A vibration impact test tool for HPD packaged power semiconductor module

Abstract

The utility model discloses a kind of vibration impact test tool of HPD packaging power semiconductor module, including the tool plate main body being fixedly installed on vibration table surface, and the top surface of tool plate main body is equipped with multiple test sample station grooves for HPD packaging power semiconductor module to place, the bottom end inside of test sample station groove is equipped with rectangular recess;And tool fixing structure;The test tool of the application is used as the transition device between vibration table and test sample, and the vibration and impact energy of vibration table are transmitted to test sample by mechanical connection without distortion, without amplification, one-to-one transmission, so as to ensure that test sample is subjected to the test stress specified, effectively solve many problems caused by direct connection, while the design of the tool fully considers the special structure of HPD packaging power semiconductor module, avoids the damage to module bottom heat dissipation pinfin and the abrasion rupture of module shell in installation process, protects the integrity and reliability of subsequent use of module.

Description

Technical Field

[0001] This utility model belongs to the field of vibration and shock testing technology for power semiconductor modules, and specifically relates to a vibration and shock testing fixture for HPD packaged power semiconductor modules. Background Technology

[0002] In the field of power electronics technology, power semiconductor modules, as key components, are widely used in electric vehicles, wind power generation, solar inverters, and industrial drive systems, etc. HybridPACK TM Drive Module (HPD) packaging is an advanced form of power semiconductor module packaging, especially modules using SiC (silicon carbide) or IGBT (insulated gate bipolar transistor) technology. It is favored for its high efficiency, high power density and good thermal management capabilities. These modules often integrate complex circuit structures and efficient heat dissipation designs, such as pinfin heat dissipation structures, to cope with the heat dissipation challenges under high power operation. In the process of product development, quality control and certification, vibration and shock testing is an important means to evaluate the reliability of power semiconductor modules in extreme environments. By mounting the module on a vibration table to simulate the vibration and shock conditions that may be encountered during actual transportation, installation and operation, the structural strength, electrical connection stability and overall reliability of the module can be verified.

[0003] However, for SiC or IGBT power semiconductor modules using HPD packages, there are significant technical challenges in directly mounting them on a vibration table for vibration and shock testing:

[0004] On the one hand, since the bottom of the module integrates a sophisticated pinfin heat dissipation structure, directly connecting it to the vibration table surface is not only complicated in terms of installation process and difficult to ensure the stability of fixation, but may also damage the heat dissipation pinfin due to improper installation or mechanical stress concentration, thereby affecting the heat dissipation performance and long-term reliability of the module. On the other hand, the module shell may also be worn or even cracked due to friction or collision during direct contact with the vibration table surface, further affecting the accuracy of the test and the integrity of the module.

[0005] Therefore, developing a vibration and shock testing fixture specifically designed for HPD packaged power semiconductor modules is key to solving the above-mentioned technical challenges and ensuring the accuracy of the test and the safety of the module. Utility Model Content

[0006] The purpose of this invention is to provide a vibration and shock testing fixture for HPD packaged power semiconductor modules to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a vibration and shock testing fixture for HPD packaged power semiconductor modules, comprising...

[0008] The fixture plate body can be fixedly installed on the vibration table, and the top surface of the fixture plate body is provided with multiple test sample station slots for placing HPD packaged power semiconductor modules. The bottom end of the test sample station slot is provided with a rectangular groove.

[0009] In addition, tooling fixing structure, module fixing structure and module positioning structure.

[0010] Preferably, the tooling fixing structure includes tooling fixing holes, and the surface of the tooling plate body is provided with multiple tooling fixing holes for connecting the vibration table.

[0011] Preferably, the module fixing structure includes sample locking and fixing holes, and the top surface of the tooling plate body is provided with multiple sample locking and fixing holes around each test sample station slot.

[0012] Preferably, the module positioning structure includes sample positioning holes, and a sample positioning hole is provided on both sides of the top surface of the tooling plate body relative to each test sample station slot.

[0013] Preferably, it also includes an inner protective pad, and an inner protective pad is installed on the inner side of each of the rectangular grooves.

[0014] Preferably, both sides of the inner protective pad are provided with integrated side clips, and the inner walls of both sides of the rectangular groove are provided with side slots for the side clips to be inserted.

[0015] Preferably, the inner walls on both sides of the inner protective pad are provided with inner buckle grooves, and the positions of the inner buckle grooves correspond to the positions of the side locking blocks.

