Infrared waveband active variable temperature camouflage net

Abstract

The utility model discloses an active variable temperature camouflage net of infrared wave band belongs to the technical field of outdoor camouflage equipment, including hexagonal flexible temperature control basic element, edge distribution type temperature sensing probe, data processing terminal and hot infrared, visible light environment data acquisition probe. Temperature control basic element includes camouflage color heat conduction composite base, embedded temperature control device, phase change material heat abstractor, and temperature sensing probe is composed of temperature sensing element that stretches out from the edge of camouflage net, and data processing terminal is composed of high -performance treater, is equipped with hot infrared and visible light image acquisition device, and is provided with built -in a variety of camouflage pattern generation algorithm and image recognition system that adapt to different environment. The utility model can realize the effective fusion with surrounding environment, and temperature changing rate is fast, and the anti -detection ability is strong, and its folding compression capacity and extension deformation ability are stronger, and it is convenient to carry, and the sheltering ability is strong, and there is the automatic intelligent setting mode, and the layout is convenient, adopts the distributed temperature sensing probe, reduces the exposure risk.

Description

Technical Field

[0001] This utility model relates to the technical field of outdoor camouflage equipment, and in particular to an active temperature-changing camouflage net in the infrared band. Background Technology

[0002] In my country's existing military camouflage technology field, traditional camouflage nets generally suffer from two major technical bottlenecks: First, the design mode of passive temperature-controlled materials combined with static camouflage patterns makes it difficult for their infrared radiation characteristics to dynamically match the complex microclimate environment of the region, making them easily exposed by high-precision infrared imaging reconnaissance from UAVs. Second, traditional dynamic camouflage devices mostly use rigid support frames combined with external infrared sensors, which have drawbacks such as large deployment volume, low deployment efficiency, and easy exposure of target components, severely restricting the requirements for rapid deployment and full-spectrum concealment.

[0003] Through data integration and experimental design, we discovered that placing temperature-sensing probes at the edge of the camouflage net coverage area to form a ring-shaped temperature measurement zone offers advantages such as fast response speed, high temperature measurement accuracy, convenient setup, and strong concealment. When used in conjunction with an external thermal infrared-visible light image acquisition device, it can accurately identify the ambient temperature field pattern, meeting the need for accurate infrared information reading, thereby enabling rapid and precise acquisition of battlefield temperature environment data.

[0004] Regarding the camouflage net structure, we mimicked the chameleon's color-changing principle, using a hexagonal structure to cover the net, balancing thermal conductivity and stability. Simultaneously, we adjusted the connecting materials between the various elements of the camouflage net to enhance its flexibility and thermal conductivity, overcoming the bulky and rigid characteristics of traditional camouflage nets.

[0005] This utility model focuses on the needs of infrared camouflage, aiming to achieve dynamic adjustment of the infrared characteristics of the camouflage net across the entire domain through the collaborative design of temperature control elements and intelligent algorithms, thereby improving the anti-infrared detection capability in complex environments. It deeply integrates hexagonal flexible temperature control elements, edge-distributed sensing probes and internally integrated intelligent algorithms, and provides technical support for the next generation of adaptive camouflage equipment through material innovation and structural optimization. Utility Model Content

[0006] This invention aims to provide an active temperature-varying camouflage net in the infrared band to solve the problems of poor infrared camouflage capability, inconvenient deployment, and poor environmental adaptability in traditional camouflage nets. It enables the camouflage net to adaptively adjust to complex infrared environments and significantly enhances the anti-infrared reconnaissance capability of the camouflage net by effectively integrating with the surrounding environment in the infrared band.

[0007] To achieve the above objectives, this utility model provides the following technical solution: an active temperature-regulating camouflage net in the infrared band, comprising a camouflage net body, a bus architecture, and a data processing terminal. A camouflage net covering surface is fixedly connected to the top of the camouflage net body. The camouflage net covering surface includes several hexagonal flexible temperature-controlling elements fixedly connected together. Each hexagonal flexible temperature-controlling element includes a camouflage-colored thermally conductive composite substrate, an embedded temperature control device, and a heat dissipation device. The embedded temperature control device and the heat dissipation device are both fixedly connected to the camouflage-colored thermally conductive composite substrate. Several edge-distributed temperature sensing probes are evenly fixedly connected around the camouflage net body. The data processing terminal is connected to each hexagonal flexible temperature-controlling element and the edge-distributed temperature sensing probes via the bus architecture.

