Thermal insulation film and window structure

Abstract

The utility model provides a kind of heat insulation film and the window structure comprising it, the heat insulation film includes: heat insulation pattern, which is separated apart from each other;And separation line, which divides the heat insulation pattern, the separation line includes: mutually mirror-symmetrical first row direction separation line and second row direction separation line;And mutually mirror-symmetrical first column direction separation line and second column direction separation line.

Description

Technical Field

[0001] This utility model relates to a heat insulation film and a window structure. More specifically, it relates to a heat insulation film and a window structure comprising multiple heat insulation patterns. Background Technology

[0002] Recently, Low-E glass (low-emissivity glass), with its high thermal insulation properties, has been used in building facades, windows, and vehicle windows to improve heating and cooling efficiency and energy efficiency. Low-E glass offers superior thermal insulation due to the metallic coating formed on its surface. However, this metallic coating may impede or block the movement of electromagnetic waves, thereby increasing electromagnetic wave loss in objects with the Low-E glass attached.

[0003] For example, with the development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth are being applied to or integrated into image display devices, electronic devices, buildings, the Internet of Things (IoT), and autonomous vehicles. Furthermore, with the recent evolution of mobile communication technologies, antennas for high-frequency or ultra-high-frequency communication are being widely used. For instance, Wi-Fi operating in the 2.4GHz and 5GHz bands, Bluetooth operating in the 2.45GHz band, and 5G (5th-generation) communication systems operating in high-frequency bands (e.g., above 28GHz) are being commercialized.

[0004] However, high-frequency or ultra-high-frequency electromagnetic waves have high transmission speeds and short wavelengths, which can lead to loss, attenuation, or dissipation when passing through building windows or car windows. As a result, the signal efficiency and coverage of the antenna may be reduced.

[0005] When electromagnetic wave transmission zones are incorporated into Low-E glass to compensate for signal loss, thermal insulation may be reduced. Furthermore, these transmission zones may also cause optical inhomogeneities, thereby reducing the window's transparency and visual characteristics.

[0006] For example, Korean Patent Publication No. 10-2013-0048132 discloses a heat insulation film, but does not take into account the transmittance of electromagnetic waves. Utility Model Content

[0007] One objective of this invention is to provide a heat insulation film with improved radio wave transmittance and heat insulation properties.

[0008] Another objective of this invention is to provide a window structure with improved radio wave transmittance and thermal insulation.

[0009] The technical solution of this utility model for solving the above-mentioned problems is as follows.

[0010] This utility model provides a heat insulation film, comprising: heat insulation patterns that are spaced apart from each other; and separation lines that divide the heat insulation patterns, the separation lines comprising: a first row direction separation line and a second row direction separation line that are mirror-symmetrical to each other; and a first column direction separation line and a second column direction separation line that are mirror-symmetrical to each other.

[0011] In this configuration, row direction line pairs are defined by adjacent first row direction separation lines and second row direction separation lines, and multiple row direction line pairs are repeated along the column direction. Similarly, column direction line pairs are defined by adjacent first column direction separation lines and second column direction separation lines, and multiple column direction line pairs are repeated along the row direction.

[0012] The first row of directional separation lines and the second row of directional separation lines are respectively wavy lines with the same period.

[0013] The first column of directional separation lines and the second column of directional separation lines are respectively wavy lines with the same period.

[0014] The heat insulation pattern includes a first heat insulation pattern and a second heat insulation pattern having different shapes from each other.

[0015] The first heat insulation pattern and the second heat insulation pattern are arranged alternately and repeatedly along the column direction and along the row direction.

[0016] The first heat insulation pattern repeats periodically, and the second heat insulation pattern repeats periodically.

[0017] The unit unit is defined by a complete heat insulation pattern and the segmented portions of the heat insulation patterns arranged around the periphery of the heat insulation pattern, and the unit unit is repeated along the row and column directions.

