A miniaturized, high sound pressure level directional sound wave control device

Abstract

This invention discloses a miniaturized, high sound pressure level directional acoustic wave control device, comprising a housing, inside which are installed a power module, a signal processing module, a power amplification module, and a controller; a directional acoustic wave emitting array is located on the top of the housing; the output of the controller is connected to the inputs of the signal processing module and the power amplification module respectively, the output of the signal processing module is connected to the input of the power amplification module, and the output of the power amplification module is connected to the directional acoustic wave emitting array; the directional acoustic wave emitting array includes a bracket, and multiple ultrasonic transducers are arrayed on the upper surface of the bracket. This invention adopts a compact circuit layout and modular installation structure, significantly reducing the size of the device; it utilizes a high-efficiency signal processing chip and power amplification technology to achieve high sound pressure level output; it improves the directionality of the sound waves through the ultrasonic transducer array and acoustic lens; and it is equipped with an intelligent controller and a power management system to support diverse function adjustments and long-term stable operation.

Description

Technical Field

[0001] This utility model relates to a directional sound wave control device, and more particularly to a miniaturized, high sound pressure level directional sound wave control device. Background Technology

[0002] Directional acoustic technology plays a crucial role in modern society's public safety, industrial production, and commercial services. It is widely used in security alerts, industrial inspections, commercial advertising, and traffic control, enabling precise sound propagation and information transmission. By focusing sound in a specific direction, directional acoustic devices can accurately convey warnings, instructions, and announcements in complex environments, avoiding interference with unrelated areas and effectively improving the efficiency and accuracy of information transmission. With the help of directional acoustic devices, operators can remotely control the direction and content of sound propagation, enabling rapid response and timely handling of various problems in emergencies or large-scale event management.

[0003] However, traditional directional acoustic wave devices face numerous challenges in practical applications. In terms of size, most traditional devices are bulky with loose internal circuit layouts, resulting in excessively large overall dimensions that fail to meet the requirements for portability and integration, limiting their application in confined spaces or mobile scenarios. Regarding sound pressure output performance, some devices suffer from inefficient power amplification modules and insufficient signal processing capabilities, failing to generate sufficiently strong sound pressure, leading to short sound propagation distances and weak penetration, making it difficult to ensure effective information transmission in noisy environments or over long distances. In terms of sound wave directionality, traditional transmitter array designs are often flawed, with unoptimized transducer arrangements and acoustic structures, resulting in large sound wave divergence angles, poor directional effects, and a waste of sound energy, impacting usability. Finally, in terms of functional adaptability, existing devices suffer from low circuit control flexibility, making it difficult to adjust sound wave frequency and sound pressure level parameters according to different usage scenarios, and lacking intelligent control functions, hindering automated and precise operation.

[0004] Currently, most directional acoustic wave devices on the market employ conventional circuit designs and structural layouts. Some devices use simple signal processing circuits, capable only of basic audio signal amplification, lacking the ability to perform in-depth signal processing and optimization, resulting in poor sound quality and severe distortion. In the power amplification stage, some devices use inefficient amplification chips, which not only consume a lot of energy but also easily generate heat, affecting the stability and lifespan of the device. In terms of transmitting array construction, most devices use ordinary transducers arranged arbitrarily, lacking scientific acoustic design, making it difficult to form highly directional acoustic beams. In addition, the power modules of traditional devices have limited battery life and lack intelligent power management functions, failing to meet the needs of long-term continuous operation; the control modules are functionally limited, complex to operate, lack user-friendly human-machine interaction, and are difficult to adapt quickly to diverse usage scenarios.

[0005] In summary, existing directional acoustic wave devices have significant shortcomings in terms of device size, sound pressure output, directional performance, and functional adaptability, and cannot meet the requirements of modern society for efficient, accurate, and intelligent sound propagation devices. Utility Model Content

[0006] Purpose of the utility model: The purpose of this utility model is to provide a miniaturized, high sound pressure level directional sound wave control device that is small in size, has sufficient sound pressure output, good directionality, and is applicable to a wide range of scenarios.

[0007] Technical solution: This utility model includes a shell, inside which a power module, a signal processing module, a power amplification module, and a controller are installed; a directional acoustic wave emitting array is provided on the top of the shell; the output terminal of the controller is connected to the input terminals of the signal processing module and the power amplification module respectively, the output terminal of the signal processing module is connected to the input terminal of the power amplification module, and the output terminal of the power amplification module is connected to the directional acoustic wave emitting array; the directional acoustic wave emitting array includes a bracket, and multiple ultrasonic transducers are arrayed on the upper surface of the bracket.

