A semiconductor chip material defect detection bearing device

Abstract

This utility model relates to the technical field of chip inspection carrier devices, and discloses a semiconductor chip material defect inspection carrier device, including a carrier platform. An infrared detection system is installed on the top of the carrier platform. Multiple fixing components are installed on the upper surface of the carrier platform, each fixing component including multiple fixing platforms. The bottoms of the multiple fixing platforms are fixedly connected to the upper surface of the carrier platform. A turntable is fixedly connected to the upper surface of the fixing platforms, and a rotating frame is rotatably connected inside the turntable. The rotating frame has an inclined groove inside. In this utility model, an electric push rod pushes the push platform, which in turn causes the inclined groove on its top to move vertically in sync. The sliding of the inclined groove inside the sliding shaft pushes and pulls the rotating frame, causing the rotating frame to rotate inside the turntable and change its tilt angle. This causes a flexible positioning plate to press down and effectively fix the chip material, ensuring the chip is stable during inspection and improving the accuracy and reliability of the inspection.

Description

Technical Field

[0001] This utility model relates to the field of chip inspection carrier device technology, and in particular to a semiconductor chip material defect inspection carrier device. Background Technology

[0002] Semiconductor chip materials are typically made of silicon or other high-purity semiconductor materials, which are precision-machined to meet the functional requirements of the chip. During the manufacturing process, various minute defects may appear on the chip surface. These defects need to be identified using high-precision inspection equipment to ensure the quality and performance of the chip.

[0003] Traditional defect inspection carriers typically consist of a support platform, a clamping device, and a positioning system. The support platform provides the foundation for placing the chip, the clamping device secures the chip, and the positioning system ensures the chip remains in the correct position during inspection. These components are mechanically connected and adjusted to fix and position the chip.

[0004] Traditional defect detection carrier devices often exhibit instability when fixing chips, especially during chip surface defect detection. Because traditional devices rely primarily on physical clamping or mechanical pressure, minute displacements or deformations of the chip during operation can lead to detection position deviations. This instability not only affects the accuracy of detection but also damages the chip over long-term use, impacting its performance and reliability. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a semiconductor chip material defect detection carrier device, which aims to improve the problem that traditional defect detection carrier devices often have instability when fixing chips, which can damage the chips during long-term use and affect their performance and reliability.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor chip material defect detection support device, including a support platform, an infrared detection system is provided on the top of the support platform, and multiple fixing components are provided on the upper surface of the support platform;

[0007] The fixing assembly includes multiple fixing platforms, the bottoms of which are fixedly connected to the upper surface of the support platform. A turntable is fixedly connected to the upper surface of the fixing platform, and a rotating frame is rotatably connected inside the turntable. An inclined groove is opened inside the rotating frame. An electric push rod is fixedly connected to the bottom of the fixing platform, and a push platform is fixedly connected to the output end of the electric push rod. A sliding shaft is fixedly connected inside the push platform and is slidably connected inside the inclined groove. A flexible positioning plate is fixedly connected to the side wall of the rotating frame, and a removal assembly is provided on the top of the support platform.

[0008] Furthermore, the removal component includes a connecting platform, the bottom of which is fixedly connected to the top of the support platform.

[0009] Furthermore, a side rail is fixedly connected to the side wall of the connecting platform, and an arc-shaped sliding groove is opened inside the connecting platform. A sliding table is slidably connected to the side wall of the side rail.

[0010] Furthermore, a motor is fixedly connected inside the arc-shaped groove, and a pusher is fixedly connected to the output end of the motor.

[0011] Furthermore, a sliding platform is slidably connected to the side wall of the side rail, and a sliding column is slidably connected inside the sliding platform.

[0012] Furthermore, a top platform is fixedly connected to the top of the sliding column, and a second sliding shaft is fixedly connected inside the top platform. The second sliding shaft is slidably connected inside the arc-shaped sliding groove.

[0013] Furthermore, an adsorption platform is fixedly connected to the bottom end of the sliding column.

[0014] This utility model has the following beneficial effects:

[0015] In this invention, the pusher is first pushed by an electric push rod. At this time, the pusher drives the inclined groove at its top to move vertically in sync. The sliding of the inclined groove inside the sliding shaft pushes and pulls the rotating frame, causing the rotating frame to rotate inside the turntable and change its tilt angle. Then, the flexible positioning plate presses down to effectively fix the chip material, ensuring that the chip is fixed and stable during the detection process, which can improve the accuracy and reliability of the detection.

