Vacuum negative pressure separation mechanism for DAF chip adhesive film

Abstract

The utility model relates to chip processing technical field, and disclose a DAF chip adhesive film vacuum negative pressure separation mechanism, include: processing platform, a plurality of electric heating blocks are fixedly installed to processing platform top surface, the top surface of electric heating block is provided with the bearing base plate, and the chip main part is arranged above the bearing base plate, the separation subassembly includes a plurality of strip adsorption boxes, a plurality of strip adsorption boxes are fixedly installed on the processing platform top surface, a plurality of strip adsorption boxes top surface all are fixedly installed with rubber strip, and a plurality of strip adsorption boxes top surface all are opened with a plurality of steady adsorption holes in equal intervals. The DAF chip adhesive film vacuum negative pressure separation mechanism, the electric heating block carries out heating to the bearing base plate, weakens the adhesion of DAF adhesive film and bearing base plate, after the starting of air suction pump, the bottom surface of bearing base plate is closely combined with the top surface of rubber strip first, then the top surface of chip main part is closely combined with the bottom surface of fixed rubber pad, finally telescopic pneumatic cylinder pulls up lifting block, so that chip main part, DAF adhesive film and bearing base plate are separated.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a vacuum negative pressure separation mechanism for DAF chip adhesive film. Background Technology

[0002] During wafer dicing, it's crucial to prevent the diced chips from detaching from the carrier film; conversely, during mounting, the chips must be smoothly peeled off. If the carrier film's adhesive strength is too strong, it can damage the chips during peeling. Solid adhesives, typically in the form of tapes or die bond films (DAF), are more suitable for stacked packaging. After back-side grinding, the die bond film is adhered between the carrier film and the back of the wafer; it is also cut during wafer dicing. In chip packaging, the chips are separated from the substrate used for carrying and transporting them for subsequent packaging processes or transferred to other substrates.

[0003] CN216902874U discloses a chip adhesive film vacuum negative pressure separation mechanism, including a base plate, a carrier film plate, a synchronous belt drive mechanism, a slide groove, and a negative pressure film tearing mechanism. The negative pressure film tearing mechanism further includes a clamping plate, an air box, a suction nozzle, a film tearing plate, and a slider. A blue film adhered to an IC chip is placed on the carrier film plate and taped thereon. Since the top surface of the suction nozzle is flush with the top surface of the carrier film plate, the blue film contacts the suction nozzle. Subsequently, a negative pressure is created in the air box, and the suction nozzle draws the blue film downwards, bringing it into contact with the film tearing plate. Under the action of the scraper within the film tearing plate and the negative pressure, the blue film bulges downwards. Therefore, when the synchronous belt drive mechanism moves the negative pressure film tearing mechanism along the slide groove, the blue film directly detaches from the chip. This device has a simple structure, and by directly applying negative pressure to the blue film, it can quickly separate the blue film from the chip, avoiding chip damage, effectively improving chip packaging efficiency and yield, and at a lower cost.

[0004] Regarding the above and existing related technologies, the inventors believe that the following defects often exist: When the above device is used, the blue film bulges downward under the action of the scraper part inside the film-tearing plate and the action of negative pressure. The chip is bonded to the carrier substrate through the DAF chip adhesive film. Directly using pure mechanical separation makes the four corners of the chip easily damaged. Utility Model Content

[0005] The technical problem to be solved by this utility model is that the existing technology has the disadvantage of uneven force on the chip and easy damage to the four corners of the chip. To this end, we propose a vacuum negative pressure separation mechanism for DAF chip adhesive film.

