An adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings

Abstract

This utility model discloses an adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings, including a magnet, a guide rail, a receiving platform, an upper fixed sleeve, a positioning locking sleeve, a lower fixed sleeve, rubber feet, a detachable stainless steel rod, a rubber anti-collision wall, a magnetic blocking wall, a rubber buffer pad, a spring, a screw rotating handle, a foldable lifting rod, a lifting rod outer cylinder, and a base. The magnet is attracted to the exit side of the stamping die; the feeding end of the guide rail is attracted to the magnet; a receiving platform is provided below the discharge end of the guide rail; a detachable stainless steel rod is provided at the center of the upper surface of the receiving platform; one rubber anti-collision wall and one magnetic blocking wall are provided on the edge of the receiving platform; a rubber buffer pad is provided inside the receiving platform; a foldable lifting rod is provided at the lower end of the receiving platform; a lifting rod outer cylinder is provided at the bottom of the foldable lifting rod; a base is provided at the bottom end of the lifting rod outer cylinder; and rubber feet are provided on the bottom surface of the base.

Description

Technical Field

[0001] This utility model belongs to the technical field of precious metal alloy material processing equipment, and further to the technical field of material stamping and forming equipment. Specifically, it relates to an adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings that is simple in structure and easy to operate. Background Technology

[0002] Ultra-thin precious metal alloy solder rings are a widely used product. The current manufacturing process for ultra-thin precious metal alloy solder rings involves: stamping the rings using a die, while the solder rings fall from the side or bottom of the stamping die into a receiving box, followed by manual collection, stacking, and packaging. This manufacturing process has the following drawbacks:

[0003] 1. Due to its thinness, the ultra-thin precious metal alloy solder ring has poor resistance to deformation. After the solder ring comes out of the stamping die, it is at a certain height from the receiving box. Due to the large height difference, the solder ring is very easy to deform or bend at the edges during the blanking process.

[0004] 2. After the solder rings arrive at the receiving box, they need to be collected, sorted, and packaged manually one by one. This process can easily cause scratches on the surface of the solder rings. Furthermore, this method of receiving materials results in low production efficiency, requires real-time manual stacking, and leads to significant product damage.

[0005] Therefore, the key to solving this problem is to research and develop an adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings that is simple in structure and easy to operate. Utility Model Content

[0006] The purpose of this invention is to provide an adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings that is simple in structure and easy to operate.

[0007] The purpose of this utility model is achieved as follows: It includes a magnet, a guide rail, a receiving platform, an upper fixing sleeve, a positioning locking sleeve, a lower fixing sleeve, rubber feet, a detachable stainless steel rod, a rubber anti-collision wall, a magnetic blocking wall, a rubber buffer pad, a spring, a screw rotating handle, a foldable lifting rod, a lifting rod outer cylinder, and a base. The magnet is attracted to the exit side of the stamping die; the feed end of the guide rail is attracted to the magnet; a receiving platform is provided below the discharge end of the guide rail; a detachable stainless steel rod is provided at the center of the upper surface of the receiving platform; the detachable stainless steel rod is aligned with the center point of the hollowed-out lower end of the guide rail; one rubber anti-collision wall and one magnetic blocking wall are provided on the edge of the receiving platform; the rubber anti-collision wall and... A semi-cylindrical box is formed by magnetic blocking walls; a rubber buffer pad is installed inside the receiving platform; a spring is installed between the receiving platform and the rubber buffer pad; a foldable lifting rod is installed at the lower end of the receiving platform; the foldable lifting rod includes a body and a top connector, which are fastened together by a screw and a rotating handle; the top connector of the foldable lifting rod is fastened to the receiving platform by an upper fixing sleeve; a lifting rod outer cylinder is installed at the bottom of the foldable lifting rod; the foldable lifting rod and the lifting rod outer cylinder are locked together by a positioning locking sleeve; a base is installed at the bottom end of the lifting rod outer cylinder; the lifting rod outer cylinder and the base are fastened together by a lower fixing sleeve; four rubber feet are installed on the bottom surface of the base.

