Foreign matter cleaning device, rack and PCB press production line

By setting a base, brush assembly, and adsorption mechanism at the material rack unloading port, a foreign matter cleaning device is automatically removed from the PCB lamination process, solving the problems of low efficiency and high cost of manual inspection, and improving lamination quality and efficiency.

CN224309188UActive Publication Date: 2026-06-02HANS CNC SCI & TECH +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HANS CNC SCI & TECH
Filing Date
2025-04-07
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

In existing technologies, manual inspection is difficult to effectively remove tiny metal particles and foreign objects during PCB lamination, resulting in low efficiency and high cost, which affects lamination quality and equipment maintenance costs.

Method used

Design a foreign object cleaning device, including a base, a brush assembly and an adsorption mechanism, which is set at the material discharge port of the material rack. It automatically removes foreign objects from the material to be pressed by brushing and adsorption, preventing foreign objects from entering the hot press.

Benefits of technology

It achieves efficient and automatic removal of foreign objects, improves the yield and production efficiency of PCB lamination, reduces equipment maintenance costs, and does not increase the number of processes.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application relates to a foreign matter cleaning device, which is installed at the discharge port of a material rack body. The material rack body is provided with a support member for carrying the material to be pressed. The discharge port is located at one end of the support member. The foreign matter cleaning device includes a base, a brush assembly, and an adsorption mechanism. The base is installed at the discharge port and extends along the length of the discharge port. The lower surface of the base is higher than the upper surface of the support member. The brush assembly is installed on the base along the extension direction of the base, and the lower end of the brush assembly extends beyond the lower surface of the base. The adsorption mechanism is installed on the base along the extension direction of the base. That is, when the material to be pressed is discharged from the discharge port, the adsorption mechanism can automatically adsorb the metallic foreign matter on the material to be pressed, and the brush assembly can automatically brush away the remaining foreign matter on the material to be pressed, thus achieving automatic removal of foreign matter from the material to be pressed, which is highly efficient and low in cost.
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Description

Technical Field

[0001] This application relates to the field of PCB lamination technology, and in particular to foreign matter removal devices, material racks, and PCB lamination production lines. Background Technology

[0002] In the PCB lamination process, during the transportation of materials to be laminated (such as copper foil, prepreg, etc.) to the hot press by the rotating equipment, the vibration or friction of the rotating equipment often causes metal foreign objects such as gaskets, retaining rings, screws, and iron filings to fall off the materials to be laminated. If these foreign objects enter the hot press cavity, they are very likely to cause a series of problems such as scratches on the surface of the hot press plate and uneven lamination, ultimately leading to an increase in the defect rate of the finished PCB and increasing the maintenance cost of the equipment.

[0003] In related technologies, manual inspection is generally used to find and remove foreign objects. However, this method is difficult to effectively remove tiny metal particles and has problems of low efficiency and high cost. Utility Model Content

[0004] Therefore, it is necessary to provide a foreign object cleaning device, material rack, and PCB lamination production line to address the problems of difficulty in effectively removing tiny metal particles and low efficiency and high cost when using manual inspection to find and remove foreign objects.

[0005] A foreign object removal device is provided, wherein the foreign object removal device is disposed at the discharge port of a material rack body, the material rack body has a support member for supporting the material to be pressed, the discharge port is located at one end of the support member, and the foreign object removal device includes:

[0006] A base is disposed at the discharge port, the base extends along the length direction of the discharge port, and the lower surface of the base is higher than the upper surface of the support member;

[0007] A brush assembly is disposed on the base along the extension direction of the base, and the lower end of the brush assembly extends beyond the lower surface of the base for brushing off foreign matter on the material to be pressed.

[0008] An adsorption mechanism is disposed on the base along the extension direction of the base, and the adsorption mechanism is used to adsorb foreign matter on the material to be compressed.

[0009] In one embodiment, the adsorption mechanism is a magnet.

[0010] In one embodiment, the magnet is located at the end of the brush assembly away from the carrier.

[0011] In one embodiment, the number of magnets is multiple, and the multiple magnets are arranged at intervals along the extension direction of the base.

[0012] In one embodiment, the brush assembly includes a brush plate and brush heads respectively disposed on both sides of the brush plate in a vertical direction, the brush plate being disposed at the end of the base away from the carrier.

[0013] In one embodiment, the adsorption mechanism is located at the bottom of the base, the lower end of the brush head located at the bottom of the brush plate extends out of the adsorption mechanism, and the upper end of the brush head located at the top of the brush plate extends into the base.

