chip carrier

Abstract

This utility model discloses a wafer carrier, comprising: a plurality of limiting rods; a baffle assembly, the baffle assembly including two baffles disposed opposite each other in a first direction, both baffles being connected to the plurality of limiting rods, the plurality of limiting rods being movably connected to at least one baffle so that the distance between the two baffles in the first direction is adjustable; and a plurality of limiting members disposed between the two baffles and arranged in the first direction, each limiting member being connected to the plurality of limiting rods respectively, and a receiving space being formed between two adjacent limiting members for placing wafers. According to the embodiment of this utility model, by providing a plurality of limiting rods movably connected to the baffles, the distance between the two baffles can be adjusted, and the number of limiting members located between the two baffles can be adjusted, allowing the wafer carrier to carry different numbers of wafers, improving the flexibility of wafer carrying and enhancing the applicability of the wafer carrier.

Description

Technical Field

[0001] This utility model relates to the field of wafer carrier technology, and in particular to a wafer carrier. Background Technology

[0002] Semiconductor wafers are the basic materials in the semiconductor manufacturing process. They are mainly circular wafers made of high-purity silicon powder or silicon carbide powder, serving to carry and connect electronic components. During production, packaging, and warehousing of defective wafers, carriers are required to hold them. In related technologies, existing wafer carriers generally use integrated clips, meaning the number of slots within the wafer carrier is fixed. This makes it difficult to carry a large number of wafers, reducing the flexibility of wafer carrying and limiting its applicability, thus leaving room for improvement. Utility Model Content

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a wafer carrier that improves the flexibility of wafer carrying and has broad applicability.

[0004] A wafer carrier according to an embodiment of the present invention includes: a plurality of limiting rods; a baffle assembly, the baffle assembly including two baffles disposed opposite to each other in a first direction, both baffles being connected together with the plurality of limiting rods, the plurality of limiting rods being movably connected to at least one baffle so that the distance between the two baffles in the first direction is adjustable; and a plurality of limiting members, the plurality of limiting members being disposed between the two baffles and arranged in the first direction, each limiting member being connected to the plurality of limiting rods respectively, and an accommodating space being formed between two adjacent limiting members for placing a wafer.

[0005] According to the embodiments of the present invention, the wafer carrier, by providing multiple limiting rods that can be movably connected to at least one baffle, can adjust the distance between the two baffles, that is, the two baffles can move closer to each other or further away from each other. It can also adjust the number of limiting members located between the two baffles and the spacing between two adjacent limiting members, so that the wafer carrier can carry multiple wafers of different numbers and thicknesses, thereby improving the flexibility of wafer carrying and the applicability of the wafer carrier.

[0006] According to some embodiments of the present invention, the limiting member includes a limiting body and a limiting protrusion. The limiting body has a first side and a second side disposed opposite to each other in the first direction. The limiting protrusion is disposed on the first side of the limiting body. In two adjacent limiting members, the limiting protrusion of one limiting member cooperates with the second side of the other limiting member to separate the limiting bodies of the two adjacent limiting members.

[0007] In some embodiments, the second side of the limiting body has a limiting groove recessed along the first direction, and in two adjacent limiting members, the limiting protrusion of one limiting member and the limiting groove of the other limiting member are inserted into each other. In the first direction, the height of the limiting protrusion is greater than the depth of the limiting groove; and / or, the limiting rod passes through the limiting body and the limiting protrusion.

[0008] In some embodiments, the limiting body includes a first limiting portion and a second limiting portion, the first limiting portion and the second limiting portion being arranged opposite to each other in a second direction and both having the limiting protrusion, the second direction being perpendicular to the first direction; wherein, the plurality of limiting rods include a first limiting rod and a second limiting rod, the first limiting rod being connected to the first limiting portion of the plurality of limiting members, and the second limiting rod being connected to the second limiting portion of the plurality of limiting members.

[0009] In some embodiments, the first direction, the second direction, and the up-down direction are arranged perpendicularly to each other. In the second direction, at least a portion of the limiting protrusions of the first limiting portion and at least a portion of the limiting protrusions of the second limiting portion gradually extend downwards in a direction close to each other, for jointly supporting the wafer.

