat sink mounting assembly for a traditional SMT pick-and-place machine in this embodiment, such as... Figure 1-3 As shown, further, a plurality of the negative pressure holes 122 are arranged in a matrix on the worktable surface 121.

[0052] In this embodiment, the negative pressure holes 122 are arranged in a matrix on the worktable 121, which can achieve uniform adsorption of the workpiece and avoid workpiece tilting or displacement caused by uneven adsorption, thereby further improving the mounting accuracy and stability.

[0053] The heat sink mounting assembly for a conventional SMT pick-and-place machine in this embodiment further includes, for example: Figure 1-3 As shown, the vacuum adsorption platform 1 includes a base 11 and a cover plate 12; the base 11 has a negative pressure chamber 111 formed inside, and an opening 113 is provided at the top; the cover plate 12 is fixedly closed at the opening 113, and the upper surface of the cover plate 12 forms the worktable surface 121.

[0054] In this embodiment, by designing the vacuum adsorption platform 1 as a separate structure of base 11 and cover plate 12, with a negative pressure cavity 111 formed inside the base 11 and a worktable 121 formed by the cover plate 12, it is not only easy to process and assemble, but also improves the maintainability and scalability of the vacuum adsorption platform.

[0055] The heat sink mounting assembly for a conventional SMT pick-and-place machine in this embodiment further includes, for example: Figure 3 As shown, the opening 113 of the base 11 expands outward to form a stepped surface 114, and the cover plate 12 is detachably fixedly installed on the stepped surface 114.

[0056] In this embodiment, the cover plate 12 can be fixedly installed on the stepped surface 114 using adhesive, for example, conductive adhesive can be used to bond the cover plate 12 to the stepped surface 114, and then high-temperature baking is used for curing and fixing. The stepped surface 114 is formed by extending outward from the opening 113 of the base 11, and the cover plate is detachably fixed to the stepped surface 114. This not only facilitates the installation and removal of the cover plate, but also improves the sealing performance of the vacuum adsorption platform and ensures the reliability of negative pressure adsorption.

[0057] The heat sink mounting assembly for a conventional SMT pick-and-place machine in this embodiment further includes, for example: Figure 1-3 As shown, it also includes a positioning structure for positioning the chip carrier 2 placed on the worktable 121. The positioning structure includes a first baffle 115 and a second baffle 116. The first baffle 115 is formed on the top of the base 11 along a first direction and is disposed in contact with the edge of the worktable 121. The second baffle 116 is formed on the top of the base 11 along a second direction and is disposed in contact with the edge of the worktable 121. The first direction and the second direction are perpendicular to each other.

[0058] In this embodiment, by providing a first baffle 115 and a second baffle 116 on the top of the base, the chip carrier 2 placed on the worktable 121 can be accurately positioned. The first baffle 115 and the second baffle 116 are arranged in mutually perpendicular directions, which further improves the positioning accuracy of the chip carrier 2, thereby ensuring that the chip and heat sink are accurately mounted.

[0059] The heat sink mounting assembly for a conventional SMT pick-and-place machine in this embodiment further includes, for example: Figure 1-3 As shown, the inner wall of the negative pressure interface 112 is provided with an internal thread, and it also includes an air pipe connector 14. One end of the air pipe connector 14 is provided with an external thread that can be screwed into the negative pressure interface 112, and the other end is fixedly connected to the air pipe 13.

[0060] In this embodiment, by providing an internal thread on the inner wall of the negative pressure interface 112 and connecting it with the external thread of the air pipe connector 14, a reliable connection between the negative pressure chamber 111 and the negative pressure source can be achieved. This design not only improves the sealing performance of the air circuit connection but also facilitates the installation and maintenance of the air pipe.

[0061] The heat sink mounting assembly for a conventional SMT pick-and-place machine in this embodiment further includes, for example: Figure 4 As shown, the angle positioning component includes a positioning protrusion 41 and a positioning plate 42. The positioning protrusion 41 is formed on the upper surface of the nozzle placement platform 4. The positioning plate 42 is fixedly installed on the nozzle 01 and is provided with a positioning groove 421. When the nozzle 01 is placed on the nozzle placement platform 4, the positioning groove 421 can engage with the positioning protrusion 41 for positioning.

[0062] In this embodiment, the nozzle placement platform 4 has a placement hole 40, into which the nozzle 01 can be inserted. When the nozzle 01 is inserted into the placement hole 40, the positioning groove 421 can engage with the positioning protrusion 41 for positioning. By providing the positioning protrusion 41 on the nozzle placement platform 4 and the positioning groove 421 engaging with the positioning protrusion 41 on the nozzle 01, the placement and removal angle of the nozzle 01 is limited, enabling precise positioning of the nozzle 01 and ensuring that the nozzle can be placed and removed at a predetermined angle. This design ensures that the angle of the nozzle is fixed during the mounting process, avoiding unstable capping accuracy caused by nozzle concentricity issues.

[0063] In this embodiment, the heat sink mounting assembly for a conventional SMT pick and place machine further includes a 50-100μm gap between the inner walls of the first slot 21 and the outer edge of the chip when the chip is placed in the first slot 21.

[0064] In this embodiment, a gap of 50-100μm is provided between the inner wall of the first slot 21 and the outer edge of the chip, which enables stable placement and precise positioning of the chip. This design avoids both the chip jamming problem caused by too small a gap and the chip position shift problem caused by too large a gap.

[0065] In this embodiment, the heat sink mounting assembly for a conventional SMT pick and place machine further includes a 50-100μm gap between the inner walls of the second slot 31 and the outer edge of the heat sink when the heat sink is placed in the second slot 31.