[0008] The power amplifier module includes a preamplifier, a power amplifier, and a heat dissipation device. The output of the preamplifier is connected to the input of the power amplifier.

[0009] The signal processing module includes a filter circuit, a modulation circuit, and a signal conversion circuit connected in sequence. The filter circuit adopts a π-type LC filter network, the modulation circuit integrates a Class D modulation chip, and the signal conversion circuit adopts a Σ-Δ type ADC chip.

[0010] The controller includes a control board and a microprocessor, a memory chip circuit, an input interface circuit, a start button, an adjustment knob, an output interface circuit, and a directional acoustic wave emission array circuit mounted on the control board. The microprocessor and the memory chip circuit are interconnected. The output terminals of the start button and the adjustment knob are connected to the input terminals of the microprocessor through the input interface circuit. The output terminals of the microprocessor are connected to the input terminals of the output interface circuit and the directional acoustic wave emission array circuit, respectively.

[0011] The start button is used to control the directional sound wave emission array to turn on and off, and the adjustment knob is used to adjust the parameters of sound wave frequency and sound pressure level.

[0012] The power module includes an AC-DC conversion circuit and a multi-channel DC-DC conversion circuit; the AC-DC conversion circuit and the multi-channel DC-DC conversion circuit are interconnected.

[0013] The outer shell is equipped with a modular mounting bracket, and each module is fixed to the bracket by shock-absorbing pads.

[0014] Beneficial effects: This utility model adopts a compact circuit layout and modular installation structure, which greatly reduces the size of the equipment; it uses a high-efficiency signal processing chip and power amplification technology to achieve high sound pressure level output; it significantly improves the directionality of sound waves through ultrasonic transducer arrays and acoustic lenses; at the same time, it is equipped with an intelligent controller and power management system, which supports diversified function adjustment and long-term stable operation, providing a more advanced and reliable technical solution and equipment selection for the application of directional sound wave technology in multiple fields, and has important practical value and broad market prospects. Attached Figure Description

[0015] Figure 1 This is an overall structural diagram of the present invention;

[0016] Figure 2 This is a schematic diagram showing the connection of each module of this utility model;

[0017] Figure 3 This is a schematic diagram of the power amplifier module of this utility model;

[0018] Figure 4 This is a block diagram of the internal structure of the controller of this utility model. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings.

[0020] like Figure 1 As shown, the miniaturized, high sound pressure level directional sound wave control device of this utility model includes a housing 1. Inside the housing 1 are installed a power module 2, a signal processing module 3, a power amplification module 4, and a controller 6. A modular mounting bracket is provided inside the housing 1, and each module is fixed to the bracket by shock-absorbing pads. A directional sound wave emitting array 5 is provided on the top of the housing 1. Figure 2 As shown, the output terminal of the controller 6 is connected to the input terminals of the signal processing module 3 and the power amplification module 4, respectively. The output terminal of the signal processing module 3 is connected to the input terminal of the power amplification module 4, and the output terminal of the power amplification module 4 is connected to the directional acoustic wave transmitting array 5.

[0021] The overall dimensions of the outer casing are only 200mm × 150mm × 80mm, a 40% reduction in volume and a weight of 2.8kg compared to traditional similar devices. The device features a modular aluminum alloy support frame with 3mm thick EPDM shock-absorbing pads, reducing the impact of external vibrations on the internal circuitry by 75%. Actual testing showed that in a 5-50Hz vibration environment, the displacement of internal components was controlled within 0.3mm, and the operating noise was reduced from 65dB to 42dB. The modules can be quickly assembled via standardized interfaces, improving maintenance efficiency by 60%. This effectively solves the problems of bulkiness and poor vibration resistance in traditional equipment, ensuring stable operation in various scenarios, including vehicle-mounted and handheld applications.

[0022] Power module 2 includes an AC-DC conversion circuit and a multi-channel DC-DC conversion circuit; the AC-DC conversion circuit and the multi-channel DC-DC conversion circuit are interconnected. The AC-DC conversion circuit adopts a flyback switching power supply topology, with the core chip PITNY277PN, supporting a wide voltage input of 90-264V and a conversion efficiency of 90%; the multi-channel DC-DC conversion circuit provides 5V / 3A, 12V / 2A, and 24V / 3A outputs, and each channel integrates overcurrent protection and thermal shutdown functions.

