Copper foil heat conducting film

Abstract

The utility model discloses a copper foil heat conduction film, including copper foil base material layer, one side of copper foil base material layer is equipped with the anti -oxidation layer, is equipped with the connecting layer between copper foil base material layer and anti -oxidation layer. Copper foil heat conduction film of the utility model through setting up the anti -oxidation layer at one side of copper foil base material layer to protect copper foil base material layer, avoid copper foil base material layer oxidation, and the connecting layer is the function that plays the combined strength of reinforcing copper foil base material layer and anti -oxidation layer.

Description

Technical Field

[0001] This utility model belongs to the field of thermal conductive film technology, specifically relating to a copper foil thermal conductive film. Background Technology

[0002] With the 5G era drawing ever closer, the introduction of high frequencies, upgrades to hardware components, and a dramatic increase in the number of connected devices and antennas are all contributing to the rapid growth in power consumption and heat generation of electronic products. The bottleneck for future high-frequency, high-power electronic products will be the electromagnetic radiation and heat they generate. To address this issue, electronic products will incorporate more and more electromagnetic shielding and heat dissipation devices in their design. Therefore, electromagnetic shielding and heat dissipation materials and devices will become increasingly important, and their demand will continue to grow.

[0003] Copper foil is one of the most widely used heat-conducting devices in the industry, but copper foil material is prone to oxidation after long-term use, forming copper oxide on the surface, which reduces its thermal conductivity.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a copper foil thermal conductive film with good anti-oxidation and thermal conductivity properties.

[0006] To achieve the above objectives, a specific embodiment of the present invention provides the following technical solution: a copper foil thermal conductive film, comprising a copper foil substrate layer, an anti-oxidation layer provided on one side of the copper foil substrate layer, and a connecting layer provided between the copper foil substrate layer and the anti-oxidation layer.

[0007] In one or more embodiments of this utility model, the anti-oxidation layer is a metallic nickel layer or a nickel-chromium alloy layer.

[0008] In one or more embodiments of this utility model, the connecting layer is a metal aluminum layer.

[0009] In one or more embodiments of this utility model, the connecting layer is a metal aluminum plating layer.

[0010] In one or more embodiments of this utility model, the thickness of the anti-oxidation layer is 15-25 nm.

[0011] In one or more embodiments of this utility model, the thickness of the connecting layer is 0.5 to 1 nm.

[0012] In one or more embodiments of this utility model, the thickness of the copper foil substrate layer is 5 to 200 μm.

[0013] In one or more embodiments of this utility model, a graphene layer is provided on the side of the anti-oxidation layer opposite to the copper foil substrate layer.

[0014] In one or more embodiments of this utility model, the thickness of the graphene layer is 8–12 μm.

[0015] In one or more embodiments of this utility model, a thermally conductive adhesive layer is provided on the side of the copper foil substrate layer facing away from the anti-oxidation layer.

[0016] Compared with the prior art, the copper foil thermal conductive film of this utility model protects the copper foil substrate layer and prevents it from oxidizing by setting an anti-oxidation layer on one side of the copper foil substrate layer. The connecting layer plays a role in enhancing the bonding strength between the copper foil substrate layer and the anti-oxidation layer. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the copper foil thermal conductive film in one example of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of a copper foil thermal conductive film in one example of this utility model.

[0020] Explanation of key figure labels:

[0021] 1. Copper foil substrate layer; 2. Connecting layer; 3. Anti-oxidation layer; 4. Graphene layer. Detailed Implementation

[0022] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0023] like Figure 1As shown, in one example of this utility model, the copper foil thermal conductive film includes a copper foil substrate layer 1, an anti-oxidation layer 3 is provided on one side of the copper foil substrate layer 1, and a connecting layer 2 is provided between the copper foil substrate layer 1 and the anti-oxidation layer 3.

[0024] It is understood that the copper foil thermal conductive film of this utility model protects the copper foil substrate layer 1 and reduces the oxidation probability of the copper foil substrate layer 1 by setting an anti-oxidation layer 3 on one side of the copper foil substrate layer 1. The connecting layer 2 plays the role of enhancing the bonding strength between the copper foil substrate layer 1 and the anti-oxidation layer 3.

[0025] Specifically, the copper foil substrate layer 1 can be copper foil. Furthermore, the thickness of the copper foil substrate layer 1 is 5–200 μm.

