A high-reliability high-density hybrid integrated packaging structure

Abstract

The application relates to the technical field of integrated circuit hybrid integrated circuit packaging, in particular to a high-reliability high-density hybrid integrated packaging structure, which is composed of a ceramic base, a chip, a passive device, a metal ring frame and a cover plate, the ceramic base, the metal ring frame and the cover plate form an airtight cavity; the ceramic base is in a cubic structure, the front surface or the side surface except the bottom is used for mounting the chip or the passive device, the metal ring frame is arranged on the front surface or the side surface of the ceramic base to surround the chip or the passive device, and the cover plate is arranged on the metal ring frame to realize airtight packaging. The high-reliability high-density hybrid integrated packaging structure has the advantages of high performance, high reliability, high density, miniaturization, stable performance, long service life and the like.

Description

Technical Field

[0001] This invention relates to the field of hybrid integrated circuit packaging technology, and in particular to a high-reliability, high-density hybrid integrated packaging structure. Background Technology

[0002] Multi-chip packaging uses integrated circuit packaging technology to assemble components with different functions into a single package structure. It not only serves as a carrier for the components but also enables electrical interconnection between them, thereby achieving specific functions. It is a very critical technology in integrated circuits and is essential for the long-term stable operation of a system and the achievement of its specified functions.

[0003] In specialized applications such as aviation, aerospace, and military equipment, high reliability requirements are placed on integrated circuits, including requirements for airtightness, resistance to high and low temperatures, and resistance to high humidity. Meanwhile, as the complexity of tasks performed by aviation, aerospace, and military equipment continues to increase, the number of electronic components is growing exponentially. This necessitates further improvements in packaging density for electronic devices while ensuring high reliability.

[0004] Existing methods for achieving miniaturized packaging include 2.5D / 3D stacking, which typically uses ABF / BT substrates as the component carrier and EMC molding compounds as the encapsulation material. However, since ABF / BT substrates are organic materials, neither the substrates nor the encapsulation materials used in these processes can guarantee a very good hermetic seal. Alternatively, silicon interposers can be used as the component carrier with silicon caps, but this technology is still in the research stage, with high costs and unproven reliability. Therefore, ceramic and metal materials remain the preferred choice for high-reliability applications.

[0005] However, traditional ceramic packaging structures generally employ single-sided cavity or anti-symmetrical cavity structures. Single-sided cavity structures allow for pin placement at the bottom of the package, reducing the PCB area occupied, but components can only be placed on one side, such as... Figure 1 Asymmetric cavity structures allow for component placement on both sides, but pins can only be placed on one side of the package, increasing the overall package size. Figure 2 Neither of these two structures makes good use of vertical space, making it difficult to achieve miniaturized assembly.

[0006] In summary, existing substrate molding and silicon interposer processes are insufficient to meet the requirements of high-reliability applications, and traditional ceramic body packaging structures cannot achieve miniaturization. Therefore, in high-reliability applications such as aerospace, there is an urgent need for a hybrid integrated packaging solution that can guarantee hermeticity, high reliability, and high density. Summary of the Invention

[0007] To solve the above-mentioned technical problems, the present invention provides a high-reliability, high-density hybrid integrated packaging structure, comprising: the packaging structure consists of a ceramic substrate, a chip, passive devices, a metal ring frame, and a cover plate, wherein the ceramic substrate, the metal ring frame, and the cover plate form an airtight cavity;

[0008] The ceramic substrate has a cubic structure, and the front or side surfaces, except for the bottom, are used to mount chips or passive devices. The metal ring frame is placed on the front or side surfaces of the ceramic substrate to surround the chips or passive devices, and the cover plate is placed on the metal ring frame to achieve hermetic sealing.

[0009] The beneficial effects of this invention are:

[0010] This invention presents a high-reliability, high-density hybrid integrated packaging structure, unlike traditional ceramic shells that only mount chips or passive devices on one or both sides. The packaging structure of this invention features BGA, LGA, DFN, or QFN package leads at the bottom, allowing for chip or passive device mounting on both the front and sides. Multiple cavities on the front and sides are covered by a ring frame, with a cover plate applied to the metal ring frame using parallel seam welding or gold-tin soldering, ensuring a hermetically sealed connection. The chips and passive devices on the front and sides are electrically interconnected through printed patterns on and inside the ceramic body. Furthermore, this invention ensures the hermetically tightness of the chip mounting cavities, protecting the chip from moisture or other atmospheric conditions. The materials and processes used have undergone long-term verification in aerospace and other fields, guaranteeing the long-term reliability of the hybrid integrated circuit. Compared to traditional integrated shells, this packaging structure significantly improves packaging efficiency, enabling miniaturized packaging of high-reliability hybrid integrated circuits.

