An electronic component taping device

Abstract

The utility model relates to electronic component patch technology field, and disclose a kind of electronic component patch device, including processing platform, the top of processing platform is fixedly installed with support side frame.The electronic component patch device, when being adsorbed and grabbed by adsorption fixing device, the clamping side plate located outside chip will push chip, so that chip moves to the just below negative pressure cavity box, simultaneously cooperate adsorption disc and carry out adsorption fixation to chip, to complete the grabbing work of chip, so that the chip after being grabbed is located in central position, improve the accuracy when subsequent patching, when being clamped to different size rectangular chip, by rotating control nut and adjusting the length that telescopic link initially extends, it can reduce the outward stretching distance when contact and grab, to improve the application range of the patch device, simultaneously by adjusting the downward length that clamping side plate extends, it can be applicable to different thickness chip clamping work, further improve the application range.

Description

Technical Field

[0001] This utility model relates to the field of electronic component surface mount technology, specifically to an electronic component surface mount device. Background Technology

[0002] Existing manual electronic component placement machines rely on hand movements to control a pick-and-place pen, moving it left and right, forward and backward, and up and down to place the electronic component onto the substrate. However, hand tremors and uneven force can easily cause the placed electronic component to shift, resulting in poor accuracy. Conventional mechanical grippers, on the other hand, simply grasp the component by suction, failing to ensure that the component is centered after being picked up. This leads to deviations during subsequent placement, affecting the placement accuracy. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] To address the shortcomings of existing technologies, this utility model provides an electronic component placement device that solves the problems of poor accuracy in manual placement and easy deviation in the grasping of general mechanical pick-up devices.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, the present invention provides the following technical solution: an electronic component mounting device, comprising a processing platform, a support side frame fixedly mounted on the top of the processing platform, a sliding groove formed on the front side wall of the support side frame, a drive motor fixedly mounted on the left side wall of the support side frame, a drive device for adjusting the mounting position provided inside the sliding groove, and an adsorption fixing device for gripping and fixing the chip provided at the bottom end of the drive device.

[0007] Preferably, the driving device includes a drive shaft, an extension frame, front and rear electric telescopic rods, a mounting base, and upper and lower electric telescopic rods. The drive shaft is rotatably mounted to the right inner wall of the slide groove via bearings. The output end of the drive motor is fixedly mounted to the left end of the drive shaft. The rear end of the extension frame is slidably engaged inside the slide groove. The drive shaft and the extension frame are connected by a threaded transmission. The front and rear electric telescopic rods are fixedly mounted to the front end of the extension frame. The mounting base is fixedly mounted to the front end of the front and rear electric telescopic rods. The upper and lower electric telescopic rods are fixedly mounted to the bottom of the mounting base.

[0008] Preferably, the adsorption and fixing device includes a negative pressure chamber, a connecting pipe, an adsorption plate, a cylindrical frame, a telescopic rod, a sliding plate groove, a clamping side plate, fixing bolts, and a return spring. The negative pressure chamber is fixedly installed at the bottom end of the upper and lower electric telescopic rods. The connecting pipe is fixedly installed at the top of the negative pressure chamber. The end of the connecting pipe away from the negative pressure chamber is connected to a negative pressure device via a flexible hose. The adsorption plate is fixedly installed at the bottom of the negative pressure chamber. The cylindrical frame is fixedly installed on the outer wall of the negative pressure chamber. The telescopic rod is movably inserted into the end of the cylindrical frame away from the negative pressure chamber. The sliding plate groove is fixedly installed at the end of the telescopic rod away from the cylindrical frame. The clamping side plate is slidably engaged with the surface of the sliding plate groove. The clamping side plate is fixedly installed to the sliding plate groove via fixing bolts. The return spring for supporting the telescopic rod outward is installed inside the cylindrical frame.

[0009] Preferably, the driving device further includes positioning balls and ball grooves. The positioning balls are embedded in the surface of the extension frame, and the ball grooves are formed on the inner sidewall of the grooves. The portion of the positioning balls extending to the outside of the extension frame is engaged in the ball groove.

