A light emitting diode package structure and a light emitting diode

Abstract

The utility model belongs to the technical field of light emitting diode packaging, specifically discloses a light emitting diode packaging structure and light emitting diode, a light emitting diode packaging structure includes: support, LED chip, wire, first glue layer, second glue layer and third glue layer, wherein, the LED chip sets up on the support, first glue layer sets up on the support and covers on the LED chip above, second glue layer sets up on the support and covers on first glue layer above, third glue layer sets up on the support and covers on second glue layer above, wherein, the refractive index of first glue layer is greater than the refractive index of second glue layer, the refractive index of first glue layer is less than the refractive index of LED chip, the refractive index of second glue layer is greater than the refractive index of third glue layer. The utility model reduces the boundary refractive index difference through multilayer glue packaging, reduces monochromatic light edge light ray total reflection phenomenon, improves the light -emitting efficiency of lamp pearl.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting diode (LED) packaging technology, and in particular to an LED packaging structure and an LED. Background Technology

[0002] Light-emitting diodes (LEDs) release energy through electron-hole coupling and radiate visible light, thus efficiently converting electrical energy into light energy. Due to their energy-saving, environmentally friendly, safe, durable, high photoelectric conversion efficiency, and strong controllability, LEDs are widely used in lighting-related fields such as displays, automotive lighting, and general lighting backlights.

[0003] Existing monochromatic light-emitting diodes (LEDs) typically use high-refractive-index adhesives to increase the emissivity of the light emitted from the LED chip, allowing the emitted light to exit into the air at a wider angle. However, due to the significant difference between the refractive index of the high-refractive-index adhesive and that of air, the emitted light at the edge positions undergoes total internal reflection between the adhesive and air boundary. This prevents the emitted light at the edge positions from entering the air, resulting in reduced LED brightness.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a light-emitting diode packaging structure and a light-emitting diode, which aims to solve the problem that in the prior art, the refractive index of the high refractive index glue used for packaging monochromatic light LED beads, the refractive index of the LED chip and the refractive index of air are not comparable, resulting in total internal reflection of the emitted light at the edge of the boundary between the two, which prevents light from being emitted and reduces the overall brightness of the LED bead.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] In a first aspect, this utility model provides a light-emitting diode (LED) packaging structure, comprising: a bracket, an LED chip, wires, a first adhesive layer, a second adhesive layer, and a third adhesive layer; wherein...

[0008] The support includes a positive electrode area and a negative electrode area for supporting the LED chip;

[0009] The LED chip is mounted on the bracket, and the positive electrode of the LED chip is connected to the positive electrode area via a wire, and the negative electrode of the LED chip is electrically connected to the negative electrode area via a wire.

[0010] The first adhesive layer is disposed on the bracket and covers the LED chip; the second adhesive layer is disposed on the bracket and covers the first adhesive layer; the third adhesive layer is disposed on the bracket and covers the second adhesive layer.

[0011] Wherein, the refractive index of the first adhesive layer is greater than that of the second adhesive layer, and the refractive index of the first adhesive layer is less than that of the LED chip; the refractive index of the second adhesive layer is greater than that of the third adhesive layer, and the refractive index of the third adhesive layer is greater than that of air;

[0012] In a further embodiment of this invention, the first adhesive layer, the second adhesive layer, and the third adhesive layer are transparent adhesive layers.

[0013] In a further embodiment of this invention, the refractive index of the first adhesive layer is 1.5-1.55, the refractive index of the second adhesive layer is 1.45-1.5, and the refractive index of the third adhesive layer is 1.4-1.45.

[0014] In a further embodiment of this invention, the LED chip is one of a red LED chip, a green LED chip, or a blue LED chip.

[0015] In a further embodiment of this invention, the substrate of the LED chip is one of sapphire, silicon carbide, or silicon substrate.

[0016] In a further embodiment of this invention, the support also includes a die-bonding substrate, which is located at the positive electrode region, and the LED chip is flip-chip mounted on the die-bonding substrate.

[0017] In a further embodiment of this invention, the bracket also includes a reflective cup, which includes a cup mouth and a cup wall. The cup wall is a reflective surface with an inclined angle for reflecting the emitted light from the LED chip. The height of the third adhesive layer is less than or equal to the height of the cup mouth of the reflective cup.