[0008] This utility model comprises a magnet, a guide rail, a receiving platform, an upper fixed sleeve, a positioning locking sleeve, a lower fixed sleeve, rubber feet, a detachable stainless steel rod, a rubber anti-collision wall, a magnetic blocking wall, a rubber buffer pad, a spring, a screw rotating handle, a foldable lifting rod, a lifting rod outer cylinder, and a base. The discharge end of the guide rail has a hollow structure, which facilitates the drop of ultra-thin precious metal alloy solder rings onto the receiving platform below. The surface of the middle sliding groove of the guide rail is polished to a mirror finish, allowing the solder rings to slide freely without damaging their surface. The detachable stainless steel rod can be removed from above the receiving platform, making it easy to neatly remove the solder rings when the platform is full. The rubber anti-collision wall and the magnetic blocking wall form a semi-cylindrical box, which effectively prevents the solder rings from being damaged when they fall and also facilitates observation of the product receiving status. The magnetic blocking wall is attached to the guide rail to prevent the receiving platform from shaking or shifting. A connection is made between the receiving platform and the rubber buffer pad. The spring lifts the rubber buffer pad at the beginning of the material collection process, minimizing the distance between the rubber buffer pad and the guide rail. As the material collection progresses, the rubber buffer pad slowly and automatically descends under the gravity of the solder ring, effectively reducing the height from which the solder ring slides freely from the guide rail to the rubber buffer pad, thus preventing violent impacts between the solder rings. The foldable lifting rod can extend and retract freely. After adjusting the material collection height, the position of the foldable lifting rod can be secured by rotating the handle with a screw. The lower end of the foldable lifting rod is locked to the top of the outer cylinder of the lifting rod through a positioning locking sleeve. When adjusting the overall height of the material collection platform, first loosen the positioning locking sleeve, then adjust the position of the foldable lifting rod up or down along the outer cylinder of the lifting rod. After confirming the position, simply tighten the positioning locking sleeve. Four rubber feet are provided on the bottom surface of the base to prevent the device from shifting.

[0009] This invention achieves soft solder ring collection by adding a guide rail, avoiding solder ring deformation or edge twisting damage caused by height differences in traditional collection methods. The rubber buffer pad adaptively adjusts its height in real time via a spring, effectively reducing the height difference between the guide rail and the rubber buffer pad. The magnetic blocking wall can engage with the outlet of the upper guide rail to prevent the collection platform from shaking or shifting.

[0010] Application method of this utility model:

[0011] First, attach the feed end of the guide rail to a suitable position at the discharge port of the stamping die; second, install the receiving platform and other parts below the discharge port of the guide rail; finally, adjust the height of the foldable lifting rod until the magnetic blocking wall is attracted to the discharge port of the guide rail.

[0012] Example 1: The ultra-thin precious metal alloy material formed by stamping is AgCu, with a single sheet thickness of about 0.2mm and an outer diameter of about 35mm. Using this utility model, AgCu ultra-thin solder ring adaptive intelligent control of material collection can be realized. The material collection process does not require manual labor, is automatically stacked, has no damage, and has high production efficiency.

[0013] Example 2: The ultra-thin precious metal alloy material formed by stamping is AgCuNi, with a single sheet thickness of about 0.25mm and an outer diameter of about 25mm. Using this utility model, the AgCuNi ultra-thin solder ring can achieve adaptive intelligent control of material collection. The material collection process does not require manual labor, is automatically stacked, has no damage, and has high production efficiency.

[0014] The solder ring produced by this invention will not deform or suffer edge twisting damage, resulting in high product quality. Furthermore, the solder ring features adaptive intelligent control for material collection, leading to high production efficiency.

[0015] This invention has a simple structure and is easy to operate, enabling adaptive intelligent control of the collection of ultra-thin precious metal alloy solder rings. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 for Figure 1 Left-view diagram.

[0018] In the diagram: 1-Stamping die, 2-Magnet, 3-Guide rail, 4-Receiving platform, 5-Upper fixing sleeve, 6-Positioning locking sleeve, 7-Lower fixing sleeve, 8-Rubber foot pad, 9-Removable stainless steel rod, 10-Rubber anti-collision wall, 11-Magnetic blocking wall, 12-Rubber buffer pad, 13-Spring, 14-Screw rotating handle, 15-Foldable lifting rod, 16-Lifting rod outer cylinder, 17-Base. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings, but this does not limit the present invention in any way. Any modifications made based on the teachings of the present invention shall fall within the protection scope of the present invention.

