Swing arm assembly and die bonder
By designing an adjustable swing arm assembly and a fracture weak point, the precision problem of the swing arm assembly during processing and debugging was solved, reducing maintenance costs and downtime, and improving the operating accuracy and efficiency of the die bonding equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN WANFUDA INTELLIGENT EQUIP CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-29
AI Technical Summary
Existing swing arm assemblies are difficult to achieve high precision requirements during processing and debugging, resulting in decreased die bonding position accuracy and high replacement costs after damage, which affects the continuous and efficient operation of semiconductor packaging production lines.
Design a swing arm assembly including a main spindle seat, a first swing arm section and a second swing arm section. The second swing arm section is provided with a fracture weak point, which allows for positional adjustment in space and fractures under abnormal external forces to protect the equipment and reduce maintenance costs.
It improves the precision and versatility of the swing arm assembly, reduces trajectory deviation caused by processing errors, lowers maintenance costs and downtime, and enhances the operational safety and efficiency of the die bonding equipment.
Smart Images

Figure CN224306286U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of die bonding equipment technology, and in particular to a swing arm assembly and die bonding equipment. Background Technology
[0002] Die bonding, also known as die bonding, involves using an adhesive to bond a wafer to a designated area on a support, creating a thermal or electrical path to facilitate subsequent wire bonding. It is mainly used in lead frame plates of various gold wire ultrasonic welding equipment, as well as various nozzles, ejector pins, dispensing heads, ceramic nozzles, through-hole needles, motors, carbon brushes, encoders, drive belts, and various spare parts, instruments, etc. of various chip mounting equipment and automated robotic arms.
[0003] In the die bonding process of Bangtou, to ensure consistency and efficiency, each swing arm nozzle must strictly follow a circular trajectory with uniform angles and the same radius. This process requirement sets extremely high standards for the manufacturing of swing arm assemblies, demanding not only micron-level dimensional accuracy of the swing arms but also minimizing the coaxiality and parallelism errors between components. Existing swing arm assemblies mostly employ traditional machining and assembly methods. Due to limitations in equipment precision, assembly processes, and human factors, it is difficult to consistently meet these high precision requirements. Even small machining errors accumulate during operation, leading to nozzle trajectory deviations and affecting die bonding position accuracy, resulting in decreased yield. Furthermore, the debugging process of swing arm assemblies also faces significant challenges. Lacking precise debugging and testing methods, debugging often relies on repeated trial and error adjustments based on the experience of technicians. This is not only time-consuming and labor-intensive but also prone to mechanical damage to the swing arm components due to improper operation or parameter setting deviations, such as shaft wear and transmission component deformation. Once the swing arm is damaged, due to its precise structure and mostly customized design, replacement not only requires a lot of time to wait for parts to be supplied, but also incurs high procurement costs, which greatly increases the maintenance costs and downtime of the equipment, and seriously restricts the continuous and efficient operation of the semiconductor packaging production line. Utility Model Content
[0004] The purpose of this utility model is to provide a swing arm assembly and a die bonding device, which aims to solve the problem of swing arm assembly accuracy and the high cost of replacing damaged swing arms in the above-mentioned technical problems.
[0005] The technical problem solved by this utility model is addressed by the following technical solution: a swing arm assembly, comprising:
[0006] A die bonding head spindle seat is used to connect to the power mechanism of the die bonding equipment, wherein the power mechanism drives the die bonding head spindle seat to rotate and the rotation axis is vertical.
[0007] The first swing arm section is suspended and mounted on the main shaft seat of the boom head;
[0008] The second swing arm section is installed at the cantilever end of the first swing arm section, and a suction nozzle is provided on the second swing arm section;
[0009] The first and second swing arm sections are assembled to be positionally adjustable within space;
[0010] A fracture weak part is provided on the second swing arm section. The fracture weak part is arranged along the circumferential direction of the second swing arm section. The fracture weak part is assembled so that it will fracture when subjected to external force.
