Chip package supply device

Abstract

The utility model relates to chip packaging technical field, concretely relates to a kind of chip packaging feed arrangement, including workbench, the top of workbench is fixedly connected with the packaging table for placing chip packaging, the side wall of the top of workbench is fixedly installed with the conveyor belt for conveying chip to the side wall of packaging table, the side wall of the top of workbench is fixedly connected with support plate close to conveyor belt, the top of support plate is provided with the feed mechanism for the feed of packaging table, the side wall of the top of workbench is fixedly connected with support frame close to packaging table, the side wall of support frame is provided with the feeding mechanism for the chip conveyed in the top of conveyor belt is automatically placed to the top of packaging table. Compared with prior art, the present application effectively reduces the labor intensity and fatigue degree of operator, also improves the continuity and accuracy of chip packaging operation, significantly improves the overall packaging efficiency, meets the demand of modern chip packaging production to automation and high efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a chip packaging feeding device. Background Technology

[0002] With the rapid development of the electronics and information industry, chips are increasingly used in various electronic products, placing higher demands on the automation, precision, and efficiency of chip packaging processes. On chip packaging production lines, the feeding device, as a key auxiliary equipment, is mainly used to stably and orderly transport chips from the storage unit to the packaging station via conveyor belt, in order to meet the process requirements of subsequent mounting, soldering, or testing.

[0003] On existing chip packaging production lines, although some equipment is equipped with feeding devices to output chips from storage units in an orderly manner, the process of transporting chips to the packaging unit still requires manual labor to pick up the chips from the conveyor belt and place them at the designated station. This method not only increases the labor intensity of operators, but also easily causes fatigue due to long-term repetitive work, affecting work efficiency and operational accuracy, and reducing packaging efficiency. It is no longer able to meet the requirements of modern chip packaging for automation and high efficiency. Utility Model Content

[0004] In view of this, the purpose of this utility model is to propose a chip packaging material feeding device to solve the problem that the need to manually pick up materials from the conveyor belt and place them at the designated work station not only increases the labor intensity of operators, but also easily causes fatigue due to long-term repetitive work, affecting work efficiency and operational accuracy, and reducing packaging efficiency.

[0005] To achieve the above objectives, this utility model provides a chip packaging feeding device, including a worktable. A packaging platform for placing chips during packaging is fixedly connected to the top of the worktable. A conveyor belt for conveying chips to the packaging platform sidewall is fixedly installed on the top of the worktable near the packaging platform sidewall. A support plate is fixedly connected to the top of the worktable near the conveyor belt sidewall. A feeding mechanism for feeding the packaging platform is provided on the top of the support plate. A support frame is fixedly connected to the top of the worktable near the packaging platform sidewall. A loading mechanism for automatically placing chips conveyed from the top of the conveyor belt onto the top of the packaging platform is provided on the sidewall of the support frame.

[0006] Preferably, the feeding mechanism includes placement plates fixedly connected to both sides of the top of the support plate. The placement plates are arranged opposite to each other. Each of the two placement plates has a discharge port at its bottom. A movable plate is slidably connected inside the discharge port. A feeding groove is formed on the top of the movable plate. The feeding groove is U-shaped. Pushing plates are rotatably connected to the side walls of the two placement plates near the discharge ports. An electric telescopic rod is fixedly connected to the top of the support plate. The output end of the electric telescopic rod is fixedly connected to the side wall of the movable plate.

[0007] Preferably, the feeding mechanism includes a telescopic cylinder fixedly connected to the side wall of the support frame. The output end of the telescopic cylinder passes through the side wall of the support frame and is fixedly connected to a rack. A gear meshes with the outer wall of the rack. The gear is rotatably connected to the side wall of the support frame. The shaft of the gear passes through the side wall of the support frame and is fixedly connected to a rotating rod. One end of the rotating rod is rotatably connected to a feeding plate. A sliding groove is provided on the side wall of the support frame. A slider is slidably connected inside the sliding groove. A guide groove is provided on the side wall of the slider. The outer wall of the feeding plate is slidably connected inside the guide groove. The feeding plate is L-shaped. An adsorption plate is fixedly connected to the bottom end of the feeding plate. The adsorption plate moves in an arc shape during operation. Vacuum suction cups are fixedly connected to the four bottom corners of the adsorption plate.