[0010] In some embodiments, the limiting protrusion of each of the first limiting portion and the second limiting portion includes: a first protrusion extending along the vertical direction; and a second protrusion connected to the lower end of the first protrusion, wherein, in the second direction, the second protrusion of one of the first limiting portion and the second limiting portion gradually extends downward in a direction close to the other of the first limiting portion and the second limiting portion; wherein, the distance between the lower ends of the second protrusion of the first limiting portion and the lower ends of the second protrusion of the second limiting portion in the second direction is less than the diameter of the wafer.

[0011] In some embodiments, there are multiple first limiting rods, which are arranged in the extending direction of the limiting protrusion of the first limiting portion, and each first limiting rod is connected to the limiting protrusion of the multiple first limiting portions and the two baffles; and / or, there are multiple second limiting rods, which are arranged in the extending direction of the limiting protrusion of the second limiting portion, and each second limiting rod is connected to the limiting protrusion of the multiple second limiting portions and the two baffles.

[0012] In some embodiments, the baffle assembly includes a plurality of baffles, wherein the first limiting rod is connected to the limiting protrusions of the plurality of first limiting portions and two baffles of one of the plurality of baffle assemblies, and the second limiting rod is connected to the limiting protrusions of the plurality of second limiting portions and two baffles of one of the plurality of baffle assemblies, wherein the distance between the first limiting portion and the second limiting portion located between two baffles of different baffle assemblies is different in the second direction.

[0013] In some embodiments, the wafer carrier further includes a first magnetic element and a second magnetic element with opposite magnetic properties. In two adjacent limiting elements, the first magnetic element is disposed on the side of the limiting protrusion of one of the limiting elements near the limiting element of the other, and the second magnetic element is disposed on the other limiting element at a position opposite to the limiting protrusion.

[0014] In some embodiments, in the adjacent baffles and limiting members, one of the baffles and the limiting members has a mounting protrusion, and the other has a mounting groove recessed along the first direction, the mounting protrusion and the mounting groove being inserted into each other; and / or, the wafer carrier further includes: a plurality of grip bars, both of the baffles being connected together with the plurality of grip bars, the plurality of grip bars being located on opposite sides of the plurality of limiting bars respectively.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the structure of a wafer carrier according to some embodiments of the present invention from one view.

[0018] Figure 2 This is a cross-sectional view of a wafer carrier according to some embodiments of the present invention from one perspective;

[0019] Figure 3 yes Figure 2 An enlarged view of structure A in one embodiment;

[0020] Figure 4 yes Figure 2 An enlarged view of structure A in another embodiment;

[0021] Figure 5 This is a schematic diagram of the structure of a wafer carrier according to some embodiments of the present invention from another perspective;

[0022] Figure 6 This is a cross-sectional view of a wafer carrier according to some embodiments of the present invention from another perspective;

[0023] Figure 7 This is a structural schematic diagram of a baffle according to other embodiments of the present invention;

[0024] Figure 8 This is a schematic diagram of the structure of the first limiting part according to some embodiments of the present utility model;

[0025] Figure 9 This is a schematic diagram of the operation of a wafer carrier according to some embodiments of the present invention.

[0026] Figure label:

[0027] Chip carrier 100, accommodating space 101, chip 200,

[0028] Limiting rod 10, first limiting rod 11, second limiting rod 12.

[0029] Baffle 20, support leg 21, first limiting hole 22, second limiting hole 23

[0030] Limiting component 30, limiting body 31, first limiting part 311, second limiting part 312, limiting groove 3121, limiting protrusion 32, first protrusion 321, second protrusion 322.

[0031] First magnetic component 40, second magnetic component 50, handle bar 60. Detailed Implementation

[0032] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0033] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] The following is for reference. Figures 1-9 A wafer carrier 100 according to an embodiment of the present invention is described.

[0036] like Figures 1-9 As shown, the wafer carrier 100 according to an embodiment of the present invention includes: a plurality of limiting rods 10, a baffle assembly, and a plurality of limiting members 30. The baffle assembly may include two baffles 20, and the two baffles 20 may be positioned in a first direction (e.g., Figure 1 The two baffles 20 are arranged opposite each other in the front-back direction (as shown), and both baffles 20 can be connected to multiple limiting rods 10 to fix the two baffles 20.