[0011] This utility model also has the following technical features:
[0012] In one embodiment of the present invention, the first swing arm segment extends along the radial direction of the main shaft seat of the shank, and the first swing arm segment and the main shaft seat of the shank constitute a position adjustment along a first direction, which is a direction parallel to the rotation surface of the main shaft seat of the shank.
[0013] In one embodiment of the present invention, the second swing arm segment and the overhanging end of the first swing arm segment are configured to be position-adjustable along a second direction, which is the radial direction along the main shaft seat of the head.
[0014] In one embodiment of this utility model, the first swing arm segment is distributed in multiple groups at intervals along the circumferential direction of the main shaft seat of the shank.
[0015] In one embodiment of the present invention, the second swing arm segment is in the shape of a tubular shell, and the fracture weak part is an annular groove formed on the outer wall of the second swing arm segment.
[0016] In one embodiment of this utility model, multiple sets of fractured weak portions are arranged at intervals along the length direction of the second swing arm segment.
[0017] In one embodiment of this utility model, the main shaft seat of the shank is provided with a mounting surface, the mounting surface is arranged vertically, one end of the first swing arm segment is attached to the mounting surface, a first strip hole is provided on the end face of the first swing arm segment, the first strip hole is arranged horizontally in the length direction, and a first bolt is provided in the first strip hole, one end of the first bolt is connected to a fixing hole on the mounting surface.
[0018] In one embodiment of this utility model, the cantilever end of the first swing arm segment is provided with an overlap platform, and one end of the second swing arm segment is provided with a slot. The slot is engaged at the cantilever end of the first swing arm segment, and the lower side plate of the second swing arm segment abuts against the overlap platform. Second oblong holes are provided on both sides of the slot. The second oblong holes are arranged along the length direction of the second swing arm segment. Second bolts are provided in the second oblong holes, and one end of the second bolts is connected to a fixing hole provided on the side wall of the first swing arm segment.
[0019] Another objective of this invention is to provide a die bonding device, which includes the aforementioned swing arm assembly.
[0020] Compared with existing technologies, the advantages of this invention are reflected in the following: the adjustable assembly method of the first and second swing arm segments in space gives the swing arm assembly extremely strong flexibility and adaptability. During the die bonding process, technicians can precisely adjust the spatial posture and position of the two swing arms according to different process requirements, chip size, and die bonding position, so that the nozzle component can accurately follow a trajectory of a circle with the same radius and evenly distributed angles. Compared with traditional fixed structure swing arms, this design significantly reduces the dependence on the swing arm machining accuracy, reduces trajectory deviation problems caused by machining errors, and greatly improves the versatility and debugging efficiency of the swing arm assembly.
[0021] The fracture weak point located on the second swing arm section provides a reliable overload protection mechanism for the swing arm assembly. When the swing arm is subjected to abnormal external forces during operation (such as collisions with other components or encountering sudden mechanical resistance), the fracture weak point will fracture preferentially, isolating the abnormal external force within a local structure and preventing wider damage to the entire swing arm assembly and die bonding equipment. Compared to the traditional method of replacing the entire swing arm after damage, this design only requires replacement of the second swing arm section, significantly reducing equipment maintenance costs and downtime. Furthermore, the circumferential arrangement of the fracture weak point ensures that the protection mechanism is effectively triggered under stress in all directions, comprehensively protecting the operational safety of the swing arm assembly and equipment. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the swing arm assembly in one embodiment of the present invention;
[0023] Figure 2 This is a schematic diagram of the structure of the first swing arm segment and the second swing arm segment after they are installed together in one embodiment of the present invention;
[0024] Figure 3 This is a schematic diagram of the structure of the second swing arm segment in a swing arm assembly according to one embodiment of the present invention;
[0025] Figure 4This is a schematic diagram of the structure of the first swing arm segment and the main shaft seat of the swivel head in one embodiment of the present invention;
[0026] Figure 5 This is a schematic diagram of the installation and cooperation of the first swing arm segment and the second swing arm segment in one embodiment of the present invention.