[0008] Preferably, the side wall of the placement plate is provided with a feeding channel, and the inside of the feeding channel is slidably connected with a pull plate for placing the chip into the two placement plates.

[0009] Preferably, the sidewall of the pull plate is inlaid with transparent glass for observing the remaining amount of chip between the two placement plates.

[0010] Preferably, when the feeding slot at the top of the moving plate is on the same vertical line as the two placement plates, the chips inside the two placement plates will slide into the feeding slot due to gravity.

[0011] Preferably, when the electric telescopic rod pushes the movable plate out into the discharge port between the two placement plates, the pusher plates set on the side walls of the bottom of the two placement plates near the discharge port will enter the inner wall of the feeding trough near the electric telescopic rod.

[0012] Preferably, the bottom of the inner wall of the feeding trough is higher than the top of the conveyor belt, and when the moving plate slides, the side wall of the moving plate will move to the top of one end of the conveyor belt.

[0013] The beneficial effects of this utility model are:

[0014] This chip packaging feeding device, through a telescopic cylinder, rack, gear, rotating rod, feeding plate, guide groove, slider, adsorption plate, and vacuum suction cup in the feeding mechanism, constructs a compact and reliable automatic feeding structure. After the chip is conveyed to the side wall of the packaging stage by the conveyor belt, no manual intervention is required. The telescopic cylinder drives the rack to move, which drives the gear to rotate and drives the rotating rod to rotate. This allows the feeding plate to move precisely guided by the guide groove and slider, and drives the adsorption plate and vacuum suction cup to complete the adsorption and transfer of the chip. This structure can realize the fully automatic transfer process of the chip from the conveyor belt to the packaging stage, avoiding the repetitive labor of manually picking up and placing chips in the traditional method. It not only effectively reduces the labor intensity and fatigue of operators, but also improves the continuity and accuracy of chip packaging operations, significantly improves the overall packaging efficiency, and meets the needs of modern chip packaging production for automation and high efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only for this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0017] Figure 2 This is a three-dimensional structural diagram of the feeding mechanism and the loading mechanism of this utility model;

[0018] Figure 3 This is a three-dimensional structural diagram of the discharge port and feeding trough of this utility model;

[0019] Figure 4 This utility model Figure 3 Enlarged 3D structural diagram at point A;

[0020] Figure 5 This is a schematic diagram of the feeding plate and its three-dimensional structure.

[0021] The diagram is marked as follows:

[0022] 1. Workbench; 2. Packaging table; 3. Conveyor belt; 4. Support plate; 5. Placement plate; 6. Discharge port; 7. Moving plate; 8. Feeding trough; 9. Pushing plate; 10. Electric telescopic rod; 11. Support frame; 12. Telescopic cylinder; 13. Rack; 14. Gear; 15. Rotating rod; 16. Loading plate; 17. Slide chute; 18. Sliding block; 19. Guide chute; 20. Adsorption plate; 21. Vacuum suction cup; 22. Discharge channel; 23. Pulling plate; 24. Transparent glass. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments.

[0024] It should be noted that, unless otherwise defined, the technical or scientific terms used in this utility model should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "first," "second," and similar terms used in this utility model do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0025] like Figures 1 to 5 As shown, a chip packaging feeding device includes a worktable 1, a packaging platform 2 for placing chips during packaging is fixedly connected to the top of the worktable 1, a conveyor belt 3 for conveying chips to the side wall of the packaging platform 2 is fixedly installed on the top of the worktable 1 near the side wall of the packaging platform 2, a support plate 4 is fixedly connected to the top of the worktable 1 near the side wall of the conveyor belt 3, a feeding mechanism for feeding the packaging platform 2 is provided on the top of the support plate 4, and a support frame 11 is fixedly connected to the top of the worktable 1 near the side wall of the packaging platform 2, and a loading mechanism for automatically placing the chips conveyed on the top of the conveyor belt 3 onto the top of the packaging platform 2 is provided on the side wall of the support frame 11.