[0037] Multiple limiting rods 10 can be movably connected to at least one baffle 20. For example, multiple limiting rods 10 can be connected to one baffle 20 and multiple limiting rods 10 can be movably connected to another baffle 20, so that the other baffle 20 can move closer to or away from one baffle 20 in the first direction. Alternatively, each limiting rod 10 can be movably connected to two baffles 20, so that the two baffles 20 can move closer to or away from each other in the first direction. Since the two baffles 20 can be connected together by multiple limiting rods 10, the distance between the two baffles 20 in the first direction can be adjusted, and the operation is convenient.

[0038] Multiple limiting members 30 can be disposed between two baffles 20, and the multiple limiting members 30 can be arranged in the first direction. Each limiting member 30 can be connected to multiple limiting rods 10 respectively. An accommodating space 101 can be formed between two adjacent limiting members 30 for placing wafers 200. By adjusting the distance between the two baffles 20 in the first direction, on the one hand, the number of limiting members 30 located between the two baffles 20 can be adjusted, so that the wafer carrier 100 can carry more wafers 200 and can be fully loaded with different numbers of wafers 200. On the other hand, the spacing between two adjacent limiting members 30 can be adjusted, so that the wafer carrier 100 can carry wafers 200 with a greater thickness in the first direction and can carry multiple wafers 200 with different thicknesses, thereby improving the flexibility of wafer 200 carrying and improving the applicability of the wafer carrier 100.

[0039] Understandably, each limiting rod 10 can have its two ends pass through two baffles 20 respectively, and the portion of the limiting rod 10 that passes through the baffles 20 can be fitted with a nut. The nut can be threadedly connected to the end of the limiting rod 10, and the nut can contact the baffles 20, so that the limiting rod 10 and the baffles 20 can be connected together. This can prevent the baffles 20 from sliding along the handle 60 after the wafer carrier 100 is assembled, and can limit the relative position of the two baffles 20. That is, the two baffles 20 can cooperate to clamp multiple limiting components 30 together, which can prevent multiple limiting components 30 from sliding along the handle 60 after the wafer carrier 100 is assembled, and can improve the reliability of the wafer 200 bearing.

[0040] According to the embodiment of the present invention, the wafer carrier 100, by providing a plurality of limiting rods 10 that can be movably connected to at least one baffle 20, can adjust the distance between the two baffles 20, that is, the two baffles 20 can be closer to each other or further apart. It can also adjust the number of limiting members 30 located between the two baffles 20, and adjust the spacing between two adjacent limiting members 30. This allows the wafer carrier 100 to carry a different number of wafers 200, and allows the wafer carrier 100 to carry a plurality of wafers 200 of different thicknesses, thereby improving the flexibility of wafer carrying and the applicability of the wafer carrier 100.

[0041] like Figure 1 , Figure 2 and Figure 3 As shown, according to some embodiments of the present invention, the limiting member 30 may include a limiting body 31 and a limiting protrusion 32. The limiting body 31 may have a first side and a second side. The first side of the limiting body 31 (e.g., Figure 1 (as shown in the front side) and the second side (as shown in the second side) Figure 1 The front side shown can be in the first direction (such as...) Figure 1 The limiting protrusions 32 can be arranged opposite each other on the front and back directions shown, and can be set on the first side of the limiting body 31 (e.g., in the front and back directions shown). Figure 1 (as shown in the front side).

[0042] In particular, among two adjacent limiting members 30, the limiting protrusion 32 of one limiting member 30 can cooperate with the second side of the other limiting member 30, that is, the limiting protrusion 32 of one limiting member 30 can cooperate with the second side of the other limiting member 30 (e.g., Figure 1 The front side shown is in contact with the limiting body 31 of the two adjacent limiting members 30, so that the limiting body 31 of the two adjacent limiting members 30 can be arranged at intervals, and the limiting body 31 and the limiting protrusion 32 can cooperate to form a receiving space 101, which facilitates the placement of the wafer 200. The wafer 200 can contact the limiting body 31 and the limiting protrusion 32 in the receiving space 101 respectively, which can limit the wafer 200 and improve the stability of the wafer 200.

[0043] like Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 8 As shown, in some embodiments, the second side of the limiting body 31 (e.g.) Figure 3 The rear side shown may have a limiting groove 3121 recessed along the first direction. In two adjacent limiting members 30, the limiting protrusion 32 of one limiting member 30 can be inserted and engaged with the limiting groove 3121 of the other limiting member 30 to limit the limiting protrusion 32, thereby limiting the two adjacent limiting members 30, preventing the two adjacent limiting members 30 from shaking with each other, improving the stability of the wafer 200, and facilitating operation.