[0027] Explanation of icon numbers:
[0028] 10. Spindle head; 11. Mounting surface;
[0029] 20. First swing arm section; 21. First strip hole; 22. First bolt; 23. Overlap platform;
[0030] 30. Second swing arm section; 31. Slot; 311. Second oblong hole; 32. Second bolt; 33. Weak fracture section;
[0031] 40. Suction nozzle. Detailed Implementation
[0032] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.
[0033] The illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0034] In die bonding equipment, the installation of chips onto printed circuit boards (PCBs) typically involves using a pick-and-place nozzle to pick up the chip and then transfer it to the PCB mounting position. Existing swing arm assemblies for fixing the nozzles often employ traditional machining and assembly methods. These methods are susceptible to limitations in machining equipment precision, assembly processes, and human error, making it difficult to consistently achieve the high precision required. Even minor machining errors can accumulate and cause the swing arm nozzle trajectory to deviate during operation, affecting the die bonding position accuracy and reducing die bonding yield. Furthermore, the debugging process for the swing arm assembly also faces significant challenges. Due to a lack of precise debugging and testing methods, the debugging process often relies on the experience of technicians for repeated trial and error adjustments. This is not only time-consuming and labor-intensive, but also prone to mechanical damage to the swing arm components due to improper operation or parameter setting deviations, such as shaft wear and transmission component deformation. Once the swing arm is damaged, its precision structure and often customized design mean that replacement requires significant time to wait for parts and incurs high procurement costs, greatly increasing equipment maintenance costs and downtime, severely hindering the continuous and efficient operation of semiconductor packaging production lines. Therefore, developing a novel die-bonding head assembly that can effectively overcome the inertia of Y-axis motion and reduce jitter is of urgent and important practical significance for improving the accuracy and production capacity of die bonders. This utility model proposes a swing arm assembly, comprising: a die-bonding head spindle seat 10 for connection to the power mechanism of the die-bonding equipment, wherein the power mechanism drives the die-bonding head spindle seat 10 to rotate with the rotation axis vertical; a first swing arm section 20, suspended and mounted on the die-bonding head spindle seat 10; a second swing arm section 30, mounted at the suspended end of the first swing arm section 20, and a suction nozzle 40 is provided on the second swing arm section 30; the first swing arm section 20 and the second swing arm section 30 are assembled to be positionally adjustable within space; a fracture weak portion 33 is provided on the second swing arm section 30, the fracture weak portion 33 is arranged along the circumferential direction of the second swing arm section 30, and the fracture weak portion 33 is assembled such that it fractures when subjected to external force.
[0035] In one embodiment, see Figure 1 Four sets of first swing arm segments 20 and second swing arm segments 30 are arranged at equal angles along the circumferential direction of the bonding head spindle seat 10. After the four sets of first swing arm segments 20 and second swing arm segments 30 are installed in a cantilever configuration, the center line of the nozzle component 40 is checked by the testing equipment to see if it is concentric with the center of the bonding head spindle seat 10. When a deviation occurs, the first swing arm segment 20 and second swing arm segment 30 are adjusted to be in a horizontal position to eliminate the deviation and ensure the die bonding accuracy.
[0036] In one embodiment, multiple sets of fracture weak parts 33 can be provided along the second swing arm section 30. When the stress on the second swing arm section 30 is too high, the second swing arm section 30 can be fractured at the location of the fracture weak part 33. The second swing arm section 30 can be replaced, which significantly reduces maintenance costs.
[0037] In one embodiment, the first swing arm segment 20 extends along the radial direction of the main shaft seat 10, and the first swing arm segment 20 and the main shaft seat 10 constitute a position adjustment along a first direction, which is a direction parallel to the rotation surface of the main shaft seat 10.
[0038] Specifically, the first direction can be understood as any position in the horizontal plane. By setting the structure of the mounting point between the first swing arm segment 20 and the main spindle seat 10, the first swing arm segment 20 can be finely adjusted at any position in the horizontal direction on the main spindle seat 10.
[0039] In one embodiment, the second swing arm segment 30 and the overhanging end of the first swing arm segment 20 are configured to be position-adjustable along a second direction, which is the radial direction along the main shaft seat 10 of the head.
