Middle frame assembly and electronic device

Abstract

This application relates to the field of electronic device technology. This application provides a mid-frame assembly and an electronic device. The mid-frame assembly includes a mid-frame, a first button, a first circuit board, and a first bracket. The mid-frame includes a connected mid-plate and a first sidewall, the first sidewall being located on one side of the mid-plate along a first direction. The first sidewall includes a first surface and a second surface disposed opposite to each other along the thickness direction. The first surface is used to connect with the screen of the electronic device, and the second surface is used to connect with the back cover of the electronic device. A first groove is formed on the first sidewall, the opening of the first groove being located on the first surface. The first circuit board includes a first segment and a second segment, the first segment being located within the first groove, and the second segment being located outside the first groove. The first segment has a first button contact. By placing the opening of the first groove on the first surface of the first sidewall (i.e., the TP side surface), this application not only enables the mounting of the first circuit board but also does not affect the waterproof performance of the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more particularly to a mid-frame assembly and an electronic device. Background Technology

[0002] Electronic devices such as tablets and mobile phones may include a mid-frame and a back cover, which together form a cavity in which devices such as cameras can be housed. The mid-frame has a connecting surface facing the back cover, through which the mid-frame can be sealed to the back cover; therefore, this connecting surface can also be called a sealing surface. Additionally, buttons (such as volume buttons) may be provided on the mid-frame, and a mounting groove is also formed on the sealing surface for mounting the button FPC.

[0003] However, as the photographic capabilities of electronic devices improve, the size of camera modules is increasing, which encroaches on the space within the mid-frame and reduces the width of the sealing surface. In this case, after creating a button FPC mounting slot on the sealing surface, the width of the sealing surface may not meet the sealing requirements. Utility Model Content

[0004] This application provides a mid-frame component and an electronic device. The following describes this application from multiple aspects, and the implementation methods and beneficial effects of the following aspects can be referred to each other.

[0005] In a first aspect, this application provides a mid-frame assembly, which includes a mid-frame (1), a first button (41), a first circuit board (61), and a first bracket (71); wherein the mid-frame (1) includes a connected mid-plate (10) and a first sidewall (21), the first sidewall (21) being located on one side of the mid-plate (10) along a first direction, the first direction being perpendicular to the thickness direction of the mid-plate (10); the first sidewall (21) includes a first surface (21a) and a second surface (21b) disposed opposite to each other along the thickness direction, the first surface (21a) being used to connect with the screen (3) of an electronic device (100), and the second surface (21b) being used to connect with the back cover (2) of the electronic device (100); the first sidewall (21) has a first groove (211) and the opening (2111) of the first groove (211) is located on the first surface (21a). The first circuit board (61) includes a first segment (611) and a second segment (612). The first segment (611) is located inside the first groove (211) and the second segment (612) is located outside the first groove (211). The first segment (611) is provided with a first button contact (6112). The first bracket (71) is located in the first groove (211) and the first segment (611) is mounted on the first bracket (71). The first button (41) is located on the first sidewall (21) and the first button (41) can trigger the first button contact (6112) when it is pressed.

[0006] According to an embodiment of this application, the first surface is used for connection with the screen; that is, the first surface can be the TP side surface of the mid-frame. This application sets the opening of the first groove on the TP side surface of the mid-frame, which not only allows for the mounting of the first circuit board but also does not affect the waterproof performance of the electronic device.

[0007] In some embodiments, the middle plate (10) includes a cutout area (12), and the second segment (612) includes a first sub-segment (612b) located in the cutout area (12).

[0008] According to the embodiments of this application, the first sub-segment and the middle plate can reuse the same thickness space, which is beneficial to reducing the overall thickness of the electronic device.

[0009] In some embodiments, the middle frame assembly further includes a heat spreader (8), the middle plate (10) includes a cutout area (12), a first portion (82) of the heat spreader (8) covers the cutout area (12); the first segment (611) includes a first sub-segment (612b), the first sub-segment (612b) is laid on the first portion (82) of the heat spreader (8).

[0010] According to the embodiments of this application, not only can the first segment be supported by the heat dissipation plate, but it also helps to dissipate heat from the first circuit board.

[0011] In some embodiments, along the thickness direction, the middle plate (10) is stacked on the first side of the heat spreader (8); and the first segment (612b) is laid on the first side of the heat spreader (8) to be located in the hollow area (12).

[0012] In some embodiments, the second surface (21b) and the heat spreader (8) are located on opposite sides of the middle plate (10) along the thickness direction.

[0013] In some embodiments, the first groove (211) is located on the first section (213) of the first sidewall (21); the mid-frame assembly also includes a second button (42), a second circuit board (62), and a second bracket; wherein, a second groove (212) is also provided on the first sidewall (21), the second groove (212) is located on the second section (214) of the first sidewall (21), the first section (213) and the second section (214) are arranged along a second direction, the second direction being perpendicular to the first direction and perpendicular to the thickness direction; and, along the first direction, the size of the second section (214) is larger than the size of the first section (213). The opening (2121) of the second groove (212) is located on the second surface (21b). The second circuit board (62) includes a third segment (621) and a fourth segment (622). The third segment (621) is located inside the second groove (212), and the fourth segment (622) is located outside the second groove (212). The fourth segment (622) is provided with a second button contact (6212). The second bracket is located in the second groove (212), and the third segment (621) is mounted on the second bracket. The second button (42) is located on the first side wall (21). When the second button (42) is pressed, it can trigger the second button contact (6212).

[0014] According to an embodiment of this application, the second surface is used to connect with the rear cover; that is, the first surface can be the BP side surface of the middle frame. This application sets the opening of the second groove on the BP side surface of the middle frame, which facilitates the maintenance and replacement of the second circuit board.

[0015] In some embodiments, the middle frame assembly further includes a heat spreader (8), the middle plate (10) includes a cutout area (12), a first portion (82) of the heat spreader (8) covers the cutout area (12); and a third segment (621) includes a second sub-segment (622b) laid on the first portion (82) of the heat spreader (8).

[0016] According to the embodiments of this application, the second sub-segment and the middle plate can reuse the same thickness space, which is beneficial to reducing the overall thickness of the electronic device.

[0017] In some embodiments, the second surface (21b) and the heat spreader (8) are spaced apart along the thickness direction; the first sidewall (21) also includes a third surface (217) facing the middle plate (10) along a first direction, the third surface (217) being located between the second surface (21b) and the heat spreader (8); the third segment (621) also includes a third sub-segment (622a) for connecting the first segment (611) and the second sub-segment (622b); wherein at least a portion of the third sub-segment (622a) is in contact with the third surface (217).

[0018] In some embodiments, at least a portion of the third segment (622a) is fixedly connected to the third surface (217) by adhesive backing. Embodiments of this application facilitate the orderly extension of the second circuit board.

[0019] In a second aspect, this application provides an electronic device (100) including a screen (3), a back cover (2) and a mid-frame assembly of the first aspect and one embodiment thereof; wherein the screen (3) is mounted on a first surface (21a) of a first sidewall (21) and the back cover (2) is mounted on a second surface (21b) of the first sidewall (21).