[0044] In the first direction (e.g.) Figure 3 In the front-back direction shown, the height of the limiting protrusion 32 can be greater than the depth of the limiting groove 3121, that is, a part of the limiting protrusion 32 can be inserted and cooperate with the limiting groove 3121, which can ensure the limiting effect of two adjacent limiting members 30 and facilitate operation. At the same time, it can ensure that the limiting bodies 31 of two adjacent limiting members 30 can be arranged at intervals, which is convenient for the placement of the chip 200 and can ensure the limiting effect of the chip 200. It can improve the stability of the chip 200 and facilitate operation.

[0045] It should be noted that the heights of the limiting protrusions 32 of the multiple limiting members 30 in the first direction can be different, or the depths of the limiting grooves 3121 of the multiple limiting members 30 in the first direction can be different. Thus, the limiting protrusions 32 of each limiting member 30 can be inserted and cooperated with the limiting grooves 3121 of different limiting members 30, or the limiting grooves 3121 of each limiting member 30 can be inserted and cooperated with the limiting protrusions 32 of different limiting members 30. This allows for adjustment of the spacing between the limiting bodies 31 of two adjacent limiting members 30. As a result, the wafer carrier 100 can carry multiple wafers 200 of different sizes in the first direction (such as multiple wafers 200 of different thicknesses). For example, the wafer carrier 100 can carry a larger wafer 200 in the first direction (such as a thicker wafer 200), thereby improving the flexibility of wafer 200 carrying and enhancing the applicability of the wafer carrier 100.

[0046] like Figure 2 , Figure 3 and Figure 5 As shown, in some embodiments, the limiting rod 10 can pass through the limiting body 31 and the limiting protrusion 32, that is, multiple limiting rods 10 can correspond to the positions of the limiting protrusion 32 respectively. On the one hand, it can realize the positioning of the limiting protrusion 32 and the limiting groove 3121, improve the smoothness of the insertion and cooperation between the limiting protrusion 32 and the limiting groove 3121, and improve the limiting effect on two adjacent limiting members 30, prevent the two adjacent limiting members 30 from shaking with each other, and improve the stability of the wafer 200.

[0047] On the other hand, it can prevent interference between the limiting rod 10 and the wafer 200 in the receiving space 101, thereby improving the reliability of the wafer 200. Of course, multiple limiting rods 10 can be located on both sides of the limiting bump 32 away from the receiving space 101 (e.g., Figure 2 As shown on the left and right sides, based on ensuring the smooth insertion and engagement of the limiting protrusion 32 and the limiting groove 3121, interference between the limiting rod 10 and the wafer 200 in the accommodating space 101 can be prevented, thereby improving the reliability of the wafer 200.

[0048] like Figure 1 , Figure 2 , Figure 3 , Figure 6 , Figure 8 and Figure 9 As shown, in some embodiments, the limiting body 31 may include a first limiting portion 311 and a second limiting portion 312, and the first limiting portion 311 and the second limiting portion 312 may be in a second direction (e.g., Figure 6The first limiting part 311 and the second limiting part 312 are arranged opposite each other in the left and right directions shown, and the structures of the first limiting part 311 and the second limiting part 312 are the same and symmetrical. The first limiting part 311 and the second limiting part 312 can be provided with limiting protrusions 32 respectively, and the first limiting part 311 and the second limiting part 312 can be provided with limiting grooves 3121 respectively.

[0049] In two adjacent first limiting portions 311, the limiting protrusion 32 of one first limiting portion 311 can be inserted and engaged with the limiting groove 3121 of the other first limiting portion 311, thereby limiting the two adjacent first limiting portions 311. In two adjacent second limiting portions 312, the limiting protrusion 32 of one second limiting portion 312 can be inserted and engaged with the limiting groove 3121 of the other second limiting portion 312, thereby limiting the two adjacent second limiting portions 312. This can improve the stability of the wafer 200 and facilitate operation.