[0040] In the above embodiments, two-stage position adjustment can dynamically compensate for machining errors and assembly deviations. For example, when the first swing arm segment 20 has a radial dimensional error, it can be corrected by adjusting the second swing arm segment 30, ensuring that the nozzle component 40 strictly follows a circular trajectory of the same radius, reducing the dependence on the machining accuracy of parts. For different chip sizes or die-bonding position requirements, the relative position of the two swing arm segments can be quickly adjusted without replacing the entire swing arm assembly. For example, when processing small-sized chips, the extension length of the two swing arm segments can be shortened to improve motion response speed; when processing large-sized chips, the adjustment range can be increased to cover a larger working area.
[0041] In one embodiment, see Figure 2 and Figure 3 The second swing arm segment 30 is in the shape of a tubular shell, and the fracture weak part 33 is an annular groove formed on the outer wall of the second swing arm segment 30; the fracture weak part 33 is arranged in multiple sets at intervals along the length direction of the second swing arm segment 30.
[0042] In the above embodiments, the second swing arm segment 30 adopts a tubular design, which effectively reduces the weight of the swing arm itself while ensuring sufficient load-bearing capacity. Compared with a solid structure, the tubular shape reduces the amount of material used and lowers the inertial load during swing arm rotation, making the swing arm more responsive and faster to start and stop during the operation of the die bonding equipment, thus helping to improve the efficiency and accuracy of chip picking and placement. At the same time, the annular cross-section of the tubular structure has good compressive and torsional resistance, and can withstand the normal mechanical stress during die bonding, ensuring the stable operation of the swing arm assembly. The fracture weak point 33 is designed as an annular groove on the outer wall of the second swing arm segment 30. By controlling the depth, width and other parameters of the annular groove, the fracture threshold of this part can be precisely set. When the swing arm encounters abnormal external force, the annular groove fractures first due to stress concentration effect, thereby cutting off the transmission path of abnormal external force in time and protecting other key components of the die bonding equipment from damage. This design makes the overload protection mechanism highly controllable and can be customized according to the actual application scenario and equipment parameters, improving the safety and reliability of equipment operation. Multiple sets of fracture weak points 33 are spaced along the length of the second swing arm segment 30, forming a multi-level overload protection mechanism. When the swing arm is subjected to a small abnormal external force, the annular groove near the force-bearing end fractures first, providing initial buffering. If the external force continues to increase, subsequent annular grooves fracture sequentially, gradually consuming the external force energy and preventing destructive damage caused by excessive stress on a single part. This multi-level protection design extends the service life of the swing arm assembly, reduces the possibility of the entire swing arm being scrapped due to a single overload, and lowers the maintenance frequency and cost of the equipment.
[0043] In one embodiment, see Figure 4 To enable adjustment between the first swing arm segment 20 and the main shaft seat 10, the main shaft seat 10 is provided with a mounting surface 11. The mounting surface 11 is vertically arranged, and one end of the first swing arm segment 20 is attached to the mounting surface 11. A first strip hole 21 is provided on the end face of the first swing arm segment 20. The first strip hole 21 is horizontally arranged in the length direction, and a first bolt 22 is provided in the first strip hole 21. One end of the first bolt 22 is connected to a fixing hole on the mounting surface 11.
[0044] In one embodiment, three sets of first strip holes 21 are provided on the end face of the first swing arm segment 20. The three sets of first strip holes 21 form an isosceles triangle, which can enhance the stability of the connection between the first swing arm segment 20 and the main shaft seat 10.
[0045] In one embodiment, see Figure 5The first swing arm segment 20 has an overlap platform 23 at its cantilever end, and the second swing arm segment 30 has a slot 31 at one end. The slot 31 is engaged at the cantilever end of the first swing arm segment 20, and the lower side plate of the second swing arm segment 30 abuts against the overlap platform 23. The slot 31 has a second waist-shaped hole 311 on both sides of its groove wall. The second waist-shaped hole 311 is arranged along the length of the second swing arm segment 30. A second bolt 32 is provided in the second waist-shaped hole 311, and one end of the second bolt 32 is connected to a fixing hole on the side wall of the first swing arm segment 20.