[0008] Preferably, two temperature sensing elements are distributed along the normal direction of the edge of the camouflage net by adjacent edge distributed temperature sensing probes, and the interval between the temperature sensing probes is 0.5 times the edge length of the element.

[0009] Preferably, the data processing terminal has a built-in infrared camouflage image generation algorithm and a thermal infrared-visible light image recognition algorithm, and the data processing terminal is equipped with a thermal infrared-visible light image acquisition device.

[0010] Preferably, the camouflage-colored thermally conductive composite substrate includes a flexible thermally conductive material, and high-strength textile material connecting modules are fixedly connected around the flexible thermally conductive material. Several hexagonal flexible temperature control units are fixedly connected to each other through high-strength textile material connecting modules. A heat insulation material is fixedly connected to the bottom of the flexible thermally conductive material, and the outer side of the flexible thermally conductive material is coated with camouflage color.

[0011] Preferably, the embedded temperature control device includes a main control chip, a semiconductor cooling chip assembly, and a temperature sensor. The main control chip and the semiconductor cooling chip assembly are fixedly connected to the bottom end of a flexible thermally conductive material through a high thermal conductivity material. The temperature sensor is fixedly connected to the top end of the flexible thermally conductive material. The semiconductor cooling chip is composed of several Peltier units. The main control chip can use the temperature sensor to provide feedback adjustment to the working state of the semiconductor cooling chip assembly.

[0012] Preferably, the heat dissipation device is made of a phase change heat-absorbing material and is covered with a high-strength metal film. The heat dissipation device is connected to the semiconductor cooling chip assembly through a high thermal conductivity material.

[0013] The principle and beneficial effects of this technical solution:

[0014] 1. It can effectively blend with the surrounding environment in the infrared band. Through active temperature control technology and camouflage image generation algorithms, the temperature of the camouflage net can be adjusted in a short time to keep the temperature consistent with the background environment, effectively reducing the difference in infrared radiation between the camouflaged target and the surrounding environment, improving the camouflage effect, and enhancing anti-reconnaissance capabilities.

[0015] 2. Portable and with strong concealment capabilities. The entire camouflage net adopts a lightweight design, and the hexagonal flexible temperature control unit has good flexibility and adaptability. It can be folded into a smaller volume, making it convenient for military personnel to carry and improving the ease of use and operational flexibility of the camouflage net.

[0016] 3. It features an automated intelligent setting mode, making deployment convenient. The camouflage net, combined with thermal infrared-visible light image acquisition equipment and thermal infrared-visible light image recognition algorithms, enables rapid and accurate identification of the surrounding environment, reducing deployment difficulty.

[0017] 4. The use of distributed temperature sensors reduces exposure risks. Compared to existing scanning single-temperature sensor designs, distributed temperature sensors eliminate the need for additional rod-type support equipment, improving their resistance to detection. Attached Figure Description

[0018] Figure 1 A schematic diagram of the structure of an active temperature-changing camouflage net in the infrared band provided for an embodiment of this utility model;

[0019] Figure 2 A schematic diagram of the structure of the hexagonal flexible temperature control element of the active temperature-changing camouflage net in the infrared band provided in this embodiment of the utility model;

[0020] In the diagram: 1. Camouflage netting coverage; 2. Hexagonal flexible temperature control unit; 3. Distributed temperature sensing probe; 4. Data processing terminal; 5. Thermal infrared-visible light image acquisition device; 6. Camouflage-colored thermally conductive composite substrate; 7. Embedded temperature control device; 8. Heat dissipation device; 9. Flexible thermally conductive material; 10. High-strength textile material connection module; 11. Thermal insulation material; 12. Main control chip; 13. Semiconductor cooling chip assembly; 14. Temperature sensor. Detailed Implementation

[0021] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments:

