A press plate structure of an integrated circuit package wire bonder

By improving the pressure plate structure of the welding equipment, the stability and flexibility of the pressure plate are enhanced, the problem of insufficient connection force of the pressure plate structure is solved, welding accuracy is ensured and waste is cleaned up, and stable positioning and convenient installation are achieved.

CN224309930UActive Publication Date: 2026-06-02CHENGDU AVIC HUACE TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHENGDU AVIC HUACE TECH CO LTD
Filing Date
2025-06-11
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

The pressure plate structure in existing welding equipment has insufficient connection force, which can easily reduce balance after long-term use, resulting in the inability to provide stable pressing force and potentially causing compression of integrated circuits.

Method used

A pressure plate structure for an integrated circuit packaging wire bonding machine was designed, including a limiting component, an adjusting screw, a guide hole, a fixing seat, fastening bolts, and a scraper. The combination of these components enhances the stability and flexibility of the pressure plate, ensures welding accuracy, and has the function of scraping off waste.

Benefits of technology

It achieves stable positioning and convenient installation of the pressure plate, improves welding accuracy, and effectively cleans up waste through the scraper, reducing environmental pollution.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224309930U_ABST
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Abstract

The utility model relates to integrated circuit packaging welding processing technical field discloses a kind of integrated circuit packaging wire bonding machine's pressing plate structure, including base, the both sides of base top end are fixedly connected with connecting seat, the front end and rear end of base top are all transversely fixedly connected with baffle, the inside of connecting seat is provided with the limiting component of strong effect connection.This integrated circuit packaging wire bonding machine's pressing plate structure is provided with connecting seat, round groove, pressing plate, adjusting screw, guide hole, round rod and socket, enhance the degree of agreement of socket outer end and round groove inner wall, and improve the stability of socket, effectively prevent socket outside downward inclination, ensure that pressing plate is in equilibrium state for a long time, the problem that the connecting force in the pressing plate structure inside in welding equipment is limited, and the balance of pressing plate is reduced after long-term use, leading to unable to provide stable pressing force, and it can cause extrusion to integrated circuit.
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Description

Technical Field

[0001] This utility model relates to the field of integrated circuit packaging and welding processing technology, specifically to a pressure plate structure for an integrated circuit packaging wire bonding machine. Background Technology

[0002] Integrated circuit chips are very fragile and easily affected by the external environment. The packaging and soldering process provides physical protection by encapsulating the chip in a shell with mechanical strength and temperature resistance, preventing damage to the chip from factors such as vibration, humidity, temperature changes and mechanical stress.

[0003] Welding equipment needs to limit and fix integrated circuits to ensure the accuracy of welding processing. However, the internal connection force of the pressure plate structure in current welding equipment is limited. After long-term use, the balance of the pressure plate is easily reduced, resulting in the inability to provide stable pressing force and causing compression to the integrated circuit.

[0004] Therefore, a novel pressure plate structure for an integrated circuit packaging wire bonding machine is proposed to solve the above problems. Utility Model Content

[0005] The purpose of this utility model is to provide a pressure plate structure for an integrated circuit packaging wire bonding machine, so as to solve the problem that the internal connection force of the pressure plate structure in the welding equipment mentioned in the background art is limited, and the balance of the pressure plate is easily reduced after long-term use, resulting in the inability to provide stable pressing force and causing compression to the integrated circuit.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a pressure plate structure for an integrated circuit packaging wire bonding machine, including a base, connecting seats fixedly connected to both sides of the top of the base, baffles fixedly connected laterally to the front and rear ends of the top of the base, and a strong connection limiting component provided on the inner side of the connecting seat;

[0007] The limiting component includes a pressure plate. The inner side of the connecting seat is recessed with a circular groove. A circular rod is fixedly connected to the inner wall of the circular groove. A socket is sleeved and fixed to the front and rear ends of the circular rod. The socket passes through the side wall of the connecting seat laterally. A guide hole is opened through the inner side of the socket. An adjusting screw is threaded through the inner side of the guide hole. The top end of the pressure plate is movably connected to the bottom end of the adjusting screw.

