A data acquisition card

Abstract

This application discloses a data acquisition card, including a temperature acquisition circuit, a signal switching circuit, and a processing module. Both the temperature acquisition circuit and the signal switching circuit are connected to the processing module. The temperature acquisition circuit includes a temperature sampling chip and at least one temperature sampling circuit. The signal switching circuit includes a register circuit and at least one analog switch circuit. The data input terminal of the register circuit is connected to the processing module, and the register circuit includes at least one data output terminal connected to the input terminal. The output terminals of the analog switch circuits are all connected to the processing module. The processing module processes the temperature digital signal acquired by the temperature sampling circuit and the voltage and current signals acquired by the analog switch circuits, and sends the processed signals to an external device. This application allows for flexible selection and integration of a corresponding number of circuit modules based on the type and quantity of signals to be acquired, making the performance of the data acquisition card more adaptable.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a data acquisition card. Background Technology

[0002] A data acquisition card (DAQ) is the core hardware used to convert physical signals (such as voltage, current, and temperature) into digital signals. Its technological foundation includes sensor interfaces, signal conditioning, analog-to-digital converters (ADCs), data transmission (such as PCI, USB, and Ethernet), and embedded control. Traditional DAQ cards typically rely on application-specific integrated circuits (ASICs) or FPGAs to implement specific functions, working in conjunction with host computer software to complete data storage and analysis. Early technologies were limited by chip performance, interface bandwidth, and algorithm complexity, resulting in relatively fixed functions.

[0003] Most industrial-grade data acquisition cards (DAQs) still employ closed architectures, relying on specific drivers and protocols, resulting in high hardware-software coupling. Existing data acquisition cards and devices are deeply customized, limiting flexibility and making them difficult to reuse in other scenarios. Furthermore, customization increases production costs. Utility Model Content

[0004] The purpose of this application is to provide a data acquisition card to solve the technical problem of existing data acquisition cards having a fixed architecture and lacking flexibility in replacement. The various technical effects of the preferred technical solutions provided in this application are detailed below.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] This application provides a data acquisition card, which includes a temperature acquisition circuit, a signal switching circuit, and a processing module. The temperature acquisition circuit and the signal switching circuit are both connected to the processing module.

[0007] The temperature acquisition circuit includes a temperature sampling chip U14 and at least one temperature sampling circuit. The serial data pin of the temperature sampling chip U14 is connected to the processing module, and the differential analog input pin of the temperature sampling chip U14 is connected to the temperature sampling circuit.

[0008] The signal switching circuit includes a register circuit and at least one analog switch circuit. The data input terminal of the register circuit is connected to the processing module. The register circuit includes at least one data output terminal. One data output terminal of the register circuit is connected to one input terminal of the analog switch circuit. The output terminals of the analog switch circuit are all connected to the processing module.

[0009] The processing module processes the digital temperature signal acquired by the temperature sampling circuit and the voltage and current signals acquired by the analog switch circuit, and sends the processed signals to an external device.

[0010] In some embodiments, the temperature sampling circuit includes a connector J1, resistors R18 and R19, capacitors C16, C17, and C18; a first end of the connector J1 is connected to one end of the resistor R19 and a bias voltage, and the other end of the resistor R19 is connected to one end of the capacitor C17, one end of the capacitor C18, and the negative input terminal of the first differential analog input pin of the temperature sampling chip U14, wherein the other end of the capacitor C18 is grounded; a second end of the connector J1 is connected to one end of the resistor R18, and the other end of the resistor R18 is connected to the other end of the capacitor C17, one end of the capacitor C16, and the positive input terminal of the first differential analog input pin of the temperature sampling chip U14, wherein the other end of the capacitor C16 is grounded.

[0011] In some embodiments, the register circuit includes a register chip U13; the serial data input pin of the register chip U13 is connected to the processing module, and the parallel output pin of the register chip U13 is connected to the analog switch circuit.

[0012] In some embodiments, the analog switch circuit includes a solid-state relay U7, a photodiode LED1, and a resistor R7; the first and third terminals of the solid-state relay U7 are connected to a parallel output pin of the register chip U13 and the anode of the photodiode LED1; the second and fourth terminals of the solid-state relay U7 are connected to one end of the resistor R7 and grounded; the other end of the resistor R7 is connected to the cathode of the photodiode LED1; the sixth and eighth terminals of the solid-state relay U7 are connected to an external sensor; and the seventh terminal of the solid-state relay U7 is connected to the processing module.