[0011] In summary, the high-reliability, high-density hybrid integrated packaging structure of the present invention has advantages such as high performance, high reliability, high density, miniaturization, stable performance, and long service life. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of an existing hybrid integrated circuit ceramic packaging structure using a single-sided cavity;

[0013] Figure 2 This is a schematic diagram of an existing hybrid integrated circuit ceramic packaging structure that uses a double-sided symmetrical cavity.

[0014] Figure 3 This is a front perspective view of a high-reliability, high-density hybrid integrated packaging structure according to a first embodiment of the present invention;

[0015] Figure 4 This is a side perspective view of a high-reliability, high-density hybrid integrated packaging structure according to a first embodiment of the present invention;

[0016] Figure 5This is a schematic diagram of a high-reliability, high-density hybrid integrated packaging structure, which is a second embodiment of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Figure 3 This is a schematic diagram of a high-reliability, high-density hybrid integrated packaging structure, representing a first embodiment of the present invention. Figure 3 As shown, the hybrid integrated packaging structure of the present invention includes a ceramic body, a ring frame, a cover plate, a chip, and passive devices. The surface of the ceramic body has conductive patterns for electrical connection, and the interior of the ceramic body has through holes or blind holes for electrical connection between ceramic body layers or cavities.

[0019] like Figure 3 The first embodiment shown is a front perspective view. The airtight cavity 1 is used to install the chip and passive devices, while the open cavities 1 and 2 can only be used to install passive devices.

[0020] like Figure 4 The first embodiment shown is a side perspective view. Chips and passive devices can be installed in the airtight cavities 1, 2, and 3. The first embodiment shown in the figure contains a total of 5 cavities, with circuit solder balls on the bottom surface serving as leads.

[0021] According to a preferred embodiment of the present invention, the ceramic matrix is ​​a high-temperature co-fired ceramic, the material is alumina ceramic, and it has a cubic structure with a length of 5mm to 40mm, a width of 2mm to 40mm, and a thickness of 2mm to 10mm.

[0022] According to a preferred embodiment of the present invention, the bottom of the ceramic substrate is an LGA pad or a BGA ball to achieve electrical interconnection between the high-reliability, high-density hybrid integrated package structure and the PCB.

[0023] According to a preferred embodiment of the present invention, the ceramic substrate can mount components on at least two sides and at most five sides.

[0024] According to a preferred embodiment of the present invention, the ceramic substrate, the metal ring frame, and the cover plate form an airtight cavity for the main user to install active chips, ensuring the reliability of the chips;

[0025] According to a preferred embodiment of the present invention, the surface of the ceramic substrate on which passive devices are mounted can be designed with a recessed cavity only on the ceramic body, without the need to install a metal ring frame and cover plate, and without the need to ensure airtightness.

[0026] According to a preferred embodiment of the present invention, the surface of the ceramic substrate on which passive devices are mounted may not have a cavity, may not have a metal ring frame or cover plate, and does not need to ensure airtightness.

[0027] According to a preferred embodiment of the present invention, the airtight cavity consisting of the ceramic substrate, the metal ring frame, and the cover plate is sealed by parallel seam welding or by a gold-tin sealing method.

[0028] Its packaging steps include, but are not limited to:

[0029] Step 1: Machining of electrical interconnect patterns on the surface of the ceramic substrate and internal electrical interconnect through holes, blind holes, and buried holes;

[0030] Step 2: Use solder to install the metal ring frame on the front and sides of the ceramic substrate;

[0031] Step 3: Mount the chip and passive components on the front or side of the ceramic substrate;

[0032] Step 4: Install the cover plate onto the metal ring frame to achieve an airtight seal;

[0033] Step 5: Install BGA solder balls on the bottom of the ceramic body. This step is not required if LGA, DFN, QFN, or other package types are used.

[0034] It is worth noting that the chip interconnection method in the airtight cavity can be bonding or flip-chip bonding. This invention does not limit the chip mounting and interconnection method; the side where passive devices are placed may also not have a cavity.