[0018] The unit includes a pair of first column direction separation line segments and a second column direction separation line segment, as well as a pair of first row direction separation line segments and a second row direction separation line segment.

[0019] The first column direction separation line segment and the second column direction separation line segment are mirror images of each other, and the first row direction separation line segment and the second row direction separation line segment are mirror images of each other.

[0020] The segmented portion of the heat insulation pattern includes a first heat insulation pattern segment and a second heat insulation pattern segment with different shapes. Within the unit, the first heat insulation pattern segment and the second heat insulation pattern segment are alternately arranged in a clockwise or counterclockwise direction around the periphery of a heat insulation pattern.

[0021] The segmented portions of the heat insulation pattern are arranged symmetrically within the unit cell relative to a virtual line passing through the center of the heat insulation pattern.

[0022] The heat insulation pattern includes a solid metal layer.

[0023] In addition, the present invention provides a window structure, including: a window substrate; and a heat insulation film disposed on the window substrate according to the above embodiments.

[0024] The window substrate includes a first window substrate and a second window substrate facing each other, and the heat insulation film is attached to one of the first window substrate and the second window substrate.

[0025] The window structure also includes a gas layer formed between the first window substrate and the second window substrate.

[0026] The effects of this utility model are as follows.

[0027] The heat insulation film of this invention may include a heat insulation layer formed by a regular arrangement of multiple unit cells. The heat insulation layer may include separation lines with a wavy shape. The non-uniformity of shape caused by the separation lines and the regularity of the unit cell arrangement are both incorporated into the heat insulation layer. Therefore, moiré and light scattering phenomena occurring in the heat insulation film can be suppressed, and light transmittance can be improved.

[0028] The heat insulation layer may include an island-shaped heat insulation pattern defined by the separation lines. This can improve the electromagnetic wave transmittance characteristics of the heat insulation film.

[0029] The separation lines can be arranged such that adjacent separation lines are mirror images of each other. Therefore, the thermal resistance and insulation properties of the heat-insulating film can be improved, while optical inhomogeneities or optical defects such as starburst phenomena can be reduced. Attached Figure Description

[0030] Figure 1 and Figure 2 These are schematic cross-sectional views and plan views illustrating exemplary embodiments of the heat insulation film.

[0031] Figure 3 This is a schematic, partially enlarged plan view of a unit cell used to illustrate an exemplary embodiment.

[0032] Figure 4 This is a schematic cross-sectional view illustrating an exemplary embodiment of a heat-insulating film.

[0033] Figure 5 and Figure 6 These are schematic cross-sectional views illustrating window structures of exemplary embodiments.

[0034] Figure 7 This is a schematic plan view showing the heat insulation film of Comparative Example 2. Detailed Implementation

[0035] An embodiment of this utility model provides a heat insulation film including a conductive pattern.

[0036] The embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. However, the following drawings accompanying this specification illustrate preferred embodiments of the present invention and, together with the foregoing description, help to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as limited to the matters described in these drawings.

[0037] The terms "upper part", "lower part", "above", and "bottom surface" used in this utility model refer to the relative positions of the components and do not imply an absolute vertical relationship.

[0038] In this application, the first direction and the second direction can refer to two directions parallel to the top surface of the heat insulation film and perpendicular to each other. For example, the first direction can refer to the row direction, the X direction, or the width direction. The second direction can refer to the column direction, the Y direction, or the length direction.

[0039] Figure 1 and Figure 2 These are schematic cross-sectional views and plan views illustrating exemplary embodiments of the heat insulation film.

[0040] Reference Figure 1 and Figure 2 In an exemplary embodiment, the heat insulation film may include a heat insulation layer 110, which may include a heat insulation pattern. In some embodiments, the heat insulation film may include a substrate layer 100 on which the heat insulation layer 110 is formed.