[0013] In some embodiments, the data acquisition card includes a Hall effect sensor circuit connected to the processing module. The Hall effect sensor circuit includes a Hall sensor U15, capacitors C22, C23, C24, C25, and connector J6. A first end of connector J6 is connected to the third and fourth ends of Hall sensor U15 and one end of capacitor C24. A second end of connector J6 is connected to the first and second ends of Hall sensor U15 and one end of capacitor C25. The other ends of capacitors C24 and C25 are grounded. One end of capacitor C22 is connected to one end of capacitor C23 and the fifth end of Hall sensor U15 and grounded. The other end of capacitor C22 is connected to the eighth end of Hall sensor U15 and the power supply voltage. The other end of capacitor C23 is connected to the seventh end of Hall sensor U15 and the processing module.

[0014] In some embodiments, the processing module includes a microcontroller U2 and an analog-to-digital converter circuit; the serial interface pin of the microcontroller U2 is connected to the serial data pin of the temperature sampling chip U14, the digital-to-analog converter pin of the microcontroller U2 is connected to the analog-to-digital converter circuit, the first I / O pin of the microcontroller U2 is connected to the serial data input pin of the register chip U13, the second I / O pin of the microcontroller U2 is connected to the seventh terminal of the Hall sensor U15, and the 485 transmission pin of the microcontroller U2 is connected to the external device.

[0015] In some embodiments, the analog-to-digital conversion circuit includes resistor R22, resistor R23, and capacitor C26; one end of resistor R22 is connected to the seventh terminal of the solid-state relay U7, and the other end of resistor R22 is connected to the digital-to-analog conversion pin of the microcontroller U2, one end of capacitor C26, and one end of resistor R23, wherein the other ends of capacitor C26 and resistor R23 are grounded.

[0016] In some embodiments, the temperature acquisition circuit includes a power supply circuit, and the power supply pin and ground pin of the temperature sampling chip U14 are both connected to the power supply circuit.

[0017] In some embodiments, the power supply circuit includes resistors R13, R14, and R15, capacitors C11 and C12, and inductor L2. The power supply pin of the temperature sampling chip U14 is connected to one end of resistor R13, one end of resistor R14, one end of capacitor C11, and one end of capacitor C12. The other end of resistor R13 is connected to one end of inductor L2, and the other end of inductor L2 is connected to the power supply voltage. The other end of resistor R14 is connected to one end of resistor R15 and the bias voltage. The other end of resistor R15 is grounded. The other ends of capacitors C11 and C12 are both connected to the ground pin of the temperature sampling chip U14 and grounded.

[0018] In some embodiments, the register circuit further includes an indicator circuit; the indicator pin of the register chip U13 is connected to the indicator circuit; the indicator circuit includes a photodiode LED7, a photodiode LED8, a resistor R5, and a resistor R6, the anode of the photodiode LED7 is connected to the first indicator pin of the register chip U13, the cathode of the photodiode LED7 is connected to one end of the resistor R5, the anode of the photodiode LED8 is connected to the second indicator pin of the register chip U13, the cathode of the photodiode LED8 is connected to one end of the resistor R6, and the other ends of the resistor R5 and the other ends of the resistor R6 are both grounded.

[0019] Implementing one of the technical solutions described above in this application has the following advantages or beneficial effects: The data acquisition card of this application acquires digital temperature signals by setting at least one temperature sampling circuit and at least one analog switching circuit to acquire voltage and current signals. Finally, the processing module processes the acquired signals and transmits them externally. In this case, the data acquisition card can flexibly select the corresponding number of circuit modules for integration and operation according to the type and quantity of signals to be acquired as needed, making the performance of the data acquisition card more adaptable. In addition, compared with existing customized data acquisition cards, the circuit modules of this application have low cost, simple structure, and are easy to integrate. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0021] Figure 1 This is a structural block diagram of the data acquisition card according to an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the circuit structure of the temperature sampling circuit according to an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the circuit structure of the register circuit in an embodiment of this application;

[0024] Figure 4 This is a schematic diagram of the circuit structure of the analog switch circuit according to an embodiment of this application;

[0025] Figure 5 This is a schematic diagram of the circuit structure of the Hall sensor circuit according to an embodiment of this application;

[0026] Figure 6 This is a schematic diagram of the circuit structure of the processing module in an embodiment of this application.