[0006] To achieve the above objectives, this application adopts the following technical solution: a DAF chip adhesive film vacuum negative pressure separation mechanism, comprising: a processing platform, a plurality of electric heating blocks fixedly installed on the top surface of the processing platform, a carrier substrate provided on the top surface of the electric heating blocks, a chip body provided above the carrier substrate, the bottom surface of the chip body being bonded to the top surface of the carrier substrate through a DAF adhesive film, an L-shaped mounting bracket fixedly installed on the top surface of the processing platform, and a separation component provided between the processing platform and the L-shaped mounting bracket;

[0007] The separation assembly includes several strip-shaped adsorption boxes, which are fixedly installed on the top surface of the processing platform. The strip-shaped adsorption boxes are staggered with several electric heating blocks. Rubber strips are fixedly installed on the top surface of each strip-shaped adsorption box. Several stable adsorption holes are evenly spaced on the top surface of each strip-shaped adsorption box, and the stable adsorption holes penetrate the rubber strips. The top surface of the rubber strips is flush with the top surface of the electric heating blocks. A lifting assembly is installed inside the L-shaped mounting frame, and an air extraction assembly is installed on the top surface of the processing platform.

[0008] Preferably, the lifting assembly includes a lifting block, an adsorption placement cavity is formed on the bottom surface of the lifting block, an adsorption gas cavity is formed inside the lifting block, a fixed rubber pad is fixedly installed on the top surface of the adsorption placement cavity, and a plurality of connecting holes are evenly spaced on the bottom surface of the adsorption gas cavity. The plurality of connecting holes pass through the fixed rubber pad and communicate with the adsorption placement cavity, and the chip body is placed inside the adsorption placement cavity.

[0009] Preferably, the air extraction assembly includes an air extraction pump, which is fixedly installed on the inner wall of the L-shaped mounting frame. Each of the several strip adsorption boxes is provided with a gas equalization pipe. One end of the gas equalization pipe is fixedly installed on the inner wall of the strip adsorption box, and the other end of the gas equalization pipe is fixedly extended to the outside of the strip adsorption box. An air extraction branch pipe is fixedly installed on the top surface of the processing platform, and the several gas equalization pipes are all connected to the air extraction branch pipe.

[0010] Preferably, the air pump is connected to an air extraction pipe and an air delivery main pipe. The other end of the air delivery main pipe is connected to the center of the air extraction branch pipe. The air delivery main pipe is connected to an air extraction branch pipe. The other end of the air extraction branch pipe is fixedly connected to the lifting block and the adsorption chamber.

[0011] Preferably, a plurality of suction holes are evenly spaced on the gas distribution pipe, and the plurality of suction holes and a plurality of stable adsorption holes are arranged alternately. A first solenoid valve is fixedly installed on the gas supply main pipe, and the first solenoid valve is located between the gas extraction branch pipe and the gas extraction sub-pipe. A second solenoid valve is fixedly installed on the gas extraction branch pipe.

[0012] Preferably, the horizontal section of the L-shaped mounting bracket is embedded with a telescopic cylinder, and the movable end of the telescopic cylinder is fixedly installed in the center of the top surface of the lifting block.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] In this invention, the electric heating block is activated, the carrier substrate is placed on the electric heating block, the air pump is activated, and the first solenoid valve is opened. External gas enters the strip-shaped adsorption box through the stable adsorption hole. The gas in the strip-shaped adsorption box enters the gas equalization pipe along the air intake hole, enters the gas supply main pipe through the air extraction branch pipe, and is discharged from the air extraction pipe, creating a negative pressure in the strip-shaped adsorption box. Under the action of the negative pressure, the bottom surface of the carrier substrate and the top surface of the rubber strip are tightly attached. The electric heating block heats the carrier substrate, weakening the adhesion between the DAF film and the carrier substrate. The telescopic cylinder is activated, pushing the lifting block downward, so that the chip body is placed in the adsorption placement cavity, and the top surface of the chip body is attached to the bottom surface of the fixed rubber pad. The second solenoid valve is opened, and the gas in the adsorption placement cavity enters the adsorption gas chamber through the connecting hole. The gas in the adsorption gas chamber enters the gas supply main pipe through the air extraction branch pipe, creating a negative pressure inside the adsorption gas chamber. Under the action of the negative pressure, the top surface of the chip body and the bottom surface of the fixed rubber pad are tightly attached. The telescopic cylinder pulls the lifting block upward, causing the chip body, DAF film, and carrier substrate to separate. Attached Figure Description

[0015] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts:

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0018] Figure 3 This is a side view of the present invention.