[0041] The substrate layer 100 may include, for example, a resin material. For instance, the substrate layer 100 may include: polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as poly(methyl methacrylate) and poly(ethyl methacrylate); styrene resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin resins such as polyethylene, polypropylene, polyolefins with cyclic or norbornene structures, and ethylene-propylene copolymers; vinyl chloride resins; amide resins such as nylon and aromatic polyamides; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; and silicone resins. These can be used individually or in combination of two or more.

[0042] In some embodiments, the substrate layer 100 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, etc.

[0043] In some embodiments, the insulation layer 110 may be disposed on top of the substrate layer 100. According to an exemplary embodiment, the insulation layer 110 may include repeating insulation patterns 105, 107. The insulation patterns 105, 107 may be divided and defined by dividing lines 102, 104, 106, 108.

[0044] Thermal insulation patterns 105 and 107 can be island-like patterns that are independently separated or spaced apart from each other by separation lines 102, 104, 106, and 108. Thermal insulation patterns 105 and 107 can be embossed patterns protruding from the substrate layer 100 or the window surface. Thermal insulation patterns 105 and 107 can include solid metal layers. For example, thermal insulation patterns 105 and 107 may not have an open structure such as a mesh structure.

[0045] For example, separation lines 102, 104, 106, and 108 may be etched lines forming the thermal insulation patterns 105 and 107. In some embodiments, after forming the thermal insulation coating for forming the thermal insulation patterns 105 and 107, the thermal insulation coating may be etched using an etching mask to form separation lines 102, 104, 106, and 108. For example, separation lines 102, 104, 106, and 108 may be empty spaces such as trenches or voids in the form of lines.

[0046] The heat-insulating patterns 105, 107, or the heat-insulating coating may include a metal or alloy layer. For example, the heat-insulating patterns 105, 107, or the heat-insulating coating may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more.

[0047] In one embodiment, the heat insulation pattern 105, 107 or the heat insulation coating may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy) or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy).

[0048] In some embodiments, the heat insulation patterns 105, 107 or the heat insulation coating may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), zinc aluminum oxide (AZO), zinc oxide (ZnOx), indium oxide (InOx), tin oxide (SnOx), cadmium tin oxide (CTO), gallium-doped zinc oxide (GZO), zinc tin oxide (ZTO), and indium gallium oxide (IGO).

[0049] In some embodiments, the heat insulation patterns 105, 107 or the heat insulation coating may include a stacked structure of transparent conductive oxide layer and metal layer, for example, a two-layer structure of transparent conductive oxide layer-metal layer, or a three-layer structure of transparent conductive oxide layer-metal layer-transparent conductive oxide layer.

[0050] The metal layer may include the aforementioned metal or alloy. The transparent conductive oxide layer may include the aforementioned transparent conductive oxide. The metal layer can improve thermal insulation, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0051] The separation lines may include column-direction separation lines 102 and 104 and row-direction separation lines 106 and 108. Column-direction separation lines 102 and 104 may extend in the second direction. Row-direction separation lines 106 and 108 may extend in the first direction. Column-direction separation lines 102 and 104 and row-direction separation lines 106 and 108 may intersect each other.

[0052] The column direction separating lines 102 and 104 and the row direction separating lines 106 and 108 may each have a wavy line shape. According to an exemplary embodiment, the column direction separating lines 102 and 104 and the row direction separating lines 106 and 108 may each have a wavy line shape with a predetermined period.

[0053] The column direction separation lines 102 and 104 may include a first column direction separation line 102 and a second column direction separation line 104. According to an exemplary embodiment, the periods of the first column direction separation line 102 and the second column direction separation line 104 may be substantially the same.

[0054] The first column direction separation line 102 and the second column direction separation line 104 can be arranged alternately and repeatedly along the first direction. According to an exemplary embodiment, the first column direction separation line 102 and the second column direction separation line 104 adjacent along the first direction can be mirror-symmetrical to each other. For example, the first column direction separation line 102 and the second column direction separation line 104 can be mirror-symmetrical with respect to a virtual axis of symmetry extending in the second direction.