[0027] In the diagram: 1. Data acquisition card; 10. Temperature acquisition circuit; 20. Signal switching circuit; 30. Processing module; 11. Temperature sampling circuit; 21. Register circuit; 22. Analog switch circuit; 40. Hall sensor circuit; 31. Analog-to-digital conversion circuit; 12. Power supply circuit. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments and depict various exemplary embodiments that may be adopted to implement this application. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this application disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this application.

[0029] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0030] To illustrate the technical solutions described in this application, specific embodiments are provided below, showing only the parts related to the embodiments of this application.

[0031] like Figures 1 to 6 As shown, this application provides a data acquisition card 1, including a temperature sampling circuit 11, a signal switching circuit 20, and a processing module 30. The temperature sampling circuit 11 and the signal switching circuit 20 are both connected to the processing module 30.

[0032] In some embodiments, the temperature acquisition circuit 10 may include a temperature sampling chip U14 and at least one temperature sampling circuit 11. The serial data pin of the temperature sampling chip U14 is connected to the processing module 30, and the differential analog input pin of the temperature sampling chip U14 is connected to the temperature sampling circuit 11.

[0033] Specifically, the temperature sampling chip U14 may have multiple sets of differential analog input pins, one set of which can be connected to the corresponding temperature sampling circuit 11. The temperature sampling circuit 11 can be used to acquire the temperature analog signal from the sensor, such as the temperature analog signal from a thermocouple resistor. The temperature sampling chip U14 can convert the temperature analog signal acquired by the temperature sampling circuit 11 into a temperature digital signal, which is then transmitted to the processing module 30 via the serial data pin of the temperature sampling chip U14.

[0034] In some embodiments, the temperature sampling circuit 11 may include connector J1, resistors R18 and R19, and capacitors C16, C17, and C18. A first end of connector J1 is connected to one end of resistor R19 and a bias voltage. The other end of resistor R19 is connected to one end of capacitor C17, one end of capacitor C18, and the negative input terminal of the first differential analog input pin, wherein the other end of capacitor C18 is grounded. A second end of connector J1 is connected to one end of resistor R18. The other end of resistor R18 is connected to the other end of capacitor C17, one end of capacitor C16, and the positive input terminal of the first differential analog input pin, wherein the other end of capacitor C16 is grounded. Connector J1 can be connected to an external sensor.

[0035] In some embodiments, another temperature sampling circuit 11 may include connector J2, resistors R20 and R21, capacitors C19, C20, and C21. A first end of connector J2 is connected to one end of resistor R21 and a bias voltage. The other end of resistor R21 is connected to one end of capacitor C20, one end of capacitor C21, and the negative input terminal of the second differential analog input pin, wherein the other end of capacitor C21 is grounded. A second end of connector J2 is connected to one end of resistor R20. The other end of resistor R20 is connected to the other end of capacitor C20, one end of capacitor C19, and the positive input terminal of the second differential analog input pin, wherein the other end of capacitor C19 may be grounded. Connector J2 can be connected to an external sensor.

[0036] In some embodiments, another temperature sampling circuit 11 may include connector J3, resistors R16 and R17, capacitors C13, C14, and C15. A first end of connector J3 is connected to one end of resistor R16 and the bias voltage. The other end of resistor R16 is connected to one end of capacitor C13, one end of capacitor C15, and the negative input terminal of the third differential analog input pin, wherein the other end of capacitor C13 is grounded. A second end of connector J3 is connected to one end of resistor R17. The other end of resistor R17 is connected to the other end of capacitor C15, one end of capacitor C14, and the positive input terminal of the third differential analog input pin, wherein the other end of capacitor C14 may be grounded. Connector J3 can be connected to an external sensor. The circuit structures of each temperature sampling circuit 11 can be identical.

[0037] In some embodiments, the temperature acquisition circuit 10 may include a power supply circuit 12, and the power supply pin and ground pin of the temperature sampling chip U14 are both connected to the power supply circuit 12.

[0038] In some embodiments, the power supply circuit 12 may include resistors R13, R14, and R15, capacitors C11 and C12, and inductor L2. The power supply pin of the temperature sampling chip U14 may be connected to one end of resistor R13, one end of resistor R14, one end of capacitor C11, and one end of capacitor C12. The other end of resistor R13 is connected to one end of inductor L2, which is connected to the power supply voltage. The other end of resistor R14 is connected to one end of resistor R15 and the bias voltage. The other end of resistor R15 is grounded. The other ends of capacitors C11 and C12 are both connected to the ground pin of the temperature sampling chip U14 and grounded.