[0019] Figure 4 This is a schematic diagram of the structure of the separation component of this utility model;

[0020] Figure 5 This is a schematic diagram of the air extraction component structure of this utility model;

[0021] Figure 6 This is a schematic diagram of the lifting component structure of this utility model.

[0022] Legend: 1. Processing platform; 2. Electric heating block; 3. Support substrate; 4. Chip body; 5. DAF film; 6. L-shaped mounting bracket; 7. Separation component; 71. Strip adsorption box; 72. Rubber strip; 73. Stabilizing adsorption hole; 74. Lifting component; 741. Lifting block; 742. Adsorption placement cavity; 743. Adsorption air cavity; 744. Fixing rubber pad; 745. Connecting hole; 75. Air extraction component; 751. Air extraction pump; 752. Air distribution pipe; 7521. Air extraction hole; 753. Air extraction branch pipe; 754. Air extraction pipe; 755. Main air supply pipe; 7551. First solenoid valve; 756. Air extraction branch pipe; 7561. Second solenoid valve; 8. Telescopic cylinder. Detailed Implementation

[0023] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0024] Reference Figures 1-6 As shown, this utility model provides a technical solution: a DAF chip adhesive film vacuum negative pressure separation mechanism, comprising: a processing platform 1, a plurality of electric heating blocks 2 fixedly installed on the top surface of the processing platform 1, a carrier substrate 3 provided on the top surface of the electric heating blocks 2, a chip body 4 provided above the carrier substrate 3, the bottom surface of the chip body 4 being bonded to the top surface of the carrier substrate 3 through a DAF adhesive film 5, the plurality of electric heating blocks 2 heating the carrier substrate 3 to weaken the adhesion between the DAF adhesive film 5 and the carrier substrate 3, an L-shaped mounting bracket 6 fixedly installed on the top surface of the processing platform 1, and a separation component 7 provided between the processing platform 1 and the L-shaped mounting bracket 6;

[0025] The separation component 7 includes several strip-shaped adsorption boxes 71, which are fixedly installed on the top surface of the processing platform 1. The strip-shaped adsorption boxes 71 are staggered with several electric heating blocks 2. Rubber strips 72 are fixedly installed on the top surface of each strip-shaped adsorption box 71. Several stable adsorption holes 73 are evenly spaced on the top surface of each strip-shaped adsorption box 71. The stable adsorption holes 73 penetrate the rubber strips 72. The top surface of the rubber strips 72 is flush with the top surface of the electric heating blocks 2. A lifting component 74 is installed inside the L-shaped mounting frame 6, and an air extraction component 75 is installed on the top surface of the processing platform 1.

[0026] The lifting assembly 74 includes a lifting block 741. The bottom surface of the lifting block 741 has an adsorption placement cavity 742. The lifting block 741 has an adsorption gas cavity 743. A fixing rubber pad 744 is fixedly installed on the top surface of the adsorption placement cavity 742. The bottom surface of the adsorption gas cavity 743 has several connecting holes 745 evenly spaced. The several connecting holes 745 pass through the fixing rubber pad 744 and communicate with the adsorption placement cavity 742. The chip body 4 is disposed in the adsorption placement cavity 742.

[0027] The air extraction assembly 75 includes an air extraction pump 751, which is fixedly installed on the inner wall of the L-shaped mounting bracket 6. Each of the several strip-shaped adsorption boxes 71 is provided with a gas equalization pipe 752. One end of the gas equalization pipe 752 is fixedly installed on the inner wall of the strip-shaped adsorption box 71, and the other end of the gas equalization pipe 752 is fixedly extended to the outside of the strip-shaped adsorption box 71. An air extraction branch pipe 753 is fixedly installed on the top surface of the processing platform 1, and the several gas equalization pipes 752 are all connected to the air extraction branch pipe 753.