[0055] In some embodiments, column direction line pairs are defined by mirror-symmetric adjacent first column direction separation lines 102 and second column direction separation lines 104. Multiple such column direction line pairs may be arranged in a regular repeating pattern along the first direction. For example, the column direction line pairs may repeat along the first direction at predetermined intervals.

[0056] The row direction separation lines 106 and 108 may include a first row direction separation line 106 and a second row direction separation line 108. According to an exemplary embodiment, the periods of the first row direction separation line 106 and the second row direction separation line 108 may be substantially the same.

[0057] The first row direction separation line 106 and the second row direction separation line 108 can be arranged alternately and repeatedly along the second direction. According to an exemplary embodiment, the first row direction separation line 106 and the second row direction separation line 108 adjacent along the second direction can be mirror-symmetrical to each other. For example, the first row direction separation line 106 and the second row direction separation line 108 can be mirror-symmetrical with respect to a virtual axis of symmetry extending in the first direction.

[0058] In some embodiments, row direction line pairs can be defined by mirror-symmetric adjacent first row direction separation lines 106 and second row direction separation lines 108. Multiple such row direction line pairs can be arranged in a regular repeating pattern along the second direction. For example, the row direction line pairs can be repeated along the second direction at predetermined intervals.

[0059] The row direction line pairs and the column direction line pairs intersect each other, and the heat insulation patterns 105 and 107 spaced apart from each other can be defined by the separation lines 102, 104, 106 and 108.

[0060] The heat insulation patterns 105 and 107 may include a first heat insulation pattern 105 and a second heat insulation pattern 107. The aforementioned separating lines 102, 104, 106, and 108 may allow the first heat insulation pattern 105 and the second heat insulation pattern 107 to have different shapes from each other. The first heat insulation pattern 105 and the second heat insulation pattern 107 may be arranged in a regular repeating pattern with a predetermined period.

[0061] According to an exemplary embodiment, the first heat-insulating pattern 105 and the second heat-insulating pattern 107 can be alternately repeated along the second direction to form a heat-insulating pattern column. The first heat-insulating pattern 105 and the second heat-insulating pattern 107 can be alternately repeated along the first direction to form a heat-insulating pattern row.

[0062] According to the above-described embodiments of the present invention, separation lines 102, 104, 106, and 108 are formed between the heat insulation patterns 105 and 107, thereby increasing the transmittance of electromagnetic waves while improving or maintaining the heat insulation properties.

[0063] For example, during the passage of electromagnetic waves through the heat insulation patterns 105 and 107, the absorption or reflection of electromagnetic waves due to the metallic composition may increase. Furthermore, in high-frequency or ultra-high-frequency bands such as 4G / 5G, the wavelength of electromagnetic waves is shorter, reducing diffraction characteristics and increasing the difficulty of diffraction, which may further increase electromagnetic wave loss.

[0064] However, according to exemplary embodiments, electromagnetic wave dissipation and reflection can be reduced and transmittance increased by using separation lines 102, 104, 106, and 108. Thus, transmission loss and attenuation can be prevented even in high-frequency bands, and signal strength can be improved.

[0065] Furthermore, the diffraction characteristics of electromagnetic waves are enhanced by the wavy separation lines 102, 104, 106, and 108, thereby further increasing the transmittance of electromagnetic waves.

[0066] As described above, separation lines of different shapes can be arranged in a mirror-symmetric repeating configuration. Therefore, insulation patterns 105 and 107 of different shapes can be regularly repeated within the insulation layer 110. Thus, the insulation layer 110 can simultaneously contain both amorphous and regular shapes.

[0067] Therefore, it can, for example, prevent optical interference patterns or moiré patterns that occur when polygonal patterns overlap completely and regularly, and can suppress light scattering phenomena such as starbursts.

[0068] In some embodiments, the line width of each of the separating lines 102, 104, 106, and 108 can be 2.5. Above, or 5 The above can be 20 Below or 10 the following.