[0022] like Figures 1 to 2 As shown, an active temperature-regulating camouflage net in the infrared band mainly consists of a camouflage net covering surface, edge-distributed temperature sensing probes, and a data processing terminal. The camouflage net covering surface is formed by connecting several hexagonal flexible temperature control elements with high-strength textile material. Each hexagonal flexible temperature control element includes a camouflage-colored thermally conductive composite substrate, an embedded temperature control device, and a heat dissipation device. Edge-distributed temperature sensing probes are connected to the edges of the camouflage net covering surface, and these probes are arranged in a ring at intervals of 0.5 times the side length of the element along the outer edge of the camouflage net. The data processing terminal is connected to each hexagonal flexible temperature control element and the edge-distributed temperature sensing probes via a bus architecture and is powered by an external power supply.

[0023] The camouflage-colored thermally conductive composite substrate consists of a flexible thermally conductive material, a high-strength textile connecting module, and a thermal insulation material, with a camouflage coating on its outer surface. The embedded temperature control device includes a main control chip, a semiconductor cooling chip assembly, and a temperature sensor, which are connected to the flexible thermally conductive material via a high thermal conductivity material. The heat dissipation device is made of a phase-change heat-absorbing material encapsulated within a high-strength metal film. It is connected to the semiconductor cooling chip assembly via a high thermal conductivity material and primarily serves as a heat dissipation device for the cooling chip.

[0024] The hexagonal flexible temperature control unit consists of a camouflage-colored thermally conductive composite substrate, an embedded temperature control device, and a heat dissipation device. Temperature sensors at the edges of the camouflage netting are connected to a data processing terminal, which in turn is connected to each temperature control unit on the camouflage netting surface.

[0025] The camouflage netting is primarily composed of hexagonal flexible temperature-controlled elements, each comprising a camouflage-colored thermally conductive composite substrate, an embedded temperature control device, and a heat dissipation device. The camouflage-colored thermally conductive composite substrate is constructed from flexible thermally conductive materials and high-strength textile materials, ensuring both the stability of the mechanical connections between the elements and enhancing the overall deformability of the camouflage netting. The substrate surface is coated with camouflage color for visible light camouflage. An embedded temperature control device is incorporated, capable of regulating a Peltier-effect-based semiconductor cooling chip. Under the precise control of the temperature control device, the cooling chip can rapidly cool or heat based on a set temperature, thereby actively regulating the temperature of the camouflage netting to match the ambient temperature, thus achieving effective camouflage in the infrared band. The heat dissipation device is connected to the cooling chip and is used to control the overall temperature of the camouflage netting.

[0026] The embedded temperature control device uses a semiconductor cooling chip group composed of Peltier units and adopts a PID control algorithm to achieve high-precision and rapid temperature control.

[0027] The edge-distributed temperature sensing probe consists of temperature-sensing elements extending from the edge of the camouflage net, forming a temperature-sensing band along the outer edge of the net and transmitting the edge temperature signal to the data processing terminal. This edge-distributed design allows for precise measurement of the temperature information at the camouflage net boundary, improving the accuracy of temperature changes and the sensitivity to ambient temperature variations, while avoiding the need for easily exposed rod-shaped components.

[0028] The data processing terminal consists of a high-performance processor, integrating infrared camouflage image generation algorithms and thermal infrared-visible light image recognition algorithms. It can fuse temperature data from edge-sensing probes, utilize the camouflage pattern generation algorithm to generate camouflage patterns that match the infrared characteristics of the background environment, and decompose these patterns into temperature control parameters for each temperature control element. This allows for precise control of the camouflage net's temperature distribution, resulting in radiation characteristics in the infrared band similar to the surrounding environment, achieving the desired camouflage effect. Simultaneously, the data processing terminal can autonomously analyze external environmental characteristics through thermal infrared-visible light images and set variable temperature modes accordingly.

[0029] The camouflage pattern generation algorithm built into the data processing terminal includes algorithms that simulate the infrared radiation distribution characteristics of different scenarios such as natural terrain and vegetation, and also has a pre-stored infrared feature database of multiple typical combat scenarios.