[0026] Further, see attached document. Figures 2 to 3As shown, the feeding mechanism includes placement plates 5 fixedly connected to the top two sides of the support plate 4. The placement plates 5 are arranged opposite each other. Each of the two placement plates 5 has a discharge port 6 at its bottom. A movable plate 7 is slidably connected inside the discharge port 6. A feeding groove 8 is opened at the top of the movable plate 7. The feeding groove 8 is U-shaped. When the feeding groove 8 opened at the top of the movable plate 7 is on the same vertical line as the two placement plates 5, the chips inside the two placement plates 5 will slide into the feeding groove 8 due to gravity. Pushing plates 9 are rotatably connected to the side walls of the two placement plates 5 near the discharge port 6. An electric telescopic rod 10 is fixedly connected to the top of the support plate 4. The output end of the electric telescopic rod 10 is fixedly connected to the side wall of the movable plate 7. When the feeding groove 8 opened at the top of the movable plate 7 is on the same vertical line as the two placement plates 5, the chips inside the two placement plates 5 will slide into the feeding groove 8 due to gravity. The bottom height of the inner wall of the feeding groove 8 is higher than the top of the conveyor belt 3. When the movable plate 7 slides, the side wall of the movable plate 7 will move to the top of one end of the conveyor belt 3.

[0027] When the feeding mechanism is started, the conveyor belt 3 and the electric telescopic rod 10 are driven to start running. At this time, the chips located inside the two placement plates 5 slide down into the feeding trough 8 under the action of gravity. The electric telescopic rod 10 pushes the moving plate 7 to move horizontally, so that one end of the moving plate 7 slides out from the inside of the discharge port 6 and approaches the side wall of the conveyor belt 3. During the sliding process of the moving plate 7, it will push up the pusher plate 9 set on the side wall of the two placement plates 5. As the pusher plate 9 is pushed up, the chips inside the feeding trough 8 are gradually pushed out into the discharge port 6. When the chip completely leaves the feeding trough 8 and enters the area of ​​the discharge port 6, since the feeding trough 8 has a concave structure, the pusher plate 9 loses the support of the top of the feeding trough 8, rotates under the action of gravity and falls into the side of the feeding trough 8 near the electric telescopic rod 10. Then, the electric telescopic rod 10 retracts, the pusher plate 9 touches the side wall of the chip and pushes the chip to the top of the conveyor belt 3, thus completing the automatic chip feeding process.

[0028] Further, see attached document. Figure 5 As shown, the feeding mechanism includes a telescopic cylinder 12 fixedly connected to the side wall of the support frame 11. The output end of the telescopic cylinder 12 passes through the side wall of the support frame 11 and is fixedly connected to a rack 13. A gear 14 meshes with the outer wall of the rack 13. The gear 14 is rotatably connected to the side wall of the support frame 11. The shaft of the gear 14 passes through the side wall of the support frame 11 and is fixedly connected to a rotating rod 15. One end of the rotating rod 15 is rotatably connected to a feeding plate 16. A sliding groove 17 is provided on the side wall of the support frame 11. A slider 18 is slidably connected inside the sliding groove 17. A guide groove 19 is provided on the side wall of the slider 18. The outer wall of the feeding plate 16 is slidably connected inside the guide groove 19. The feeding plate 16 is L-shaped. An adsorption plate 20 is fixedly connected to the bottom end of the feeding plate 16. The adsorption plate 20 moves in an arc shape during operation. Vacuum suction cups 21 are fixedly connected to the four corners of the bottom of the adsorption plate 20.