[0010] Preferably, there are four tube frames in total.

[0011] Preferably, the adsorption fixing device further includes an adjusting nut, which is rotatably installed on the end of the cylinder away from the negative pressure chamber via a bearing, and the adjusting nut is sleeved on the outside of the telescopic rod, and the adjusting nut and the telescopic rod are connected by threads.

[0012] Compared with the prior art, the present invention provides an electronic component mounting device, which has the following advantages:

[0013] 1. In this electronic component placement device, when the chip is picked up by the adsorption and fixing device, the clamping side plate located on the outside of the chip pushes the chip, causing the chip to move directly below the negative pressure chamber. At the same time, the adsorption plate is used to adsorb and fix the chip, thereby completing the chip picking work. This ensures that the picked chip is in the center position, improving the accuracy of subsequent placement.

[0014] 2. When gripping rectangular chips of different sizes, this electronic component placement device can reduce the outward extension distance during contact gripping by adjusting the initial extension length of the telescopic rod by rotating the adjusting nut, thereby improving the applicability of the placement device. At the same time, by adjusting the downward extension length of the clamping side plate, it can be used to clamp chips of different thicknesses, further improving the applicability.

[0015] 3. This electronic component placement device moves by means of a motor, which improves the processing accuracy compared to manual clamping and movement for placement. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This utility model Figure 1 Enlarged view of the structure at point A in the middle;

[0018] Figure 3 This is a schematic diagram of the driving device and the adsorption fixing device of this utility model;

[0019] Figure 4 This is a partial structural cross-sectional view of the adsorption and fixation device of this utility model.

[0020] The components include: 1. Processing platform; 2. Support side frame; 3. Slide groove; 4. Drive motor; 5. Drive device; 51. Drive shaft; 52. Extension frame; 53. Positioning ball; 54. Ball slide groove; 55. Front and rear electric telescopic rods; 56. Mounting base; 57. Upper and lower electric telescopic rods; 6. Adsorption fixing device; 61. Negative pressure chamber; 62. Connecting pipe; 63. Adsorption plate; 64. Cylindrical frame; 65. Telescopic rod; 66. Adjusting nut; 67. Slide groove; 68. Clamping side plate; 69. Fixing bolt; 70. Return spring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4 This utility model provides an electronic component placement device, including a processing platform 1. A support side frame 2 is fixedly installed on the top of the processing platform 1. A slide groove 3 is opened on the front side wall of the support side frame 2. A drive motor 4 is fixedly installed on the left side wall of the support side frame 2. A drive device 5 for adjusting the placement position is provided inside the slide groove 3. An adsorption fixing device 6 for gripping and fixing the chip is provided at the bottom end of the drive device 5. The chip is gripped by the adsorption fixing device 6, and then the chip is driven by the drive device 5 to move to the designated position for placement.

[0023] Furthermore, the drive device 5 includes a drive shaft 51, an extension frame 52, front and rear electric telescopic rods 55, a mounting base 56, and a vertical electric telescopic rod 57. The drive shaft 51 is rotatably mounted to the right inner wall of the slide groove 3 via bearings. The output end of the drive motor 4 is fixedly mounted to the left end of the drive shaft 51. The rear end of the extension frame 52 is slidably engaged inside the slide groove 3. The drive shaft 51 and the extension frame 52 are connected by a threaded transmission. The front and rear electric telescopic rods 55 are fixedly mounted to the front end of the extension frame 52. The mounting base 56 is fixedly mounted to the front end of the front and rear electric telescopic rods 55. The vertical electric telescopic rod 57 is fixedly mounted to the bottom of the mounting base 56. The drive motor 4 drives the drive shaft 51 to rotate. The drive shaft 51 drives the extension frame 52 to move left and right via a threaded drive to adjust the left and right position. Then, the front and rear electric telescopic rods 55 can be controlled to extend and retract to control the front and rear position. The vertical electric telescopic rod 57 can be controlled to extend and retract to control the control chip to lift up or lower down.