[0028] The air pump 751 is connected to the air extraction pipe 754 and the main gas supply pipe 755. The other end of the main gas supply pipe 755 is connected to the center of the air extraction branch pipe 753. The main gas supply pipe 755 is connected to the air extraction branch pipe 756. The other end of the air extraction branch pipe 756 is fixedly connected to the lifting block 741 and the adsorption gas chamber 743.

[0029] A plurality of suction holes 7521 are evenly spaced on the gas distribution pipe 752. The plurality of suction holes 7521 and a plurality of stable adsorption holes 73 are staggered, so that the adsorption force of the stable adsorption holes 73 on each position of the support substrate 3 is approximately equal. A first solenoid valve 7551 is fixedly installed on the gas supply main pipe 755. The first solenoid valve 7551 is located between the gas extraction branch pipe 756 and the gas extraction sub-pipe 753, and controls the opening and closing of the gas extraction sub-pipe 753 and the gas supply main pipe 755. A second solenoid valve 7561 is fixedly installed on the gas extraction branch pipe 756, and controls the opening and closing of the gas extraction branch pipe 756.

[0030] The horizontal section of the L-shaped mounting bracket 6 is embedded with a telescopic cylinder 8, and the movable end of the telescopic cylinder 8 is fixedly installed in the center of the top surface of the lifting block 741.

[0031] Reference Figure 1As shown, in this embodiment: the electric heating block 2 is activated, the carrier substrate 3 is placed on the electric heating block 2, the vacuum pump 751 is activated, and the first solenoid valve 7551 is opened. External gas enters the strip-shaped adsorption box 71 through the stable adsorption hole 73. The gas in the strip-shaped adsorption box 71 enters the gas equalization pipe 752 along the suction hole 7521, enters the gas supply main pipe 755 through the suction pipe 753, and is discharged from the suction pipe 754, thus creating a negative pressure in the strip-shaped adsorption box 71. Under the action of the negative pressure, the bottom surface of the carrier substrate 3 is tightly attached to the top surface of the rubber strip 72. The electric heating block 2 heats the carrier substrate 3, weakening the adhesion between the DAF film 5 and the carrier substrate 3. The telescopic cylinder 8 is activated, pushing the lifting block 741 downwards, so that the chip body 4 is placed in the adsorption placement cavity 742, and the top surface of the chip body 4 is in contact with the bottom surface of the fixed rubber pad 744. The second solenoid valve 7561 is opened, and the gas in the adsorption placement cavity 742 enters the adsorption gas cavity 743 through the connecting hole 745. The gas in the adsorption gas cavity 743 enters the gas supply main pipe 755 through the suction branch pipe 756, so that a negative pressure is formed inside the adsorption gas cavity 743. Under the action of negative pressure, the top surface of the chip body 4 is in close contact with the bottom surface of the fixed rubber pad 744. The telescopic cylinder 8 pulls the lifting block 741 upwards, so that the chip body 4, DAF film 5 and carrier substrate 3 are separated.

[0032] Working principle: The user heats the carrier substrate 3 with the electric heating block 2, which weakens the adhesion between the DAF film 5 and the carrier substrate 3. After the air pump 751 is started, the bottom surface of the carrier substrate 3 first adheres tightly to the top surface of the rubber strip 72, then the top surface of the chip body 4 adheres tightly to the bottom surface of the fixing rubber pad 744, and finally the telescopic cylinder 8 pulls the lifting block 741 upward, so that the chip body 4, the DAF film 5 and the carrier substrate 3 are separated.