[0008] As a further technical solution of this utility model, a first knob is fixedly connected to the top of the adjusting screw, the two sets of pressure plates are symmetrically distributed about the vertical center line of the base, and an anti-slip pad is fixedly connected to the bottom of the base.

[0009] As a further technical solution of this utility model, the front end and the rear end of the base are fixedly connected to an external plate, and the two sides of the external plate are symmetrically fixedly connected to a fixed seat. The inner end of the fixed seat is fixedly connected to the outer end of the base. The top and bottom of the outer end of the fixed seat are fixedly connected to a fixed block. The outer end of the fixed block is fixedly connected to a limit frame, and the limit frame is sleeved on the outside of the fixed seat. The inner end of the limit frame is fixedly connected to the outer end of the base.

[0010] As a further technical solution of this utility model, fastening bolts are vertically arranged through both sides inside the outer plate, and a second knob is fixedly connected to the top of the fastening bolts.

[0011] As a further technical solution of this utility model, the inner end of the baffle is provided with horizontal mounting grooves on both sides, and the two sides of the baffle are fixedly connected with external seats, and the bottom end of the external seats is fixedly connected to the top end of the base.

[0012] As a further technical solution of this utility model, an auxiliary rod is slidably provided inside the external base, and a scraper is fixedly connected to the inner ends of the two sets of auxiliary rods. Positioning plates are fixedly connected to both sides of the outer end of the scraper. The positioning plates are inserted into the interior of the mounting groove, and handles are fixedly connected to both sides of the top of the scraper.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the pressure plate structure of the integrated circuit packaging wire bonding machine not only realizes the safety limiting function and the easy fixing function, but also realizes the scraping function;

[0014] (1) By setting a connecting seat, a circular groove, a pressure plate, an adjusting screw, a guide hole, a circular rod and a socket, the circular rod is fixedly installed inside the corresponding circular groove, and the socket is sleeved and fixed on the outside of both ends of the circular rod, which enhances the fit between the outer end of the socket and the inner wall of the circular groove and improves the stability of the socket, effectively prevents the outer side of the socket from tilting downward, and ensures that the pressure plate is in a balanced state for a long time. The socket has a guide hole inside, which can be adjusted according to the thread direction of the inner wall of the guide hole to move the screw up and down, enhance the flexibility of the pressure plate, ensure that displacement occurs during the integrated circuit welding process, and improve the welding accuracy.

[0015] (2) By setting an outer plate, a fixed seat, a fixed block, a limit frame and fastening bolts, and adding an anti-slip pad to the bottom of the base, the anti-slip properties of the contact surface are enhanced. Multiple sets of fastening bolts are used to move through the interior of the outer plate, making it convenient to install and fix the overall structure in the welding equipment, ensuring the stability of the overall structure, and optimizing the disassembly and assembly method. The limit frame and the fixed seat cooperate with each other to improve the connection force between the outer plate and the base.

[0016] (3) By setting baffles, scrapers, auxiliary rods, positioning plates, mounting slots and handles, two sets of scrapers are located on the base surface. The auxiliary rods move stably inside the outer seat, which makes it easy to scrape off the waste on the base surface and reduce the harm to the environment caused by the accumulation of waste. The positioning plate is inserted and fixed in the corresponding mounting slot by the plug-in connection method to ensure that the scraper is fixed at the inner end of the baffle during the welding process. Attached Figure Description

[0017] Figure 1 This is a front view structural diagram of the present utility model;

[0018] Figure 2 This is a top view schematic diagram of the pressure plate structure of this utility model;

[0019] Figure 3 This is a front view structural diagram of the connector of this utility model;

[0020] Figure 4 This is a front view schematic diagram of the baffle structure of this utility model.