[0020] According to an embodiment of this application, the first surface is used for connection with the screen; that is, the first surface can be the TP side surface of the mid-frame. This application sets the opening of the first groove on the TP side surface of the mid-frame, which not only allows for the mounting of the first circuit board but also does not affect the waterproof performance of the electronic device.

[0021] In some embodiments, the first surface (21a) and the screen (3) are bonded by dispensing adhesive (95), and the second surface (21b) and the back cover (2) are bonded by adhesive backing (96).

[0022] In some embodiments, a first groove (211) is provided on a first section (213) of a first sidewall (21); the electronic device (100) further includes a first device (51), the first device (51) and the first section (213) being disposed opposite to each other along a first direction; wherein, along the first direction, the ratio of the size of the first device (51) to the size of the electronic device (100) is greater than or equal to 67%.

[0023] In some embodiments, the middle plate (10) includes a cutout area (12) in which the first device (51) passes through; the second segment (612) of the first circuit board (61) includes a first sub-segment (612b) located in the cutout area (12).

[0024] According to the embodiments of this application, the first sub-segment, the first device, and the middle plate can reuse the same thickness space, which is beneficial to reducing the overall thickness of the electronic device.

[0025] In some embodiments, the projection of the first device (51) along the thickness direction and the projection of the first sub-segment (612b) along the thickness direction at least partially overlap.

[0026] In some embodiments, the electronic device (100) further includes a third circuit board (91); the second segment (612) of the first circuit board (61) includes a first interface (615), and the first circuit board (61) is electrically connected to the third circuit board (91) through the first interface (615); wherein the first interface (615) and the first device (51) are arranged along a second direction, the second direction being perpendicular to the first direction and perpendicular to the thickness direction.

[0027] In some embodiments, the spacing between the first segment (213) and the first device (51) along the first direction is less than a first value, and the gap between the first device (51) and the first sidewall (21) does not include the third circuit board (91).

[0028] In some embodiments, the mid-frame assembly is the mid-frame assembly mentioned in the first aspect above; the electronic device (100) further includes a second device (52) disposed opposite to the second segment (214) along a first direction; wherein, along the first direction, the size of the second device (52) is smaller than the size of the first device (51).

[0029] In some embodiments, the fourth segment (622) of the second circuit board (62) includes a second sub-segment (622b), and the projections of the second device (52) along the thickness direction and the projections of the second sub-segment (622b) along the thickness direction at least partially overlap. Embodiments of this application facilitate a compact arrangement of internal components in electronic devices.

[0030] In some implementations, the first device (51) is a telephoto camera and the second device (52) is a main camera. Attached Figure Description

[0031] Figure 1A Schematic diagrams of the electronic devices in some embodiments are shown;

[0032] Figure 1B Schematic diagrams of the electronic device are shown in other embodiments;

[0033] Figure 2A A schematic diagram of the appearance of the electronic device in an embodiment of this application is shown;

[0034] Figure 2B A cross-sectional view of an electronic device according to an embodiment of this application is shown;

[0035] Figure 2C A schematic diagram of the internal structure of the electronic device in an embodiment of this application is shown;

[0036] Figure 2D An exploded view of an electronic device according to an embodiment of this application is shown;

[0037] Figure 3AA partially enlarged view of an electronic device according to an embodiment of this application is shown;

[0038] Figure 3B A schematic diagram of the arrangement of the first circuit board in an embodiment of this application is shown;

[0039] Figure 3C A second schematic diagram illustrating the arrangement of the first circuit board in an embodiment of this application is shown;

[0040] Figure 3D This illustration shows a schematic diagram of the mounting method of the first circuit board on the first bracket in an embodiment of this application;

[0041] Figure 4 A schematic diagram of the extension method of the circuit board in an embodiment of this application is shown;

[0042] Figure 5A A second enlarged view of a portion of the electronic device in an embodiment of this application is shown;

[0043] Figure 5B A schematic diagram of the arrangement of the second circuit board in an embodiment of this application is shown;

[0044] Figure 5C A schematic diagram of the arrangement of the second circuit board in an embodiment of this application is shown. Detailed Implementation

[0045] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0046] This application provides an electronic device, which can be any of the following: mobile phone, tablet, laptop, camera, ultra-mobile personal computer (UMPC), handheld computer, touch screen TV, walkie-talkie, netbook, personal digital assistant (PDA), wearable device, virtual reality device, industrial equipment, etc. This application does not limit the type of electronic device.

[0047] The following uses a mobile phone as an example of an electronic device to illustrate the technical solutions of the embodiments of this application.

[0048] Figure 1A Schematic diagrams of the structure of the mobile phone 100 in some embodiments are shown. (Reference) Figure 1AThe mobile phone 100 includes a mid-frame 1, a screen 3, and a back cover 2, with the screen 3 and back cover 2 located on opposite sides of the mid-frame 1. Specifically, the mid-frame 1 includes a connected bezel 20 and a mid-plate 10, and the bezel 20 includes two opposing surfaces 20a and 20b. The screen 3 can be connected to surface 20a, and the back cover 2 can be connected to surface 20b, so that the screen 3, back cover 2, and bezel 20 together form the internal space of the mobile phone 100.

[0049] In this embodiment, the side of the middle frame 1 facing the screen 3 can be referred to as the TP side of the middle frame 1. Therefore, surface 20a can also be referred to as the TP side surface of the frame 20. The side of the middle frame 1 facing the back cover 2 can be referred to as the BP side of the middle frame 1. Therefore, surface 20b can also be referred to as the BP side surface of the frame 20.

[0050] Specifically, the back cover 2 and surface 20b can be sealed together using adhesive backing 96, and the screen 3 and surface 20a can be sealed together using adhesive application 95. In this way, the screen 3, back cover 2, and frame 20 can form a sealed casing, preventing external moisture from entering the internal space of the phone 100, thus giving the phone 100 a certain degree of water resistance. Under the same water resistance rating, the width w50 of adhesive application 95 can be smaller than the width w20 of adhesive backing 96.

[0051] The internal space of the mobile phone 100 can accommodate electronic components such as the camera 51 and the motherboard 91. It is understandable that, since the back cover 2 is connected to the mid-frame 1 by adhesive 96, the back cover 2 can be easily removed from the mid-frame 1. For example, by heating the adhesive 96, its stickiness is reduced, allowing the back cover 2 to be removed from the mid-frame 1. Once the back cover 2 is removed from the mid-frame 1, the internal electronic components of the mobile phone 100 are exposed, facilitating their repair.

[0052] A button 4 can also be installed on the frame 20. To detect user button presses, a groove 210 is provided on the frame 20, and a flexible printed circuit board 60 (FPC) (or "button FPC") is installed in the groove 210. When button 4 is pressed, it can trigger the contacts on the FPC 60, causing the FPC 60 to generate a press signal. In addition, the motherboard 91 can extend into the gap e1 between the camera 51 and the frame 20, and the FPC 60 can be electrically connected to the motherboard 91. After the FPC 60 is electrically connected to the motherboard 91, it can send button signals to the motherboard 91.