[0069] For example, if the widths of the separation lines 102, 104, 106, and 108 are too narrow, etching defects may occur due to the fine spacing, and electromagnetic interference may occur due to the electrical connection of the thermal insulation patterns 105 and 107. If the widths of the separation lines 102, 104, 106, and 108 are too large, the patterns may be visually identifiable, and the optical properties and thermal insulation may be reduced. Within the specified range, heat flow and heat transfer through the separation lines 102, 104, 106, and 108 can be suppressed while ensuring sufficient electromagnetic wave transmittance.

[0070] In some embodiments, the area of ​​the separation lines 102, 104, 106, and 108 in the planar direction may be less than 20%, less than 15%, or less than 10% of the total area of ​​the insulation layer 110. For example, the total area of ​​the insulation patterns 105 and 107 may be more than 80%, more than 85%, or more than 90% of the total area of ​​the insulation layer 110. In some embodiments, the area of ​​the separation lines 102, 104, 106, and 108 may be more than 3% of the total area of ​​the insulation layer 110.

[0071] Within the aforementioned range, the electromagnetic wave transmittance through separation lines 102, 104, 106, and 108 can be increased while heat transfer and radiation can be reduced. Therefore, the electromagnetic wave transmittance and thermal insulation properties of the heat insulation film can be further improved.

[0072] For example, the area of ​​separation lines 102, 104, 106, and 108 can be 5% to 20%, 5% to 15%, or 5% to 10% of the total area of ​​the insulation layer 110.

[0073] Figure 3 This is a schematic, partially enlarged plan view of a unit cell used to illustrate an exemplary embodiment. Figure 3 Yes Figure 2 The diagram shows an enlarged plan view of the unit cell UC region.

[0074] Reference Figure 3 The unit cell UC may include segments of separating lines 102, 104, 106, and 108. According to an exemplary embodiment, the unit cell UC may include a pair of first column-direction separating line segments 102-1 and second column-direction separating line segments 104-1. The unit cell UC may also include a pair of first row-direction separating line segments 106-1 and second row-direction separating line segments 108-1.

[0075] The first column directional separation segment 102-1 and the second column directional separation segment 104-1 included in the unit cell UC can be mirror images of each other. The first row directional separation segment 106-1 and the second row directional separation segment 108-1 included in the unit cell UC can be mirror images of each other.

[0076] According to an exemplary embodiment, the unit UC may include a complete heat insulation pattern and segmented portions of the heat insulation pattern. For example, such as Figure 3 As shown, the unit UC may include a complete heat insulation pattern (e.g., the second heat insulation pattern 107) and may include segments of the heat insulation pattern arranged around the periphery of the heat insulation pattern.

[0077] For example, the segments 105-1, 105-2, 105-3, and 105-4 of the four first heat insulation patterns and the segments 107-1, 107-2, 107-3, and 107-4 of the four second heat insulation patterns can be arranged alternately in a clockwise or counterclockwise direction around the heat insulation pattern.

[0078] In some embodiments, the segments of the thermal insulation pattern may be configured mirror-symmetrically with respect to a virtual line extending along the second direction through the center of the thermal insulation pattern disposed in the center.

[0079] The unit cells UC can be repeatedly arranged along the first and second directions to form the insulation layer 110. As described above, the unit cells UC, which have amorphous or random characteristics, can be repeated regularly. Thus, the insulation layer 110 as a whole can simultaneously contain both amorphous and regular characteristics.

[0080] For example, an etch mask corresponding to a unit cell UC can be used to form separation segments. The patterning process can be repeated by moving the etch mask along a first direction and a second direction at a spacing corresponding to the length and width of the unit cell UC.

[0081] Therefore, the aforementioned heat insulation layer 110 can be easily formed using the etching mask corresponding to the unit cell UC. Furthermore, a large-area heat insulation film can be easily fabricated by repeating the unit cells UC.