[0014] A material rack includes a rack body and a foreign object cleaning device. The rack body includes multiple layers of support members spaced apart in a vertical direction. The foreign object cleaning device includes multiple cleaning units. Each cleaning unit includes a base, a brush assembly, and an adsorption mechanism. The upper part of each layer of support members is provided with a corresponding cleaning unit.

[0015] In one embodiment, the brush assembly includes a brush plate and brush heads respectively disposed on both sides of the brush plate in a vertical direction;

[0016] The brush body assembly and the carrier are staggered in the vertical direction, and the brush body assembly is provided on both sides of each carrier in the vertical direction.

[0017] In one embodiment, the material rack includes a lifting mechanism and a lifting platform connected to the lifting mechanism. The lifting platform is located on one side of the material rack's loading port. The lifting mechanism is fixed to the material rack body. The lifting platform is slidably connected to the material rack body in a vertical direction. The lifting mechanism is used to move the material to be pressed to the loading port of the material rack body through the lifting platform.

[0018] In one embodiment, the material rack includes a pushing mechanism disposed at one end of the lifting platform along a first direction. The pushing mechanism is used to push the material to be pressed from the lifting platform to the feeding port along the first direction, where the first direction is from the feeding port to the unloading port.

[0019] A PCB lamination production line includes a hot press and a material rack, the material rack being located upstream of the hot press.

[0020] The aforementioned foreign matter removal device, material rack, and PCB lamination production line have a base positioned at the feed inlet to allow the material to be laminated to pass through the foreign matter removal device as it is fed from the feed inlet. The lower surface of the base is higher than the upper surface of the support component, facilitating the feeding of the material between the base and the support component. The base extends along the length of the feed inlet, and an adsorption mechanism is positioned on the base along its extension direction. When the material to be laminated is fed from the feed inlet, the adsorption mechanism automatically adsorbs any metallic foreign objects on the material. A brush assembly is positioned on the base along its extension direction, with its lower end extending outside the base, meaning the brush assembly is located above the material to be laminated. When the material is fed from the feed inlet, the brush assembly automatically removes any remaining foreign objects from the material, preventing them from entering the hot pressing mechanism and affecting the lamination effect. This automatic removal of foreign objects from the material is highly efficient and cost-effective. In addition, this application sets the foreign object cleaning device at the unloading port of the material rack body. As long as the material to be pressed passes through the unloading port, foreign objects can be removed without increasing the process flow or interrupting the transportation of the material to be pressed. This ensures PCB lamination efficiency and improves the yield of laminated materials. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the material rack structure in one embodiment.

[0022] Figure 2 for Figure 1 A schematic diagram of the structure at point A in the middle.

[0023] Figure 3 This is a schematic diagram of the structure in one embodiment where the material to be pressed is moved out of the material rack body.

[0024] Figure 4 This is a schematic diagram of the cleaning unit in one embodiment.

[0025] Figure 5 This is a structural schematic diagram of the cross-section of the cleaning unit in one embodiment.

[0026] Reference numerals: 100, Material rack body; 110, Feeding port; 120, Discharging port; 130, Material to be pressed; 140, Supporting component; 200, Cleaning unit; 210, Base; 220, Brush assembly; 221, Brush plate; 222, Brush head; 230, Adsorption mechanism; 300, Lifting mechanism; 310, Lifting platform; 320, Pushing mechanism; 330, Lifting rope. Detailed Implementation

[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0028] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0033] See Figure 1 , Figure 2 as well as Figure 4 This application provides a foreign matter cleaning device in one embodiment. The foreign matter cleaning device is disposed at the discharge port 120 of the material rack body 100. The material rack body 100 is provided with a support member 140 for carrying the material 130 to be pressed. The discharge port 120 is located at one end of the support member 140. The foreign matter cleaning device includes a base 210, a brush assembly 220, and an adsorption mechanism 230. The base 210 is disposed at the discharge port 120 and extends along the length direction of the discharge port 120. The lower surface of the base 210 is higher than the upper surface of the support member 140. The brush assembly 220 is disposed on the base 210 along the extension direction of the base 210, and the lower end of the brush assembly 220 extends beyond the lower surface of the base 210 for brushing away foreign matter on the material 130 to be pressed. The adsorption mechanism 230 is disposed on the base 210 along the extension direction of the base 210 for adsorbing foreign matter on the material 130 to be pressed.