[0050] Second direction (e.g.) Figure 1 (as shown in the left and right directions) and the first direction (such as) Figure 1 The front and rear directions shown can be perpendicular to each other, so that the first limiting part 311 and the second limiting part 312 of each limiting member 30 cooperate, and can be in a direction perpendicular to the arrangement direction of the multiple wafers 200 (such as...). Figure 8 The wafer 200 is supported on the left and right sides (as shown), which can improve the limiting effect on the wafer 200 and improve the stability of supporting the wafer 200.

[0051] The plurality of limiting rods 10 may include a first limiting rod 11 and a second limiting rod 12. The first limiting rod 11 may be connected to the first limiting part 311 of the plurality of limiting members 30, thereby limiting the plurality of first limiting parts 311. The second limiting rod 12 may be connected to the second limiting part 312 of the plurality of limiting members 30, thereby limiting the plurality of second limiting parts 312. This facilitates the cooperation of the first limiting part 311 and the second limiting part 312 to jointly support the wafer 200, thereby improving the limiting effect on the wafer 200 and improving the stability of supporting the wafer 200.

[0052] It is understood that there can be multiple first limiting rods 11, and each first limiting part 311 can be connected to multiple first limiting rods 11 respectively, which can improve the limiting effect of the first limiting part 311. There can also be multiple second limiting rods 12, and each second limiting part 312 can be connected to multiple second limiting rods 12 respectively, which can improve the limiting effect of the second limiting part 312. Thus, the first limiting part 311 and the second limiting part 312 can cooperate to jointly support the chip 200, which can improve the limiting effect of the chip 200 and improve the stability of the chip 200.

[0053] like Figure 1 , Figure 6 , Figure 8 and Figure 9 As shown, in some embodiments, the first direction, the second direction, and the up and down directions (e.g.) Figure 5 The vertical direction shown can be set perpendicularly to each other, that is, the first direction can be... Figure 1 The front and back directions shown can be followed by a second direction. Figure 1 The left and right directions shown are in the second direction (such as...) Figure 6 In the left-right direction shown, at least a portion of the limiting protrusion 32 of the first limiting portion 311 and at least a portion of the limiting protrusion 32 of the second limiting portion 312 can gradually extend downward in a direction closer to each other.

[0054] That is, at least a portion of the limiting protrusion 32 of the first limiting portion 311 can extend downward at an angle from left to right, and at least a portion of the limiting protrusion 32 of the second limiting portion 312 can extend downward at an angle from right to left. This facilitates the contact between the first limiting portion 311 and the second limiting portion 312 with the lower side of the wafer 200, so that the first limiting portion 311 and the second limiting portion 312 cooperate to jointly support the wafer 200 and improve the stability of the wafer 200.

[0055] like Figure 6 , Figure 8 and Figure 9 As shown, in some embodiments, the limiting protrusion 32 of the first limiting portion 311 may include a first protrusion 321 and a second protrusion 322, and the limiting protrusion 32 of the second limiting portion 312 may include a first protrusion 321 and a second protrusion 322. The first protrusion 321 may be along the vertical direction (e.g., Figure 6 Extending in the vertical direction shown, the second protrusion 322 can be connected to the lower end of the first protrusion 321 (as shown in the figure). Figure 6 (As shown at the lower end) connection.

[0056] In the second direction, the second protrusion 322 of the first limiting portion 311 can be positioned along the direction close to the second limiting portion 312 (e.g., Figure 6 As shown in the left-to-right direction, the second protrusion 322 of the second limiting portion 312 gradually slopes downwards, and can extend in a direction close to the first limiting portion 311 (e.g., Figure 6 As shown, the first limiting part 311 and the second limiting part 312 gradually extend downwards from right to left, so that they can contact the lower side of the wafer 200 respectively, thereby achieving joint support for the wafer 200 and improving the stability of the wafer 200.

[0057] In the second direction (such as) Figure 6 On the left and right directions shown, the lower end of the second protrusion 322 of the first limiting part 311 (as shown) Figure 6The lower end shown) and the lower end of the second protrusion 322 of the second limiting portion 312 (as shown) Figure 6 The distance between the lower end shown can be less than the diameter of the wafer 200, which can ensure that the first limiting part 311 and the second limiting part 312 can respectively contact the lower side of the wafer 200. Based on the realization of supporting the wafer 200, the limiting effect of the wafer 200 can be improved, the wafer 200 can be prevented from falling out of the accommodating space 101, and the reliability and stability of supporting the wafer 200 can be improved.