[0082] For example, forming a heat insulation film in a single etching process might require a large-area mask and etching equipment. However, according to the embodiments of the present invention described above, the heat insulation layer 110 can be formed by repeatedly patterning a small area corresponding to a unit cell UC using an etching mask. Therefore, process efficiency can be improved while simplifying the process equipment.

[0083] The patterning process may include photolithography. For example, after forming a photoresist layer on the heat-insulating coating, the etch mask can be moved to repeat the exposure process. Subsequently, the photoresist layer can be partially removed by a development process to form a photoresist pattern.

[0084] Thermal insulation patterns 105 and 107 can be formed by dry etching or wet etching of the photoresist pattern.

[0085] After the patterning process, the photoresist pattern can be removed by an ashing and / or stripping process.

[0086] In some embodiments, the heat insulation patterns 105, 107 or unit cells UC can also be formed by using a laser etching process with the etching mask.

[0087] Figure 4 This is a schematic cross-sectional view illustrating an exemplary embodiment of a heat-insulating film. For example, Figure 4 This is a cross-sectional view showing the laminated structure of the heat insulation film.

[0088] Reference Figure 4 The heat insulation film may include a protective layer formed on the top or bottom surface of the heat insulation patterns 105, 107. According to an exemplary embodiment, the protective layer may include an upper protective layer 140 formed on the top surface of the heat insulation patterns 105, 107, and a lower protective layer 130 formed on the bottom surface of the heat insulation patterns 105, 107 and disposed between the substrate layer 100 and the heat insulation patterns 105, 107.

[0089] The protective layers 130 and 140 can prevent physical and chemical damage to the heat insulation patterns 105 and 107 from the external environment, and can suppress haze caused by heat to improve transparency.

[0090] Protective layers 130 and 140 may include inorganic insulating materials such as metal oxides, metal nitrides, or metal oxynitrides. Protective layers 130 and 140 may, for example, include silicon oxide, silicon nitride, silicon oxynitride, zinc oxide, zinc nitride, zinc oxynitride, etc.

[0091] The protective layers 130 and 140 may include organic insulating materials such as epoxy resin, acrylic resin, and imide resin.

[0092] In some embodiments, the dielectric constants of the protective layers 130 and 140 can be adjusted to a range of approximately 2 to 12, respectively. Within this range, transmission loss due to refraction and reflection of electromagnetic waves can be suppressed.

[0093] According to an exemplary embodiment, the heat insulation film may further include an adhesive layer 120. The adhesive layer 120 may be formed between the substrate layer 100 and the heat insulation patterns 105, 107, or between the substrate layer 100 and the lower protective layer 130.

[0094] The adhesive layer 120 may include an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0095] Figure 5 and Figure 6 These are schematic cross-sectional views illustrating window structures of exemplary embodiments.

[0096] Reference Figure 5 The window structure may include the heat insulation layer 110 of the above embodiments attached to the window substrate.

[0097] The window substrate may include a first window substrate 150 and a second window substrate 160 facing each other. For example, the window substrate may include a glass substrate.

[0098] According to one embodiment, a glass substrate of the object onto which the window structure is applied can be provided as the window substrate. The glass substrate may, for example, include glass from windows in building exteriors, windows included in household appliances, or automotive glass.

[0099] In one embodiment, the thickness of the glass substrate can be from 2t to 10t, but is not limited thereto, and can be appropriately adjusted according to the design purpose and target object.

[0100] The first window substrate 150 and the second window substrate 160 may include a transparent resin substrate. For example, the transparent resin substrate may include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), etc.

[0101] For example, the outer surface of the first window substrate 150 may be a surface exposed to the external environment. The outer surface of the second window substrate 160 may be a surface exposed to the internal environment of the object to which the window structure is attached.

[0102] As described above, the window structure can be in the form of a pair of glass. In one embodiment, the window structure may further include a spacer (not shown) formed between the first window substrate 150 and the second window substrate 160. The spacer can maintain the spacing between the first window substrate 150 and the second window substrate 160.