[0016] Preferably, the front and rear surfaces of the bottom end of the inner protective pad are provided with multiple through-holes, and the two side surfaces of the inner protective pad are provided with multiple through-holes that pass through the through-holes.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: The test fixture of this application serves as a transition device between the vibration table and the test sample, transmitting the vibration and impact energy of the vibration table to the test sample in a one-to-one manner through mechanical connection without distortion or amplification, thereby ensuring that the test sample is subjected to the specified test stress. This effectively solves many problems caused by direct connection. At the same time, the design of this fixture fully considers the special structure of HPD packaged power semiconductor modules, avoiding damage to the heat dissipation pinfin at the bottom of the module and wear and cracking of the module shell during installation, thus protecting the integrity of the module and the reliability of subsequent use. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This utility model Figure 1 A magnified view of a portion of region A in the middle;

[0020] Figure 3 This is a cross-sectional view of the test sample station groove of this utility model;

[0021] Figure 4 This utility model Figure 3 A magnified view of a portion of region B in the middle;

[0022] Figure 5 This is a schematic diagram of the structure of the inner protective pad of this utility model;

[0023] In the figure: 1. Tooling plate body; 2. Tooling fixing hole; 3. Test sample station slot; 4. Sample locking and fixing hole; 5. Sample positioning hole; 6. Rectangular groove; 61. Side slot; 7. Inner protective pad; 71. Side block; 72. Inner buckle groove; 73. Deformation through hole; 74. Side through hole. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example

[0026] Please see Figures 1 to 5 This is an embodiment of the present invention, which provides the following technical solution: a vibration and shock testing fixture for HPD packaged power semiconductor modules, comprising...

[0027] The fixture plate body 1 can be fixedly installed on the vibration table. The top surface of the fixture plate body 1 has multiple test sample station slots 3 for placing HPD packaged power semiconductor modules. The bottom end of the test sample station slot 3 has a rectangular groove 6. In actual testing, the HPD packaged power semiconductor module is first fixed in the test sample station slot 3. The rectangular groove 6 is used to match and place the heat dissipation pinfin of the HPD packaged module to avoid damage during subsequent vibration and shock tests. Then, the fixture plate body 1 is fixed on the vibration table for testing. The vibration table is started to perform a vibration and shock test in one direction. After completion, the vibration table is rotated to perform a vibration and shock test in another direction until all directions are tested. During the test, the fixture plate body 1 transmits the vibration and shock energy of the vibration table to the test sample without distortion or amplification through mechanical connection, ensuring that the test sample is subjected to the specified test stress. Under the action of the rectangular groove 6, damage to the heat dissipation pinfin at the bottom of the module and wear and cracking of the module shell are avoided during installation, protecting the integrity of the module and the reliability of subsequent use.

[0028] In addition, tooling fixing structure, module fixing structure and module positioning structure.

[0029] In this embodiment, preferably, the tooling fixing structure includes tooling fixing holes 2. Multiple tooling fixing holes 2 for connecting to the vibration table are opened through the surface of the tooling plate body 1. The actual number of tooling fixing holes 2 is twenty-nine, so that the tooling plate body 1 can be firmly installed on the vibration table by bolts.

[0030] In this embodiment, preferably, the module fixing structure includes sample locking and fixing holes 4. The top surface of the tooling plate body 1 is provided with multiple sample locking and fixing holes 4 around each test sample station slot 3. The actual number of sample locking and fixing holes 4 is eight, which are evenly distributed on both sides of the test sample station slot 3. The sample locking and fixing holes 4 match the fixing feet of the HPD packaged power semiconductor module itself, so that the HPD packaged power semiconductor module can be stably fixed by bolts after being placed inside the test sample station slot 3.

[0031] In this embodiment, preferably, the module positioning structure includes sample positioning holes 5. A sample positioning hole 5 is provided on both sides of the top surface of the tooling plate body 1 relative to each test sample station slot 3. The sample positioning hole 5 matches the positioning pin of the HPD packaged power semiconductor module, which can quickly complete the positioning during the installation of the HPD packaged power semiconductor module, and facilitate subsequent bolt fixing.

[0032] In this embodiment, preferably, an inner protective pad 7 is also included. An inner protective pad 7 is installed on the inner side of each rectangular groove 6, so that when the HPD packaged power semiconductor module is placed into the test sample station slot 3, the heat dissipation pinfin at the bottom of the module will be protected by the inner protective pad 7 when it enters the rectangular groove 6, avoiding unnecessary damage caused by the heat dissipation pinfin at the bottom contacting the inner wall of the rectangular groove 6. It can also prevent the heat dissipation pinfin at the bottom from colliding with the inner wall of the rectangular groove 6 during the subsequent vibration and shock test, ensuring the integrity of the product after the test.