[0053] To facilitate FPC inspection and repair, the opening of the groove 210 (or the mounting groove for the button FPC) is located on the surface 20b. It can be understood that to ensure the waterproof performance of the phone 100, the frame 20 needs to have a certain width w10, thus requiring the surface 20b to have a certain sealing width w20. Since the opening of the groove 210 occupies part of the width of the frame 20, the sealing width w20 will be smaller than the width w10 of the frame 20.

[0054] As the photographic capabilities of electronic devices improve, the size of cameras tends to increase, which encroaches on the space of the mid-frame 1 and reduces the width of the bezel 20.

[0055] For example, refer to Figure 1B In some embodiments, with the increase in the size of the camera 51, the arrangement space of the mid-frame 1 is compressed, and the thickness of the frame 20 is reduced from w10 to w11. After the groove 210 for mounting the FPC 60 is opened on the surface 20b, the sealing width of the surface 20b is reduced from w20 to w21, which may not meet the waterproof requirements of the mobile phone 100.

[0056] Therefore, this application provides an electronic device in which the opening of the mounting slot of the button FPC is not located on the BP side surface of the frame, but on the TP side surface of the frame. Since the TP side surface and the screen 3 can be bonded together by adhesive dispensing, and the sealing width requirement for adhesive dispensing is lower than that for adhesive backing, by placing the opening of the mounting slot of the button FPC on the TP side surface, sufficient adhesive dispensing sealing width can still be achieved even with a reduced frame width to meet the waterproof requirements of the electronic device.

[0057] The following describes specific embodiments of this application in conjunction with the accompanying drawings.

[0058] Figure 2A and Figure 2B An exemplary structure of the mobile phone 100 in this embodiment is shown. Wherein, Figure 2A A schematic diagram of the appearance of mobile phone 100 is shown. Figure 2B A cross-sectional view of mobile phone 100 is shown.

[0059] refer to Figure 2A and Figure 2B The mobile phone 100 includes a mid-frame 1, a back cover 2 (or "battery cover"), and a screen 3. The back cover 2 and the screen 3 are located on opposite sides of the mid-frame 1. The screen 3 is used to display the interface of the mobile phone 100, and the user can face the screen 3 when using the mobile phone 100. That is, the screen 3 can form the front of the mobile phone 100. The screen 3 can be a touch screen, an LCD screen, an OLED screen, etc., and this application is not limited thereto. In addition, the screen 3 can be a curved screen or a flat screen.

[0060] The back cover 2 is used to protect the internal components of the mobile phone 100, and it can form the back of the mobile phone 100. The material of the back cover 2 may include plastic, metal, composite fiber, glass, etc., and this application does not limit it.

[0061] The mid-frame 1 can form the side of the phone 100. For details, please refer to... Figure 2A and Figure 2B The middle frame 1 may include a middle plate 10 and a frame 20 that surrounds the middle plate 10 circumferentially. The middle plate 10 is generally plate-shaped, and the frame 20 is generally frame-shaped. The frame 20 surrounds the middle plate 10 circumferentially and stands on its side relative to the middle plate 10 along the thickness direction of the middle plate 10.

[0062] The frame 20 can form the various sidewalls around the phone 100. According to the location of each sidewall, the frame 20 can include a right sidewall 21 (as the first sidewall), a top sidewall 22, a left sidewall 23, and a bottom sidewall 24. Along the X direction, the right sidewall 21 and left sidewall 23 are located on opposite sides of the middle plate 10, respectively. Along the Y direction, the top sidewall 22 and bottom sidewall 24 are located on opposite sides of the middle plate 10, respectively. When the user faces the screen 3, the top sidewall 22 and bottom sidewall 24 can be located at the top and bottom of the phone 100, respectively, and the left sidewall 23 and right sidewall 21 can be located on the left and right sides of the phone 100, respectively. It can be understood that when the user holds the phone 100 with their right hand, the user's right thumb can rest on the right sidewall 21.

[0063] For ease of description later, let's first combine... Figure 1A and Figure 1B Define an exemplary orientation for mobile phone 100. For example... Figure 2A As shown, the first direction can be the width direction of the mobile phone 100, which can be the direction from the right side wall 21 of the mobile phone 100 to the left side wall 23 of the mobile phone 100. For example, the width direction of the mobile phone 100 can be the X direction.

[0064] The second direction can be the length direction of the mobile phone 100, which can be the direction from the upper sidewall 22 of the mobile phone 100 to the lower sidewall 24. For example, the length direction of the mobile phone 100 can be the Y direction.

[0065] The thickness direction of the mobile phone 100 can be from the screen 3 of the mobile phone 100 to the back cover 2 of the mobile phone 100. For example, the thickness direction of the mobile phone 100 can be the Z direction.

[0066] In this configuration, the X, Y, and Z directions intersect each other. In some embodiments, the X, Y, and Z directions may be perpendicular to each other.

[0067] In addition, unless otherwise stated, the width of each component in this document can be the dimension of the component along the X direction, the length of each component can be the dimension of the component along the Y direction, and the thickness of each component can be the dimension of the component along the Z direction.

[0068] It is understood that the perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors (e.g., an angle of 89.9° between two structural features) is also within the scope of mutual perpendicularity in this application. Similarly, the parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors (e.g., an angle of 0.1° between two structural features) is also within the scope of mutual parallelism in this application. The definitions of mutual parallelism and mutual perpendicularity will not be repeated below.

[0069] Additionally, it should be noted that the directional terms such as "upper," "lower," "left," "right," "top," and "bottom" used in this document are exemplary orientations of the mobile phone 100 in normal user use (for example, when the user is using the mobile phone 100 normally, the upper sidewall 22 is located at the top of the mobile phone 100), and do not indicate or imply that the referred component must have a specific orientation. These orientations can change accordingly based on actual use and should not be construed as limitations on this application.

[0070] Continue to refer to Figure 2A The mobile phone 100 may also include one or more buttons 4. Figure 2A The image shows two buttons 4 on a mobile phone 100, namely a first button 41 and a second button 42. Since users typically press buttons 4 with their thumbs, for ease of operation, the first button 41 and the second button 42 can be located on the right side wall 21. For example, the first button 41 and the second button 42 can be located on the right side wall 21 near the top of the mobile phone 100 (e.g., where the upper side wall 22 is located) to further facilitate user pressing. It is understood that the pressing direction of the first button 41 and the second button 42 can be the positive X direction.

[0071] However, this application is not limited to this. For example, in some other embodiments, the first button 41 and the second button 42 may also be disposed on other sidewalls of the frame 20, such as the upper sidewall 22. The pressing direction of the buttons may also be adjusted accordingly. For example, in this embodiment, the pressing direction of the first button 41 and the second button 42 may be the positive Y direction.

[0072] For example, the first button 41 can be a volume button, allowing the user to adjust the call volume, audio playback volume, etc., of the phone 100. The second button 42 can be a power button, allowing the user to perform operations such as turning the phone on / off and turning the screen 3 on / off. In some embodiments, the first button 41 and the second button 42 can also support some combination keys or shortcut keys. For example, double-clicking the second button 42 can bring up a specific interface of the phone 100 (e.g., the negative one screen). Similarly, long-pressing the first button 41 can take a screenshot of the phone 100. Furthermore, pressing the first button 41 and the second button 42 simultaneously can perform specific shortcut operations, such as opening the settings application.