[0026] Specifically, the anti-oxidation layer 3 is a metallic nickel layer or a nickel-chromium alloy layer, meaning the raw material for the anti-oxidation layer 3 is nickel or nickel-chromium. Nickel has good thermal and electrical conductivity, and possesses excellent properties such as high plasticity, high temperature resistance, corrosion resistance, chemical stability, and strong oxidation resistance. The addition of chromium to the nickel-chromium alloy improves its oxidation resistance. For practical applications, nickel-chromium alloys offer better oxidation resistance than pure nickel; however, the mixed alloy target material is more expensive, resulting in higher usage costs.

[0027] Preferably, the mass ratio of nickel to chromium in the nickel-chromium alloy is 80:20. It can be understood that the mass ratio of nickel to chromium in the nickel-chromium alloy can be adjusted according to actual needs.

[0028] Furthermore, in order to avoid the impact of the anti-oxidation layer 3 on the thermal conductivity of the entire copper foil and to minimize the total thickness of the thermal conductive film of the entire copper foil, the thickness of the anti-oxidation layer 3 is 15-25 nm.

[0029] Specifically, the connecting layer 2 is an aluminum layer. Preferably, the connecting layer 2 is an aluminum plating layer. That is, the connecting layer 2 can be deposited on the copper foil by magnetron sputtering, for example, aluminum can be deposited on the copper foil by magnetron sputtering.

[0030] Furthermore, in order to avoid the influence of the connecting layer 2 on the thermal conductivity of the entire copper foil and to minimize the total thickness of the thermal conductive film of the entire copper foil, the thickness of the connecting layer 2 is 0.5 to 1 nm.

[0031] like Figure 2 As shown in a specific example, a graphene layer 4 is provided on the side of the anti-oxidation layer 3 facing away from the copper foil substrate layer 1. The raw material of the graphene layer 4 is graphene. Because graphene has excellent electrical conductivity and good thermal conductivity, it can improve the thermal conductivity of the entire copper foil thermal conductive film.

[0032] Specifically, graphene material can be sprayed onto the surface of the antioxidant layer using a spraying machine to form a graphene layer 4.

[0033] Preferably, in order to minimize the total thickness of the entire copper foil thermal conductive film, the thickness of the graphene layer 4 is 8–12 μm.

[0034] In a specific example, a thermally conductive adhesive layer (not shown in the figure) is provided on the side of the copper foil substrate layer 1 facing away from the anti-oxidation layer 3. The thermally conductive adhesive layer is made of commercially available thermally conductive adhesive, and its function is to adhere the copper foil substrate layer 1 to the surface of the object to be attached, thereby adhering the copper foil thermally conductive film to the surface of the object.

[0035] Example 1

[0036] Obtain as Figure 1 The copper foil thermal conductive film shown has a copper foil substrate layer with a thickness of 10 μm. A metal aluminum layer (connecting layer) is formed on one side of the copper foil by magnetron sputtering. The thickness of the metal aluminum layer is 1 nm. A metal nickel layer is formed on the side of the metal aluminum layer opposite to the copper foil by magnetron sputtering. The thickness of the metal nickel layer is 20 nm, thus obtaining the copper foil thermal conductive film of this application.

[0037] Example 2

[0038] Obtain as Figure 1 The copper foil thermal conductive film shown has a copper foil substrate layer with a thickness of 10 μm. A metallic aluminum layer (connecting layer) is formed on one side of the copper foil by magnetron sputtering. The thickness of the metallic aluminum layer is 1 nm. A nickel-chromium alloy layer (anti-oxidation layer) is formed on the side of the metallic aluminum layer opposite to the copper foil by magnetron sputtering. The thickness of the nickel-chromium alloy layer is 20 nm, thus obtaining the copper foil thermal conductive film of this application.

[0039] Example 3

[0040] Obtain as Figure 2 The copper foil thermal conductive film shown has a copper foil substrate layer of 10 μm thickness. A metal aluminum layer (connecting layer) with a thickness of 1 nm is formed on one side of the copper foil by magnetron sputtering. A metal nickel layer with a thickness of 20 nm is formed on the side of the metal aluminum layer away from the copper foil by magnetron sputtering. Then, a graphene layer is formed on the side of the metal nickel layer away from the copper foil by a spraying machine to obtain the copper foil thermal conductive film of this application.