[0039] like Figure 2 As shown, pins 15 and 16 of the temperature sampling chip U14 can be serial data pins. The temperature sampling chip U14 can send data to the processing module 30 through pin 15, and receive data from the processing module 30 through pin 16. Pin 5 of the temperature sampling chip U14 is the positive input terminal of the first differential analog input pin, pin 6 of the temperature sampling chip U14 is the negative input terminal of the first differential analog input pin, pin 7 of the temperature sampling chip U14 is the positive input terminal of the second differential analog input pin, pin 8 of the temperature sampling chip U14 is the negative input terminal of the second differential analog input pin, pin 9 of the temperature sampling chip U14 is the positive input terminal of the third differential analog input pin, and pin 10 of the temperature sampling chip U14 is the negative input terminal of the third differential analog input pin. Pin 12 of the temperature sampling chip U14 is the ground pin, and pins 13 and 14 of the temperature sampling chip U14 are power supply pins.

[0040] In some embodiments, the signal switching circuit 20 may include a register circuit 21 and at least one analog switch circuit 22. The data input terminal of the register circuit 21 is connected to the processing module 30, and the register circuit 21 may include at least one data output terminal. One data output terminal of the register circuit 21 is connected to the input terminal of one analog switch circuit 22, and the output terminals of the analog switch circuits 22 are all connected to the processing module 30. Specifically, the processing module 30 may send a switch signal to the register circuit 21, and the register circuit 21 may activate the corresponding analog switch circuit 22 according to the switch signal. At this time, the analog switch circuit 22 may receive voltage and current signals from external sensors and send the voltage and current signals to the processing module 30.

[0041] In some embodiments, the register circuit 21 may include a register chip U13. The serial data input pin of the register chip U13 is connected to the processing module 30, and the parallel output pin of the register chip U13 is connected to the analog switch circuit 22. Specifically, the register chip U13 can be connected to one analog switch circuit 22 through one of its parallel output pins. The total number of analog switch circuits 22 and the number of analog switch circuits 22 to be activated can be set according to the number of voltage and current signals to be received. The serial data input pin of the register chip U13 can be the data input terminal of the register circuit 21, and one of its parallel output pins can be the data output terminal of the register circuit 21.

[0042] In some embodiments, the register circuit 21 may further include an indicator circuit. The indicator pin of the register chip U13 is connected to the indicator circuit. The indicator circuit may include a photodiode LED7, a photodiode LED8, resistors R5 and R6. The anode of the photodiode LED7 is connected to the first indicator pin of the register chip U13, the cathode of the photodiode LED7 may be connected to one end of the resistor R5, the anode of the photodiode LED8 is connected to the second indicator pin of the register chip U13, and the cathode of the photodiode LED8 may be connected to one end of the resistor R6. The other ends of resistors R5 and R6 are both grounded.

[0043] like Figure 3 As shown, pins 1 and 2 of register chip U13 can be serial data input pins of register chip U13, pins 3, 4, 5, 6, 10 and 11 of register chip U13 can be parallel output pins of register chip U13, and pins 12 and 13 of register chip U13 can be indicator pins of register chip U13.

[0044] In some embodiments, such as Figure 4 As shown, the analog switch circuit 22 may include a solid-state relay U7, a photodiode LED1, and a resistor R7. The first and third terminals of the solid-state relay U7 can be connected to a parallel output pin of the register chip U13 and the anode of the photodiode LED1. The second and fourth terminals of the solid-state relay U7 can be connected to one end of the resistor R7 and grounded. The other end of the resistor R7 can be connected to the cathode of the photodiode LED1. The sixth and eighth terminals of the solid-state relay U7 can be connected to an external sensor, and the seventh terminal of the solid-state relay U7 can be connected to the processing module 30.

[0045] The sixth and eighth terminals of the solid-state relay U7 can be connected to external sensors to receive voltage and current signals, and the seventh terminal of the solid-state relay U7 can transmit the voltage and current signals to the processing module 30.