[0073] In other embodiments, the first button 41 may also be a button other than the volume button, such as the power button, camera focus button, page up / down button, etc. The second button 42 may also be a button other than the power button, such as the volume button, shutter button, etc.

[0074] The following describes exemplary connection methods between the components.

[0075] As described above, the middle frame 1 includes a middle plate 10 and a border 20 surrounding the middle plate 10. (Reference) Figure 2B The thickness direction of the middle plate 10 can be the Z direction. Along the Z direction, the frame 20 can include surfaces 20a and 20b arranged opposite to each other, wherein surface 20a is located on the TP side of the frame 20, and the screen 3 can be connected to surface 20a so that the screen 3 is connected to the middle frame 1. Furthermore, the middle plate 10, the screen 3, and the frame 20 can form a receiving cavity 100a. The receiving cavity 100a can accommodate a vapor chamber heatspreader 8 (or "VC"), which can be attached to the screen 3 and / or the middle plate 10 to provide uniform heat distribution inside the mobile phone 100.

[0076] For example, the screen 3 can be bonded to the surface 20a by dispensing adhesive 95, so that the screen 3 and the middle frame 1 have better sealing, thereby improving the waterproof performance of the mobile phone 100. The adhesive material of dispensing adhesive 95 can be hot melt adhesive, epoxy resin adhesive, silicone, etc., and this application is not limited thereto.

[0077] Surface 20b is located on the BP side of frame 20, and back cover 2 can be connected to surface 20b so that back cover 2 is connected to mid-frame 1. Furthermore, mid-frame 10, back cover 2, and frame 20 can form a receiving cavity 100b. The receiving cavity 100b can accommodate multiple electronic components of mobile phone 100, such as camera module 5, motherboard 91, motor (not shown), speaker (not shown), battery, etc. Motherboard 91 can be directly or indirectly electrically connected to electronic components such as camera module 5, motor, screen 3, and buttons 4 to receive data collected by each electronic component and send control signals to each electronic component. For example, motherboard 91 can be electrically connected to buttons 4 via an adapter FPC (not shown) to receive button signals from buttons 4. Furthermore, motherboard 91 can receive image data collected by camera module 5 and process the image data (e.g., noise reduction, enhancement processing). Motherboard 91 can also send the processed image data to screen 3 so that screen 3 displays the image captured by camera module 5.

[0078] For example, the back cover 2 can be bonded to the surface 20b by adhesive 96, so that the back cover 2 and the middle frame 1 have good sealing performance, while also facilitating the installation and removal of the back cover 2. For example, when it is necessary to repair the internal components of the mobile phone 100, the adhesive 96 between the back cover 2 and the middle frame 1 can be heated to make the adhesive 96 lose its stickiness, thereby removing the back cover 2 from the mobile phone 100 to expose the components in the receiving cavity 100b.

[0079] Compared to the adhesive 95 connection, the adhesive 96 connection has higher requirements for the sealing width. In some embodiments, in order to enable the mobile phone 100 to have a higher level of waterproof performance (e.g., IPX7 or above), the width of the adhesive surface between the back cover 2 and the surface 20b (i.e., the width of the adhesive 96) can be greater than or equal to 1.5mm.

[0080] The following combination Figure 2C and Figure 2D This section introduces the internal structure of the mobile phone 100. Among other things, Figure 2C and Figure 2D It shows Figure 2A The internal structure of part A of the mobile phone 100. Additionally, for easier observation, Figure 2C The positions of cameras 51 and 52 are shown in dashed boxes.

[0081] refer to Figure 2C and Figure 2DTo improve the user's shooting experience, the camera module 5 may include multiple cameras with different functions, such as camera 51 (as a first device) and camera 52 (as a second device). Camera 51 may be a telephoto camera, and camera 52 may be a main camera. A telephoto camera can have a longer focal length, which is beneficial for capturing details in distant scenes. The main camera can have a higher pixel count and can be used for high-definition shooting, video recording, scanning QR codes, etc. In other embodiments, the camera module 5 may also include other cameras, such as a wide-angle camera, etc., which is not limited in this application.

[0082] To reduce the overall thickness of the mobile phone 100, a cutout area 12 can be formed on the middle plate 10, and the camera 51 and camera 52 can be inserted into the cutout area 12. In this way, the camera 51, camera 52 and the middle plate 10 can reuse the thickness space of the mobile phone 100, thereby reducing the overall thickness of the mobile phone 100.

[0083] Each camera in camera module 5 can be located at a different position within the mobile phone 100. For example, camera 51 can be positioned relative to segment 213 (as the first segment) of the right side wall 21 along the X-direction, and camera 52 can be positioned relative to segment 214 (as the second segment) of the right side wall 21 along the X-direction. Segments 213 and 214 are different segments of the right side wall 21 along the Y-direction. That is, segment 213 and camera 51 can share the same length of the mobile phone 100, and segment 214 and camera 52 can share the same length (Y-direction dimension) of the mobile phone 100.

[0084] As camera functionality improves, camera size also increases. For example, to achieve a longer focal length, the width w30 of camera 51 (e.g., a telephoto camera) increases. For instance, the width w30 of camera 51 is greater than the total width w40 of phone 100 (see [reference needed for the meaning of w40]). Figure 2A The ratio can be greater than or equal to 67%. Increasing the width w30 of camera 51 will encroach on the arrangement space of the right side wall 21. For example, to accommodate camera 51, the inner surface 217 of segment 213 is recessed in the negative X direction to avoid obstructing camera 51. It is understood that the width of segment 213 will decrease accordingly, thus making the width of segment 213 smaller than the width of other segments of the right side wall 21 (e.g., segment 214).

[0085] The first button 41 can be arranged on section 213, and the second button 42 can be arranged on section 214. To sense user pressure on the first button 41, a first FPC 61 (serving as a first circuit board) can also be arranged in section 213. The first FPC 61 is used to sense user pressure on the first button 41 and can send a corresponding pressure signal to the main board 91 (serving as a third circuit board). Similarly, to sense user pressure on the second button 42, a second FPC 62 (serving as a second circuit board) can also be arranged in section 214.

[0086] Figures 3A to 3C An exemplary configuration of the first FPC 61 is shown. Wherein, Figure 3A for Figure 2B Enlarged view of part B, Figure 3B for Figure 3A CC section diagram, Figure 3C for Figure 3B DD cross-sectional view.

[0087] refer to Figure 3A and Figure 3B A first groove 211 is formed on section 213. The first FPC 61 may include a connected first segment 611 and a second segment 612, wherein the first segment 611 is located inside the first groove 211 and the second segment 612 is located outside the first groove 211. Exemplarily, the first FPC 61 may extend from the inside of the first groove 211 to the outside of the first groove 211 through the opening 2111 of the first groove 211.