[0103] In one embodiment, an air layer 170 may be formed between the first window substrate 150 and the second window substrate 160. The air layer 170 may include an inert gas such as air or argon (Ar). The air layer 170 may further suppress heat flow by conduction and convection.

[0104] The heat insulation layer 110 or heat insulation film can be attached to either the first window substrate 150 or the second window substrate 160. In some embodiments, the heat insulation layer 110 or heat insulation film can be attached to the inner surface of the first window substrate 150 (e.g., the surface facing the second window substrate 160). For example, the heat insulation layer 110 can be separated from the substrate layer 100 of the heat insulation film. The heat insulation layer 110 separated from the substrate layer 100 can be attached to the window substrate via an adhesive layer 120.

[0105] The window structure can be provided as Low-E glass. For example, the gas layer 170 can suppress heat flow by conduction and convection and block heat transfer between the first window substrate 150 and the second window substrate 160. According to an exemplary embodiment, thermal radiation transmitted from a heat source can be blocked by the heat insulation layer 110.

[0106] In some embodiments, the thermal conduction rate of the window structure can be 3.90 kcal / m². 2 The temperature is below h℃. The window structure can have a lower thermal conductivity than a typical glass substrate, for example, 3.70 kcal / m³. 2 Below h℃. For example, it can have 3.40 kcal / m³. 2 h℃ to 3.70 kcal / m 2 h℃, or 3.50kcal / m 2 h℃ to 3.60 kcal / m 2 Thermal flow rate within the h℃ range.

[0107] According to an exemplary embodiment, the above-described heat insulation layer 110 structure can improve the transmission characteristics of electromagnetic waves transmitted from the base station antenna (AT), thereby reducing or suppressing signal loss of electromagnetic waves passing through the window structure.

[0108] Reference Figure 6 An insulating material can be filled between the first window substrate 150 and the second window substrate 160. For example, the window structure may also include a filler layer 180 sandwiched or embedded between the first window substrate 150 and the second window substrate 160. The filler layer 180 may include the aforementioned organic insulating material and / or inorganic insulating material.

[0109] like Figure 6 As shown, the heat insulation layer 110 can be attached to the outside of the first window substrate 150 (e.g., the opposite side to the side facing the second window substrate 160).

[0110] The aforementioned window structure can be applied to various structures and objects, such as windows of public transportation vehicles like buses and subways, buildings, vehicles, decorative features, and directional signs (e.g., directional signs, emergency exit signs, emergency lights). The window structure can improve thermal insulation and energy efficiency while increasing the signal efficiency of antennas or radar.

[0111] Preferred embodiments will be shown below to aid in understanding the present invention. However, these embodiments are only for illustrative purposes and do not limit the scope of the appended claims. It will be apparent to those skilled in the art that various changes and modifications can be made to the embodiments within the scope and technical concept of the present invention, and these changes and modifications naturally fall within the scope of the appended claims.

[0112] Experimental Example 1

[0113] Example

[0114] A glass substrate with an applied heat-insulating film is used as the window structure. The glass substrate is 4.8 tons thick, and the heat-insulating film is made to have the following properties: Figure 2 The insulation layer is shown in the diagram. Specifically, it will have the following characteristics: Figure 3 The unit cells shown are arranged periodically to form an insulating film. The width and width of each unit cell are set to 20 mm, and the width of the separation line is set to 2.5 mm. The area occupied by the separation line is set to 20% of the total area of ​​the unit.

[0115] The heat insulation layer is formed as a three-layer structure: a lower insulating layer, an electrode layer (IZO / APC / IZO), and an upper insulating layer. The heat insulation layer is then subjected to OCA (thickness 5) bonding. It is bonded to the glass substrate.

[0116] Comparative Example 1

[0117] A glass substrate (4.8t thick) without heat insulation film was used as the window structure.

[0118] Comparative Example 2

[0119] Figure 7 This is a schematic plan view showing the heat insulation film of Comparative Example 2.

[0120] In addition to Figure 7 In addition to fabricating the insulation layer in the same manner as shown in the embodiment, the window structure was fabricated in the same way.