[0018] Secondly, this utility model also provides a light-emitting diode, which includes a lamp holder, a light-transmitting lamp cover, a core post, and a light-emitting diode encapsulation structure as described above. The light-transmitting lamp cover and the core post are fixedly connected to the lamp holder, and the light-emitting diode encapsulation structure is mounted and fixed on the core post.

[0019] This utility model provides a light-emitting diode (LED) packaging structure and an LED. The LED packaging structure includes: a bracket, an LED chip, wires, a first adhesive layer, a second adhesive layer, and a third adhesive layer. The bracket includes a positive electrode region and a negative electrode region for supporting the LED chip. The LED chip is disposed on the bracket, with its positive electrode connected to the positive electrode region via wires, and its negative electrode electrically connected to the negative electrode region via wires. The first adhesive layer is disposed on the bracket and covers the LED chip. The second adhesive layer is disposed on the bracket and covers the first adhesive layer. The third adhesive layer is disposed on the bracket and covers the second adhesive layer. The refractive index of the first adhesive layer is greater than that of the second adhesive layer, and the refractive index of the first adhesive layer is less than that of the LED chip. The refractive index of the second adhesive layer is greater than that of the third adhesive layer, and the refractive index of the third adhesive layer is greater than that of air. In this invention, the refractive indices of the first, second, and third adhesive layers decrease sequentially, gradually approaching the refractive index of air. This effectively reduces total internal reflection and improves the light output of the LED beads. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the packaging structure of a light-emitting diode in the prior art.

[0022] Figure 2 This is a schematic diagram of the light-emitting diode packaging structure of some preferred embodiments of the present invention.

[0023] Figure 3 This is a schematic diagram of the LED packaging structure in another preferred embodiment of the present invention.

[0024] The following labels are used in the attached diagram: 1. Support; 11. Positive electrode area; 12. Negative electrode area; 13. Reflector cup; 131. Cup mouth; 132. Cup wall; 14. Die-bonding substrate; 2. LED chip; 3. First adhesive layer; 4. Second adhesive layer; 5. Third adhesive layer; 6. High-refractive adhesive layer. Detailed Implementation

[0025] This utility model provides a light-emitting diode (LED) packaging structure and an LED. To make the objectives, technical solutions, and effects of this utility model clearer and more explicit, the following detailed description is provided with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit it.

[0026] In the implementation methods and claims, unless otherwise specified in the text, the terms "a," "an," "the," and "the" may also include plural forms. If the embodiments of this utility model involve descriptions of "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0027] It should be further understood that the term "comprising" as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when we say an element is "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, "connected" or "coupled" as used herein can include wireless connections or wireless coupling. The term "and / or" as used herein includes all or any unit and all combinations of one or more associated listed items.

[0028] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0029] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0030] The inventors discovered that existing monochromatic LED chips typically use a transparent adhesive layer to encapsulate the underlying support, wiring, and the LED chip used for light emission. Specifically, Figure 1The diagram shows a schematic of a light-emitting diode (LED) packaging structure in the prior art. Here, we take an LED chip 2 based on a sapphire substrate as an example. After die bonding of the LED chip 2 and connection via wires, a transparent high-refractive-index adhesive is poured over the LED chip 2, wires, and the support 1 on the bracket, resulting in a high-refractive-index adhesive layer 6, which protects the wires and the chip. Simultaneously, the high-refractive-index adhesive in the high-refractive-index adhesive layer 6 ensures that the emitted light from inside the LED chip 2 reaches the air to the maximum extent, reducing the total internal reflection of large-angle emitted light and the resulting loss of LED brightness. When the refractive index of the medium in the optical path changes, light will be reflected and refracted at the boundary between the media. Specifically, the law of refraction satisfies: n1·sinθ1=n2·sinθ2; where n1 is the refractive index of the medium at the angle of incidence, θ1 is the angle of incidence, n2 is the refractive index of the medium at the angle of exit, and θ2 is the angle of exit. When light is incident from a medium with a high refractive index into a medium with a low refractive index at a large incident angle, since even a large θ2 cannot make sinθ2 exceed 1, total internal reflection will occur when sinθ2 is 1 (i.e., sinθ1' = n2 / n1) and θ2 ≥ 90°. Therefore, the calculated incident angle θ1' is the critical angle for total internal reflection at the boundary between media with corresponding refractive indices. Total internal reflection occurs when the incident angle of the outgoing light at the boundary is greater than the critical angle θ1'. Thus, it is evident that the greater the difference in refractive indices at the boundary, the more likely the outgoing light is to be completely reflected at the edge with a larger refractive angle, resulting in a decrease in light extraction efficiency.