[0046] In some embodiments, another analog switch circuit 22 may include a solid-state relay U8, a photodiode LED2, and a resistor R8. The first and third terminals of the solid-state relay U8 can be connected to another parallel output pin of the register chip U13 and the anode of the photodiode LED2. The second and fourth terminals of the solid-state relay U8 can be connected to one end of the resistor R8 and grounded. The other end of the resistor R8 can be connected to the cathode of the photodiode LED2. The sixth and eighth terminals of the solid-state relay U8 can be connected to an external sensor to receive voltage and current signals. The seventh terminal of the solid-state relay U8 can transmit the voltage and current signals to the processing module 30.

[0047] In some embodiments, another analog switch circuit 22 may include a solid-state relay U9, a photodiode LED3, and a resistor R9. The first and third terminals of the solid-state relay U9 can be connected to another parallel output pin of the register chip U13 and the anode of the photodiode LED3. The second and fourth terminals of the solid-state relay U9 can be connected to one end of the resistor R9 and grounded. The other end of the resistor R9 can be connected to the cathode of the photodiode LED3. The sixth and eighth terminals of the solid-state relay U9 can be connected to an external sensor to receive voltage and current signals. The seventh terminal of the solid-state relay U9 can transmit the voltage and current signals to the processing module 30.

[0048] In some embodiments, another analog switch circuit 22 may include a solid-state relay U10, a photodiode LED4, and a resistor R10. The first and third terminals of the solid-state relay U10 can be connected to another parallel output pin of the register chip U13 and the anode of the photodiode LED4. The second and fourth terminals of the solid-state relay U10 can be connected to one end of the resistor R10 and grounded. The other end of the resistor R10 can be connected to the cathode of the photodiode LED4. The sixth and eighth terminals of the solid-state relay U10 can be connected to an external sensor to receive voltage and current signals. The seventh terminal of the solid-state relay U10 can transmit the voltage and current signals to the processing module 30.

[0049] In some embodiments, another analog switch circuit 22 may include a solid-state relay U11, a photodiode LED5, and a resistor R11. The first and third terminals of the solid-state relay U11 can be connected to another parallel output pin of the register chip U13 and the anode of the photodiode LED5. The second and fourth terminals of the solid-state relay U11 can be connected to one end of the resistor R11 and grounded. The other end of the resistor R11 can be connected to the cathode of the photodiode LED5. The sixth and eighth terminals of the solid-state relay U11 can be connected to an external sensor to receive voltage and current signals. The seventh terminal of the solid-state relay U11 can transmit the voltage and current signals to the processing module 30.

[0050] In some embodiments, another analog switch circuit 22 may include a solid-state relay U12, a photodiode LED6, and a resistor R12. The first and third terminals of the solid-state relay U12 can be connected to another parallel output pin of the register chip U13 and the anode of the photodiode LED6. The second and fourth terminals of the solid-state relay U12 can be connected to one end of the resistor R12 and grounded. The other end of the resistor R12 can be connected to the cathode of the photodiode LED6. The sixth and eighth terminals of the solid-state relay U12 can be connected to external sensors to receive voltage and current signals. The seventh terminal of the solid-state relay U12 can transmit the voltage and current signals to the processing module 30. The circuit structures of each analog switch circuit 22 can be identical.

[0051] In summary, the signal switching circuit 20 may include one to six analog switch circuits 22, which can be connected to the parallel output pins of the register chip U13.

[0052] In some embodiments, the data acquisition card 1 may include a Hall sensor circuit 40, which may be connected to the processing module 30.

[0053] In some embodiments, such as Figure 5 As shown, the Hall sensor circuit 40 may include a Hall sensor U15, capacitors C22, C23, C24, C25, and connector J6. The first end of connector J6 is connected to the third and fourth ends of Hall sensor U15 and one end of capacitor C24. The second end of connector J6 is connected to the first and second ends of Hall sensor U15 and one end of capacitor C25. The other ends of capacitors C24 and C25 are grounded. One end of capacitor C22 is connected to one end of capacitor C23 and the fifth end of Hall sensor U15 and grounded. The other end of capacitor C22 is connected to the eighth end of Hall sensor U15 and the power supply voltage. The other end of capacitor C23 is connected to the seventh end of Hall sensor U15 and the processing module 30.

[0054] Specifically, connector J6 can be used to connect to an external sensor, acquire the current detection signal from the external sensor and transmit the current detection signal to Hall sensor U15. Hall sensor U15 generates a current analog signal based on the current detection signal, and the current analog signal can be output to processing module 30 via the seventh terminal of Hall sensor U15.