[0030] The specific implementation process is as follows:

[0031] The camouflage net is deployed and laid over the target area, ensuring effective contact between the temperature sensor and the surrounding environment. The data processing terminal is then connected to the camouflage net coverage area, and the net is powered on. The data terminal is activated, using a thermal infrared-visible light image acquisition device to capture information about the surrounding surface environment. The data terminal's internal thermal infrared-visible light image recognition algorithm identifies environmental features and automatically matches them to a natural environment pattern. The temperature sensor reads the infrared information of the surrounding environment and sends it back to the data processing terminal. Based on the infrared environmental information and the pre-selected pattern, the data processing terminal automatically runs a camouflage pattern generation algorithm and sends temperature control commands to the embedded temperature control devices in each temperature control unit. The main control chip automatically adjusts the semiconductor cooling chip group according to the commands, achieving active temperature regulation of the camouflage net. Once the preset temperature is reached, the temperature sensor will periodically collect temperature information and update the preset temperatures of each main control chip.

[0032] This utility model of an infrared band active temperature-changing camouflage net can effectively blend into the surrounding environment, has strong anti-reconnaissance capabilities, is easy to carry and deploy, and has no easily exposed marking structures. It can be widely used in various camouflage scenarios under military backgrounds.

[0033] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions or characteristics are not described in detail here. For those skilled in the art, various modifications and improvements can be made without departing from the technical solution of this utility model, and these should also be considered within the scope of protection of this utility model. These modifications will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application shall be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. An active temperature-varying camouflage net in the infrared band, characterized in that: The system includes a camouflage net body, a bus architecture, and a data processing terminal. The top of the camouflage net body is fixedly connected to a camouflage net covering surface. The camouflage net covering surface includes several hexagonal flexible temperature control elements that are fixedly connected together. Each hexagonal flexible temperature control element includes a camouflage-colored thermally conductive composite substrate, an embedded temperature control device, and a heat dissipation device. The embedded temperature control device and the heat dissipation device are both fixedly connected to the camouflage-colored thermally conductive composite substrate. Several edge-distributed temperature sensing probes are evenly fixedly connected around the camouflage net body. The data processing terminal is connected to each hexagonal flexible temperature control element and the edge-distributed temperature sensing probes through the bus architecture.

2. The active temperature-varying camouflage net in the infrared band according to claim 1, characterized in that: The temperature sensing elements of the adjacent edge-distributed temperature sensing probes extend along the normal direction of the edge of the camouflage net, and two or more temperature sensing elements are distributed in this direction, with the interval between the temperature sensing elements not exceeding 0.5 times the side length of the hexagonal flexible temperature control unit.

3. The active temperature-varying camouflage net in the infrared band according to claim 1, characterized in that: The data processing terminal has a built-in infrared camouflage image generation algorithm and a thermal infrared-visible light image recognition algorithm, and the data processing terminal is equipped with a thermal infrared-visible light image acquisition device.

4. The active temperature-varying camouflage net in the infrared band according to claim 1, characterized in that: The camouflage-colored thermally conductive composite substrate includes a flexible thermally conductive material. High-strength textile material connecting modules are fixedly connected around the flexible thermally conductive material. Several hexagonal flexible temperature control units are fixedly connected to each other through the high-strength textile material connecting modules. Thermal insulation material is fixedly connected to the bottom of the flexible thermally conductive material. The outer side of the flexible thermally conductive material is coated with camouflage color.

5. The active temperature-varying camouflage net in the infrared band according to claim 1, characterized in that: The embedded temperature control device includes a main control chip, a semiconductor cooling chip assembly, and a temperature sensor. The main control chip and the semiconductor cooling chip assembly are fixedly connected to the bottom of a flexible thermally conductive material through a high thermal conductivity material. The temperature sensor is fixedly connected to the top of the flexible thermally conductive material. The semiconductor cooling chip is composed of several Peltier units. The main control chip can use the temperature sensor to provide feedback adjustment to the working state of the semiconductor cooling chip assembly.

6. The active temperature-varying camouflage net in the infrared band according to claim 1, characterized in that: The heat dissipation device is made of phase change heat-absorbing material and covered with a high-strength metal film. The heat dissipation device is connected to the semiconductor cooling chip assembly through a high thermal conductivity material.

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