[0023] Power module 2 achieves stable conversion from AC mains power to multi-voltage DC output through a cascaded design of a flyback AC-DC converter circuit and multiple DC-DC converter circuits, and provides overcurrent and overheat protection. The flyback topology completes the initial AC-to-DC conversion, while the multiple DC-DC circuits further step down and regulate the voltage, providing suitable power to each module of the device and ensuring reliable system operation. The AC-DC converter circuit adopts a flyback switching power supply topology. The core chip controls the on / off state of the transformer's primary winding through a high-frequency switch, inducing a DC voltage in the secondary winding, achieving a conversion from a wide voltage input of 90-264V to high-voltage DC with a conversion efficiency of 90%. The multiple DC-DC converter circuits step down the high-voltage DC to 5V, 12V, and 24V outputs respectively. Each channel has a built-in overcurrent detection resistor and temperature sensor. When the current exceeds the rated value or the temperature reaches the threshold, the protection circuit is triggered to cut off the output, preventing module damage. The two-stage circuits work together to ensure that the output voltage is stable within ±2% error range. The power module features a wide input voltage range of 90-264V, adapting to various global mains environments, and its conversion efficiency is 40% higher than traditional linear power supplies. Ripple on the 5V, 12V, and 24V output channels is controlled within 50mV, 80mV, and 100mV respectively, meeting the power supply requirements of the controller, signal processing module, and power amplifier module. Overcurrent protection response time is less than 50ms, and the thermal shutdown temperature threshold is set at 85℃. Testing showed that after 8 hours of continuous full-load operation, the module temperature stabilized at 75℃, effectively improving system reliability. The power module supports an operating temperature range of -20℃ to 60℃, ensuring stable power supply to the device in complex environments, with a mean time between failures (MTBF) exceeding 50,000 hours.

[0024] Signal processing module 3 includes a filter circuit, a modulation circuit, and a signal conversion circuit connected in sequence. Through the collaborative design of these three circuits, signal quality and processing efficiency are significantly improved. The filter circuit adopts a π-type LC filter network, composed of TDKCGA4D2X7R1H475M ceramic capacitors and Coilcraft DO3330S-4R7M inductors, achieving a noise suppression ratio of 85dB for frequencies above 50Hz. The modulation circuit integrates a Texas Instruments UCC27532D class-D modulation chip with a conversion efficiency of up to 92%. The signal conversion circuit uses an Analog Devices AD7606 16-bit Σ-Δ ADC chip with a sampling rate of 200kSPS and a quantization error of only ±0.0015%. Actual tests show that the signal-to-noise ratio of the processed signal increases from 65dB to 90dB, and the distortion decreases from 0.5% to 0.01%. When driving directional sound wave emission, the sound pressure level fluctuation range is reduced from ±5dB to ±1dB, precisely controlling the sound wave parameters and achieving high-quality signal output.

[0025] Signal processing module 3 employs a three-stage cascaded architecture consisting of a π-type LC filter network, a Class D modulation chip, and a 16-bit Σ-Δ ADC chip to achieve noise filtering, power modulation, and digitization of the audio signal. The filter circuit suppresses noise in the input signal, the modulation circuit converts the analog signal into high-frequency pulses, and the signal conversion circuit performs analog-to-digital conversion, providing a high-quality digital signal for power amplification and directional sound wave emission. The filter circuit uses a π-type LC topology, consisting of two capacitors and one inductor. It utilizes the characteristics of capacitors passing high frequencies and blocking low frequencies, and inductors passing low frequencies and blocking high frequencies, to attenuate noise above 50Hz. The modulation circuit uses a Class D modulation chip, which converts the analog audio signal into high-frequency pulses using pulse width modulation technology. The chip's internal comparator and driver circuit achieve efficient signal conversion. The 16-bit Σ-Δ ADC chip in the signal conversion circuit uses oversampling and noise shaping techniques to convert the modulated analog signal into a digital signal, ensuring signal fidelity through a 200kSPS sampling rate and 16-bit quantization accuracy. After filtering, the signal noise suppression ratio reaches 85dB, and the signal-to-noise ratio is improved from 65dB to 90dB. The Class D modulation chip achieves a conversion efficiency of 92%, reducing power consumption by 30% compared to traditional solutions. The 16-bit Σ-Δ ADC chip reduces signal distortion from 0.5% to 0.01%, and controls quantization error within ±0.0015%. When driving directional sound wave transmission, the sound pressure level fluctuation range is reduced from ±5dB to ±1dB, and the frequency response range is extended to 20Hz-20kHz. This results in a sound pressure level attenuation of only 12dB at a distance of 100 meters, increasing the effective operating distance to 150 meters and significantly improving the stability and directional accuracy of sound wave transmission.