[0029] After the conveyor belt 3 transports the chip to the side wall of the packaging stage 2, the telescopic cylinder 12 is activated. The output end of the telescopic cylinder 12 extends, driving the rack 13 connected to it to move in a predetermined direction. The movement of the rack 13 drives the gear 14 meshing with it to rotate. The gear 14 then drives the rotating rod 15 to rotate. When the rotating rod 15 rotates to one side of the conveyor belt 3, it drives the loading plate 16 to move accordingly. Since the loading plate 16 is slidably fitted in the guide groove 19, it only has the ability to slide in the vertical direction. At the same time, it is limited by the slider 18 to ensure that it only moves in the horizontal direction, thereby achieving precise guidance. While the loading plate 16 moves, it also drives the adsorption plate 20 to move to the side wall of the packaging stage 2. Above the conveyor belt 3, the suction plate 20 is equipped with a vacuum suction cup 21. The vacuum suction cup 21 is connected to an external suction pump through a connecting pipe. After the suction pump is started, the vacuum suction cup 21 generates negative pressure and adsorbs the chip. Then, the output end of the telescopic cylinder 12 retracts, driving the rack 13 to move in the opposite direction. The gear 14 rotates in the opposite direction and drives the rotating rod 15 to rotate, thereby driving the loading plate 16 and the suction plate 20 adsorbing the chip to move together to the top of the packaging platform 2. When the suction plate 20 moves to the top of the packaging platform 2, the external suction pump stops working, the vacuum suction cup 21 releases the chip, and the chip is accurately placed on the packaging platform 2, completing the loading operation. Then, the staff performs the packaging process.

[0030] A compact and reliable automatic feeding structure is constructed using a telescopic cylinder 12, rack 13, gear 14, rotating rod 15, feeding plate 16, guide groove 19, slider 18, adsorption plate 20, and vacuum suction cup 21 in the feeding mechanism. Once the chip is conveyed to the side wall of the packaging stage 2 by the conveyor belt 3, no manual intervention is required. The telescopic cylinder 12 drives the rack 13 to move, which in turn drives the gear 14 to rotate and the rotating rod 15 to rotate. This allows the feeding plate 16 to move precisely guided by the guide groove 19 and slider 18, and the adsorption plate 20 and vacuum suction cup 21 work together to adsorb and transfer the chip. This structure enables a fully automated chip transfer process from the conveyor belt 3 to the packaging stage 2, avoiding the repetitive manual chip handling required in traditional methods. It effectively reduces the labor intensity and fatigue of operators, improves the continuity and accuracy of chip packaging operations, significantly increases overall packaging efficiency, and meets the demands of modern chip packaging production for automation and high efficiency.

[0031] Further, see attached document. Figure 2 As shown, the side wall of the placement plate 5 is provided with a feeding channel 22. The inside of the feeding channel 22 is slidably connected with a pull plate 23 for placing chips into the two placement plates 5. By pulling open the pull plate 23, the stacked chips can be placed between the two placement plates 5 for easy feeding.

[0032] Further, see attached document. Figure 3As shown, the sidewall of the pull plate 23 is inlaid with transparent glass 24 for observing the remaining amount of chips between the two placement plates 5, which facilitates timely filling of chips and increases the continuity of the packaging.

[0033] Further, see attached document. Figure 3 As shown, when the electric telescopic rod 10 pushes the moving plate 7 out into the outlet 6 between the two placement plates 5, the pusher plate 9 set on the side wall of the bottom of the two placement plates 5 near the outlet 6 will enter the side of the feeding groove 8 near the electric telescopic rod 10. When the moving plate 7 drives the feeding groove 8 to move into the outlet 6, the pusher plate 9 will enter the rear side of the chip, which is convenient for pushing the chip.

[0034] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; within the framework of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.