[0024] Furthermore, the adsorption fixing device 6 includes a negative pressure chamber 61, a connecting pipe 62, an adsorption plate 63, a cylindrical frame 64, a telescopic rod 65, a sliding plate groove 67, a clamping side plate 68, a fixing bolt 69, and a return spring 70. The negative pressure chamber 61 is fixedly installed at the bottom end of the upper and lower electric telescopic rods 57. The connecting pipe 62 is fixedly installed at the top of the negative pressure chamber 61. The end of the connecting pipe 62 away from the negative pressure chamber 61 is connected to the negative pressure equipment via a flexible hose. The adsorption plate 63 is fixedly installed at the bottom of the negative pressure chamber 61. The cylindrical frame 64 is fixedly installed on the outer wall of the negative pressure chamber 61. The telescopic rod 65 is movably inserted into the end of the cylindrical frame 64 away from the negative pressure chamber 61. The sliding plate groove 67 is connected to the end of the telescopic rod 65 away from the cylindrical frame 64. The end is fixedly installed, and the clamping side plate 68 slides and engages with the surface of the slide groove 67. The clamping side plate 68 is fixedly installed with the slide groove 67 by fixing bolts 69. The return spring 70, which supports the telescopic rod 65 outward, is installed inside the cylinder frame 64. The negative pressure device applies negative pressure to the inside of the negative pressure chamber box 61 through the connecting pipe 62. The negative pressure drives the telescopic rod 65 to compress the return spring 70 and retract into the cylinder frame 64. The telescopic rod 65 drives the clamping side plate 68 to move inward through the slide groove 67 to clamp the outside of the chip. At the same time, it pushes the chip to move and align it directly below the negative pressure chamber box 61. Simultaneously, it is adsorbed by contacting the top of the chip through the adsorption plate 63, thereby completing the chip gripping work.

[0025] Furthermore, the drive device 5 also includes positioning balls 53 and ball grooves 54. The positioning balls 53 are embedded in the surface of the extension frame 52, and the ball grooves 54 are formed on the inner side wall of the groove 3. The part of the positioning balls 53 that extends to the outside of the extension frame 52 is inserted into the ball grooves 54. Through the cooperation of the positioning balls 53 and the ball grooves 54, the moving friction between the extension frame 52 and the support side frame 2 is reduced, and the smoothness and stability of the extension frame 52 when it moves are improved.

[0026] Furthermore, there are four cylindrical holders 64, which clamp the chip from four directions and also position and clamp the chip towards the center.

[0027] Furthermore, the adsorption fixing device 6 also includes an adjusting nut 66, which is rotatably installed on the end of the cylinder frame 64 away from the negative pressure chamber 61 via a bearing. The adjusting nut 66 is sleeved on the outside of the telescopic rod 65, and the adjusting nut 66 and the telescopic rod 65 are connected by threads. The maximum extension length of the telescopic rod 65 in the non-clamping state can be adjusted by rotating the adjusting nut 66.

[0028] During use, when clamping, the negative pressure device applies negative pressure to the inside of the negative pressure chamber 61 through the connecting pipe 62. The negative pressure drives the telescopic rod 65 to compress the return spring 70 and retract it into the cylinder 64. The telescopic rod 65, through the sliding plate groove 67, moves the clamping side plate 68 inward to clamp the outside of the chip. At the same time, it pushes the chip to move and align it directly below the negative pressure chamber 61. Simultaneously, the adsorption plate 63 contacts the top of the chip for adsorption. The chip is gripped by the combination of adsorption and clamping. Controlling the retraction of the upper and lower electric telescopic rod 57 causes the adsorption fixing device 6 and the chip to be lifted upward. Then, controlling the drive motor 4 to rotate drives the drive shaft 5. 1. The drive shaft 51 rotates, and the extension frame 52 moves left and right through the thread. The front and rear electric telescopic rods 55 are controlled to extend and retract to adjust the front and rear position of the chip. After the chip is moved to the position where it needs to be placed, the upper and lower electric telescopic rods 57 are controlled to extend. The upper and lower electric telescopic rods 57 drive the adsorption fixing device 6 to move downward to perform the placement work. Then, the negative pressure of the negative pressure device is released, the return spring 70 returns to its deformation and pushes the telescopic rod 65 to move outward. The telescopic rod 65 drives the slide groove 67 and the clamping side plate 68 to move outward to release the clamping work. At the same time, the negative pressure inside the adsorption plate 63 is no longer generated, the adsorption of the chip is released, and the placement work is completed.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electronic component surface mount device, comprising a processing platform (1), characterized in that: The processing platform (1) is fixedly installed with a support side frame (2). The front side wall of the support side frame (2) is provided with a slide groove (3). The left side wall of the support side frame (2) is fixedly installed with a drive motor (4). The slide groove (3) is provided with a drive device (5) for adjusting the chip position. The bottom end of the drive device (5) is provided with an adsorption fixing device (6) for gripping and fixing the chip.

