A circuit board mounting structure inside the air duct of a rear-inlet blower

Abstract

This utility model discloses a circuit board mounting structure within the air duct of a rear-inlet blower. It includes: an air duct housing; a fan fixed inside the air duct housing, positioned between the air inlet and outlet ends of the air duct housing; a first limiting opening on the side wall of the air duct housing, located between the fan and the air outlet end; an IGBT module mounted on and sealed to the first limiting opening; IGBT wires disposed on the IGBT module and located outside the air duct housing; a second limiting opening on the side wall of the air duct housing, located between the fan and the air outlet end; an IPM module mounted on the second limiting opening and sealed to the second limiting opening; IPM wires disposed on the IPM module and located outside the air duct housing; and a main control board located outside the air duct housing and connected to the IGBT wires and IPM wires. The advantage of this utility model is that it eliminates the need for wiring inside the air duct.

Description

Technical Field

[0001] This utility model relates to the technical field of hair dryers, and in particular to a circuit board mounting structure in the air duct of a rear-inlet hair dryer. Background Technology

[0002] A hair dryer consists of a set of resistance wires and a high-speed motor. The high-speed motor contains fan blades that blow air. When powered on, the resistance wires generate heat, and the air blown by the fan passes through the resistance wires, turning into hot air. If only the small fan is running, but the resistance wires are not heated, then only air will be blown out, not hot air.

[0003] In the current market, there are two heat dissipation solutions for high-temperature components in high-speed hair dryers where the motor and heating module are coaxially arranged: (1) The high-temperature component is integrated with the main control board and placed at the air inlet (motor air inlet end). Its heat dissipation surface is not covered. When the airflow passes through, it can carry away the surface high temperature to complete the cooling process. This heat dissipation method will result in a long overall length and inconvenience in use; (2) The high-temperature component is placed as a module in the air duct and located at the air outlet end of the high-speed fan. It is cooled by using high-speed airflow. The high-temperature component is connected to the main control board of the hair dryer through the internal wiring through the air duct. Although this method solves the problem of a long overall length and inconvenience in use, it will lead to: a) a lot of wires in the air duct; b) the need to seal the internal wiring penetration part on the air duct; c) the internal wires have no consistent shape, affecting the wind speed and wind noise; d) the product is difficult to install; e) the part is difficult to repair after failure.

[0004] In summary, there is a need for a circuit board mounting structure inside the air duct of a rear-inlet blower that eliminates the need for wiring inside the duct. Utility Model Content

[0005] This invention aims to overcome the shortcomings of existing technologies where high-temperature components are placed in the air duct for heat dissipation, requiring internal wiring to penetrate the air duct and connect to the main control board of the blower. It provides a circuit board mounting structure in the air duct of a rear-inlet blower that eliminates the need for wiring inside the air duct.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A circuit board mounting structure within the air duct of a rear-inlet blower includes:

[0008] Duct housing;

[0009] A fan is fixed inside the air duct housing, and the fan is located between the air inlet end and the air outlet end of the air duct housing.

[0010] A limiting opening is provided on the side wall of the air duct housing, and the limiting opening is provided between the fan and the air outlet end of the air duct housing;

[0011] An IGBT module is installed at one of the limiting openings and is sealed to it;

[0012] IGBT wires are disposed on the IGBT module and located outside the air duct housing;

[0013] Limiting opening two is provided on the side wall of the air duct housing, and the limiting opening two is provided between the fan and the air outlet end of the air duct housing;

[0014] The IPM module is installed at the two limiting openings and is sealed to them;

[0015] IPM wires are disposed on the IPM module and located outside the air duct housing;

[0016] The main control board is located outside the air duct housing and is connected to the IGBT wires and IPM wires.

[0017] Both the IGBT module and the IPM module are high-heat sources in the hair dryer, requiring cooling via an air duct. This invention addresses this by creating two limiting openings on the side wall of the air duct housing. These openings allow the IGBT and IPM modules to be sealed and installed at these openings respectively. The heating elements of the IGBT and IPM modules are housed within the air duct housing, while the IGBT and IPM wires are exposed on the outside of the housing. This effectively avoids the need for the IGBT and IPM wires to penetrate the air duct housing to connect to the hair dryer's main control board, achieving a wireless design within the air duct housing. This minimizes interference from the IGBT and IPM wires to the air duct housing, as well as their impact on airflow and noise. Furthermore, since the wiring for both IGBT and IPM wires is outside the air duct, wiring, cable management, and installation are simplified.