[0046] This utility model also proposes a die bonding device, which includes a swing arm assembly. The adjustable spatial assembly of the first swing arm segment 20 and the second swing arm segment 30 of the swing arm assembly gives the assembly excellent flexibility and adaptability. During die bonding, technicians can precisely adjust the spatial posture and position of the two swing arms according to different process requirements, chip size, and die bonding position, enabling the nozzle to accurately follow a trajectory with a uniform radius and evenly distributed angles. Compared to traditional fixed-structure swing arms, this design significantly reduces the dependence on the swing arm's machining accuracy, reduces trajectory deviation caused by machining errors, and greatly improves the versatility and debugging efficiency of the swing arm assembly. The specific structure of this die bonding assembly is described in the above embodiments. Since this die bonding device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.
[0047] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0048] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A swing arm assembly, characterized in that, include: A die bonder spindle seat (10) is used to connect to the power mechanism of the die bonder, which drives the die bonder spindle seat (10) to rotate with the rotation axis being vertical. The first swing arm section (20) is suspended and mounted on the main shaft seat (10) of the head; The second swing arm section (30) is installed at the cantilever end of the first swing arm section (20), and a suction nozzle (40) is provided on the second swing arm section (30). The first swing arm segment (20) and the second swing arm segment (30) are assembled to be positionally adjustable in space; A fracture weak part (33) is provided on the second swing arm section (30). The fracture weak part (33) is arranged along the circumferential direction of the second swing arm section (30). The fracture weak part (33) is assembled so that it will break when subjected to external force.
2. The swing arm assembly according to claim 1, characterized in that: The first swing arm segment (20) extends along the radial direction of the main shaft seat (10), and the first swing arm segment (20) and the main shaft seat (10) constitute a position adjustment along a first direction, which is a direction parallel to the rotation surface of the main shaft seat (10).
3. The swing arm assembly according to claim 1, characterized in that: The second swing arm segment (30) and the overhanging end of the first swing arm segment (20) form a position adjustment along a second direction, which is the radial direction along the main shaft seat (10) of the first swing arm segment (20).
4. The swing arm assembly according to claim 1, characterized in that: The first swing arm segment (20) is distributed in multiple groups at intervals along the circumferential direction of the main shaft seat (10).
5. The swing arm assembly according to claim 1, characterized in that: The second swing arm section (30) is in the shape of a tubular shell, and the fracture weak part (33) is an annular groove formed on the outer wall of the second swing arm section (30).
6. The swing arm assembly according to claim 5, characterized in that: Multiple sets of the fracture weak parts (33) are arranged at intervals along the length direction of the second swing arm segment (30).
7. The swing arm assembly according to claim 2, characterized in that: The main shaft seat (10) of the shank is provided with a mounting surface (11), which is arranged vertically. One end of the first swing arm section (20) is attached to the mounting surface (11). A first strip hole (21) is provided on the end face of the first swing arm section (20). The first strip hole (21) is arranged horizontally in the length direction, and a first bolt (22) is provided in the first strip hole (21). One end of the first bolt (22) is connected to the fixing hole on the mounting surface (11).
8. The swing arm assembly according to claim 3, characterized in that: The first swing arm segment (20) has a connecting platform (23) at its cantilever end, and the second swing arm segment (30) has a slot (31) at one end. The slot (31) is engaged at the cantilever end of the first swing arm segment (20), and the lower side plate of the second swing arm segment (30) abuts against the connecting platform (23). The slot (31) has a second waist-shaped hole (311) on both sides of the slot wall. The second waist-shaped hole (311) is arranged along the length of the second swing arm segment (30). A second bolt (32) is provided in the second waist-shaped hole (311), and one end of the second bolt (32) is connected to a fixing hole on the side wall of the first swing arm segment (20).
9. A die bonding device, characterized in that: The die bonding device includes the swing arm assembly as described in any one of claims 1 to 8.