2. The electronic component mounting device according to claim 1, characterized in that: The drive device (5) includes a drive shaft (51), an extension frame (52), front and rear electric telescopic rods (55), a mounting base (56), and upper and lower electric telescopic rods (57). The drive shaft (51) is rotatably mounted on the right inner wall of the slide groove (3) via a bearing. The output end of the drive motor (4) is fixedly mounted on the left end of the drive shaft (51). The rear end of the extension frame (52) is slidably engaged inside the slide groove (3). The drive shaft (51) and the extension frame (52) are connected by a threaded transmission. The front and rear electric telescopic rods (55) are fixedly mounted on the front end of the extension frame (52). The mounting base (56) is fixedly mounted on the front end of the front and rear electric telescopic rods (55). The upper and lower electric telescopic rods (57) are fixedly mounted on the bottom of the mounting base (56).

3. The electronic component mounting device according to claim 1, characterized in that: The adsorption fixing device (6) includes a negative pressure chamber (61), a connecting pipe (62), an adsorption plate (63), a cylinder frame (64), a telescopic rod (65), a sliding plate groove (67), a clamping side plate (68), a fixing bolt (69), and a return spring (70). The negative pressure chamber (61) is fixedly installed at the bottom end of the upper and lower electric telescopic rods (57), and the connecting pipe (62) is fixedly installed at the top of the negative pressure chamber (61). The end of the connecting pipe (62) away from the negative pressure chamber (61) is connected to the negative pressure equipment through a flexible hose. The adsorption plate (63) is connected to the negative pressure chamber (64). 1) The bottom is fixedly installed, the cylinder frame (64) is fixedly installed on the outer wall of the negative pressure chamber (61), the telescopic rod (65) is movably inserted into the end of the cylinder frame (64) away from the negative pressure chamber (61), the slide groove (67) is fixedly installed on the end of the telescopic rod (65) away from the cylinder frame (64), the clamping side plate (68) is slidably engaged with the surface of the slide groove (67), the clamping side plate (68) is fixedly installed with the slide groove (67) by fixing bolts (69), and the return spring (70) for supporting the telescopic rod (65) outward is installed inside the cylinder frame (64).

4. The electronic component mounting device according to claim 2, characterized in that: The drive device (5) further includes a positioning ball (53) and a ball groove (54). The positioning ball (53) is embedded in the surface of the extension frame (52), and the ball groove (54) is opened on the inner side wall of the groove (3). The part of the positioning ball (53) extending to the outside of the extension frame (52) is inserted into the ball groove (54).

5. The electronic component mounting device according to claim 3, characterized in that: There are four of the tube frames (64).

6. The electronic component mounting device according to claim 3, characterized in that: The adsorption fixing device (6) also includes an adjusting nut (66), which is rotatably installed on the end of the cylinder frame (64) away from the negative pressure chamber (61) via a bearing. The adjusting nut (66) is sleeved on the outside of the telescopic rod (65), and the adjusting nut (66) and the telescopic rod (65) are connected by threads.

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