[0018] Preferably, the IGBT module includes an IGBT substrate. The outer edge of the limiting opening is coated with foam adhesive. The IGBT substrate is bonded to the limiting opening using the foam adhesive. The IGBT wires are connected to the outer surface of the IGBT substrate. An IGBT tube is fixed to the inner surface of the IGBT substrate, and the IGBT tube passes through the limiting opening and is placed inside the air duct housing. During installation, the outer edge of the limiting opening is bonded with high-density foam adhesive, and then the circuit board plane of the IGBT substrate is pressed onto the foam adhesive, compressing the foam adhesive to complete the seal, resulting in a stable connection and good sealing effect. The IGBT tube (SCR) is the heat source with the highest heat output in the hair dryer and is housed within the air duct housing for cooling. The IGBT wires are used to connect to the main control board of the hair dryer and are placed externally within the air duct housing to avoid affecting the interior of the air duct housing.

[0019] Preferably, an IGBT cover is provided on the outer side of the IGBT substrate. The IGBT substrate is fixed between the IGBT cover and a limiting opening. Limiting buckles are fixed on both sides of the IGBT cover. A limiting groove matching the limiting buckle is provided on the air duct housing. The IGBT cover is engaged with the air duct housing through the cooperation of the limiting buckle and the limiting groove. After the IGBT module is installed on the side wall of the air duct housing, the IGBT cover is then secured to the outside of the IGBT module using the cooperation of the limiting buckle and the limiting groove, further protecting and securing the IGBT module. This facilitates installation, disassembly, and maintenance. The IGBT cover has an IGBT cover notch, from which the IGBT wires are led out.

[0020] Preferably, the IPM module includes an IPM substrate. The outer edge of the second limiting opening is coated with foam adhesive. The IPM substrate is bonded to the second limiting opening using the foam adhesive. IPM wires are connected to the outer surface of the IPM substrate. An IPM chip is fixed to the inner surface of the IPM substrate. The IPM chip passes through the second limiting opening and is placed inside the air duct housing. During installation, the outer edge of the second limiting opening is bonded with high-density foam adhesive, and then the circuit board plane of the IPM substrate is pressed onto the foam adhesive, compressing the foam adhesive to achieve a seal. This results in a stable connection and good sealing effect. The IPM chip (three-phase intelligent power module) is a heat source with high heat output inside the hair dryer and is built into the air duct housing for cooling. The IPM wires are used to connect to the main control board of the hair dryer and are placed outside the air duct housing to avoid affecting the interior of the air duct housing.

[0021] Preferably, the IPM substrate has an IPM cover on its outer side. The IPM substrate is fixed between the IPM cover and the second limiting opening. Limiting buckles are fixed to both sides of the IPM cover. The air duct housing has limiting grooves that match the limiting buckles. The IPM cover is engaged with the air duct housing through the cooperation of the limiting buckles and the limiting grooves. After the IPM module is installed on the side wall of the air duct housing, the IPM cover is then secured to the outside of the IPM module using the cooperation of the limiting buckles and the limiting grooves, providing further protection and fixation for the IPM module. This facilitates installation, disassembly, and maintenance. The IPM cover has an IPM cover notch, from which the IPM wires are led out.

[0022] Preferably, a handle is mounted on the duct housing, and the main control board is located inside the handle. This design is simple in structure and easy to install.

[0023] The advantages of this invention are: it effectively avoids the shortcomings of IGBT and IPM wires needing to penetrate the air duct housing to connect with the main control board of the blower, thus realizing a wireless design within the air duct housing; it minimizes the interference of IGBT and IPM wires on the air duct housing, as well as their impact on airflow and wind noise; it simplifies wiring, cable management, and installation; it provides stable connections and good sealing; and it is easy to install, disassemble, and maintain. Attached Figure Description

[0024] Figure 1 This is an exploded view of this utility model;

[0025] Figure 2 This is a circuit connection diagram between the high-temperature components and the main control board;

[0026] Figure 3 It is a three-dimensional view of the air duct shell;

[0027] Figure 4 This is a top view of the air duct shell;

[0028] Figure 5 yes Figure 4 A partial sectional view at point AA.

[0029] In the diagram: 1. Duct housing, 2. Fan, 3. Limiting opening one, 4. Limiting opening two, 5. Main control board, 6. Handle, 7. IGBT substrate, 8. Foam adhesive one, 9. IGBT wire, 10. IGBT tube, 11. IGBT cover, 12. IPM substrate, 13. Foam adhesive two, 14. IPM wire, 15. IPM chip, 16. IPM cover. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0031] like Figure 1 and Figure 2 In the embodiments described above, a circuit board mounting structure within the air duct of a rear-intake blower includes:

[0032] Duct housing 1;

[0033] Fan 2 is fixed inside the air duct housing 1 and is located between the air inlet end and the air outlet end of the air duct housing 1.