[0026] like Figure 3As shown, the power amplifier module 4 includes a preamplifier 401, a power amplifier 402, and a heat sink 403. The output of the preamplifier is connected to the input of the power amplifier. The preamplifier 401 uses a Texas Instruments OPA2134 low-noise operational amplifier with a noise density as low as 4nV / Hz and a gain-bandwidth product of 63MHz. The power amplifier 402 uses an STMicroelectronics TDA7294 Class AB power amplifier chip, which can provide 50WRMS continuous power output with a total harmonic distortion of <0.05%. The heat sink 403 includes a miniature aluminum-magnesium alloy heat sink array and a 4500RPM axial fan. The heat sink array is directly attached to the heat dissipation surface of the power amplifier 402. During full-power operation, the temperature of the power chip is stably controlled below 70℃, which is 45% lower than traditional heat dissipation solutions. The entire system improves the power conversion efficiency to 78% and the MTBF to over 100,000 hours, ensuring the continuous and stable output of high sound pressure level sound waves.

[0027] The power amplifier module 4 utilizes a three-tiered architecture of "preamplification-power amplification-heat dissipation coordination" to convert audio signals from weak levels to high-power output, while ensuring stable operation through a heat dissipation device. A low-noise operational amplifier performs signal pre-amplification, an AB-class power amplifier chip achieves high-power output, and a combination of a miniature heat sink array and an axial fan provides thermal management, ensuring the module efficiently and reliably powers the directional acoustic wave emission array. The preamplifier 401 employs a low-noise operational amplifier, leveraging its high input impedance and high gain characteristics to amplify the weak input audio signal to a suitable power amplification level, reducing the interference of circuit noise floor. The power amplifier 402 uses an AB-class power amplifier chip, utilizing its class AB operating mode to maintain low power consumption in static conditions and provide high output power in dynamic conditions, driving the load through complementary symmetry circuitry. In the heat dissipation device 403, the miniature heat sink array is tightly fitted to the heat dissipation surface of the power amplifier 402, rapidly dissipating heat through conduction; the axial fan generates forced convection at a constant speed, accelerating heat diffusion from the fin surface and forming an efficient heat dissipation cycle. The preamplifier reduces the input signal noise density to 4nV / Hz, achieving a gain-bandwidth product of 63MHz, ensuring distortion-free signal amplification. The Class AB power amplifier chip achieves continuous power output of 50WRMS, with total harmonic distortion less than 0.05% and power conversion efficiency increased to 78%. The heat dissipation device keeps the power chip temperature stably below 70℃ under full load operation, with a thermal resistance as low as 0.3℃ / W, representing a 45% temperature reduction compared to solutions without heat dissipation, and a mean time between failures (MTBF) exceeding 100,000 hours. When driving a directional acoustic wave emission array, the sound pressure level fluctuation is controlled within ±1dB, maintaining a high sound pressure output of 110dB at a distance of 100 meters, significantly improving the device's power output capability and long-term operational stability.

[0028] The directional acoustic wave transmitting array 5 includes a support 502, on the upper surface of which are arrayed multiple ultrasonic transducers 501 in a hexagonal close-packed design. The ultrasonic transducers 501 are made of piezoelectric ceramic material, model Panasonic CBB81-402, with a center frequency of 40kHz and an effective radiation area of ​​not less than 25mm². 2 This system achieves a half-power angle of 8°, improving directional accuracy by 40% compared to traditional rectangular arrays. Real-world testing shows that at a distance of 100 meters, the sound pressure level attenuates by only 12 dB, extending the effective range by 50% compared to traditional equipment. It can accurately cover a target area with a radius of 50 meters, while the sound pressure level attenuates by over 20 dB at a distance of 3 meters, preventing interference to unrelated areas and effectively improving the directionality and coverage of sound wave transmission.