[0034] In this embodiment, the base 210 is disposed at the discharge port 120 so that the material to be pressed 130 can pass through the foreign matter removal device when it is discharged from the discharge port 120. The lower surface of the base 210 is higher than the upper surface of the support member 140 so that the material to be pressed 130 can be discharged between the base 210 and the support member 140. The base 210 extends along the length of the feed port 120, and the adsorption mechanism 230 is disposed on the base 210 along the extension direction of the base 210. When the material to be pressed 130 is fed from the feed port 120, the adsorption mechanism 230 can automatically adsorb the metal foreign objects on the material to be pressed 130. The brush assembly 220 is disposed on the base 210 along the extension direction of the base 210, and the lower end of the brush assembly 220 extends outside the base 210, that is, the brush assembly 220 is located above the material to be pressed 130. When the material to be pressed 130 is fed from the feed port 120, the brush assembly 220 can automatically brush away the remaining foreign objects on the material to be pressed 130, preventing foreign objects from entering the hot pressing mechanism and affecting the lamination effect. It can also realize the automatic removal of foreign objects on the material to be pressed 130, which is highly efficient and low in cost. In addition, this application sets the foreign object cleaning device at the unloading port 120 of the material rack body 100. As long as the material to be pressed 130 passes through the unloading port 120, foreign objects can be removed without increasing the process flow or interrupting the transmission of the material to be pressed 130. This ensures PCB lamination efficiency and improves the yield of the material to be pressed 130.

[0035] In some embodiments, the adsorption mechanism 230 is a magnet.

[0036] In this embodiment, the adsorption mechanism 230 is a magnet. When the material to be pressed 130 is discharged from the discharge port 120, the magnet can automatically adsorb the metal objects on the material to be pressed 130, thereby removing the metal objects from the material to be pressed 130. The magnet is located above the material to be pressed 130 and spaced apart from it, so that the material to be pressed 130 can be discharged from the bottom of the magnet. Specifically, the distance between the magnet and the material to be pressed 130 can be related to the magnetic attraction force generated by the magnet's magnetism. For example, when the distance between the magnet and the material to be pressed 130 is large, a stronger magnet can be used; when the distance between the magnet and the material to be pressed 130 is small, a weaker magnet can be used.

[0037] In some other embodiments, the adsorption mechanism 230 can also be an electrostatic adsorption mechanism 230, which can also adsorb metal objects on the material to be pressed 130.

[0038] In other embodiments, the adsorption mechanism 230 may also be a vacuum adsorption mechanism 230, which is used to adsorb small particles on the material to be compressed 130, and the brush assembly 220 is used to brush off large particles on the material to be compressed 130.

[0039] Furthermore, the magnet is located at the end of the brush assembly 220 away from the carrier 140.

[0040] In this embodiment, the magnet is located at the end of the brush assembly 220 away from the carrier 140. That is, when the material to be pressed 130 is discharged, it first passes through the magnetic attraction of the magnet to adsorb the metal particles on the material to be pressed 130, and then passes through the brush assembly 220 to brush away the remaining foreign matter that was not magnetically attracted, so as to ensure that there are no metal particles on the surface of the material to be pressed 130 after passing through the foreign matter cleaning device.

[0041] Combination Figure 4 Specifically, there are multiple magnets, which are arranged at intervals along the extension direction of the base 210.

[0042] In this embodiment, there are multiple magnets, which are spaced apart on the base 210 along the extension direction of the base 210. For foreign objects between two adjacent magnets, both adjacent magnets can be attracted, which means that while ensuring the cleaning effect, the amount of magnets used can be reduced and the cost can be lowered.

[0043] Combination Figure 2 In some embodiments, the brush body assembly 220 includes a brush plate 221 and brush heads 222 respectively disposed on both sides of the brush plate 221 along the vertical direction, with the brush plate 221 disposed at the end of the base 210 away from the support member 140.

[0044] In this embodiment, the brush plate 221 is located at the end of the base 210 away from the support member 140, which facilitates fixing the two ends of the base 210 near the support member 140 to the material rack body. Brush heads 222 are respectively provided at both ends of the brush plate 221 in the vertical direction. The upper brush head 222 is used to clean the lower surface of the upper layer of material to be pressed 130, and the lower brush head 222 is used to clean the upper surface of the lower layer of material to be pressed 130. The brush head 222 can be a bristle brush, a silicone brush, a serrated soft brush head, or a sponge block.

[0045] Combination Figure 5 Furthermore, the adsorption mechanism 230 is located at the bottom of the base 210, the lower end of the brush head 222 located at the bottom of the brush plate 221 extends out of the adsorption mechanism 230, and the upper end of the brush head 222 located at the top of the brush plate 221 extends into the base 210.