[0034] Limiting opening 3 is provided on the side wall of the air duct housing 1, and limiting opening 3 is provided between the fan 2 and the air outlet end of the air duct housing 1.

[0035] The IGBT module is installed at the limiting opening 3 and sealed to it;

[0036] IGBT wire 9 is disposed on the IGBT module and located outside the air duct housing 1;

[0037] Limiting opening 2 4 is provided on the side wall of the air duct housing 1, and limiting opening 2 4 is provided between the fan 2 and the air outlet end of the air duct housing 1.

[0038] The IPM module is installed at the limiting opening 24 and is sealed to it;

[0039] IPM wire 14 is disposed on the IPM module and located outside the air duct housing 1;

[0040] The main control board 5 is located outside the air duct housing 1 and is connected to the IGBT wire 9 and the IPM wire 14.

[0041] The IPM module and IGBT module are adjusted according to the airflow direction to minimize airflow obstruction, with a spacing of more than 5mm between the module and the unit.

[0042] like Figure 3 , Figure 4 and Figure 5 As shown, the IGBT module includes an IGBT substrate 7. Foam adhesive 8 is coated on the outer edge of the limiting opening 3. The IGBT substrate 7 is bonded to the limiting opening 3 by the foam adhesive 8. IGBT wires 9 are connected to the outer plate surface of the IGBT substrate 7. An IGBT tube 10 is fixed on the inner plate surface of the IGBT substrate 7. The IGBT tube 10 passes through the limiting opening 3 and is placed inside the air duct housing 1.

[0043] An IGBT cover 11 is provided on the outer side of the IGBT substrate 7. The IGBT substrate 7 is fixed between the IGBT cover 11 and the limiting opening 3. Limiting buckles are fixed on both sides of the IGBT cover 11. A limiting groove matching the limiting buckle is provided on the air duct housing 1. The IGBT cover 11 is engaged with the air duct housing 1 through the cooperation of the limiting buckle and the limiting groove. An IGBT cover notch is provided on the IGBT cover 11, and the IGBT wire 9 is led out from the IGBT cover notch.

[0044] The IPM module includes an IPM substrate 12. Foam adhesive 13 is coated on the outer edge of the limiting opening 4. The IPM substrate 12 is bonded to the limiting opening 4 by the foam adhesive 13. IPM wires 14 are connected to the outer surface of the IPM substrate 12. An IPM chip 15 is fixed on the inner surface of the IPM substrate 12. The IPM chip 15 passes through the limiting opening 4 and is placed inside the air duct housing 1.

[0045] There are two IPM substrates (the number of limiting openings matches the number of IPM substrates). One IPM substrate has one IPM chip fixed on it, and the other IPM substrate has two IPM chips. The two IPM substrates are connected by an FPC flexible flat cable. A wire connected to the fan is fixed on the inner surface of the IPM substrate. Before the IPM substrate is bonded, this wire passes through the limiting opening and is inserted into the fan. The inner wall of the duct housing also has a wire clip that matches the wire to secure it, minimizing the impact of the wire on the interior of the duct housing.

[0046] An IPM cover 16 is provided on the outer side of the IPM substrate 12. The IPM substrate 12 is fixed between the IPM cover 16 and the limiting opening 4. Limiting buckles 2 are fixed on both sides of the IPM cover 16. The air duct housing 1 is provided with limiting grooves 2 that match the limiting buckles 2. The IPM cover 16 is engaged with the air duct housing 1 through the cooperation of the limiting buckles 2 and the limiting grooves 2. An IGBT cover notch is provided on the IPM cover 16, and the IPM wire 14 is led out from the IGBT cover notch.

[0047] A handle 6 is installed on the air duct housing 1, and the main control board 5 is placed inside the handle 6.

[0048] When installing the IGBT module, the outer edge of the limiting opening 3 is bonded with high-density foam adhesive 8. Then, the circuit board plane of the IGBT substrate 7 is pressed onto the foam adhesive 8, compressing the foam adhesive 8 to complete the seal. Then, the IGBT cover 11 is snapped onto the outside of the IGBT module using the cooperation of the limiting buckle 1 and the limiting slot 1 to further protect and fix the IGBT module. After the IGBT module is installed, the IGBT tube 10 (SCR) is built into the air duct housing 1 for cooling, and the IGBT wire 9 is placed outside the air duct housing 1 and connected to the main control board 5.

