Wafer spreading and inverse molding machine

Abstract

This utility model discloses a wafer expansion and molding machine. It includes a chassis, a wafer expansion mechanism, a film application mechanism, and a film cutting mechanism. A wafer placement station and a film application mechanism are located on the top of the chassis. The wafer expansion mechanism and the molding mechanism are located inside the chassis. The molding mechanism is mounted on the wafer expansion mechanism and positioned below the wafer placement station. The film application mechanism is located to one side of the wafer placement station. The wafer expansion mechanism includes an adsorption plate and a lifting mechanism. The lifting mechanism is located inside the chassis, and the adsorption plate and the molding mechanism are vertically and flexibly mounted on the lifting mechanism. The adsorption plate is located below the center of the wafer placement station, and the output end of the molding mechanism makes a circular motion with the center of the wafer placement station as the center. The cutting mechanism's output end is positioned between the expanded wafer and the old steel ring. The film-applying mechanism includes a film-applying platform and a film-applying winding mechanism. The film-applying winding mechanism is located on one side of the wafer placement station. The film-applying platform is closable and positioned between the film-applying winding mechanism and the wafer placement station. The structure of the film-applying platform is adapted to the wafer placement station. When closed, the film-applying platform is located above the wafer placement station. The wafer placement station and the film-applying platform form a lifting channel for the adsorption tray. The apex of the adsorption tray's lifting trajectory is higher than the film-applying platform. The top surface of the film-applying platform forms the film-applying station, which is located in front of the output end of the film-applying winding mechanism. This invention not only reduces production steps and improves production efficiency but also reduces production costs.

Description

Technical fields:

[0001] This utility model belongs to the field of semiconductor wafer manufacturing technology, and specifically relates to a wafer expansion and casting machine. Background technology:

[0002] In semiconductor wafer manufacturing, after laser cutting and dicing, the wafer needs to undergo a die expansion process. This die expansion process typically uses a die expansion ring and a die expansion ring together to expand the wafer. After expansion, the wafer, along with the die expansion ring, is transferred to the next processing step.

[0003] Because subsequent processes do not support expansion rings, the wafer must be removed from the expansion rings and replaced with a steel ring, increasing the number of steps and reducing production efficiency. This expansion process uses a large number of expansion rings, resulting in high production costs. Furthermore, when the wafer film thickness is too thick, it can lead to poor bonding between the expansion rings and the expansion rings, causing the ring to break apart. Therefore, how to eliminate the use of expansion rings in the expansion process, thereby reducing steps, improving production efficiency, and lowering production costs, is a problem that needs to be solved.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content:

[0005] The purpose of this invention is to provide a wafer expansion and casting machine, thereby overcoming the defects in the prior art.

[0006] To achieve the above objectives, this utility model provides a wafer expansion and molding machine, including a chassis, a wafer expansion mechanism, a film application mechanism, and a film cutting mechanism. The top of the chassis is equipped with a wafer placement station and a film application mechanism. The wafer expansion mechanism and the molding mechanism are located inside the chassis. The molding mechanism is mounted on the wafer expansion mechanism and positioned below the wafer placement station. The film application mechanism is located to one side of the wafer placement station. The wafer expansion mechanism includes an adsorption plate and a lifting mechanism. The lifting mechanism is located inside the chassis, and the adsorption plate and the molding mechanism are vertically and flexibly mounted on the lifting mechanism. The adsorption plate is located below the center of the wafer placement station. The output end of the molding mechanism performs a circular motion around the center of the wafer placement station, with the output end facing... The positioning between the expanded wafer and the old steel ring; the film-applying mechanism includes a film-applying platform and a film-applying winding mechanism. The film-applying winding mechanism is located on one side of the wafer placement station. The film-applying platform is closable and positioned between the film-applying winding mechanism and the wafer placement station. The structure of the film-applying platform is adapted to the wafer placement station. When closed, the film-applying platform is located above the wafer placement station. The wafer placement station and the film-applying platform form a lifting channel for the adsorption disk. The apex of the adsorption disk's lifting trajectory is higher than the film-applying platform. The top surface of the film-applying platform forms the film-applying station, which is located in front of the output end of the film-applying winding mechanism. The wafer is expanded by the expansion mechanism, and the top surface of the expanded wafer is film-applied by the film-applying mechanism. The old steel ring and the wafer are separated by the film-cutting mechanism.