[0033] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. A vacuum negative pressure separation mechanism for DAF chip adhesive film, characterized in that, The system includes a processing platform (1): a plurality of electric heating blocks (2) are fixedly installed on the top surface of the processing platform (1), a carrier substrate (3) is provided on the top surface of the electric heating blocks (2), a chip body (4) is provided above the carrier substrate (3), the bottom surface of the chip body (4) is bonded to the top surface of the carrier substrate (3) through DAF adhesive film (5), an L-shaped mounting bracket (6) is fixedly installed on the top surface of the processing platform (1), and a separation component (7) is provided between the processing platform (1) and the L-shaped mounting bracket (6); The separation component (7) includes several strip-shaped adsorption boxes (71), which are fixedly installed on the top surface of the processing platform (1). The strip-shaped adsorption boxes (71) and several electric heating blocks (2) are arranged alternately. A rubber strip (72) is fixedly installed on the top surface of each strip-shaped adsorption box (71). Several stable adsorption holes (73) are evenly and equidistantly opened on the top surface of each strip-shaped adsorption box (71). The stable adsorption holes (73) penetrate the rubber strip (72). The top surface of the rubber strip (72) is flush with the top surface of the several electric heating blocks (2). A lifting component (74) is provided in the L-shaped mounting frame (6). An air extraction component (75) is provided on the top surface of the processing platform (1).

2. The DAF chip film vacuum negative pressure separation mechanism according to claim 1, characterized in that: The lifting assembly (74) includes a lifting block (741), the bottom surface of the lifting block (741) is provided with an adsorption placement cavity (742), the lifting block (741) is provided with an adsorption gas cavity (743), the top surface of the adsorption placement cavity (742) is fixedly installed with a fixing rubber pad (744), the bottom surface of the adsorption gas cavity (743) is provided with a plurality of connecting holes (745) evenly spaced, the plurality of connecting holes (745) penetrate the fixing rubber pad (744) and communicate with the adsorption placement cavity (742), and the chip body (4) is disposed in the adsorption placement cavity (742).

3. The DAF chip film vacuum negative pressure separation mechanism according to claim 2, characterized in that: The air extraction assembly (75) includes an air extraction pump (751), which is fixedly installed on the inner wall of the L-shaped mounting bracket (6). Each of the strip-shaped adsorption boxes (71) is provided with a gas equalization pipe (752). One end of the gas equalization pipe (752) is fixedly installed on the inner wall of the strip-shaped adsorption box (71), and the other end of the gas equalization pipe (752) is fixedly extended to the outside of the strip-shaped adsorption box (71). The top surface of the processing platform (1) is fixedly installed with an air extraction branch pipe (753), and each of the gas equalization pipes (752) is connected to the air extraction branch pipe (753).

4. The DAF chip film vacuum negative pressure separation mechanism according to claim 3, characterized in that: The air pump (751) is connected to an air extraction pipe (754) and an air supply main pipe (755). The other end of the air supply main pipe (755) is connected to the center of the air extraction branch pipe (753). The air supply main pipe (755) is connected to an air extraction branch pipe (756). The other end of the air extraction branch pipe (756) is fixedly connected to the lifting block (741) and the adsorption gas chamber (743).

5. The DAF chip film vacuum negative pressure separation mechanism according to claim 4, characterized in that: The gas distribution pipe (752) is provided with a plurality of suction holes (7521) evenly spaced at equal intervals. The plurality of suction holes (7521) and the plurality of stable adsorption holes (73) are arranged alternately. A first solenoid valve (7551) is fixedly installed on the gas supply main pipe (755). The first solenoid valve (7551) is located between the gas extraction branch pipe (756) and the gas extraction sub-pipe (753). A second solenoid valve (7561) is fixedly installed on the gas extraction branch pipe (756).

6. The DAF chip film vacuum negative pressure separation mechanism according to claim 2, characterized in that: The horizontal section of the L-shaped mounting bracket (6) is embedded with a telescopic cylinder (8), and the movable end of the telescopic cylinder (8) is fixedly installed in the center of the top surface of the lifting block (741).

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