[0041] Comparative Example 1

[0042] A 10μm thick copper foil was selected as the copper foil thermal conductive film.

[0043] Comparative Example 2

[0044] It is basically the same as Example 1, except that there is no connecting layer (metallic aluminum layer).

[0045] The thermal conductivity performance and dry cross-cut adhesion test were performed on the thermal conductive films in Examples 1-3 and Comparative Examples 1-2.

[0046] The thermal conductivity was tested using the standard test method of ASTM E1461-01, the flash test, to determine fixed thermal conductivity. The three thermal conductivity values ​​and their average values ​​were recorded in the table below.

[0047] The test method for the 100-cross cross-cut test is ASTM D3359 (American Society for Testing and Materials standard).

[0048] Use a blade with a width of approximately 10-12mm, spaced 1mm apart, for a total of 10 grids. When making a straight cut, 10 equally spaced straight blade marks will appear. Make a cut perpendicular to the straight blade marks to create a 10x10 square of 100 grids. Apply 3M 681 tape to the grid area, then peel it off to check the extent of coating peeling. Grade it from 5B to 0B (based on the area of ​​peeling). 5B shows no peeling, while 0B shows complete peeling.

[0049] Table 1: Thermal conductivity test values

[0050]

[0051]

[0052] Table 2: Thermal conductivity test values

[0053]

[0054]

[0055] Table 2 shows the thermal conductivity values ​​of the thermally conductive film after it has been placed in a constant temperature and humidity chamber at 85% humidity / 85℃ for 48 hours and then subjected to the above-mentioned thermal conductivity test.

[0056] The reason why the thermal conductive film of Comparative Example 2 in Tables 1 and 2 has no test value is that the lack of a connecting layer caused the aluminum foil and the anti-oxidation layer to delaminate, which ultimately made it impossible to measure.

[0057] As can be seen from the thermal conductivity data of Example 1 and Comparative Example 1 in Table 1, adding a layer of aluminum and a layer of nickel to the copper foil has a low impact on the thermal conductivity of the copper foil thermal conductive film, and is basically the same as that of pure copper foil.

[0058] As can be seen from the thermal conductivity data of Example 1 and Example 3 in Table 1, the copper foil thermal conductive film of Example 3 is based on the copper foil thermal conductive film of Example 1 with an additional graphene layer. Therefore, the graphene layer can increase the thermal conductivity of the entire copper foil thermal conductive film and further prevent the oxidation of the copper foil substrate layer.

[0059] A comparison of Tables 1 and 2 reveals that, under normal environmental conditions (85% humidity / 85℃) and after 48 hours in a constant temperature and humidity chamber, the thermal conductivity of the thermal conductive film in Comparative Example 1 decreased by approximately 10%, while the thermal conductivity of the thermal conductive films in Examples 1-3 showed little change. This demonstrates that the thermal conductive films in Examples 1-3 have an antioxidant effect.

[0060] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0061] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A copper foil thermal conductive film, characterized in that, It includes a copper foil substrate layer, an anti-oxidation layer on one side of the copper foil substrate layer, and a connecting layer between the copper foil substrate layer and the anti-oxidation layer.

2. The copper foil thermal conductive film according to claim 1, characterized in that, The anti-oxidation layer is a metallic nickel layer or a nickel-chromium alloy layer.

3. The copper foil thermal conductive film according to claim 1, characterized in that, The connecting layer is a metal aluminum layer.

4. The copper foil thermal conductive film according to claim 3, characterized in that, The connecting layer is an aluminum plating layer.

5. The copper foil thermal conductive film according to claim 1, characterized in that, The thickness of the anti-oxidation layer is 15–25 nm.

6. The copper foil thermal conductive film according to claim 1, characterized in that, The thickness of the connecting layer is 0.5 to 1 nm.

7. The copper foil thermal conductive film according to claim 1, characterized in that, The thickness of the copper foil substrate layer is 5–200 μm.

8. The copper foil thermal conductive film according to claim 1, characterized in that, A graphene layer is provided on the side of the anti-oxidation layer that is opposite to the copper foil substrate layer.

9. The copper foil thermal conductive film according to claim 8, characterized in that, The thickness of the graphene layer is 8–12 μm.

10. The copper foil thermal conductive film according to claim 1, characterized in that, A thermally conductive adhesive layer is provided on the side of the copper foil substrate layer that is opposite to the anti-oxidation layer.

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