[0058] like Figure 5 , Figure 6 and Figure 8 As shown, in some embodiments, there are multiple first limiting rods 11. These multiple first limiting rods 11 can be arranged in the extending direction of the limiting protrusion 32 of the first limiting part 311, which can improve the limiting effect of the first limiting part 311 and improve the smoothness of the insertion and cooperation between the limiting protrusion 32 and the limiting groove 3121. Each first limiting rod 11 can be connected to the limiting protrusion 32 of the multiple first limiting parts 311 and the two baffles 20, which can realize the limiting of the multiple first limiting parts 311. This is beneficial for the first limiting part 311 and the second limiting part 312 to cooperate in carrying the wafer 200, which can improve the limiting effect of the wafer 200 and improve the stability of the wafer 200.

[0059] like Figure 5 , Figure 6 and Figure 8 As shown, in some embodiments, there are multiple second limiting rods 12. These multiple second limiting rods 12 can be arranged in the extending direction of the limiting protrusion 32 of the second limiting part 312, which can improve the limiting effect of the second limiting part 312 and improve the smoothness of the insertion and cooperation between the limiting protrusion 32 and the limiting groove 3121. Each second limiting rod 12 can be connected to the limiting protrusion 32 of the multiple second limiting parts 312 and the two baffles 20, which can realize the limiting of the multiple second limiting parts 312. This is beneficial for the second limiting part 312 and the first limiting part 311 to cooperate in carrying the wafer 200, which can improve the limiting effect of the wafer 200 and improve the stability of the wafer 200.

[0060] In some embodiments, a baffle assembly may include multiple baffles, each baffle assembly may include two baffles 20 with the same structure and size, each baffle 20 may have multiple first limiting holes 22 and multiple second limiting holes 23, multiple first limiting rods 11 and multiple first limiting holes 22 may correspond one-to-one, and the first limiting rods 11 may pass through the first limiting holes 22 through the baffles 20 so that the first limiting rods 11 are respectively connected to the two baffles 20 of a baffle assembly, multiple second limiting rods 12 and multiple second limiting holes 23 may correspond one-to-one, and the second limiting rods 12 may pass through the second limiting holes 23 through the baffles 20 so that the second limiting rods 12 are respectively connected to the two baffles 20 of a baffle assembly.

[0061] In the vertical direction (e.g.) Figure 6 In the vertical direction shown, each baffle 20 has a first limiting hole 22 and a second limiting hole 23 that can be positioned correspondingly. The first limiting rod 11 can be connected to the limiting protrusions 32 of multiple first limiting parts 311 and the two baffles 20 of a baffle assembly. The second limiting rod 12 can be connected to the limiting protrusions 32 of multiple second limiting parts 312 and the two baffles 20 of a baffle assembly. The distances between the first limiting hole 22 and the second limiting hole 23 corresponding to the baffles 20 in the vertical direction of different baffle assemblies are different in the second direction.

[0062] Multiple limiting members 30 can be assembled into a wafer carrier 100 by cooperating with baffles 20 of different baffle assemblies through limiting rods 10. This allows the distance between the first limiting part 311 and the second limiting part 312 between two baffles 20 of different baffle assemblies in the second direction to be different. By replacing different baffle assemblies, the distance between the first limiting part 311 and the second limiting part 312 of each limiting member 30 in the second direction can be adjusted. This allows the wafer carrier 100 to carry wafers 200 of a larger size in the second direction. Furthermore, the same wafer carrier 100 can carry multiple wafers 200 of different sizes after replacing different baffle assemblies, thereby improving the flexibility of wafer 200 carrying and the applicability of the wafer carrier 100.

[0063] In other embodiments, reference is made to... Figure 7As shown, the baffle assembly may include one baffle, and the baffle assembly may include two baffles 20 with the same structure and size. The baffle 20 may have more first limiting holes 22 and more second limiting holes 23, that is, the number of first limiting holes 22 may be greater than the number of first limiting rods 11. The multiple first limiting rods 11 and a portion of the multiple first limiting holes 22 correspond one-to-one. The first limiting rods 11 can pass through the first limiting holes 22 and be inserted into the baffle 20. The number of second limiting holes 23 may be greater than the number of second limiting rods 12. The multiple second limiting rods 12 and a portion of the multiple second limiting holes 23 may correspond one-to-one. The second limiting rods 12 can pass through the second limiting holes 23 and be inserted into the baffle 20.