[0088] refer to Figure 3B In this embodiment, by setting the opening 2111 of the first groove 211 on the TP side surface 21a (as the first surface) of the right side wall 21, it can be avoided that if the opening 2111 of the first groove 211 is further set on the BP side surface 21b (as the second surface) of the right side wall 21 after the width of the section 213 is reduced, the width of the area of ​​the BP side surface 21b used for connecting with the back cover 2 (e.g., the width of the area where the adhesive 96 is located) will be further reduced, which may not meet the waterproof requirements of the mobile phone 100. It can be understood that the BP side surface 21b and the TP side surface 21a are opposite sides of the right side wall 21 along the Z direction.

[0089] In this embodiment, since the TP side surface 21a and the screen 3 can be connected by adhesive 95, the required sealing width w50 is relatively small. Therefore, in addition to the area where adhesive 95 is arranged, the TP side surface 21a has other usable areas for arranging the opening 2111 of the first groove 211. That is to say, by setting the opening 2111 of the first groove 211 on the TP side surface 21a, not only can the first FPC 61 be installed, but the waterproof performance of the mobile phone 100 will not be affected.

[0090] Furthermore, the second segment 612 of the first FPC 61 may include an interface 615 (as a first interface), through which the first FPC 61 can be electrically connected to the motherboard 91. Exemplarily, the interface 615 may be a metal plate or a metal electrode, and the interface 615 may be electrically connected to the motherboard 91 via a spring contact. In other embodiments, the interface 615 may also be electrically connected to the motherboard 91 via a connector (e.g., a BTB connector).

[0091] The following combination Figure 3B and Figure 3C This section describes an exemplary configuration of the first segment 611 of the first FPC 61. (See reference...) Figure 3B and Figure 3C A button slot 215 is provided on section 213, and the first button 41 can be installed in the button slot 215. Exemplarily, the opening of the button slot 215 can face the negative X direction. Section 213 may include a protrusion 2131, which can be located on the side of the bottom wall 215a of the button slot 215 facing the negative X direction, and is disposed opposite to the bottom wall 215a along the X direction. That is, the projection of the protrusion 2131 along the X direction at least partially overlaps with the projection of the bottom wall 215a of the button slot 215 along the X direction.

[0092] The first button 41 includes a hook 411, which is disposed between the bottom wall 215a and the protrusion 2131. In this way, the protrusion 2131 can limit the hook 411 in the negative X direction to prevent the first button 41 from falling out of the button slot 215, thereby allowing the first button 41 to be installed in the button slot 215.

[0093] A first groove 211 is also provided on section 213, and a first bracket 71 is disposed in the first groove 211. Exemplarily, the first bracket 71 includes a bracket body 711 and a spring piece 712. The bracket body 711 is fixedly connected to the groove wall of the first groove 211, so that the first bracket 71 is fixed in the first groove 211. The spring piece 712 is disposed on the bracket body 711 and is positioned opposite to the first button 41 along the X direction.

[0094] The first segment 611 of the first FPC 61 is located in the first groove 211 and is mounted on the first bracket 71. Figure 3D An exemplary mounting configuration of the first FPC 61 on the first bracket 71 is shown. (Reference) Figure 3D and combined Figure 3CThe support body 711 of the first support 71 may include columns 711a, 711b, 711c, and 711d arranged sequentially at intervals along the Y direction. The support body 711 also includes a connecting beam 711e. The ends of columns 711a, 711b, 711c, and 711d facing the negative Z direction can all be connected to the connecting beam 711e.

[0095] The first support 71 may include two spring clips 712, one of which is disposed between the support column 711a and the support column 711b, and the other spring clip 712 is disposed between the support column 711c and the support column 711d.

[0096] Furthermore, the support column 711a and the support column 711d may protrude from the support column 711b and the support column 711c in the X direction. That is, the support column 711a includes a protrusion 7111a protruding from the support column 711b and the support column 711c in the X direction, and the support column 711d includes a protrusion 7111d protruding from the support column 711b and the support column 711c in the X direction.

[0097] The back side of the first segment 611 includes a reinforcing steel sheet 6111, which is located between the protrusions 7111a and 7111d. The two ends of the reinforcing steel sheet 6111 along the X direction can respectively abut against the protrusions 7111a and 7111d, so that the first segment 611 is snapped into the first bracket 71.

[0098] The front of the first segment 611 includes two contacts 6112, which correspond one-to-one with two springs 712. The corresponding contacts 6112 and springs 712 are arranged opposite each other along the X direction.

[0099] Reference Figure 3D and Figure 3B Since the first button 41 and the spring 712 are arranged opposite each other along the X direction, and the contact 6112 and the spring 712 are also arranged opposite each other along the X direction, when the user presses the first button 41, the first button 41 can press the spring 712, causing the spring 712 to move along the pressing direction (e.g., the positive X direction) to trigger the contact 6112 (as the first button contact).

[0100] This application does not limit the form of the contact 6112, as long as it can sense the user's pressing operation on the button. For example, the contact 6112 can be a mechanical contact, which can change its open or closed state (e.g., from open to closed) when the button is pressed, and the contact 6112 can be triggered. Alternatively, the contact 6112 can be a capacitive contact, where the capacitance value changes when the button is pressed, and the contact 6112 can be triggered. Furthermore, the contact 6112 can also be a pressure sensor; when the button is pressed, if the pressure detected by the pressure sensor exceeds a set threshold, the contact 6112 can be triggered.

[0101] When contact 6112 is triggered, the first FPC 61 can generate a press signal. The first FPC 61 can be electrically connected to the motherboard 91 to send the press signal to the motherboard 91. For the sake of narrative coherence, the electrical connection method between the first FPC 61 and the motherboard 91 will be described later.

[0102] The following combination Figure 3A and Figure 3B An exemplary configuration of the second segment 612 of the first FPC 61 is described.

[0103] refer to Figure 3A and Figure 3B To achieve a compact arrangement of electronic components, the gap between camera 51 and right side wall 21 can be as small as possible. For example, refer to... Figure 3B Along the X direction, the distance between the camera 51 and the right side wall 21 (i.e., the width of the gap e1) can be less than 4.8 mm (as a first value). Furthermore, since the BP side surface 21b of the right side wall 21 does not need to have an opening 2111 for the first groove 211, a portion of the BP side surface 21b can be left unused for mounting the camera 51's mounting bracket 511. The camera 51 can be mounted on the surface 21b of the right side wall 21 using the mounting bracket 511. In some embodiments, the camera 51's mounting bracket 511 and the right side wall 21 can be fitted together. Alternatively, a portion of the structure of the mounting bracket 511 can be embedded into the right side wall 21.

[0104] Because the distance between the camera 51 and the right side wall 21 is small, the extension of the motherboard 91 does not need to be provided in the gap e1 between the camera 51 and the right side wall 21. In this embodiment, the first FPC 61 can extend beyond the gap e1 to achieve electrical connection with the motherboard 91.

[0105] Furthermore, the mobile phone 100 may also include a heat spreader 8. The heat spreader 8 may include flow channels, and a cooling medium is provided in the flow channels. When the cooling medium flows in the flow channels, it can transfer heat from the hot area (the area in the mobile phone 100 that generates more heat) to the cold area (the area in the mobile phone 100 that generates less heat), so as to achieve uniform heating inside the mobile phone 100.