[0016] In this invention, a motor drives the pusher to rotate, and during the rotation of the pusher, it pushes the second sliding shaft, causing the second sliding shaft to slide inside the arc-shaped sliding groove. The sliding process of the second sliding shaft pushes the top platform, causing the sliding column at the bottom of the top platform to slide inside the sliding platform, and pushing the sliding platform to slide horizontally on the side rail sidewall, thereby driving the adsorption platform to remove the chip material on the surface of the carrier platform, thus improving the automation and detection efficiency of this device. Attached Figure Description

[0017] Figure 1 This is a perspective view of a semiconductor chip material defect detection support device proposed in this utility model;

[0018] Figure 2 This is a schematic diagram of the support platform structure of a semiconductor chip material defect detection support device proposed in this utility model;

[0019] Figure 3 This is a schematic diagram of the fixed platform structure of a semiconductor chip material defect detection support device proposed in this utility model;

[0020] Figure 4This is a schematic diagram of the connection platform structure of a semiconductor chip material defect detection support device proposed in this utility model;

[0021] Figure 5 This is a schematic diagram of the adsorption stage structure of a semiconductor chip material defect detection support device proposed in this utility model.

[0022] Legend:

[0023] 1. Support platform; 2. Infrared detection system; 3. Fixed platform; 4. Electric push rod; 5. Turntable; 6. Turning frame; 7. Push platform; 8. Slide shaft one; 9. Inclined groove; 10. Flexible positioning plate; 11. Connecting platform; 12. Side rail; 13. Arc-shaped slide groove; 14. Motor; 15. Push frame; 16. Slide table; 17. Slide column; 18. Top platform; 19. Slide shaft two; 20. Adsorption platform. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Reference Figures 1-3This utility model provides an embodiment of a semiconductor chip material defect detection support device, comprising a support platform 1, an infrared detection system 2 mounted on the top of the support platform 1 for detecting defects on the chip surface, providing accurate detection data to help identify chip material defects, multiple fixing components mounted on the upper surface of the support platform 1 to ensure the stability and accurate positioning of the chip during the detection process, the fixing components including multiple fixing platforms 3, the bottom of the multiple fixing platforms 3 being fixedly connected to the upper surface of the support platform 1 to ensure the stability and load-bearing capacity of the entire device and prevent shaking or displacement during use, a turntable 5 fixedly connected to the upper surface of the fixing platform 3, the turntable 5 being able to rotate and adjust the angle to facilitate multi-angle detection of the chip, a rotating frame 6 rotatably connected inside the turntable 5, the rotating frame 6 providing stability for rotational operation and supporting the sliding and positioning functions of the inclined slot 9, the rotating frame 6 having an inclined slot 9 inside. Slot 9 guides the sliding of the sliding shaft 8, ensuring that the fixed stage 3 can be precisely adjusted according to the set requirements when needed. An electric push rod 4 is fixedly connected to the bottom of the fixed stage 3. The electric push rod 4 adjusts the position by pushing the push platform 7, ensuring the automated operation of the entire device. The output end of the electric push rod 4 is fixedly connected to the push platform 7. The sliding shaft 8 is fixedly connected inside the push platform 7. When the sliding shaft 8 slides inside the inclined slot 9, it drives the rotating frame 6 to change its angle, so that the chip material can be detected at a suitable angle. A flexible positioning plate 10 is fixedly connected to the side wall of the rotating frame 6. The flexible positioning plate 10 ensures that the chip remains stable during the detection process, reduces the chip position change caused by external forces, and thus improves the detection accuracy and reliability. A removal component is provided on the top of the carrier stage 1, which can effectively remove the chip material from the surface of the carrier stage 1 after the detection is completed, ensuring the high efficiency and automation of the device operation.

[0026] Specifically, when it is necessary to fix the chip material to be tested, the electric push rod 4 is activated to push the push stage 7. At this time, the push stage 7 drives the inclined groove 9 at its top to move vertically in sync. The sliding of the inclined groove 9 inside the sliding shaft 8 will push and pull the rotating frame 6, so that the rotating frame 6 rotates inside the turntable 5 and changes the tilt angle. Then, the flexible positioning plate 10 is pressed down to effectively fix the chip material, ensuring that the chip is in a stable state during the test, and improving the accuracy and reliability of the test.

[0027] Reference Figure 4 and Figure 5The removal components include a connecting platform 11, the bottom of which is fixedly connected to the top of the support platform 1. A side rail 12 is fixedly connected to the side wall of the connecting platform 11. An arc-shaped groove 13 is provided inside the connecting platform 11. A slide table 16 is slidably connected to the side wall of the side rail 12. A motor 14 is fixedly connected inside the arc-shaped groove 13. A pusher 15 is fixedly connected to the output end of the motor 14. A slide table 16 is slidably connected to the side wall of the side rail 12. A slide column 17 is slidably connected inside the slide table 16. A top platform 18 is fixedly connected to the top of the slide column 17. A second slide shaft 19 is fixedly connected inside the top platform 18. The second slide shaft 19 is slidably connected inside the arc-shaped groove 13. An adsorption platform 20 is fixedly connected to the bottom of the slide column 17.