[0035] It is worth noting that, Figure 3 , 4 The first embodiment shown is only one example of the present invention. The number of cavities and whether the cavities are airtight can be designed according to actual needs.

[0036] Figure 5 This is a schematic diagram of a high-reliability, high-density hybrid integrated packaging structure, representing a second embodiment of the present invention. Figure 5 The high-reliability, high-density hybrid integrated packaging structure shown includes a ceramic body, a metal ring frame, a cover plate, a chip, passive components, and solder balls. The surface of the ceramic body is printed with metallized patterns, and the interior has through holes for mounting devices and realizing electrical interconnection. The ceramic body, the metal ring frame, and the cover plate form an airtight cavity to ensure the long-term reliability of the chip inside the cavity.

[0037] like Figure 5The high-reliability, high-density hybrid integrated package structure shown in the second embodiment includes a non-hermetic cavity for mounting passive devices such as resistors and capacitors necessary for the peripheral configuration of the chip. The depth of the non-hermetic cavity should generally be greater than the height of the passive devices inside the cavity to prevent interference between the devices and the substrate or collisions between the devices when they are mounted to the substrate.

[0038] like Figure 5 The non-hermetic cavity area of ​​the high-reliability, high-density hybrid integrated packaging structure shown in the second embodiment does not completely occupy the bottom of the ceramic body, and space is left around the non-hermetic cavity for installing the solder ball leads of the second embodiment.

[0039] It is worth noting that the chip interconnection method in the airtight cavity can be bonding or flip-chip bonding. This invention does not limit the chip mounting and interconnection method; the bottom lead of the hybrid integrated package structure can be in BGA form or LGA form.

[0040] This application presents a high-reliability, high-density hybrid integrated packaging structure that differs from traditional ceramic housings where chips or passive devices are mounted on only one side or both sides. The packaging structure of this invention has BGA, LGA, DFN, or QFN package pins at the bottom, and chips or passive devices can be mounted on both the front and sides. Multiple cavities on the front and sides are covered with ring frames, and the cover plate is covered on the metal ring frame by parallel seam welding or gold-tin welding and is sealed to the metal ring frame to ensure hermetic packaging. The chips and passive devices on the front and sides are electrically interconnected through printed patterns on the surface and inside of the ceramic body.

[0041] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-reliability, high-density hybrid integrated packaging structure, characterized in that, include: The packaging structure consists of a ceramic substrate, a chip, passive components, a metal ring frame, and a cover plate, with the ceramic substrate, metal ring frame, and cover plate forming an airtight cavity. The ceramic substrate has a cubic structure, and the front or side surfaces, except for the bottom, are used to mount chips or passive devices. The metal ring frame is placed on the front or side surfaces of the ceramic substrate to surround the chips or passive devices, and the cover plate is placed on the metal ring frame to achieve hermetic sealing.

2. The high-reliability, high-density hybrid integrated packaging structure according to claim 1, characterized in that, The ceramic matrix is ​​alumina ceramic or aluminum nitride ceramic, and has a cubic structure with a length of 5mm to 40mm, a width of 2mm to 40mm, and a thickness of 2mm to 10mm.

3. The high-reliability, high-density hybrid integrated packaging structure according to claim 1, characterized in that, Multiple chips or passive devices are mounted on the front or side of the ceramic substrate, and conductive patterns are printed on it to achieve electrical interconnection between the multiple chips or passive devices.

4. The high-reliability, high-density hybrid integrated packaging structure according to claim 1, characterized in that, The bottom of the ceramic substrate is an LGA pad or a BGA ball, which enables electrical interconnection between the high-reliability, high-density hybrid integrated package structure and the PCB.

5. The high-reliability, high-density hybrid integrated packaging structure according to claim 1, characterized in that, The ceramic substrate has through holes, blind holes, or buried holes to enable electrical interconnection between chips or passive devices on different surfaces.

6. The high-reliability, high-density hybrid integrated packaging structure according to claim 1, characterized in that, The ceramic substrate can mount components on at least two sides and at most five sides.

7. The high-reliability, high-density hybrid integrated packaging structure according to claim 1, characterized in that, The ceramic substrate can be fitted with a metal ring frame and cover plate to ensure hermetic sealing on the surface where passive components are mounted, or it can be left unmounted.

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