[0029] The directional acoustic wave transmitting array 5 achieves highly concentrated directional propagation of sound waves through a structural design of hexagonally arranged ultrasonic transducers and a lightweight alloy support. Transducers using piezoelectric ceramic materials convert electrical signals into 40kHz ultrasonic waves. The hexagonal array layout utilizes the principle of acoustic wave interference to enhance directionality, while the lightweight alloy support ensures structural stability, improving the propagation distance and coverage accuracy of the sound waves. Ultrasonic transducers 501, based on the piezoelectric effect, convert the electrical signal input from the power amplification module into mechanical vibrations of the same frequency, generating 40kHz ultrasonic waves. The close arrangement of the hexagons causes phase interference between the sound waves emitted by adjacent transducers, forming an enhanced main beam in front of the array while suppressing sidelobe energy. The lightweight alloy support possesses high strength and low weight characteristics, and precision machining ensures the transducer positioning accuracy, reducing acoustic wave divergence caused by installation errors and ensuring coordinated operation of all transducers. It features 12 transducers with a center frequency of 40kHz and an effective radiation area of ​​28mm². 2 The ultrasonic transducers are arranged in a hexagonal array, achieving a sound wave half-power angle of 8°, which improves directional accuracy by 40% compared to traditional rectangular arrays. At a distance of 100 meters, the sound pressure level attenuates by only 12 dB, extending the effective range by 50% compared to traditional solutions, and can accurately cover a target area with a radius of 50 meters. The sound pressure level attenuates by more than 20 dB beyond a 3-meter radius, effectively reducing interference to unrelated areas. Actual measurements show that the device achieves a sound pressure level of 135 dB at 1 meter and maintains 110 dB at 100 meters, significantly improving the propagation efficiency and coverage accuracy of directional sound waves.

[0030] like Figure 4As shown, the controller 6 includes a control board and a microprocessor 603, a storage chip circuit 606, an input interface circuit 604, a start button 601, an adjustment knob 602, an output interface circuit 605, and a directional sound wave emitting array circuit 607 mounted on the control board. The microprocessor 603 and the storage chip circuit 606 are interconnected and connected through a data bus and an address bus to realize data storage and instruction retrieval. The output terminals of the start button 601 and the adjustment knob 602 are connected to the input terminals of the microprocessor 603 through the input interface circuit 604. The output terminals of the microprocessor 603 are connected to the input terminals of the output interface circuit 605 and the directional sound wave emitting array circuit 607, respectively.

[0031] Controller 6 uses an STM32F103RCT6 microprocessor as its core, connecting to AT24C08C-SSHT-T and W25Q16JVSSIQ memory chips via data and address buses. Together with a start button, adjustment knobs, and input / output interfaces, it enables human-machine interaction control and management of operating parameters. The microprocessor receives external operation commands, retrieves data from the memory chips, and coordinates the signal processing and power amplification modules to ensure the precise operation of the directional acoustic wave device. 2 The system accesses the AT24C08C-SSHT-T memory chip via the C protocol to store system configuration parameters; it reads acoustic waveform data and operating mode files from the W25Q16JVSSIQ via the SPI protocol. The start button triggers an interrupt signal, and the microprocessor responds and initializes the system. The adjustment knob transmits analog signals with 0.1kHz and 0.5dB precision to the microprocessor's ADC module via the input interface. After processing, the signals are output via the PWM signal or digital commands to control the signal processing and power amplification modules. The microprocessor dynamically adjusts the device's operating parameters based on a preset algorithm, analyzing sensor feedback data in real time. The controller stores 100 operating modes, with a parameter call response time of less than 5ms and an instruction execution latency of less than 100ms. The adjustment knob allows for rapid switching between 20kHz-25kHz and 1kHz-5kHz, with a sound pressure level adjustment range of 90dB-130dB and an adjustment precision of 0.5dB. Actual test data shows that the controller operates stably in environments ranging from -20℃ to 60℃, with a processing capacity of 168DMIPS, meeting the complex computational requirements of the device. After 100,000 continuous operation tests, the mechanical lifespan of the start button and adjustment knob showed no significant decline, and the data in the storage chip remained intact, ensuring that the device has high flexibility and reliability in diverse scenarios.

[0032] The start button 601 is used to control the opening and closing of the directional sound wave emission array 5, and the adjustment knob 602 is used to adjust the parameters of sound wave frequency and sound pressure level. The start button 601 and the adjustment knob 602 are connected to the input interface through wires. When operated, an electrical signal is generated and transmitted to the input interface. The output interface is connected to the control terminals of the signal processing module 3 and the power amplification module 4 through ribbon cables.