[0055] In some embodiments, such as Figure 6As shown, the processing module 30 may include a microcontroller U2 and an analog-to-digital converter circuit 31. The serial interface pin of the microcontroller U2 can be connected to the serial data pin of the temperature sampling chip, the digital-to-analog conversion pin of the microcontroller U2 is connected to the analog-to-digital converter circuit 31, the first IO pin of the microcontroller U2 can be connected to the serial data input pin of the register chip U13, the second IO pin of the microcontroller U2 can be connected to the seventh terminal of the Hall sensor U15, and the 485 transmission pin of the microcontroller U2 can be connected to an external device.

[0056] like Figure 6 As shown, pins 13 and 14 of microcontroller U2 can be serial interface pins of microcontroller U2, pin 11 of microcontroller U2 can be digital-to-analog conversion pin of microcontroller U2, pin 9 of microcontroller U2 can be the first IO pin of microcontroller U2, pin 15 of microcontroller U2 can be the second IO pin of microcontroller U2, and pin 19 of microcontroller U2 can be the 485 transmission pin of microcontroller U2.

[0057] The processing module 30 can process the signals collected by each circuit, and then output the processed signals through the 485 transmission pin. External devices can be sensors, actuators, or smart meters.

[0058] In some embodiments, the analog-to-digital conversion circuit 31 may include resistors R22 and R23 and capacitor C26. One end of resistor R22 may be connected to the seventh terminal of solid-state relay U7, and the other end of resistor R22 may be connected to the digital-to-analog conversion pin of microcontroller U2, one end of capacitor C26, and one end of resistor R23, wherein the other ends of capacitor C26 and resistor R23 are grounded.

[0059] The application scenario of this application is as follows: Based on the total number of voltage, current, and temperature acquisition channels required by the device to be acquired, such as a solar panel, a corresponding number of circuit modules are selected and soldered onto a circuit board to obtain the data acquisition card 1 of this application. The data acquisition card 1 of this application can be adjusted accordingly according to the actual acquisition needs, achieving the same acquisition function at a low cost.

[0060] On the one hand, the selection of existing data acquisition cards is limited, and customizing data acquisition cards according to the number of channels will increase costs.

[0061] The data acquisition card 1 of this application acquires digital temperature signals by setting at least one temperature sampling circuit 11 and at least one analog switching circuit 22 to acquire voltage and current signals. Finally, the processing module 30 processes the acquired signals and transmits them externally. In this configuration, the data acquisition card 1 can flexibly select the corresponding number of circuit modules for integration and operation according to the type and quantity of signals to be acquired as needed, making the performance of the data acquisition card 1 more adaptable. In addition, compared with existing customized data acquisition cards, the circuit modules of this application are low in cost, simple in structure, and easy to integrate.

[0062] The above description is merely a preferred embodiment of this application. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this application. Furthermore, under the teachings of this application, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this application. Therefore, this application is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this application.

Claims

1. A data acquisition card, characterized in that, It includes a temperature acquisition circuit, a signal switching circuit, and a processing module, wherein the temperature acquisition circuit and the signal switching circuit are both connected to the processing module; The temperature acquisition circuit includes a temperature sampling chip U14 and at least one temperature sampling circuit. The serial data pin of the temperature sampling chip U14 is connected to the processing module, and the differential analog input pin of the temperature sampling chip U14 is connected to the temperature sampling circuit. The signal switching circuit includes a register circuit and at least one analog switch circuit. The data input terminal of the register circuit is connected to the processing module. The register circuit includes at least one data output terminal. One data output terminal of the register circuit is connected to one input terminal of the analog switch circuit. The output terminals of the analog switch circuit are all connected to the processing module. The processing module processes the digital temperature signal acquired by the temperature sampling circuit and the voltage and current signals acquired by the analog switch circuit, and sends the processed signals to an external device.

2. The data acquisition card according to claim 1, characterized in that, The temperature sampling circuit includes connector J1, resistors R18 and R19, capacitors C16, C17, and C18. The first end of connector J1 is connected to one end of resistor R19 and a bias voltage. The other end of resistor R19 is connected to one end of capacitor C17, one end of capacitor C18, and the negative input terminal of the first differential analog input pin of the temperature sampling chip U14. The other end of capacitor C18 is grounded. The second end of connector J1 is connected to one end of resistor R18. The other end of resistor R18 is connected to the other end of capacitor C17, one end of capacitor C16, and the positive input terminal of the first differential analog input pin of the temperature sampling chip U14. The other end of capacitor C16 is grounded.