[0066] In this embodiment, a gap of 50-100μm is provided between the inner wall of the second slot 31 and the outer edge of the heat sink cover, which enables stable placement and precise positioning of the heat sink cover. This design avoids both the problem of the heat sink cover getting stuck due to an excessively small gap and the problem of the heat sink cover shifting position due to an excessively large gap.

[0067] The placement of chip 02 and heat sink 03 in the placement slot should be consistent to minimize the placement angle deviation, which is beneficial to the subsequent mounting accuracy. For example, the gap between the inner wall of the first card slot 21 and the outer edge of the chip, as well as the gap between the inner wall of the first card slot 21 and the outer edge of the chip, can be the same, such as 50μm or 100μm.

[0068] The heat sink mounting assembly for a traditional SMT pick-and-place machine in this embodiment works on the following principle:

[0069] The vacuum adsorption platform 1 and the nozzle placement platform 4 are fixedly installed on the worktable of the SMT pick and place machine or on a dedicated clamping and positioning device;

[0070] Place chip 02 in the first slot 21 of chip carrier 2, ensuring that the chip is correctly placed in each slot; place heat sink 03 in the second slot 31 of heat sink carrier 3, ensuring that the heat sink is correctly placed in each slot.

[0071] Place the chip carrier 2 with chip 02 already placed on the worktable 121 of the vacuum adsorption platform 1, so that the sidewalls of the chip carrier 2 abut against the first baffle 115 and the second baffle 116 respectively; activate the vacuum adsorption function of the vacuum adsorption platform 1 to adsorb and fix the chip carrier 2 to prevent it from moving during the placement process; fix the heat sink carrier 3 on the worktable of the SMT placement machine or on a dedicated clamping and positioning device.

[0072] The nozzle 01 is placed on the nozzle placement platform 4, and the positioning plate 42 is positioned by engaging with the positioning protrusion 41 through the positioning groove 421 to ensure the accuracy of the nozzle angle.

[0073] The SMT placement machine uses a downward-viewing camera to identify and position the chip substrate. The control system drives a robotic arm to pick up the nozzle 01 from the nozzle placement platform 4, and operates the nozzle 01 to pick up the heat sink 03 from the heat sink carrier 3. The heat sink 03 is placed above the upward-viewing camera for bottom identification and positioning, and then the heat sink 03 is precisely placed onto the chip substrate of the chip 02 on the chip carrier 2.

[0074] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this innovative technical solution.

Claims

1. A heat sink mounting assembly for a traditional SMT pick-and-place machine, characterized in that, include: The vacuum adsorption platform (1) has a worktable (121) for carrying and adsorbing workpieces. The chip carrier (2) can be placed and attached to the worktable (121); the chip carrier (2) has a plurality of first slots (21) for placing chips, and the plurality of first slots (21) are arranged in a matrix. The heat dissipation cover carrier (3) is provided with a number of second slots (31) for placing the heat dissipation cover, and the number of second slots (31) are arranged in a matrix. The nozzle placement platform (4) is used to carry the nozzle (01) and can position the carried nozzle (01) by means of an angle positioning component, so that the nozzle (01) can be placed and picked up at a predetermined angle.

2. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 1, characterized in that, The vacuum adsorption platform (1) has a negative pressure chamber (111) inside; the work surface (121) is provided with a number of negative pressure holes (122) that communicate with the negative pressure chamber (111); the side wall of the vacuum adsorption platform (1) is provided with a negative pressure interface (112), and the negative pressure chamber (111) is connected to a negative pressure source through an air pipe (13) installed on the negative pressure interface (112).

3. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 2, characterized in that, Several of the negative pressure holes (122) are arranged in a matrix on the worktable (121).

4. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 2, characterized in that, The vacuum adsorption platform (1) includes: The base (11) has the negative pressure chamber (111) formed inside and has an opening (113) at the top. A cover plate (12) is fixedly closed at the opening (113), and the upper surface of the cover plate (12) forms the worktable surface (121).

5. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 4, characterized in that, The base (11) has an opening (113) that expands outward to form a stepped surface (114), and the cover plate (12) is detachably fixed on the stepped surface (114).

6. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 5, characterized in that, It also includes a positioning structure for positioning the chip carrier (2) placed on the worktable (121), the positioning structure comprising: The first baffle (115) is formed on the top of the base (11) along the first direction and is disposed in contact with the edge of the worktable (121); The second baffle (116) is formed on the top of the base (11) along the second direction and is disposed in contact with the edge of the worktable (121); the first direction and the second direction are perpendicular to each other.

7. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 2, characterized in that, The inner wall of the negative pressure interface (112) is provided with internal threads, and further includes: The air pipe connector (14) has an external thread at one end that can be screwed into the negative pressure interface (112), and the other end is fixedly connected to the air pipe (13).

8. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 1, characterized in that, The angle positioning component includes: A positioning protrusion (41) is formed on the upper surface of the nozzle placement platform (4); The positioning plate (42) is fixedly installed on the suction nozzle (01) and has a positioning groove (421); when the suction nozzle (01) is placed on the suction nozzle placement platform (4), the positioning groove (421) can engage with the positioning protrusion (41) for positioning.

9. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 1, characterized in that, When the chip is placed in the first card slot (21), a gap of 50-100μm is formed between the inner wall of the first card slot (21) and the outer edge of the chip.

10. The heat sink mounting assembly for a conventional SMT pick-and-place machine according to claim 1, characterized in that, When the heat sink is placed in the second slot (31), a gap of 50-100μm is formed between the inner wall of the second slot (31) and the outer edge of the heat sink.

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