[0046] In this embodiment, the vertical width of the brush plate 221 is equal to the sum of the thickness of the base and the thickness of the magnet. The lower end of the brush head 222 located at the bottom of the brush plate 221 extends out of the magnet, and the upper end of the brush head 222 located at the top of the brush plate 221 extends into the base 210. This prevents the magnet from obstructing the brush head 222 at the bottom of the brush plate 221, and also prevents the base from obstructing the brush head 222 at the top of the brush plate 221, thus avoiding any impact on the brushing effect of the brush head 222. Furthermore, because the brush head 222 has a flexible characteristic, it is convenient to clean materials of different thicknesses to be pressed.

[0047] Combination Figure 1 and Figure 3 One embodiment of this application provides a material rack, which includes a material rack body 100 and a foreign object cleaning device. The material rack body 100 includes multiple layers of support members 140 arranged at intervals along the vertical direction. The foreign object cleaning device includes multiple cleaning units 200. Each cleaning unit 200 includes a base 210, a brush assembly 220 and an adsorption mechanism 230. The upper part of each layer of support member 140 is respectively provided with a corresponding cleaning unit 200.

[0048] In this embodiment, the rack is used to stack the materials 130 to be pressed. Therefore, multiple layers of support members 140 are arranged vertically at intervals on the rack body 100, and each layer of support member 140 is used to place the materials 130 to be pressed. When multiple layers of materials 130 to be pressed are discharged from the discharge port 120 at the same time, a cleaning unit 200 is provided above each material 130 to be pressed, and each cleaning unit 200 is used to clean foreign objects on the corresponding material to be pressed. Specifically, when the material to be laminated 130 is fed from the feeding port 120, the adsorption mechanism 230 can automatically adsorb the metal foreign objects on the material to be laminated 130; the brush assembly 220 is arranged on the base 210 along the extension direction of the base 210, and the lower end of the brush assembly 220 extends outside the base 210, that is, the brush assembly 220 is located above the material to be laminated 130. When the material to be laminated 130 is fed from the feeding port 120, the brush assembly 220 can automatically brush away the remaining foreign objects on the material to be laminated 130, preventing foreign objects from entering the hot pressing mechanism and affecting the lamination effect. In addition, this application sets the foreign object cleaning device at the feeding port 120 of the material rack body 100. As long as the material to be laminated 130 passes through the feeding port 120, foreign objects can be removed without increasing the process flow or interrupting the transportation of the material to be laminated 130, which ensures PCB lamination efficiency and improves the yield of laminated materials.

[0049] Furthermore, the brush body assembly 220 includes a brush plate 221 and brush heads 222 respectively disposed on both sides of the brush plate 221 in the vertical direction; the brush body assembly 220 and the carrier 140 are staggered in the vertical direction, and each carrier 140 is provided with a brush body assembly 220 on both sides in the vertical direction.

[0050] In this embodiment, the brush body assembly 220 and the carrier member 140 are staggered in the vertical direction. The number of brush body assemblies 220 is greater than the number of carrier members 140. For example, there are 13 carrier members 140 and 14 brush body assemblies 220, so that each carrier member 140 is provided with brush body assemblies 220 on both sides in the vertical direction. At the same time, since each brush plate 221 is provided with brush heads 222 on the upper and lower sides, the upper brush head 222 is used to clean the lower surface of the material to be pressed 130 of the previous layer, and the lower brush head 222 is used to clean the upper surface of the material to be pressed 130 of the next layer. This ensures that foreign objects on the upper and lower surfaces of the material to be pressed 130 after passing through the brush body assembly 220 can be removed, thereby ensuring the cleaning effect of the foreign object cleaning device.

[0051] In some embodiments, the material rack includes a lifting mechanism 300 and a lifting platform 310. The lifting platform 310 is located on one side of the material rack's loading port 110. The lifting mechanism 300 is fixed to the material rack body 100. The lifting platform 310 is slidably connected to the material rack body 100 in the vertical direction. The lifting mechanism 300 is connected to the lifting platform 310. The lifting mechanism 300 is used to move the material to be pressed 130 to the loading port 110 of the material rack body 100 through the lifting platform 310.

[0052] In this embodiment, the lifting mechanism 300 can be a motor. The motor drives the lifting platform 310 to slide vertically through the lifting rope 330. The bottom of the material rack body 100 is provided with a pulley. One end of the conveyor belt is wound around the output shaft of the motor, and the other end is wound around the pulley. Both ends of the lifting rope 330 are connected to the lifting platform 310. When the motor drives the transmission belt, the transmission belt can drive the lifting platform 310 to rise or fall.