[0064] In the vertical direction, the multiple first limiting holes 22 and multiple second limiting holes 23 of the baffle 20 can be positioned correspondingly. The first limiting rod 11 can be connected to the limiting protrusions 32 of the multiple first limiting parts 311 and the two baffles 20. The second limiting rod 12 can be connected to the limiting protrusions 32 of the multiple second limiting parts 312 and the two baffles 20. The multiple first limiting holes 22 that are positioned correspondingly in the vertical direction can be arranged at intervals along the second direction. The multiple second limiting holes 23 that are positioned correspondingly in the vertical direction can be arranged at intervals along the second direction.

[0065] The first limiting rod 11 can be selectively inserted into one of the plurality of first limiting holes 22 corresponding to the above-mentioned vertical position, and the second limiting rod 12 can be selectively inserted into one of the plurality of second limiting holes 23 corresponding to the above-mentioned vertical position. This allows for adjustment of the distance between the first limiting part 311 and the second limiting part 312 of each limiting member 30 in the second direction, enabling the wafer carrier 100 to carry a wafer 200 of a larger size in the second direction. This improves the flexibility of carrying the wafer 200, enhances the applicability of the wafer carrier 100, and reduces costs.

[0066] like Figure 2 , Figure 4 and Figure 8 As shown, in some embodiments, the wafer carrier 100 may further include a first magnetic element 40 and a second magnetic element 50. In two adjacent limiting elements 30, the first magnetic element 40 may be disposed on the side of the limiting protrusion 32 of one limiting element 30 closer to the other limiting element 30 (e.g., Figure 4 (as shown on the front side), the second magnetic element 50 can be disposed at a position opposite to the limiting protrusion 32 of another limiting element 30, that is, the second magnetic element 50 can be disposed at the bottom of the limiting groove 3121 of the other limiting element 30, and the magnetism of the first magnetic element 40 and the second magnetic element 50 are opposite.

[0067] On the one hand, the first magnetic component 40 and the second magnetic component 50 can be attracted together when the limiting bump 32 and the limiting groove 3121 are close to each other, which can realize the positioning of the insertion of the limiting bump 32 and the limiting groove 3121, improve the smoothness of the insertion and cooperation of the limiting bump 32 and the limiting groove 3121, and facilitate operation. On the other hand, it can improve the insertion effect of the limiting bump 32 and the insertion groove, improve the limiting effect of the two adjacent limiting components 30, prevent the two adjacent limiting components 30 from shaking with each other, and improve the stability of the wafer 200.

[0068] It is understood that the first magnetic element 40 can be a magnetic strip, and the first magnetic element 40 can extend along the extension direction of the limiting protrusion 32. The second magnetic element 50 can be a magnetic strip, and the second magnetic element 50 can extend along the extension direction of the limiting groove 3121. This can increase the mutual attraction area of ​​the first magnetic element 40 and the second magnetic element 50, thereby improving the limiting effect of the two adjacent limiting elements 30, preventing the two adjacent limiting elements 30 from shaking with each other, and improving the stability of the wafer 200.

[0069] In some embodiments, in the adjacent baffle 20 and limiting member 30, the baffle 20 may have a mounting protrusion (not shown in the figure), and the limiting member 30 may have a mounting groove (not shown in the figure). The mounting protrusion and the mounting groove can be inserted and engaged. Alternatively, the baffle 20 may have a mounting groove, and the limiting member 30 may have a mounting protrusion. The mounting protrusion and the mounting groove can be inserted and engaged. This can achieve the positioning of the limiting member 30 and the limiting member 30, and can limit the multiple limiting members 30. It can prevent the limiting member 30 and the baffle 20 from shaking with each other, improve the stability of the wafer 200, and facilitate operation.

[0070] It is understandable that the mounting protrusion of one limiting member 30 and the mounting groove of one baffle 20 can be inserted and matched, wherein the mounting protrusion can be the limiting protrusion 32 of the limiting member 30, and the mounting groove of another limiting member 30 and the mounting protrusion of another baffle 20 can be inserted and matched, wherein the mounting groove can be the limiting groove 3121 of the limiting member 30, which can reduce processing costs.