[0033] In this embodiment, preferably, both sides of the inner protective pad 7 are provided with integrated side locking blocks 71, both of which are made of rubber material and will undergo elastic deformation when squeezed. The inner walls of both sides of the rectangular groove 6 are provided with side locking grooves 61 for the side locking blocks 71 to be inserted, so that the inner protective pad 7 can be stably installed in the rectangular groove 6. At the same time, the cross section of the side locking block 71 is a right-angled triangle with the inclined surface facing down, so that when the inner protective pad 7 is placed into the rectangular groove 6 from top to bottom, the inclined surface of the side locking block 71 will press against the inner wall of the rectangular groove 6 and be easily squeezed into the side locking groove 61.

[0034] In this embodiment, preferably, the inner walls on both sides of the inner protective pad 7 are provided with inner buckle grooves 72, and the positions of the inner buckle grooves 72 correspond to the positions of the side locking blocks 71. This allows the operator to insert the fingertips into the inner side of the inner buckle grooves 72 when removing the inner protective pad 7, and then lift the inner protective pad 7 upwards with force. This facilitates the application of force by the fingers when removing the inner protective pad 7, similar to a point of force application.

[0035] In this embodiment, preferably, the front and rear surfaces of the bottom end of the inner protective pad 7 are provided with multiple deformation through holes 73, and the two side surfaces of the inner protective pad 7 are provided with multiple side through holes 74 that penetrate the deformation through holes 73. The design of the deformation through holes 73 makes it easy for the bottom end of the inner protective pad 7 to undergo elastic deformation when squeezed, and also makes the bottom end of the inner protective pad 7 have sufficient deformation space when squeezed. The design of the side through holes 74 makes it easy for the air inside the deformation through holes 73 to be discharged when squeezed, avoiding the situation where the deformation through holes 73 are difficult to deform when the bottom end of the inner protective pad 7 is pressed because the air inside the deformation through holes 73 cannot be discharged in time.

[0036] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vibration and shock testing fixture for HPD packaged power semiconductor modules, characterized in that: include The tooling plate body (1) can be fixedly installed on the vibration table, and the top surface of the tooling plate body (1) is provided with multiple test sample station slots (3) for placing HPD packaged power semiconductor modules. The bottom end of the test sample station slot (3) is provided with a rectangular groove (6). In addition, tooling fixing structure, module fixing structure and module positioning structure.

2. The vibration and shock testing fixture for an HPD packaged power semiconductor module according to claim 1, characterized in that: The tooling fixing structure includes tooling fixing holes (2), and the surface of the tooling plate body (1) is provided with multiple tooling fixing holes (2) for connecting the vibration table.

3. The vibration and shock testing fixture for an HPD packaged power semiconductor module according to claim 1, characterized in that: The module fixing structure includes sample locking and fixing holes (4), and the top surface of the tooling plate body (1) is provided with multiple sample locking and fixing holes (4) around each test sample station slot (3).

4. The vibration and shock testing fixture for an HPD packaged power semiconductor module according to claim 1, characterized in that: The module positioning structure includes sample positioning holes (5), and a sample positioning hole (5) is provided on both sides of the top surface of the tooling plate body (1) relative to each test sample work station slot (3).

5. The vibration and shock testing fixture for an HPD packaged power semiconductor module according to claim 1, characterized in that: It also includes an inner protective pad (7), and an inner protective pad (7) is installed on the inner side of each of the rectangular grooves (6).

6. The vibration and shock testing fixture for an HPD packaged power semiconductor module according to claim 5, characterized in that: The inner protective pad (7) has integrated side clips (71) on both sides, and the inner walls of the rectangular groove (6) have side slots (61) for the side clips (71) to be inserted.

7. The vibration and shock testing fixture for an HPD packaged power semiconductor module according to claim 6, characterized in that: The inner protective pad (7) has inner grooves (72) on both sides of its inner wall, and the positions of the inner grooves (72) correspond to the positions of the side clips (71).

8. The vibration and shock testing fixture for an HPD packaged power semiconductor module according to claim 6, characterized in that: The inner protective pad (7) has multiple through holes (73) on the front and rear surfaces at the bottom end, and multiple through holes (74) on both sides of the inner protective pad (7) are provided.

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