[0021] In the diagram: 1. Anti-slip pad; 2. Base; 3. Connecting seat; 4. Circular groove; 5. Circular rod; 6. First knob; 7. Adjusting screw; 8. Baffle; 9. Mounting slot; 10. Socket; 11. Guide hole; 12. Pressure plate; 13. Auxiliary rod; 14. Fixed seat; 15. Limiting bracket; 16. External plate; 17. Fastening bolt; 18. Fixing block; 19. Second knob; 20. External seat; 21. Handle; 22. Positioning plate; 23. Scraper. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 A pressure plate structure for an integrated circuit packaging wire bonding machine includes a base 2, with connecting seats 3 fixedly connected to both sides of the top of the base 2, and baffles 8 horizontally fixedly connected to the front and rear ends of the top of the base 2, and a strong connection limiting component provided on the inner side of the connecting seat 3.

[0024] The limiting component includes a pressure plate 12. A circular groove 4 is recessed inward on the inner side of the connecting seat 3. A circular rod 5 is fixedly connected to the inner wall of the circular groove 4. A socket 10 is sleeved and fixed at the front and rear ends of the circular rod 5. The socket 10 passes through the side wall of the connecting seat 3 laterally. A guide hole 11 is opened through the inner side of the socket 10. An adjusting screw 7 is threaded through the inner side of the guide hole 11. The top end of the pressure plate 12 is movably connected to the bottom end of the adjusting screw 7.

[0025] The top of the adjusting screw 7 is fixedly connected to the first knob 6, and the two sets of pressure plates 12 are symmetrically distributed about the vertical center line of the base 2. The bottom of the base 2 is fixedly connected to the anti-slip pad 1.

[0026] Specifically, such as Figure 1 and Figure 3 As shown, during use, the integrated circuit to be soldered is placed on the surface of the base 2, the round rod 5 is fixedly installed inside the corresponding round groove 4, and the socket 10 is sleeved and fixed on the outside of both ends of the round rod 5 to improve the fit between the outer end of the socket 10 and the inner wall of the round groove 4 and to improve the stability of the socket 10. After rotating the first knob 6 in sequence, the adjusting screw 7 is moved downward according to the thread direction of the inner wall of the guide hole 11 until the two sets of pressure plates 12 press on both sides of the top of the integrated circuit to ensure its stability.

[0027] An external plate 16 is fixedly connected to both the front and rear ends of the base 2. A fixed seat 14 is fixedly connected to both sides of the external plate 16. The inner end of the fixed seat 14 is fixedly connected to the outer end of the base 2. A fixed block 18 is fixedly connected to the top and bottom of the outer end of the fixed seat 14. A limit frame 15 is fixedly connected to the outer end of the fixed block 18, and the limit frame 15 is sleeved on the outside of the fixed seat 14. The inner end of the limit frame 15 is fixedly connected to the outer end of the base 2.

[0028] Fastening bolts 17 are vertically installed on both sides inside the outer plate 16, and a second knob 19 is fixedly connected to the top of the fastening bolts 17.

[0029] Specifically, such as Figure 1 and Figure 2 As shown, when in use, the base 2 is placed inside the welding equipment, and the anti-slip properties of the contact surface of the base 2 are enhanced by the anti-slip pad 1. The second knob 19 is rotated in sequence to move the fastening bolt 17 through the interior of the outer plate 16 to fix the base 2 in all directions.

[0030] The inner end of the baffle 8 has horizontally opened mounting grooves 9 on both sides, and the baffle 8 is fixedly connected to the two sides of the external base 20. The bottom end of the external base 20 is fixedly connected to the top end of the base 2.

[0031] An auxiliary rod 13 is slidably installed inside the external base 20. The inner ends of the two sets of auxiliary rods 13 are fixedly connected to scrapers 23. Positioning plates 22 are fixedly connected to both sides of the outer end of the scraper 23. The positioning plates 22 are inserted into the inside of the mounting groove 9. Handles 21 are fixedly connected to both sides of the top of the scraper 23.

[0032] Specifically, such as Figure 1 and Figure 4 As shown, when waste accumulates on the surface of the base 2 during use, the auxiliary rod 13 is pushed inward inside the outer seat 20, and the waste is concentrated and pushed to the center by the two sets of scrapers 23 for easy cleaning. During welding, the scraper 23 is pushed outward by the handle 21 until the positioning plate 22 is inserted and fixed in the mounting groove 9, and the scraper 23 is fixed at the inner end of the baffle 8.