[0020] like Figures 1-2As shown, this utility model includes a magnet 2, a guide rail 3, a receiving platform 4, an upper fixing sleeve 5, a positioning locking sleeve 6, a lower fixing sleeve 7, rubber feet 8, a detachable stainless steel rod 9, a rubber anti-collision wall 10, a magnetic blocking wall 11, a rubber buffer pad 12, a spring 13, a screw rotating handle 14, a foldable lifting rod 15, a lifting rod outer cylinder 16, and a base 17. The magnet 2 is attracted to the exit side of the stamping die 1; the feeding end of the guide rail 3 is attracted to the magnet 2; a receiving platform 4 is provided below the discharge end of the guide rail 3; a detachable stainless steel rod 9 is provided at the center of the upper surface of the receiving platform 4; the detachable stainless steel rod 9 is aligned with the center point of the hollowed-out lower end of the guide rail 3; one rubber anti-collision wall 10 and one magnetic blocking wall 11 are provided on the edge of the receiving platform 4; the rubber anti-collision wall 10 and the magnetic blocking wall 11 are connected to each other. The wall 11 forms a semi-cylindrical box; a rubber buffer pad 12 is installed inside the receiving platform 4; a spring 13 is installed between the receiving platform 4 and the rubber buffer pad 12; a foldable lifting rod 15 is installed at the lower end of the receiving platform 4; the foldable lifting rod 15 includes a body and a top connector, and the body and the top connector are fastened together by a screw rotating handle 14; the top connector of the foldable lifting rod 15 is fastened to the receiving platform 4 by an upper fixing sleeve 5; a lifting rod outer cylinder 16 is installed at the bottom of the foldable lifting rod 15; the foldable lifting rod 15 and the lifting rod outer cylinder 16 are locked together by a positioning locking sleeve 6; a base 17 is installed at the bottom end of the lifting rod outer cylinder 16; the lifting rod outer cylinder 16 and the base 17 are fastened together by a lower fixing sleeve 7; four rubber foot pads 8 are installed on the bottom surface of the base 17.

[0021] The material guide rail 3 has an S-shaped groove structure.

[0022] The discharge end of the guide rail 3 is a hollow structure.

[0023] The surface of the middle sliding groove of the guide rail 3 is polished to a mirror finish.

[0024] The working principle and process of this utility model:

[0025] This utility model consists of a magnet 2, a guide rail 3, a receiving platform 4, an upper fixing sleeve 5, a positioning locking sleeve 6, a lower fixing sleeve 7, rubber feet 8, a detachable stainless steel rod 9, a rubber anti-collision wall 10, a magnetic blocking wall 11, a rubber buffer pad 12, a spring 13, a screw rotating handle 14, a foldable lifting rod 15, a lifting rod outer cylinder 16, and a base 17; the discharge end of the guide rail 3 has a hollow structure, which facilitates the ultra-thin precious metal alloy solder ring to fall onto the receiving platform 4 below; the middle of the guide rail 3... The sliding groove surface is polished to a mirror finish, allowing the solder rings to slide freely without damaging their surface. The detachable stainless steel rod 9 can be removed from above the receiving platform 4, facilitating the neat and orderly removal of solder rings when the platform is full. The rubber anti-collision wall 10 and the magnetic barrier wall 11 form a semi-cylindrical box, effectively preventing damage from falling solder rings and facilitating observation of the product receiving process. The magnetic barrier wall 11 adheres to the guide rail 3, preventing the receiving platform 4 from shaking or shifting. The receiving platform 4 and the rubber buffer pad 12... A spring 13 is installed between the material receiving and the guide rail 3. At the beginning of the material receiving process, the spring 13 lifts the rubber buffer pad 12, making the distance between the rubber buffer pad 12 and the guide rail 3 smaller. As the material receiving process proceeds, the rubber buffer pad 12 will slowly and automatically descend under the gravity of the solder ring, effectively reducing the height between the solder ring and the guide rail 3, and effectively avoiding violent impact between the solder rings. The foldable lifting rod 15 can extend and retract freely up and down. After the material receiving height is adjusted, the position of the foldable lifting rod 15 can be tightened by rotating the handle 14 with the screw. The lower end of the foldable lifting rod 15 is locked to the top of the lifting rod outer cylinder 16 through the positioning locking sleeve 6. When it is necessary to adjust the overall height of the receiving platform 4, the positioning locking sleeve 6 can be loosened first, and then the foldable lifting rod 15 can be adjusted up or down along the lifting rod outer cylinder 16. After confirming the position, only the positioning locking sleeve 6 needs to be tightened. Four rubber foot pads 8 are installed on the bottom surface of the base 17 to prevent the device from shifting.