[0106] The first portion 82 of the heat spreader 8 can cover the hollowed-out area 12 of the middle plate 10. That is, the projection of the first portion 82 of the heat spreader 8 in the thickness direction at least partially overlaps with the hollowed-out area 12. Further, the middle plate 10 can be stacked on the BP side (as the first side) of the heat spreader 8. In some embodiments, the heat spreader 8 can be connected to the middle plate 10. For example, the heat spreader 8 is fixedly connected to the TP side surface 10a of the middle plate 10, for example, by bonding. In other embodiments, the heat spreader 8 can be connected to the screen 3, for example, the heat spreader 8 is fixedly connected to the back surface 3a of the screen 3, for example, by bonding.

[0107] refer to Figure 3A and Figure 3B The second segment 612 of the first FPC 61 may include sequentially connected sub-segments 612a, 612b, 612c, and 612d. These will be described in detail below.

[0108] Sub-segment 612a may include a first part, a second part, and a third part connected sequentially along the positive X direction. The first part of sub-segment 612a is connected to the first segment 611 of the first FPC 61. The first part of sub-segment 612a may be located between the TP side surface 21a and the screen 3. The second part may be located between the mounting bracket 511 of the camera 51 and the screen 3, and spaced apart from the mounting bracket 511 and the screen 3, respectively. Further, the second and third parts of sub-segment 612a may both be located in the hollow area 12 of the middle plate 10 to reuse the thickness space of the mobile phone 100 with the middle plate 10.

[0109] The following combination Figure 4 This section describes an exemplary configuration method for subfield 612b, in which... Figure 4 for Figure 3B Enlarged view of part E.

[0110] refer to Figure 4 and combined Figure 3AThe sub-segment 612b (as the first sub-segment) can be located in the hollowed-out area 12 of the middle plate 10. That is, the thickness space where the sub-segment 612b is located and the thickness space where the middle plate 10 is located at least partially overlap along the Z direction. In this way, the sub-segment 612b, the middle plate 10, and the camera 51 can reuse the same thickness space (the space in the Z direction) of the mobile phone 100 to further reduce the thickness of the mobile phone 100. For example, the sub-segment 612b can be a long strip structure, and the length direction of the sub-segment 612b can be the Y direction.

[0111] Segment 612b can be laid on the first portion 82 of the heat spreader 8. This arrangement allows the heat spreader 8 to support the first FPC 61, facilitating its orderly extension within the mobile phone 100; furthermore, the heat spreader 8 can also evenly heat the first FPC 61 to prevent overheating. Exemplarily, segment 612b can be fixedly connected to the heat spreader 8, for example, by adhesive bonding.

[0112] In this embodiment, segment 612b is laid on the BP side surface 8b of the heat spreader 8. Since the heat spreader 8 is located on the TP side of the middle plate 10, laying segment 612b on the BP side surface 8b of the heat spreader 8 allows segment 612b to be positioned precisely within the hollow area 12 of the middle plate 10, thereby facilitating the reuse of height space between the middle plate 10 and segment 612b and reducing the overall thickness of the mobile phone 100. In other embodiments, segment 612b may also be laid on the TP side surface 8a of the heat spreader 8.

[0113] Additionally, sub-segment 612b can be located on the TP side of camera 51. For example, the projection of sub-segment 612b along the thickness direction (e.g., the Z direction) can at least partially overlap with the projection of camera 51 along the thickness direction, thereby further achieving a compact arrangement of devices in mobile phone 100.

[0114] The following combination Figure 3A This section describes an exemplary configuration method for subsection 612c. (See reference...) Figure 3A The first portion 82 of the heat spreader 8 can partially cover the hollowed-out area 12 of the middle plate 10. That is, the hollowed-out area 12 of the middle plate 10 can include the portion not covered by the heat spreader 8, such as the sub-area 121 in the hollowed-out area 12. The sub-segment 612c can be located in the sub-area 121. Since the sub-segment 612c is not supported by the heat spreader 8, a reinforcing steel sheet 616 can also be attached to the sub-segment 612c to maintain a stable shape.

[0115] The following combination Figure 3A This section describes an exemplary configuration for subfield 612d. (See reference...) Figure 3AThe sub-segment 612d can be located outside the hollow area 12 of the middle plate 10. For example, the sub-segment 612d can cover the solid part of the middle plate 10. Furthermore, the sub-segment 612d can be laid on the middle plate 10 and located between the middle plate 10 and the main plate 91.

[0116] The interface 615 of the first FPC 61 can be located on the sub-segment 612d. In this embodiment, the sub-segment 612d and the camera 51 can be arranged along the Y direction. For example, the sub-segment 612d can be located on the side of the camera 51 facing the negative Y direction. In this way, the width space where the interface 615 is located and the width space where the camera 51 is located can overlap. That is, the interface 615 and the camera 51 can reuse the same width space of the mobile phone 100 (i.e., the X direction space) to avoid arranging too many devices in the X direction, thereby avoiding further compression of the width of the right side wall 21.

[0117] refer to Figure 2B and Figure 2C As described above, the mobile phone 100 may also include a camera 52, which is positioned opposite to segment 214 of the right side wall 21. The second button 42 of the mobile phone 100 may be located on segment 214 of the right side wall 21. To sense user presses on the second button 42, a second FPC 62 (as a second circuit board) may also be arranged in segment 214; the second FPC 62 is used to sense user presses on the second button 42.

[0118] Figures 5A to 5C An exemplary configuration of the second FPC 62 is shown. Wherein, Figure 5A for Figure 2B Enlarged view of part F, Figure 5B for Figure 5A GG cross-sectional view, Figure 5C for Figure 5B HH cross-sectional diagram.

[0119] refer to Figure 5A and Figure 5B A second groove 212 is provided on section 214. The second FPC 62 includes a connected third section 621 and a fourth section 622, wherein the third section 621 is located inside the second groove 212, and the fourth section 622 is located outside the second groove 212. That is, the second FPC 62 can extend from the inside of the second groove 212 to the outside of the second groove 212 through the opening 2121 of the second groove 212.

[0120] In this embodiment, the opening 2121 of the second groove 212 is located on the BP side surface 21b. As mentioned above, the width of the camera 52 can be smaller than the width of the camera 51. Therefore, the width of the section 214 can be greater than the width of the section 213. That is to say, the BP side surface 21b of the section 214 has a sufficiently large width, which allows the opening 2121 of the second groove 212 to be arranged simultaneously while meeting the sealing requirements.

[0121] In addition, since the BP side surface 21b is connected to the back cover 2 by the adhesive 96, the back cover 2 can be easily removed from the middle frame 1 to facilitate the maintenance and replacement of the second FPC 62 and the second bracket 72.

[0122] However, this application is not limited thereto. In some other embodiments, the opening 2121 of the second groove 212 may also be provided on the TP side surface 21a of the right side wall 21, just like the opening 2111 of the first groove 211, so that the BP side surface 21b has sufficient sealing width.