[0031] Specifically, to maximize the scattering range, brightness, and uniformity of the emitted light from the LED, the emission angle of the LED needs to be widened. Given that the refractive index of air is 1 and the refractive index of the sapphire substrate in LED chip 2 is 1.73, assuming no adhesive protection, the critical angle θ1' for total internal reflection at the boundary between LED chip 2 and air is approximately 35.3° due to the difference in refractive index. This results in a significant portion of the light undergoing total internal reflection within the chip. Therefore, a high-refractive-index adhesive is filled between the substrate of LED chip 2 and air, creating a high-refractive-index adhesive layer 6 that encapsulates LED chip 2. Since the refractive index of the high-refractive-index adhesive is 1.54, the refractive index difference with the substrate material of LED chip 2 is reduced, thereby increasing the proportion of emitted light entering the high-refractive-index adhesive layer 6. However, the refractive index difference between the high-refractive-index adhesive layer 6 and the sapphire substrate is not significant, while the refractive index difference between the high-refractive-index adhesive layer 6 and air is relatively large. Therefore, total internal reflection easily occurs at the boundary between the high-refractive-index adhesive layer 6 and air. According to the refractive index formula, with n1 = 1.54 and n2 = 1.0, the critical angle θ1' for total internal reflection at the boundary between the high-refractive-index adhesive layer 6 and the air is 40.5°. That is, total internal reflection occurs when the incident angle θ1 ≥ θ1' = 40.5° at the boundary. It should be understood that the substrate of the LED chip 2 is a sapphire substrate, but it can also be a silicon carbide substrate or a silicon substrate. The refractive index of the silicon carbide or silicon substrate is generally greater than 1.6, which is also higher than the refractive index of air. Therefore, total internal reflection occurs at the boundary between the high-refractive-index adhesive layer 6 and the air, resulting in low light extraction efficiency.

[0032] To solve the above technical problems, firstly, please refer to... Figure 2This utility model provides a light-emitting diode (LED) packaging structure, comprising: a support 1, an LED chip 2, wires, a first adhesive layer 3, a second adhesive layer 4, and a third adhesive layer 5; wherein, the support 1 includes a positive electrode region 11 and a negative electrode region 12 for supporting the LED chip 2; the LED chip 2 is disposed on the support 1, the positive electrode of the LED chip 2 is connected to the positive electrode region 11 via wires, and the negative electrode of the LED chip 2 is electrically connected to the negative electrode region 12 via wires; wherein, the first adhesive layer 3 is disposed on the support 1 and covers the LED chip 2; the second adhesive layer 4 is disposed on the support 1 and covers the first adhesive layer 3; the third adhesive layer 5 is disposed on the support 1 and covers the second adhesive layer 4; wherein, the refractive index of the first adhesive layer 3 is greater than the refractive index of the second adhesive layer 4, and the refractive index of the first adhesive layer 3 is less than the refractive index of the LED chip 2; the refractive index of the second adhesive layer 4 is greater than the refractive index of the third adhesive layer 5, and the refractive index of the third adhesive layer 5 is greater than the refractive index of air. The first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 are used to fix the bracket 1, the LED chip 2, and the wire.