[0026] This invention achieves soft take-up of the solder ring by adding a guide rail 3, avoiding deformation or edge twisting damage of the solder ring due to height differences in traditional take-up methods. The rubber buffer pad 12 adaptively adjusts its height in real time via a spring 13, effectively reducing the height difference between the material exiting the guide rail 3 and the rubber buffer pad 12. The magnetic blocking wall 11 can engage with the outlet of the upper guide rail 3 to prevent shaking or displacement of the take-up platform 4.

[0027] Application method of this utility model:

[0028] First, attach the feed end of the guide rail 3 to a suitable position at the discharge port of the stamping die 1; second, install parts such as the receiving platform 4 below the discharge port of the guide rail 3; finally, adjust the height of the foldable lifting rod 15 until the magnetic blocking wall 11 is attracted to the discharge port of the guide rail 3.

[0029] Example 1: The ultra-thin precious metal alloy material formed by stamping is AgCu, with a single sheet thickness of about 0.2mm and an outer diameter of about 35mm. Using this utility model, AgCu ultra-thin solder ring adaptive intelligent control of material collection can be realized. The material collection process does not require manual labor, is automatically stacked, has no damage, and has high production efficiency.

[0030] Example 2: The ultra-thin precious metal alloy material formed by stamping is AgCuNi, with a single sheet thickness of about 0.25mm and an outer diameter of about 25mm. Using this utility model, the AgCuNi ultra-thin solder ring can achieve adaptive intelligent control of material collection. The material collection process does not require manual labor, is automatically stacked, has no damage, and has high production efficiency.

Claims

1. An adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings, comprising a magnet (2), a guide rail (3), a receiving platform (4), an upper fixing sleeve (5), a positioning locking sleeve (6), a lower fixing sleeve (7), rubber feet (8), a detachable stainless steel rod (9), a rubber anti-collision wall (10), a magnetic blocking wall (11), a rubber buffer pad (12), a spring (13), a screw rotating handle (14), a foldable lifting rod (15), an outer cylinder of the lifting rod (16), and a base (17), characterized in that: The magnet (2) is attracted to the outlet side of the stamping die (1); the feed end of the guide rail (3) is attracted to the magnet (2); a receiving platform (4) is set below the discharge end of the guide rail (3); a detachable stainless steel rod (9) is set at the center of the upper surface of the receiving platform (4); the detachable stainless steel rod (9) is aligned with the center point of the hollowed-out lower end of the guide rail (3); a rubber anti-collision wall (10) and a magnetic blocking wall (11) are set on the edge of the receiving platform (4); the rubber anti-collision wall (10) and the magnetic blocking wall (11) form a semi-cylindrical box; a rubber buffer pad (12) is set inside the receiving platform (4); a spring (13) is set between the receiving platform (4) and the rubber buffer pad (12); A foldable lifting rod (15) is provided at the lower end of the receiving platform (4); the foldable lifting rod (15) includes a body and a top connector, and the body and the top connector are fastened together by a screw rotating handle (14); the top connector of the foldable lifting rod (15) is fastened to the receiving platform (4) by an upper fixing sleeve (5); the bottom of the foldable lifting rod (15) is provided with a lifting rod outer cylinder (16); the foldable lifting rod (15) and the lifting rod outer cylinder (16) are fastened together by a positioning locking sleeve (6); the bottom end of the lifting rod outer cylinder (16) is provided with a base (17); the lifting rod outer cylinder (16) and the base (17) are fastened together by a lower fixing sleeve (7); four rubber foot pads (8) are provided on the bottom surface of the base (17).

2. The adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings according to claim 1, characterized in that: The guide rail (3) has an S-shaped groove structure.

3. The adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings according to claim 1, characterized in that: The material guide rail (3) has a hollow structure at its discharge end.

4. The adaptive intelligent control receiving device for ultra-thin precious metal alloy solder rings according to claim 1, characterized in that: The surface of the middle sliding groove of the guide rail (3) is polished mirror.

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