[0123] Furthermore, the fourth segment 622 may include an interface 625, through which the second FPC 62 can be electrically connected to the circuit board 92 (e.g., an RF board). The circuit board 92 can be electrically connected to the motherboard 91, thus the second FPC 62 can be indirectly electrically connected to the motherboard 91 via the circuit board 92. The interface 625 can be a metal plate or a metal electrode, and the interface 625 and the circuit board 92 can be electrically connected via a connector (e.g., a BTB connector). In other embodiments, the interface 625 can also be electrically connected to the circuit board 92 via a spring or the like.

[0124] In this embodiment, since the circuit board 92 is located near the second recess 212, the second FPC 62 is electrically connected to the motherboard 91 via the circuit board 92, thus shortening the extension path of the second FPC 62. In other embodiments, the second FPC 62 may also be directly electrically connected to the motherboard 91.

[0125] The following combination Figure 5B and Figure 5C This section describes an exemplary configuration of the third segment 621 of the second FPC 62. (See reference...) Figure 5B and Figure 5C A button slot 216 is provided on section 214, and the second button 42 can be installed in the button slot 216. Exemplarily, the opening of the button slot 216 can face the negative X direction. Section 214 may include a protrusion 2141, which can be located on the side of the bottom wall 216a of the button slot 216 facing the negative X direction, and is disposed opposite to the bottom wall 216a along the X direction. That is, the projection of the protrusion 2141 along the X direction at least partially overlaps with the projection of the bottom wall 216a of the button slot 216 along the X direction.

[0126] The second button 42 includes a lug 421, which is disposed between the bottom wall 216a and the protrusion 2141. In this way, the protrusion 2141 can limit the lug 421 in the negative X direction to prevent the second button 42 from falling out of the button slot 216, thereby allowing the second button 42 to be installed in the button slot 216.

[0127] A second groove 212 is also provided on section 214, and a second bracket 72 is disposed in the second groove 212. Exemplarily, the second bracket 72 includes a bracket body 721 and a spring piece 722. The bracket body 721 is fixedly connected to the groove wall of the second groove 212, so that the second bracket 72 is fixed in the second groove 212. The spring piece 722 is disposed on the bracket body 721 and is positioned opposite to the second button 42 along the X direction.

[0128] The third segment 621 of the second FPC 62 is located in the second groove 212 and mounted on the second bracket 72. Exemplarily, the back side of the third segment 621 includes a reinforcing steel sheet 6211, which is snapped into the second bracket 72 to fix the third segment 621 onto the second bracket 72. The snapping method of the reinforcing steel sheet 6211 in the second bracket 72 can be referred to the snapping method of the reinforcing steel sheet 6111 in the first bracket 71, and will not be described in detail here.

[0129] The third segment 621 includes a contact 6212, which is positioned opposite to a spring 722 along the X-direction. The specific structure of the contact 6212 can be referenced from the contact 6112 of the first FPC 61, and will not be elaborated further. Meanwhile, since the spring 722 and the second button 42 are positioned opposite each other along the X-direction, when the user presses the second button 42, the second button 42 can press the spring 722, causing the spring 722 to move along the pressing direction (e.g., the positive X-direction) to trigger the contact 6212. Once the contact 6212 is triggered, the second FPC 62 can generate a pressing signal.

[0130] The following combination Figure 5A and Figure 5B An exemplary configuration of the fourth segment 622 of the second FPC 62 is described.

[0131] refer to Figure 5A and Figure 5B The second segment 612 of the second FPC 62 may include sub-segments 622a, 622b, and 622c connected in sequence. These will be described in detail below.

[0132] refer to Figure 5A and Figure 5BSub-segment 622a (as the third sub-segment) can be connected to the third segment 621. 622a can be abutted against the inner surface 217 (as the third surface) of the right side wall 21, wherein the inner surface 217 is the surface of the right side wall 21 facing the middle plate 10 in the X direction. That is, the inner surface 217 is the surface of the right side wall 21 facing the receiving cavity 100b. Exemplarily, sub-segment 622a can be fixedly connected to the inner surface 217, for example, by means of adhesive 97. This arrangement facilitates the orderly extension of the second FPC 62 within the mobile phone 100.

[0133] The following describes an exemplary configuration for subfield 622b. (See reference...) Figure 5A and Figure 5B Similar to the first FPC 61, segment 622b (as the second segment) can also be located within the hollow area 12 of the middle plate 10. Thus, segment 622b, the middle plate 10, and the camera 52 can share the same thickness space, facilitating a reduction in the thickness of the phone 100. Furthermore, segment 622b can be laid on the heat spreader 8 for support and heat distribution. Segment 622b can be laid on the BP side surface 8b of the heat spreader 8, or on the TP side surface 8a of the heat spreader 8. The arrangement of segment 622b in the hollow area 12 can be referenced to the arrangement of segment 612b in the hollow area 12 of the first FPC 61, and will not be elaborated further.

[0134] Furthermore, the projection of sub-segment 622b along the thickness direction and the projection of camera 52 along the thickness direction can at least partially overlap, thereby further achieving a compact arrangement of components in mobile phone 100. In this embodiment, sub-segment 622b can be located on the TP side of camera 52, that is, the second FPC 62 bypasses camera 52 from the TP side of camera 52. In other embodiments, sub-segment 622b can also be located on the BP side of camera 52, that is, the second FPC 62 bypasses camera 52 from the BP side of camera 52.

[0135] The following describes an exemplary configuration of sub-segment 622c. Exemplarily, sub-segment 622c may be located outside the cutout area 12 of the middle plate 10; for example, at least a portion of sub-segment 612d may cover the solid portion of the middle plate 10. Further, at least a portion of sub-segment 612d may be located on the side of the circuit board 92 facing away from the middle plate 10, and interface 625 may be disposed on this portion of sub-segment 612d. Exemplarily, interface 625 may be electrically connected to the circuit board 92 via a connector (e.g., a BTB connector).

[0136] Additionally, segment 622c can be located on the side of camera 52 facing the positive X direction, so that interface 625 can be located on the side of camera 52 facing the positive X direction, so as to facilitate electrical connection between interface 625 and circuit board 92.

[0137] It is understood that the above are exemplary structures of electronic devices provided in this application, and those skilled in the art can make other modifications.

[0138] For example, in the above embodiment, the opening 2121 of the second groove 212 (i.e., the mounting groove of the second FPC 62) is provided on the BP side surface 21b of the frame 20 to facilitate the maintenance of the second FPC 62 and the maintenance and replacement of the second bracket 72. This application is not limited thereto. In other embodiments, the opening 2121 of the second groove 212 may also be provided on the TP side surface 21a of the frame 20 to increase the sealing width of the BP side surface 21b.

[0139] For example, in the above embodiment, the first button 41 and the second button 42 are disposed on the right side wall 21. Therefore, the first groove 211 and the second groove 212 are also disposed on the right side wall 21. However, this application is not limited to this. For example, in some other embodiments, the first button 41 or the second button 42 may be disposed on other side walls (e.g., the upper side wall 22), and correspondingly, the first groove 211 or the second groove 212 may also be disposed on the upper side wall 22.