[0049] When installing the IPM module, the outer edge of the limiting opening 2 4 is bonded with high-density foam adhesive 2 13. Before bonding the IPM substrate 12, the wires on the inner plate of the IPM substrate 12 are passed through the limiting opening 2 4 and inserted into the fan 2 (the inner wall of the air duct housing 1 is also provided with a wire slot that matches the wires for fixing them). Then, the circuit board plane of the IPM substrate 12 is pressed onto the foam adhesive 2 13, so that the foam adhesive 2 13 is compressed and sealed. Then, the IPM cover 16 is snapped onto the outside of the IPM module using the cooperation of the limiting buckle 2 and the limiting slot 2 to further protect and fix the IPM module. After the IPM module is installed, the IPM chip 15 (three-phase intelligent power module) is built into the air duct housing 1 for cooling, and the IPM wires 14 are placed outside the air duct housing 1 and connected to the main control board 5.

[0050] This invention provides limiting openings 3 and 4 on the side wall of the air duct housing 1, allowing the IGBT module and IPM module to be sealed and installed at the limiting openings 3 and 4 respectively. The heating elements of the IGBT and IPM modules are housed inside the air duct housing 1, while the wires are exposed outside the air duct housing 1. This effectively avoids the drawback of the IGBT wires 9 and IPM wires 14 needing to penetrate the air duct housing 1 to connect to the main control board 5 of the blower. This achieves a wireless design within the air duct housing 1, minimizing interference from the IGBT wires 9 and IPM wires 14 on the air duct housing 1, as well as minimizing their impact on airflow and noise. Furthermore, since the wiring of the IGBT wires 9 and IPM wires 14 is outside the air duct, wiring, cable management, and installation are simplified.

Claims

1. A circuit board mounting structure in a duct of a rear intake hair dryer, characterized by, include: Duct shell (1); A fan (2) is fixed inside the air duct housing (1), and the fan (2) is located between the air inlet end and the air outlet end of the air duct housing (1). Limiting opening 1 (3) is provided on the side wall of the air duct housing (1), and the limiting opening 1 (3) is provided between the fan (2) and the air outlet end of the air duct housing (1); The IGBT module is installed at the limiting opening (3) and sealed to it; IGBT wires (9) are disposed on the IGBT module and located outside the air duct housing (1); Limiting opening two (4) is provided on the side wall of the air duct housing (1), and the limiting opening two (4) is provided between the fan (2) and the air outlet end of the air duct housing (1); The IPM module is installed at the limiting opening two (4) and sealed to it; IPM wire (14) is disposed on the IPM module and located outside the air duct housing (1); The main control board (5) is located outside the air duct housing (1) and is connected to the IGBT wire (9) and IPM wire (14).

2. A circuit board mounting structure in a rear intake blower duct according to claim 1, wherein The IGBT module includes an IGBT substrate (7), and foam adhesive (8) is coated on the outer edge of the limiting opening (3). The IGBT substrate (7) is bonded to the limiting opening (3) by the foam adhesive (8). The IGBT wire (9) is connected to the outer plate surface of the IGBT substrate (7). An IGBT tube (10) is fixed on the inner plate surface of the IGBT substrate (7). The IGBT tube (10) passes through the limiting opening (3) and is placed inside the air duct housing (1).

3. A circuit board mounting structure in a rear intake blower duct according to claim 2, wherein An IGBT cover (11) is provided on the outside of the IGBT substrate (7). The IGBT substrate (7) is fixed between the IGBT cover (11) and the limiting opening (3). Limiting buckles are fixed on both sides of the IGBT cover (11). A limiting groove matching the limiting buckle is provided on the air duct housing (1). The IGBT cover (11) is engaged with the air duct housing (1) through the cooperation of the limiting buckle and the limiting groove.

4. A circuit board mounting structure in a rear intake blower duct according to claim 1, wherein The IPM module includes an IPM substrate (12), and foam adhesive (13) is coated on the outer edge of the limiting opening (4). The IPM substrate (12) is bonded to the limiting opening (4) by the foam adhesive (13). The IPM wire (14) is connected to the outer plate surface of the IPM substrate (12). An IPM chip (15) is fixed on the inner plate surface of the IPM substrate (12). The IPM chip (15) passes through the limiting opening (4) and is placed inside the air duct housing (1).

5. A circuit board mounting structure in a rear intake blower duct according to claim 4, wherein The outer side of the IPM substrate (12) is provided with an IPM gland (16), the IPM substrate (12) is fixed between the IPM gland (16) and the limiting opening two (4), the two sides of the IPM gland (16) are fixed with limiting buckles two, the air duct shell (1) is provided with limiting card slots two matched with the limiting buckles two, the IPM gland (16) is clamped with the air duct shell (1) through the cooperation of the limiting buckles two and the limiting card slots two.

6. A circuit board mounting structure in a rear intake blower duct according to claim 1, wherein The air duct shell (1) is provided with a handle (6), and the main control board (5) is arranged in the handle (6).

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