[0035] This utility model is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A chip packaging feeding device, comprising a worktable (1), characterized in that: The top of the workbench (1) is fixedly connected to a packaging platform (2) for placing chips during packaging. The top of the workbench (1) near the side wall of the packaging platform (2) is fixedly installed with a conveyor belt (3) for conveying chips to the side wall of the packaging platform (2). The top of the workbench (1) near the side wall of the conveyor belt (3) is fixedly connected to a support plate (4). The top of the support plate (4) is provided with a feeding mechanism for feeding materials to the packaging platform (2). The top of the workbench (1) near the side wall of the packaging platform (2) is fixedly connected to a support frame (11). The side wall of the support frame (11) is provided with a feeding mechanism for automatically placing the chips conveyed by the top of the conveyor belt (3) onto the top of the packaging platform (2).

2. The chip packaging feeding device according to claim 1, characterized in that, The feeding mechanism includes placement plates (5) fixedly connected to the top two sides of the support plate (4). The placement plates (5) are arranged opposite to each other. The bottom of each of the two placement plates (5) is provided with a discharge port (6). A moving plate (7) is slidably connected inside the discharge port (6). A feeding groove (8) is provided on the top of the moving plate (7). The feeding groove (8) is U-shaped. Pushing plates (9) are rotatably connected to the side walls of the two placement plates (5) near the discharge port (6). An electric telescopic rod (10) is fixedly connected to the top of the support plate (4). The output end of the electric telescopic rod (10) is fixedly connected to the side wall of the moving plate (7).

3. The chip packaging feeding device according to claim 1, characterized in that, The feeding mechanism includes a telescopic cylinder (12) fixedly connected to the side wall of the support frame (11). The output end of the telescopic cylinder (12) passes through the side wall of the support frame (11) and is fixedly connected to a rack (13). A gear (14) meshes with the outer wall of the rack (13). The gear (14) is rotatably connected to the side wall of the support frame (11). The shaft of the gear (14) passes through the side wall of the support frame (11) and is fixedly connected to a rotating rod (15). One end of the rotating rod (15) is rotatably connected to a feeding plate (16). The support frame... (11) has a sliding groove (17) on its side wall. A slider (18) is slidably connected inside the sliding groove (17). A guide groove (19) is provided on the side wall of the slider (18). The outer wall of the feeding plate (16) is slidably connected inside the guide groove (19). The feeding plate (16) is L-shaped. An adsorption plate (20) is fixedly connected to the bottom end of the feeding plate (16). The adsorption plate (20) moves in an arc shape during operation. Vacuum suction cups (21) are fixedly connected to the four bottom corners of the adsorption plate (20).

4. The chip packaging feeding device according to claim 2, characterized in that, The side wall of the placement plate (5) is provided with a feeding channel (22), and the inside of the feeding channel (22) is slidably connected with a pull plate (23) for putting the chip into the two placement plates (5).

5. A chip packaging feeding device according to claim 4, characterized in that, The sidewall of the pull plate (23) is inlaid with transparent glass (24) for observing the remaining amount of chips between the two placement plates (5).

6. A chip packaging feeding device according to claim 2, characterized in that, When the feed trough (8) opened on the top of the movable plate (7) is on the same vertical line as the two placement plates (5), the chips inside the two placement plates (5) will slide into the feed trough (8) due to gravity.

7. A chip packaging feeding device according to claim 2, characterized in that, When the electric telescopic rod (10) pushes the moving plate (7) out into the discharge port (6) between the two placement plates (5), the pusher plate (9) set on the side wall of the bottom of the two placement plates (5) near the discharge port (6) will enter the inner wall of the feeding groove (8) near the electric telescopic rod (10).

8. A chip packaging feeding device according to claim 2, characterized in that, When the bottom of the inner wall of the feeding trough (8) is higher than the top of the conveyor belt (3) and the moving plate (7) slides, the side wall of the moving plate (7) will move to the top of one end of the conveyor belt (3).

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