[0033] Specifically, the bracket 1 of the LED packaging structure can be made of ceramic, aluminum substrate, or plastic. It serves to support the LED chip 2 and provides electrical conductivity and heat dissipation. The bracket 1 can be a through-hole bracket, surface mount bracket, flat bracket, high-power bracket, or Chips on Board (COB) bracket. The LED chip 2 is die-bonded onto the bracket 1, and its positive and negative terminals are fixedly connected by wires between the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5. To match the refractive index of air, three layers of transparent adhesive with high, medium, and low refractive indices are applied in layers, allowing more light to gradually transition from the high-refractive-index medium to the low-refractive-index medium. The first adhesive layer 3 covers the chip and wires, the second adhesive layer 4 is the intermediate layer, and the third adhesive layer 5 is the surface layer. Through this encapsulation, the refractive indices of the three adhesive layers decrease sequentially, gradually approaching the refractive index of air. This effectively reduces total internal reflection and improves the light output of the LED chip. Meanwhile, the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 are also used to isolate harmful substances in the external space from contacting the substrate, thereby changing the chemical or physical properties of the substrate's electroplated layer and extending the lifespan of the LED's packaging structure.

[0034] In this design, the positive electrode of LED chip 2 is connected to the positive electrode region 11 of the bracket 1 via a wire, and the negative electrode of LED chip 2 is connected to the negative electrode region 12 of the bracket 1 via a wire. When the bracket 1 is connected to an external power source, current flows through the LED chip 2, and electrons and holes recombine in the semiconductor material inside the LED chip 2, releasing energy in the form of photons and emitting light. When the emitted light leaves the LED chip 2, it passes through the boundary between the upper surface of the LED chip 2 and the first adhesive layer 3. Because the refractive indices of the first adhesive layer 3 and the LED chip 2 are similar, the emitted light needs to exit at a relatively large critical angle to achieve total internal reflection. When the emitted light passes through the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 and is emitted into the outside air, because the refractive indices of the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 are very similar, the difference between the emission angle and the incident angle at the boundaries of the first adhesive layer 3 and the second adhesive layer 4, and the boundaries of the second adhesive layer 4 and the third adhesive layer 5 is very small. The light path of the emitted light in the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 is similar to the light path using a single transparent adhesive layer. Similarly, because the difference in refractive index between the third adhesive layer 5 and air is smaller than in the prior art, the emitted light needs to be incident at a large incident angle at the boundary between the third adhesive layer 5 and air to achieve total internal reflection, thereby increasing the intensity of the emitted light emitted into the air.

[0035] Furthermore, the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 are transparent adhesive layers. The first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 are obtained by layering and applying adhesives with different refractive indices and then curing them. Specifically, the adhesive can be at least one of epoxy resin (EPoxy, EP), silicone (Sil), polyurethane (PU), or acrylic adhesive (AAS). The refractive index of the first adhesive layer 3 is 1.5-1.55, the refractive index of the second adhesive layer 4 is 1.45-1.5, and the refractive index of the third adhesive layer 5 is 1.4-1.45. The refractive index of most of these layers is between 1.4 and 1.54, depending on the substances and components added to the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5; the refractive index of the adhesive cannot exceed 1.55. Therefore, the adhesives used in the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 are classified into three types according to their refractive index: low refractive index adhesive, medium refractive index adhesive, and high refractive index adhesive. The refractive index of the low refractive index adhesive, medium refractive index adhesive, and high refractive index adhesive increases sequentially. Specifically, the low refractive index adhesive can be a transparent adhesive with a refractive index of 1.4-1.45, the medium refractive index adhesive can be a transparent adhesive with a refractive index of 1.45-1.5, and the high refractive index adhesive can be a transparent adhesive with a refractive index of 1.5-1.55. That is, the first adhesive layer 3 is prepared by high refractive index adhesive, the second adhesive layer 4 is prepared by medium refractive index adhesive, and the third adhesive layer 5 is prepared by low refractive index adhesive. The method for preparing the adhesive layer for the light-emitting diode packaging structure from transparent adhesive is prior art known to those skilled in the art and will not be described in detail here.