[0007] Preferably, in the technical solution, the lifting mechanism includes a lifting motor, a belt drive mechanism, a ball screw, and a lifting platform. The lifting motor and the ball screw are installed inside the housing. The lifting motor and the ball screw are connected by a belt drive mechanism. The ball screw is equipped with a lifting platform, which rotates and rises with the ball screw. The lifting platform is equipped with a support column, a vacuum generator, and a film cutting mechanism. An adsorption plate is installed on the top of the support column, and the vacuum generator is connected to the adsorption plate.

[0008] Preferably, in the technical solution, the die-cutting mechanism includes a rotary motor, a rotary seat, a rotary arm, and an automatic die-cutting knife. The rotary motor is mounted on a lifting platform, the rotary seat is mounted on a support column, and the output end of the rotary motor is connected to the rotary seat via a transmission belt. A rotary arm is mounted on the rotary seat, and an automatic die-cutting knife is mounted at the end of the rotary arm. The blade of the automatic die-cutting knife faces the position between the expanded wafer and the old steel ring.

[0009] Preferably, in the technical solution, a locking groove is provided on the bottom surface of the film application platform, and a locking pin is provided on the top of the chassis. The locking groove and the locking pin are positioned correspondingly to maintain the locked state when the film application platform is closed.

[0010] Preferably, in the technical solution, the film application and winding mechanism includes a film roll, a tension roller, a guide roller, a bracket, a pneumatic guide rail, a film cutter, and a guide roller frame. The guide roller frame and the bracket are respectively installed on the top of the machine box. The film roll and the tension roller are installed on the guide roller frame, and the guide roller and the pneumatic guide rail are installed on the bracket. The film cutter is installed on the pneumatic guide rail. The film roll, the tension roller, and the guide roller form a film application feeding channel. The film application station is located in front of the film application feeding channel, and the film cutter is located at the outlet of the film application feeding channel.

[0011] Preferably, in the technical solution, a cover is provided on the support that can be opened and closed, and the cover is located above the wafer placement station, the adsorption tray, and the film application platform.

[0012] Preferably, in the technical solution, a manual film cutting device is provided on the box lid. The manual film cutting device includes a handle, a rotating shaft, a blade arm, and a manual film cutting knife. The handle is provided on the top surface of the box lid, and the rotating shaft and blade arm are provided inside the box lid. The handle is connected to the rotating shaft, and the rotating shaft is connected to the blade arm. A manual film cutting knife is provided at one end of the blade arm, and the radius of the blade arm is equal to the radius of the steel ring. The waste film on the outer circumference of the new steel ring is cut by the manual film cutting knife.

[0013] Preferably, in the technical solution, a protective cover is also provided on the top of the chassis, which wraps around the outside of the guide roller frame.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] The wafer is expanded using a die-expanding mechanism, and a film-coating mechanism applies a film to the expanded wafer and a new steel ring. Finally, a die-cutting mechanism separates the wafer from the old steel ring. Compared to conventional wafer expansion processes, this method eliminates the need for expansion rings, reducing production steps, increasing efficiency, and lowering costs. Attached image description:

[0016] Figure 1 This is a schematic diagram of the wafer expansion and casting machine of this utility model;

[0017] Figure 2 This is a top view of the wafer expansion and casting machine of this utility model;

[0018] Figure 3 for Figure 2 A sectional view along line AA. Detailed implementation method:

[0019] The specific embodiments of this utility model are described in detail below, but it should be understood that the protection scope of this utility model is not limited to the specific embodiments.

[0020] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0021] like Figure 1-3 As shown, a wafer expansion and molding machine includes a chassis 1, a wafer expansion mechanism 2, a film application mechanism 3, and a film cutting mechanism 4. The top of the chassis 1 is provided with a wafer placement station 10 and the film application mechanism 3. The wafer expansion mechanism 2 and the molding mechanism 4 are provided inside the chassis 1. The molding mechanism 4 is disposed on the wafer expansion mechanism 2. The wafer expansion mechanism 2 is disposed below the wafer placement station 10. The film application mechanism 3 is located on one side of the wafer placement station 10.

[0022] The wafer expansion mechanism 2 includes an adsorption plate 20 and a lifting mechanism. The lifting mechanism includes a lifting motor 21, a belt drive mechanism, a ball screw 22, and a lifting platform 23. The lifting motor 21 and the ball screw 22 are installed inside the housing 1. The lifting motor 21 and the ball screw 22 are connected by a belt drive mechanism. The lifting platform 23 is installed on the ball screw 22 and rises and falls with the rotation of the ball screw 22. The lifting platform 23 is equipped with a support column 24, a vacuum generator 25, and a wafer cutting mechanism 4. The adsorption plate 20 is installed on the top of the support column 24. The vacuum generator 25 is connected to the adsorption plate 20. The adsorption plate 20 is located below the center of the wafer placement station 10.