[0033] The start button 601 and the adjustment knob 602 constitute a human-machine interface control unit. The physical operation is converted into an electrical signal via the input interface. After processing by the controller 6, the signal processing module 3 and the power amplifier module 4 are controlled via the output interface to achieve on / off control and parameter adjustment of the directional sound wave transmitting array 5. This unit uses a combination of hardware coding and digital instructions to ensure fast operation response and precise parameter adjustment. The start button 601 adopts a self-resetting design. When pressed, the closed circuit generates a low-level trigger signal. After being shaped by the Schmitt trigger of the input interface, it is converted into a standard pulse signal with a width ≥10ms and transmitted to the external interrupt pin of the controller 6. The adjustment knob 602 uses a 10-bit rotary encoder, generating 360 pulses per revolution, corresponding to a frequency adjustment range of 20kHz-50kHz and a sound pressure adjustment range of 90dB-130dB. The controller 6 captures the encoder pulses through a timer, calculates the rotation direction and angle, converts them into corresponding parameter values ​​through a lookup table, and then sends a frequency control word to the signal processing module 3 and a gain control command to the power amplifier module 4 via the SPI bus. The output interface uses differential signal transmission, with an anti-interference capability of ±15kV ESD, ensuring accurate transmission of commands to the controlled module. The start button trigger response time is ≤5ms, and it has undergone millions of press tests without contact failure, with a mechanical life exceeding 1 million cycles. The adjustment knob has a resolution of 0.1kHz and 0.5dB, a parameter update delay of ≤80ms, and an adjustment error of <±0.3% across the entire range. The system supports quick switching between 6 preset operating modes, each mode can save 10 sets of custom parameters, and the switching time is <150ms. Within a temperature range of -20℃ to 60℃, the change in operating feel is <15%, and the signal transmission bit error rate is <10%. 9 This ensures precise control even in complex environments. Actual testing shows that operators can switch from standby to specific frequency sound pressure output within 5 seconds, significantly improving the device's ease of use and response speed.

Claims

1. A miniaturized, high sound pressure level, directional sound wave control device, characterized by, The device includes an outer casing, inside which are installed a power module, a signal processing module, a power amplification module, and a controller; a directional acoustic wave emission array is located on the top of the casing; the output of the controller is connected to the input of the signal processing module and the power amplification module respectively, the output of the signal processing module is connected to the input of the power amplification module, and the output of the power amplification module is connected to the directional acoustic wave emission array; The directional acoustic wave emitting array includes a support frame, on the upper surface of which multiple ultrasonic transducers are arrayed.

2. The miniaturized, high sound pressure level, directional acoustic wave control device of claim 1, wherein, The power amplifier module includes a preamplifier, a power amplifier, and a heat dissipation device. The output of the preamplifier is connected to the input of the power amplifier.

3. The miniaturized, high sound pressure level directional acoustic wave control device according to claim 1, characterized in that, The signal processing module includes a filter circuit, a modulation circuit, and a signal conversion circuit connected in sequence. The filter circuit adopts a π-type LC filter network, the modulation circuit integrates a Class D modulation chip, and the signal conversion circuit adopts a Σ-Δ type ADC chip.

4. The miniaturized, high sound pressure level directional acoustic wave control device according to claim 1, characterized in that, The controller includes a control board and a microprocessor, a memory chip circuit, an input interface circuit, a start button, an adjustment knob, an output interface circuit, and a directional acoustic wave emission array circuit mounted on the control board. The microprocessor and the memory chip circuit are interconnected. The output terminals of the start button and the adjustment knob are connected to the input terminals of the microprocessor through the input interface circuit. The output terminals of the microprocessor are connected to the input terminals of the output interface circuit and the directional acoustic wave emission array circuit, respectively.

5. The miniaturized, high sound pressure level directional acoustic wave control device according to claim 4, characterized in that, The start button is used to control the directional sound wave emission array to turn on and off, and the adjustment knob is used to adjust the parameters of sound wave frequency and sound pressure level.

6. The miniaturized, high sound pressure level directional acoustic wave control device according to claim 1, characterized in that, The power module includes an AC-DC conversion circuit and a multi-channel DC-DC conversion circuit; the AC-DC conversion circuit and the multi-channel DC-DC conversion circuit are interconnected.

7. The miniaturized, high sound pressure level directional acoustic wave control device according to claim 1, characterized in that, The outer shell is equipped with a modular mounting bracket, and each module is fixed to the bracket by shock-absorbing pads.

Images