[0036] It should be noted that the number of adhesive layers is related to the depth of the support 1. As the number of adhesive layers increases, the overall thickness of the adhesive layer used for encapsulation also increases. Furthermore, preparing the adhesive layer requires repeated dispensing and curing of the transparent adhesive, complicating the LED encapsulation process. This application uses three adhesive layers, but two layers can also be prepared, or the number of adhesive layers can be set according to the depth of the support 1; this application does not impose any limitations here. Because the refractive index difference exists between the two adhesive layers, the critical angle for total internal reflection when the emitted light from the LED chip 2 is transmitted through the two adhesive layers is smaller than that of the three-layer adhesive layer solution. Therefore, the effect of improving light output efficiency using a two-layer adhesive layer solution is lower than that of the three-layer solution (first adhesive layer 3, second adhesive layer 4, and third adhesive layer 5) in this application, but it is superior to the prior art solution using a single layer of high-refractive-index adhesive.

[0037] Further, please refer to Figure 3The LED chip 2 is one of a red LED chip, a green LED chip, or a blue LED chip. The substrate of the LED chip 2 is one of a sapphire, silicon carbide, or silicon substrate, and the refractive index of the substrate of the LED chip 2 is generally greater than 1.6. The support 1 also includes a die-bonding base 14, which is located at the positive electrode region 11. The LED chip 2 is flip-chip mounted on the die-bonding base 14 using conductive silver paste. It should be noted that the LED chip 2 can also be mounted upright on the support 1, and the support 1 and the positive and negative electrodes of the LED chip 2 are connected by wires. The mounting method and wire connection method of the LED chip 2 can be set according to the model and structure of the LED chip 2. The wire is preferably gold wire, but copper wire or other conductive metals can also be used. The bracket 1 also includes a reflective cup 13, which includes a cup mouth 131 and a cup wall 132. The cup wall 132 is a reflective surface with an inclined angle for reflecting the emitted light from the LED chip 2. The height of the third adhesive layer 5 is less than or equal to the height of the cup mouth 131 of the reflective cup 13.

[0038] For example, taking an LED chip 2 on a sapphire substrate as an example, the light emission process of the light-emitting diode packaging structure in this application will be described. When preparing the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5, the refractive index difference of each adhesive layer is controlled. Preferably, the refractive index of the first adhesive layer is controlled at 1.54, the refractive index of the second adhesive layer is controlled at 1.45, and the refractive index of the third adhesive layer is controlled at 1.41, with the third adhesive layer in contact with air. This ensures that the refractive index difference between the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer 5 does not exceed 0.1. It can be determined that the refractive index of the sapphire substrate is 1.73; therefore, the critical angle at which total internal reflection occurs at different boundaries can be calculated. Specifically, the critical angle θ at the boundary between the LED chip 2 and the first adhesive layer 3 is... 1a The critical angle θ at the boundary between the first adhesive layer 3 and the second adhesive layer 4 is approximately 62.9°, which is the angle at which total internal reflection occurs. 1b The critical angle θ at the boundary between the second adhesive layer 4 and the third adhesive layer 5 is approximately 70.3°, which is the angle at which total internal reflection occurs. 1c The critical angle θ at the boundary between the third adhesive layer 5 and the air is approximately 76.5°, representing the point at which total internal reflection occurs. 1d The angle is approximately 45.2°. Under otherwise identical conditions, if a high-refractive-index adhesive with a refractive index of 1.54 is used to prepare the adhesive layer, the critical value θ at the boundary between the adhesive layer and air for total internal reflection is... 1e The angle is approximately 40.4°. Thus, the refractive index of the adhesive in the three adhesive layers (first adhesive layer 3, second adhesive layer 4, and third adhesive layer 5) decreases sequentially, gradually approaching the refractive index of air. This effectively reduces total internal reflection and improves the light output of the LED.

[0039] Secondly, this utility model also provides a light-emitting diode (LED), which includes a lamp holder, a light-transmitting cover, a core post, and an LED encapsulation structure as described above. The light-transmitting cover and the core post are fixedly connected to the lamp holder, and the LED encapsulation structure is mounted and fixed on the core post. The core post is used to fix the LED encapsulation structure and provide electrical energy to the LED encapsulation structure. The light-transmitting cover can be made of polymethyl methacrylate (PMMA), polycarbonate (PC), polyvinyl alcohol (PVA), polystyrene (PS), glass, or polyvinyl chloride (PVC). The light-transmitting cover is used to present a clear and colorless light effect to meet the needs of high-brightness lighting. The LED encapsulation structure is used to convert electrical energy into light energy. The specific structure of the LED encapsulation structure is as described above and will not be repeated here.