[0140] For example, in other embodiments, cameras 51 and 52 can be replaced with other devices, such as batteries, speakers, etc., which are not limited in this application. For example, in the above embodiments, the device used to sense button press operations is an FPC (e.g., first FPC 61, second FPC 62). In other embodiments, first FPC 61 and second FPC 62 can also be replaced with rigid circuit boards.

[0141] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0142] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0143] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0144] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A mid-frame component, characterized in that, The mid-frame assembly includes a mid-frame (1), a first button (41), a first circuit board (61), and a first bracket (71); wherein, The middle frame (1) includes a connected middle plate (10) and a first side wall (21). The first side wall (21) is located on one side of the middle plate (10) along a first direction, which is perpendicular to the thickness direction of the middle plate (10). The first side wall (21) includes a first surface (21a) and a second surface (21b) arranged opposite to each other along the thickness direction. The first surface (21a) is used to connect with the screen (3) of the electronic device (100), and the second surface (21b) is used to connect with the back cover (2) of the electronic device (100). A first groove (211) is provided on the first sidewall (21), and the opening (2111) of the first groove (211) is located on the first surface (21a). The first circuit board (61) includes a first segment (611) and a second segment (612). The first segment (611) is located inside the first groove (211), and the second segment (612) is located outside the first groove (211). A first button contact (6112) is provided on the first segment (611). The first bracket (71) is disposed in the first groove (211), and the first segment (611) is mounted on the first bracket (71); The first button (41) is located on the first side wall (21), and the first button (41) can trigger the first button contact (6112) when it is pressed.

2. The mid-frame assembly according to claim 1, characterized in that, The middle plate (10) includes a hollow area (12), and the second segment (612) includes a first sub-segment (612b) located in the hollow area (12).

3. The mid-frame assembly according to claim 1, characterized in that, The middle frame assembly also includes a heat spreader (8), the middle plate (10) includes a hollow area (12), and a first part (82) of the heat spreader (8) covers the hollow area (12); The first segment (611) includes a first sub-segment (612b) which is laid on the first portion (82) of the heat spreader (8).

4. The mid-frame assembly according to claim 3, characterized in that, Along the thickness direction, the middle plate (10) is stacked on the first side of the heat spreader (8); Furthermore, the first segment (612b) is laid on the first side of the heat spreader (8) so as to be located in the hollow area (12).

5. The mid-frame assembly according to claim 3 or 4, characterized in that, Along the thickness direction, the second surface (21b) and the heat spreader (8) are located on opposite sides of the middle plate (10).

6. The mid-frame assembly according to claim 1, characterized in that, The first groove (211) is located on the first section (213) of the first sidewall (21); The mid-frame assembly further includes a second button (42), a second circuit board (62), and a second bracket; wherein, A second groove (212) is also provided on the first sidewall (21). The second groove (212) is located on the second section (214) of the first sidewall (21). The first section (213) and the second section (214) are arranged along a second direction, which is perpendicular to the first direction and perpendicular to the thickness direction. Furthermore, along the first direction, the size of the second section (214) is larger than the size of the first section (213). The opening (2121) of the second groove (212) is located on the second surface (21b). The second circuit board (62) includes a third segment (621) and a fourth segment (622). The third segment (621) is located inside the second groove (212), and the fourth segment (622) is located outside the second groove (212). The fourth segment (622) is provided with a second button contact (6212). The second bracket is disposed in the second groove (212), and the third segment (621) is mounted on the second bracket; The second button (42) is located on the first side wall (21). When the second button (42) is pressed, it can trigger the second button contact (6212).

7. The mid-frame assembly according to claim 6, characterized in that, The middle frame assembly also includes a heat spreader (8), the middle plate (10) includes a hollow area (12), and a first part (82) of the heat spreader (8) covers the hollow area (12); The third segment (621) includes a second sub-segment (622b) which is laid on the first portion (82) of the heat spreader (8).

8. The mid-frame assembly according to claim 7, characterized in that, Along the thickness direction, the second surface (21b) and the heat spreader (8) are spaced apart; The first sidewall (21) also includes a third surface (217) facing the middle plate (10) along the first direction, the third surface (217) being located between the second surface (21b) and the heat spreader (8); The third segment (621) further includes a third sub-segment (622a), which is used to connect the first segment (611) and the second sub-segment (622b); At least a portion of the third segment (622a) is attached to the third surface (217).

9. The mid-frame assembly according to claim 8, characterized in that, The at least portion of the third segment (622a) is fixedly connected to the third surface (217) by adhesive backing.

10. An electronic device (100), characterized in that, Includes a screen (3), a back cover (2), and a mid-frame assembly as described in any one of claims 1 to 9; The screen (3) is mounted on the first surface (21a) of the first sidewall (21), and the back cover (2) is mounted on the second surface (21b) of the first sidewall (21).

11. The electronic device (100) according to claim 10, characterized in that, The first surface (21a) and the screen (3) are bonded together by dispensing adhesive (95), and the second surface (21b) and the back cover (2) are bonded together by adhesive backing (96).

12. The electronic device (100) according to claim 10, characterized in that, The first groove (211) is provided on the first section (213) of the first sidewall (21); The electronic device (100) further includes a first device (51), wherein the first device (51) and the first segment (213) are disposed opposite to each other along a first direction; Along the first direction, the ratio of the size of the first device (51) to the size of the electronic device (100) is greater than or equal to 67%.

13. The electronic device (100) according to claim 12, characterized in that, The middle plate (10) includes a hollow area (12), and the first device (51) is inserted through the hollow area (12); The second segment (612) of the first circuit board (61) includes a first sub-segment (612b) located in the cutout area (12).

14. The electronic device (100) according to claim 13, characterized in that, The projection of the first device (51) along the thickness direction and the projection of the first sub-segment (612b) along the thickness direction at least partially overlap.

15. The electronic device (100) according to claim 12, characterized in that, The electronic device (100) also includes a third circuit board (91); The second segment (612) of the first circuit board (61) includes a first interface (615), and the first circuit board (61) is electrically connected to the third circuit board (91) through the first interface (615); The first interface (615) and the first device (51) are arranged along a second direction, which is perpendicular to the first direction and perpendicular to the thickness direction.

16. The electronic device (100) according to claim 15, characterized in that, Along the first direction, the distance between the first section (213) and the first device (51) is less than a first value, and the gap between the first device (51) and the first sidewall (21) does not include the third circuit board (91).

17. The electronic device (100) according to claim 12, characterized in that, The middle frame component is the middle frame component as described in claim 6; The electronic device (100) further includes a second device (52), which is disposed opposite to the second segment (214) along the first direction; Along the first direction, the size of the second device (52) is smaller than the size of the first device (51).

18. The electronic device (100) according to claim 17, characterized in that, The fourth segment (622) of the second circuit board (62) includes a second sub-segment (622b), wherein the projection of the second device (52) along the thickness direction and the projection of the second sub-segment (622b) along the thickness direction at least partially overlap.

19. The electronic device (100) according to claim 17, characterized in that, The first device (51) is a telephoto camera, and the second device (52) is a main camera.

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