[0028] Specifically, when the chip material needs to be removed after testing, the start motor 14 drives the pusher 15 to rotate. During the rotation of the pusher 15, the pusher 15 pushes the sliding shaft 19, causing the sliding shaft 19 to slide inside the arc-shaped sliding groove 13. The sliding process of the sliding shaft 19 pushes the top platform 18, causing the sliding column 17 at the bottom of the top platform 18 to slide inside the sliding table 16, and pushing the sliding table 16 to slide horizontally on the side wall of the side rail 12. This, in turn, drives the adsorption stage 20 to remove the chip material from the surface of the carrier stage 1. The chip material can be removed stably and effectively from the surface of the carrier stage 1, avoiding errors caused by improper operation or equipment instability. The process has a high degree of automation, reducing the need for manual intervention, thereby improving work efficiency, reducing errors or damage that may be caused by improper manual operation, ensuring the accuracy of chip material removal, and promoting the smooth operation of the overall testing process.

[0029] Working principle: First, when the chip material to be tested needs to be fixed, the electric push rod 4 is activated to push the push stage 7. At this time, the push stage 7 drives the inclined groove 9 at its top to move vertically in sync. The sliding of the inclined groove 9 inside the sliding shaft 8 pushes and pulls the rotating frame 6, causing the rotating frame 6 to rotate inside the turntable 5 and change its tilt angle. Then, the flexible positioning plate 10 presses down to effectively fix the chip material, ensuring that the chip is fixed and stable during the detection process, which can improve the accuracy and reliability of the detection. When it is necessary to remove the chip material after detection, the motor 14 is activated to drive the push frame 15 to rotate. During the rotation of the push frame 15, the push shaft 19 is pushed, causing the sliding shaft 19 to slide inside the arc-shaped sliding groove 13. The sliding process of the sliding shaft 19 pushes the top platform 18, causing the sliding column 17 at the bottom of the top platform 18 to slide inside the sliding table 16, and pushing the sliding table 16 to slide horizontally on the side wall of the side rail 12, thereby driving the adsorption stage 20 to remove the chip material from the surface of the carrier stage 1, improving the automation and detection efficiency of this device.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip material defect detection support device, comprising a support stage (1), characterized in that: An infrared detection system (2) is provided on the top of the support platform (1), and multiple fixing components are provided on the upper surface of the support platform (1); The fixing assembly includes multiple fixing platforms (3), the bottom of the multiple fixing platforms (3) is fixedly connected to the upper surface of the bearing platform (1), a turntable (5) is fixedly connected to the upper surface of the fixing platform (3), a rotating frame (6) is rotatably connected inside the turntable (5), an inclined groove (9) is opened inside the rotating frame (6), an electric push rod (4) is fixedly connected to the bottom of the fixing platform (3), a push table (7) is fixedly connected to the output end of the electric push rod (4), a sliding shaft (8) is fixedly connected inside the push table (7), the sliding shaft (8) is slidably connected inside the inclined groove (9), a flexible positioning plate (10) is fixedly connected to the side wall of the rotating frame (6), and a removal assembly is provided on the top of the bearing platform (1).

2. The semiconductor chip material defect detection support device according to claim 1, characterized in that: The removal component includes a connecting platform (11), the bottom of which is fixedly connected to the top of the support platform (1).

3. The semiconductor chip material defect detection support device according to claim 2, characterized in that: The side wall of the connecting platform (11) is fixedly connected to a side rail (12), and an arc-shaped sliding groove (13) is opened inside the connecting platform (11). The side wall of the side rail (12) is slidably connected to a sliding table (16).

4. The semiconductor chip material defect detection support device according to claim 3, characterized in that: A motor (14) is fixedly connected inside the arc-shaped slide (13), and a pusher (15) is fixedly connected to the output end of the motor (14).

5. The semiconductor chip material defect detection support device according to claim 4, characterized in that: The side rail (12) is slidably connected to a slide table (16), and a slide column (17) is slidably connected inside the slide table (16).

6. The semiconductor chip material defect detection support device according to claim 5, characterized in that: The top of the sliding column (17) is fixedly connected to a top platform (18), and a second sliding shaft (19) is fixedly connected inside the top platform (18). The second sliding shaft (19) is slidably connected inside the arc-shaped sliding groove (13).

7. The semiconductor chip material defect detection support device according to claim 6, characterized in that: An adsorption platform (20) is fixedly connected to the bottom end of the sliding column (17).

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