[0040] In summary, this utility model provides a light-emitting diode (LED) packaging structure and an LED. The LED packaging structure includes: a bracket, an LED chip, wires, a first adhesive layer, a second adhesive layer, and a third adhesive layer. The bracket includes a positive electrode region and a negative electrode region for supporting the LED chip. The LED chip is disposed on the bracket, with its positive electrode connected to the positive electrode region via wires, and its negative electrode electrically connected to the negative electrode region via wires. The first adhesive layer is disposed on the bracket and covers the LED chip. The second adhesive layer is disposed on the bracket and covers the first adhesive layer. The third adhesive layer is disposed on the bracket and covers the second adhesive layer. The refractive index of the first adhesive layer is greater than that of the second adhesive layer, and the refractive index of the first adhesive layer is less than that of the LED chip. The refractive index of the second adhesive layer is greater than that of the third adhesive layer, and the refractive index of the third adhesive layer is greater than that of air. The first, second, and third adhesive layers are used to seal the bracket, the LED chip, and the wires. The refractive indices of the first, second, and third adhesive layers decrease sequentially, gradually approaching the refractive index of air. This effectively reduces total internal reflection and improves the light extraction efficiency of the LED chip. Simultaneously, by using three adhesive layers with progressively decreasing refractive indices, the refractive index difference between the media at the boundaries between the LED chip and the first adhesive layer, and between the third adhesive layer and air, is reduced. This increases the critical angle at which total internal reflection occurs at these interfaces, reducing light loss during transmission and demonstrating broad application prospects.

[0041] It should be understood that the application of this utility model is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A light-emitting diode (LED) packaging structure, characterized in that, include: The components include a bracket, LED chip, wires, a first adhesive layer, a second adhesive layer, and a third adhesive layer; among which, The support includes a positive electrode area and a negative electrode area for supporting the LED chip; The LED chip is mounted on the bracket, and the positive electrode of the LED chip is connected to the positive electrode area via a wire, and the negative electrode of the LED chip is electrically connected to the negative electrode area via a wire. The first adhesive layer is disposed on the bracket and covers the LED chip; the second adhesive layer is disposed on the bracket and covers the first adhesive layer; the third adhesive layer is disposed on the bracket and covers the second adhesive layer. Wherein, the refractive index of the first adhesive layer is greater than that of the second adhesive layer, and the refractive index of the first adhesive layer is less than that of the LED chip; the refractive index of the second adhesive layer is greater than that of the third adhesive layer, and the refractive index of the third adhesive layer is greater than that of air.

2. The light-emitting diode packaging structure as described in claim 1, characterized in that, The first adhesive layer, the second adhesive layer, and the third adhesive layer are transparent adhesive layers.

3. The light-emitting diode packaging structure as described in claim 1, characterized in that, The refractive index of the first adhesive layer is 1.5-1.55, the refractive index of the second adhesive layer is 1.45-1.5, and the refractive index of the third adhesive layer is 1.4-1.

45.

4. The light-emitting diode packaging structure as described in claim 1, characterized in that, The LED chip is one of a red LED chip, a green LED chip, or a blue LED chip.

5. The light-emitting diode packaging structure as described in claim 1, characterized in that, The substrate of the LED chip is one of sapphire, silicon carbide or silicon substrate.

6. The light-emitting diode packaging structure as described in claim 1, characterized in that, The support also includes a die-bonding substrate located at the positive electrode region, and the LED chip is flip-chip mounted on the die-bonding substrate.

7. The light-emitting diode packaging structure as described in claim 1, characterized in that, The bracket also includes a reflective cup, which has a rim and a wall. The wall is a reflective surface with an inclined angle for reflecting the emitted light from the LED chip. The height of the third adhesive layer is less than or equal to the height of the rim of the reflective cup.

8. A light-emitting diode, characterized in that, The device includes a lamp holder, a light-transmitting lamp cover, a core post, and a light-emitting diode (LED) encapsulation structure as described in any one of claims 1-7, wherein the light-transmitting lamp cover and the core post are fixedly connected to the lamp holder, and the LED encapsulation structure is mounted and fixed on the core post.

Images