3. The data acquisition card according to claim 1, characterized in that, The register circuit includes a register chip U13; the serial data input pin of the register chip U13 is connected to the processing module, and the parallel output pin of the register chip U13 is connected to the analog switch circuit.

4. The data acquisition card according to claim 3, characterized in that, The analog switch circuit includes a solid-state relay U7, a photodiode LED1, and a resistor R7. The first and third terminals of the solid-state relay U7 are connected to a parallel output pin of the register chip U13 and the anode of the photodiode LED1. The second and fourth terminals of the solid-state relay U7 are connected to one end of the resistor R7 and grounded. The other end of the resistor R7 is connected to the cathode of the photodiode LED1. The sixth and eighth terminals of the solid-state relay U7 are connected to an external sensor. The seventh terminal of the solid-state relay U7 is connected to the processing module.

5. The data acquisition card according to claim 4, characterized in that, The data acquisition card includes a Hall effect sensor circuit, which is connected to the processing module. The Hall effect sensor circuit includes a Hall sensor U15, capacitors C22, C23, C24, and C25, and a connector J6. The first end of the connector J6 is connected to the third and fourth ends of the Hall sensor U15 and one end of the capacitor C24. The second end of the connector J6 is connected to the first and second ends of the Hall sensor U15 and one end of the capacitor C25. The other ends of the capacitors C24 and C25 are grounded. One end of the capacitor C22 is connected to one end of the capacitor C23 and the fifth end of the Hall sensor U15 and grounded. The other end of the capacitor C22 is connected to the eighth end of the Hall sensor U15 and the power supply voltage. The other end of the capacitor C23 is connected to the seventh end of the Hall sensor U15 and the processing module.

6. The data acquisition card according to claim 5, characterized in that, The processing module includes a microcontroller U2 and an analog-to-digital converter circuit; the serial interface pin of the microcontroller U2 is connected to the serial data pin of the temperature sampling chip U14, the digital-to-analog converter pin of the microcontroller U2 is connected to the analog-to-digital converter circuit, the first IO pin of the microcontroller U2 is connected to the serial data input pin of the register chip U13, the second IO pin of the microcontroller U2 is connected to the seventh terminal of the Hall sensor U15, and the 485 transmission pin of the microcontroller U2 is connected to the external device.

7. The data acquisition card according to claim 6, characterized in that, The analog-to-digital conversion circuit includes resistors R22 and R23 and capacitor C26; one end of resistor R22 is connected to the seventh terminal of the solid-state relay U7, and the other end of resistor R22 is connected to the digital-to-analog conversion pin of the microcontroller U2, one end of capacitor C26, and one end of resistor R23, wherein the other ends of capacitor C26 and resistor R23 are grounded.

8. The data acquisition card according to claim 1, characterized in that, The temperature acquisition circuit includes a power supply circuit, and the power supply pin and ground pin of the temperature sampling chip U14 are both connected to the power supply circuit.

9. The data acquisition card according to claim 8, characterized in that, The power supply circuit includes resistors R13, R14, and R15, capacitors C11 and C12, and inductor L2. The power supply pin of the temperature sampling chip U14 is connected to one end of resistor R13, one end of resistor R14, one end of capacitor C11, and one end of capacitor C12. The other end of resistor R13 is connected to one end of inductor L2, and the other end of inductor L2 is connected to the power supply voltage. The other end of resistor R14 is connected to one end of resistor R15 and the bias voltage. The other end of resistor R15 is grounded. The other ends of capacitors C11 and C12 are both connected to the ground pin of the temperature sampling chip U14 and grounded.

10. The data acquisition card according to claim 3, characterized in that, The register circuit also includes an indicator circuit; the indicator pin of the register chip U13 is connected to the indicator circuit; the indicator circuit includes a photodiode LED7, a photodiode LED8, a resistor R5, and a resistor R6. The anode of the photodiode LED7 is connected to the first indicator pin of the register chip U13, the cathode of the photodiode LED7 is connected to one end of the resistor R5, the anode of the photodiode LED8 is connected to the second indicator pin of the register chip U13, the cathode of the photodiode LED8 is connected to one end of the resistor R6, and the other ends of the resistors R5 and R6 are both grounded.

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