[0121] In Comparative Example 2, a square-shaped heat insulation pattern 50 is arranged periodically, and the width W of the heat insulation pattern 50 is set to 300. The width of the separator line 55 is set to 2.5. The area of ​​the separation line 55 is set to 20% of the total area of ​​the insulation layer.

[0122] Starburst Assessment

[0123] The light source was observed using the window structures of Examples 1 and 2 to evaluate the light scattering phenomenon.

[0124] In the window structure of this embodiment, almost no light scattering occurs, and the observed light source is substantially similar to that of the glass substrate.

[0125] In the window structure of Comparative Example 2, the periodic arrangement of patterns of the same shape increases the scattering and diffusion of light as it passes through the window structure.

Claims

1. A thermal insulation film, characterized by, include: The heat-insulating patterns are spaced apart from each other; as well as Separation lines, which divide the heat insulation pattern, The separation line includes: The first and second rows of directional separation lines are mirror-symmetric to each other; as well as The first and second column direction separation lines are mirror images of each other.

2. The heat insulation film according to claim 1, characterized in that, Row direction line pairs are defined by adjacent first row direction separation lines and second row direction separation lines, and multiple row direction line pairs are repeated along the column direction. Column direction line pairs are defined by adjacent first column direction separation lines and second column direction separation lines, and multiple column direction line pairs are repeated along the row direction.

3. The heat insulation film according to claim 1, characterized in that, The first and second rows of directional separation lines are both wavy lines with the same period.

4. The heat insulation film according to claim 1, characterized in that, The first column of directional separation lines and the second column of directional separation lines are respectively wavy lines with the same period.

5. The heat insulation film according to claim 1, characterized in that, The heat insulation pattern includes a first heat insulation pattern and a second heat insulation pattern having different shapes from each other.

6. The heat insulation film according to claim 5, characterized in that, The first heat insulation pattern and the second heat insulation pattern are arranged alternately and repeatedly along the column direction, and also alternately and repeatedly along the row direction.

7. The heat insulation film according to claim 5, characterized in that, The first heat insulation pattern repeats periodically, and the second heat insulation pattern repeats periodically.

8. The heat insulation film according to claim 5, characterized in that, A unit is defined by a complete heat insulation pattern and segmented portions of heat insulation patterns arranged around the periphery of the complete heat insulation pattern. The unit cell is repeated along both the row and column directions.

9. The heat insulation film according to claim 8, characterized in that, The unit includes a pair of first column direction separation line segments and a second column direction separation line segment, as well as a pair of first row direction separation line segments and a second row direction separation line segment.

10. The heat insulation film according to claim 9, characterized in that, The first column of directional separation line segments is a mirror image of the second column of directional separation line segments. The first row of directional separation line segments and the second row of directional separation line segments are mirror images of each other.

11. The heat insulation film according to claim 8, characterized in that, The segmented portion of the heat insulation pattern includes a first heat insulation pattern segment and a second heat insulation pattern segment having different shapes from each other. Within the unit, the first heat insulation pattern segment and the second heat insulation pattern segment are arranged alternately in a clockwise or counterclockwise direction around the periphery of a heat insulation pattern.

12. The heat insulation film according to claim 8, characterized in that, The segments of the heat insulation pattern are arranged in a mirror-symmetrical manner within the unit cell relative to a virtual line passing through the center of the heat insulation pattern.

13. The heat insulation film according to claim 1, characterized in that, The heat insulation pattern comprises a solid metal layer.

14. A window structure, characterized by include: Window substrate; as well as The heat insulation film according to claim 1 is disposed on the window substrate.

15. The window structure according to claim 14, characterized in that, The window substrate includes a first window substrate and a second window substrate facing each other. The heat insulation film is attached to one of the first window substrate and the second window substrate.

16. The window structure according to claim 15, characterized in that, It also includes a gas layer formed between the first window substrate and the second window substrate.

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