[0023] The die-cutting mechanism 4 includes a rotary motor 40, a rotary seat 41, a rotary arm 42, and an automatic die-cutting knife 43. The rotary motor 40 is mounted on the lifting platform 23, and the rotary seat 41 is mounted on the support column 24. The output end of the rotary motor 40 is connected to the rotary seat 41 via a transmission belt. The rotary seat 41 is equipped with a rotary arm 42, and the end of the rotary arm 42 is equipped with an automatic die-cutting knife 43. The blade of the automatic die-cutting knife 43 faces the position between the expanded wafer and the old steel ring. The automatic die-cutting knife 43 makes a circular motion with the center of the wafer placement station 10 as the center.

[0024] The film application mechanism 3 includes a film application platform 30 and a film application and winding mechanism. The film application and winding mechanism includes a film roll 31, a tension roller 32, a guide roller 33, a bracket 34, a pneumatic guide rail 35, a film cutter 36, and a guide roller frame 37. The guide roller frame 37 and the bracket 34 are respectively mounted on the top of the chassis 1. The film roll 31 and the tension roller 32 are mounted on the guide roller frame 37, and the guide roller 33 and the pneumatic guide rail 35 are mounted on the bracket 34. The film cutter 36 is mounted on the pneumatic guide rail 35. The film roll 31, the tension roller 32, and the guide roller 33 form a film application feeding channel, and the film cutter 36 is located at the outlet of the film application feeding channel. The film application and winding mechanism is located on one side of the wafer placement station 10, and the film application platform 30 is configurably openable via a cylinder mechanism. Between the film application and winding mechanism and the wafer placement station 10, the structure of the film application platform 30 is adapted to the wafer placement station 10. When the film application platform 30 is closed, it is located above the wafer placement station 10. The wafer placement station 10 and the film application platform 30 form a lifting channel for the adsorption tray 20. The apex of the lifting trajectory of the adsorption tray 20 is higher than the film application platform 30. The top surface of the film application platform 30 forms the film application station, which is located in front of the film application feeding channel. A locking groove 38 is provided on the bottom surface of the film application platform 30, and a locking pin 11 is provided on the top of the machine housing 1. The locking groove 38 and the locking pin 11 are positioned correspondingly to maintain the locked state when the film application platform 30 is closed. A protective cover 13 is also provided on the top of the machine housing 1, which is wrapped around the outside of the guide roller frame 37.

[0025] A cover 12 is mounted on the support 34 via a cylinder mechanism, which can be opened and closed. The cover 12 is located above the wafer placement station 10, the adsorption tray 20, and the film application platform 30. A manual film cutting device is mounted on the cover 12, which includes a handle 14, a rotating shaft 15, a cutting arm 16, and a manual film cutting knife 17. The handle 14 is mounted on the top surface of the cover 12, and the rotating shaft 15 and the cutting arm 16 are mounted inside the cover 12. The handle 14 is connected to the rotating shaft 15, and the rotating shaft 15 is connected to the cutting arm 16. A manual film cutting knife 17 is mounted at one end of the cutting arm 16, and the radius of the cutting arm 16 is equal to the radius of the steel ring. The waste film on the outer circumference of the new steel ring is cut by the manual film cutting knife 17.

[0026] In use, place the wafer with the UV film and steel ring on the wafer placement station 10, fasten and lock the film application platform 30, and the lifting mechanism lifts the adsorption plate 20. The adsorption plate 20 picks up the wafer and lifts it upward to expand the wafer. After expansion, place the new steel ring on the film application station of the film application platform 30, pull the film out from the guide roller 33 and apply it to the surface of the new steel ring and the wafer. After the film is applied, the pneumatic guide rail 35 drives the film cutting knife 36 to cut the film from the film application feeding channel outlet. The rotary motor 40 starts and drives the automatic film cutting knife 43 to rotate. The automatic film cutting knife 43 cuts the film between the old steel ring and the wafer, separating the old steel ring from the wafer, leaving the wafer on the new steel ring. Close the box cover 12, turn the handle 14, and use the manual film cutting knife 17 to remove the excess waste film, finally completing the molding. Remove the new steel ring with the film and the wafer and put them into the UV de-adhesive machine for de-adhesive removal, and then gently peel off the old UV film.