[0053] In some other embodiments, the lifting mechanism 300 may also be a telescopic mechanism such as a cylinder or an electric cylinder, with its telescopic end connected to the lifting platform 310, for directly driving the lifting platform 310 to slide in the vertical direction.

[0054] In some embodiments, the material rack includes a pushing mechanism 320, which is disposed at one end of the lifting platform 310 along a first direction. The pushing mechanism 320 is used to push the material to be pressed 130 from the lifting platform 310 to the loading port 110 along the first direction, where the first direction is from the loading port 110 to the unloading port 120.

[0055] In actual use, the motor first rotates to lower the lifting platform 310, then the material to be pressed 130 is placed on the lifting platform 310. Next, the motor rotates again to raise the lifting platform 310, lifting the material to be pressed 130 to the feeding port 110. Then, the pushing mechanism 320 pushes the material to be pressed 130 onto the carrier 140 along the first direction. It should also be noted that the material rack is provided with multiple layers of carriers 140 arranged vertically. When placing the material to be pressed 130, the lifting platform 310 is first raised to be flush with the bottom carrier 140, and the material to be pressed 130 is placed on the bottom carrier 140. Then, the position of the lifting platform 310 is raised sequentially so that the material to be pressed 130 is placed on the carriers 140 from bottom to top.

[0056] One embodiment of this application also discloses a PCB lamination production line, which includes a hot press and a material rack, with the material rack located upstream of the hot press. That is, after foreign objects are removed from the material rack, the material to be lamination 130 enters the hot press for hot pressing. This avoids foreign objects scratching the surface of the hot press plate during hot pressing, as well as uneven lamination caused by foreign objects.

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A foreign object removal device, characterized in that, The foreign object cleaning device is installed at the discharge port of the material rack body. The material rack body has a support member for supporting the material to be pressed. The discharge port is located at one end of the support member. The foreign object cleaning device includes: A base is disposed at the discharge port, the base extends along the length direction of the discharge port, and the lower surface of the base is higher than the upper surface of the support member; A brush assembly is disposed on the base along the extension direction of the base, and the lower end of the brush assembly extends beyond the lower surface of the base for brushing off foreign matter on the material to be pressed. An adsorption mechanism is disposed on the base along the extension direction of the base, and the adsorption mechanism is used to adsorb foreign matter on the material to be compressed.

2. The foreign object removal device according to claim 1, characterized in that, The adsorption mechanism is a magnet.

3. The foreign object removal device according to claim 2, characterized in that, The magnet is located at the end of the brush assembly away from the carrier.

4. The foreign object removal device according to claim 2, characterized in that, The number of magnets is multiple, and the multiple magnets are arranged at intervals along the extension direction of the base.

5. The foreign object removal device according to claim 1, characterized in that, The brush assembly includes a brush plate and brush heads respectively disposed on both sides of the brush plate along the vertical direction, the brush plate being disposed at the end of the base away from the support member.

6. The foreign object removal device according to claim 5, characterized in that, The adsorption mechanism is located at the bottom of the base, the lower end of the brush head located at the bottom of the brush plate extends out of the adsorption mechanism, and the upper end of the brush head located at the top of the brush plate extends into the base.

7. A material rack, characterized in that, The material rack includes a material rack body and a foreign object cleaning device as described in any one of claims 1-6. The material rack body includes multiple layers of support members arranged at intervals along the vertical direction. The foreign object cleaning device includes multiple cleaning units. Each cleaning unit includes a base, a brush assembly, and an adsorption mechanism. The upper part of each layer of support members is provided with a corresponding cleaning unit.

8. The material rack according to claim 7, characterized in that, The brush assembly includes a brush plate and brush heads respectively disposed on both sides of the brush plate along the vertical direction; The brush body assembly and the carrier are staggered in the vertical direction, and the brush body assembly is provided on both sides of each carrier in the vertical direction.

9. The material rack according to claim 7, characterized in that, The material rack includes a lifting mechanism and a lifting platform connected to the lifting mechanism. The lifting platform is located on one side of the material rack's loading port. The lifting mechanism is fixed to the material rack body. The lifting platform is slidably connected to the material rack body in the vertical direction. The lifting mechanism is used to move the material to be pressed to the loading port of the material rack body through the lifting platform.

10. The material rack according to claim 9, characterized in that, The material rack includes a pushing mechanism, which is disposed at one end of the lifting platform along a first direction. The pushing mechanism is used to push the material to be pressed from the lifting platform to the feeding port along the first direction, where the first direction is from the feeding port to the unloading port.

11. A PCB lamination production line, characterized in that, It includes a hot press and a material rack as described in any one of claims 7-10, wherein the material rack is located upstream of the hot press.