[0033] Working Principle: In use, the base 2 is placed inside the welding equipment. The anti-slip pad 1 enhances the anti-slip properties of the base 2's contact surface. The second knob 19 is rotated sequentially to move the fastening bolt 17 through the interior of the outer plate 16, securing the base 2 in all directions. The integrated circuit to be welded is placed on the surface of the base 2. The round rod 5 is fixedly installed inside the corresponding round groove 4. The socket 10 is sleeved and fixed to the outside of both ends of the round rod 5, improving the fit between the outer end of the socket 10 and the inner wall of the round groove 4, and enhancing the socket 10's stability. For stability, turn the first knob 6 in sequence and move the adjusting screw 7 downward according to the thread direction of the inner wall of the guide hole 11 until the two sets of pressure plates 12 press on both sides of the top of the integrated circuit. When waste accumulates on the surface of the base 2, the auxiliary rod 13 pushes inward inside the outer seat 20 and pushes the waste to the center through the two sets of scrapers 23 for easy cleaning. During the welding process, push the scraper 23 outward through the handle 21 until the positioning plate 22 is inserted and fixed in the mounting groove 9, and fix the scraper 23 at the inner end of the baffle 8.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A pressure plate structure for an integrated circuit packaging wire bonding machine, comprising a base (2), characterized in that: Connecting seats (3) are fixedly connected to both sides of the top of the base (2). Baffles (8) are fixedly connected to the front and rear ends of the top of the base (2) in the horizontal direction. A limiting component with strong connection is provided on the inner side of the connecting seat (3). The limiting component includes a pressure plate (12), and a circular groove (4) is recessed inward on the inner side of the connecting seat (3). A circular rod (5) is fixedly connected to the inner wall of the circular groove (4). A socket (10) is sleeved and fixed to the front and rear ends of the circular rod (5). The socket (10) passes through the side wall of the connecting seat (3) laterally. A guide hole (11) is opened through the inner side of the socket (10). An adjusting screw (7) is threaded through the inner side of the guide hole (11). The top end of the pressure plate (12) is movably connected to the bottom end of the adjusting screw (7).

2. The pressure plate structure of an integrated circuit packaging wire bonding machine according to claim 1, characterized in that: The top of the adjusting screw (7) is fixedly connected to a first knob (6), the two sets of pressure plates (12) are symmetrically distributed about the vertical center line of the base (2), and the bottom of the base (2) is fixedly connected to an anti-slip pad (1).

3. The pressure plate structure of an integrated circuit packaging wire bonding machine according to claim 1, characterized in that: The front and rear ends of the base (2) are fixedly connected to an outer plate (16). The two sides of the outer plate (16) are symmetrically fixedly connected to a fixed seat (14). The inner end of the fixed seat (14) is fixedly connected to the outer end of the base (2). The top and bottom of the outer end of the fixed seat (14) are fixedly connected to a fixed block (18). The outer end of the fixed block (18) is fixedly connected to a limit frame (15), and the limit frame (15) is sleeved on the outside of the fixed seat (14). The inner end of the limit frame (15) is fixedly connected to the outer end of the base (2).

4. The pressure plate structure of an integrated circuit packaging wire bonding machine according to claim 3, characterized in that: The outer plate (16) has vertically penetrating fastening bolts (17) on both sides inside, and a second knob (19) is fixedly connected to the top of the fastening bolts (17).

5. The pressure plate structure of an integrated circuit packaging wire bonding machine according to claim 1, characterized in that: The inner end of the baffle (8) has horizontally opened mounting grooves (9) on both sides. The baffle (8) is fixedly connected to the two sides of the external base (20). The bottom end of the external base (20) is fixedly connected to the top end of the base (2).

6. The pressure plate structure of an integrated circuit packaging wire bonding machine according to claim 5, characterized in that: An auxiliary rod (13) is slidably provided inside the external base (20). The inner ends of the two sets of auxiliary rods (13) are fixedly connected to scrapers (23). Positioning plates (22) are fixedly connected to both sides of the outer end of the scraper (23). The positioning plates (22) are inserted into the interior of the mounting groove (9). Handles (21) are fixedly connected to both sides of the top of the scraper (23).