[0027] The wafer is expanded using a die-expanding mechanism, and a film-coating mechanism applies a film to the expanded wafer and a new steel ring. Finally, a die-cutting mechanism separates the wafer from the old steel ring. Compared to conventional wafer expansion processes, this method eliminates the need for expansion rings, reducing production steps, increasing efficiency, and lowering costs.

[0028] The foregoing description of specific exemplary embodiments of the present invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the present invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the present invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the present invention, as well as various different choices and variations. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A wafer expansion and casting machine, characterized in that: The system includes a chassis, a die expansion mechanism, a film application mechanism, and a film cutting mechanism. The top of the chassis houses a wafer placement station and the film application mechanism. Inside the chassis are the die expansion mechanism and the film cutting mechanism, with the cutting mechanism mounted on top of the die expansion mechanism and positioned below the wafer placement station. The film application mechanism is located to one side of the wafer placement station. The die expansion mechanism includes an adsorption plate and a lifting mechanism. The lifting mechanism is located inside the chassis, and the adsorption plate and the film cutting mechanism are vertically and flexibly mounted on it. The adsorption plate is located below the center of the wafer placement station, and the output end of the cutting mechanism makes a circular motion centered on the center of the wafer placement station. The cutting mechanism's output end is positioned between the expanded wafer and the old steel ring. The film-applying mechanism includes a film-applying platform and a film-applying winding mechanism. The film-applying winding mechanism is located on one side of the wafer placement station. The film-applying platform is closable and positioned between the film-applying winding mechanism and the wafer placement station. The structure of the film-applying platform is adapted to the wafer placement station. When closed, the film-applying platform is located above the wafer placement station. The wafer placement station and the film-applying platform form a lifting channel for the adsorption plate. The apex of the adsorption plate's lifting trajectory is higher than the film-applying platform. The top surface of the film-applying platform forms the film-applying station, which is located in front of the output end of the film-applying winding mechanism.

2. The wafer expansion and casting machine according to claim 1, characterized in that: The lifting mechanism includes a lifting motor, a belt drive mechanism, a ball screw, and a lifting platform. The lifting motor and ball screw are housed inside the machine housing. The lifting motor and ball screw are connected by a belt drive mechanism. The ball screw is equipped with a lifting platform, which rotates and rises with the ball screw. The lifting platform is equipped with a support column, a vacuum generator, and a film cutting mechanism. An adsorption plate is installed on the top of the support column, and the vacuum generator is connected to the adsorption plate.

3. The wafer expansion and casting machine according to claim 2, characterized in that: The die-cutting mechanism includes a rotary motor, a rotary seat, a rotary arm, and an automatic die-cutting knife. The rotary motor is mounted on a lifting platform, and the rotary seat is mounted on a support column. The output end of the rotary motor is connected to the rotary seat via a transmission belt. A rotary arm is mounted on the rotary seat, and an automatic die-cutting knife is mounted at the end of the rotary arm. The blade of the automatic die-cutting knife faces the position between the expanded wafer and the old steel ring.

4. The wafer expansion and casting machine according to claim 1, characterized in that: The bottom surface of the film application platform is provided with a locking groove, and the top of the chassis is provided with a locking pin. The locking groove and the locking pin are positioned correspondingly.

5. The wafer expansion and casting machine according to claim 1, characterized in that: The film application and winding mechanism includes a film roll, a tension roller, a guide roller, a bracket, a pneumatic guide rail, a film cutter, and a guide roller frame. The guide roller frame and the bracket are respectively located on the top of the machine box. The film roll and the tension roller are mounted on the guide roller frame, and the guide roller and the pneumatic guide rail are mounted on the bracket. The film cutter is mounted on the pneumatic guide rail. The film roll, the tension roller, and the guide roller form a film application feeding channel. The film application station is located in front of the film application feeding channel, and the film cutter is located at the exit of the film application feeding channel.

6. The wafer expansion and casting machine according to claim 5, characterized in that: The support is equipped with an openable cover, which is located above the wafer placement station, the adsorption tray, and the film application platform.

7. The wafer expansion and casting machine according to claim 6, characterized in that: The box lid is equipped with a manual film cutting device, which includes a handle, a rotating shaft, a blade arm, and a manual film cutting knife. The handle is located on the top surface of the box lid, and the rotating shaft and blade arm are located inside the box lid. The handle is connected to the rotating shaft, and the rotating shaft is connected to the blade arm. A manual film cutting knife is located at one end of the blade arm, and the radius of the blade arm is equal to the radius of the steel ring.

8. The wafer expansion and casting machine according to claim 5, characterized in that: A protective cover is also installed on the top of the chassis, which wraps around the outside of the guide roller frame.

Images