[0071] like Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 8 As shown, in some embodiments, the wafer carrier 100 may further include a plurality of grip levers 60, and both baffles 20 may be connected together with the plurality of grip levers 60. The plurality of grip levers 60 may be located on opposite sides of the plurality of limiting levers 10 (e.g., Figure 1 (as shown on the left and right sides), making it easy for operators to grasp and transfer the wafer carrier 100, and the lower side of each baffle 20 (as shown on the left and right sides), is designed to facilitate the handling of the wafer carrier 100 by the operator, and the lower side of each baffle 20 (as shown on the right and left sides) is designed to facilitate the handling of the wafer carrier 100 by the operator, and the lower side of each baffle 20 (as shown on the left and right sides) is Figure 5The lower side shown can have two legs 21 and two baffles 20 working together to support the entire wafer carrier 100.

[0072] Understandably, each end of the grip lever 60 can pass through two baffles 20 respectively, and the part of the grip lever 60 that passes through the baffles 20 can be fitted with a nut. The nut can be threaded to the end of the grip lever 60 and can contact the baffle 20, so that the grip lever 60 and the baffle 20 can be connected together. This can prevent the baffle 20 from sliding along the grip lever 60 after the wafer carrier 100 is assembled. The two baffles 20 can cooperate to clamp multiple limiting members 30 together, which can prevent multiple limiting members 30 from sliding along the grip lever 60 after the wafer carrier 100 is assembled, thereby improving the reliability of the wafer 200.

[0073] In this application, at least one limiting member 30 can be inserted or removed by removing a baffle 20, thereby adjusting the maximum number of wafers 200 that the wafer carrier 100 can carry. For example, the number of wafers 200 carried by the wafer carrier 100 in this application can be between 30 and 50. By adjusting the maximum number of wafers 200 that the wafer carrier 100 can carry, the wafer carrier 100 can be used for the grading and warehousing of good and bad wafers 200.

[0074] Furthermore, by replacing different baffle assemblies, and with the first limiting part 311 and the second limiting part 312 located between the two baffles 20 in different baffle assemblies having different distances in the second direction, the size of the wafer 200 carried by the wafer carrier 100 in the second direction can be adjusted, so that the wafer carrier 100 can adapt to the needs of carrying wafers 200 of different sizes. It should be noted that the wafer carrier 100 of this application can carry wafers 200 such as silicon carbide, silicon wafers or sapphire.

[0075] Other configurations and operations of the wafer carrier 100 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here. In the description of the present invention, "first feature" and "second feature" may include one or more of the features. The up-down direction, left-right direction, and front-back direction are defined as shown in the figures.

[0076] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features not in direct contact but through another feature between them. Moreover, "above," "over," and "on top" of the second feature include the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature.

[0077] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0078] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer carrier, characterized by, The utility model relates to a wafer holder, comprising: a plurality of limiting rods; a baffle assembly comprising two baffles arranged opposite in a first direction, both of which are connected with the plurality of limiting rods, and the plurality of limiting rods are movably connected with at least one baffle to adjust the distance between the two baffles in the first direction; a plurality of limiting members arranged between the two baffles in the first direction, each of which is connected with the plurality of limiting rods, and the two adjacent limiting members form a containing space for placing a wafer.

2. The wafer carrier of claim 1, wherein, The limiting member comprises a limiting body and a limiting protrusion, the limiting body has a first side and a second side arranged opposite in the first direction, and the limiting protrusion is arranged on the first side of the limiting body; wherein the limiting protrusion of one of the two adjacent limiting members cooperates with the second side of the other limiting member to separate the limiting bodies of the two adjacent limiting members.

3. The wafer carrier of claim 2, wherein, The second side of the limiting body has a limiting groove recessed along the first direction, and the limiting protrusion of one of the two adjacent limiting members is inserted into the limiting groove of the other limiting member, and the height of the limiting protrusion is greater than the depth of the limiting groove in the first direction; and / or, the limiting rod is arranged through the limiting body and the limiting protrusion.

4. The wafer carrier of claim 2, wherein, The limiting body comprises a first limiting part and a second limiting part arranged opposite in a second direction, both of which are provided with the limiting protrusion, and the second direction is perpendicular to the first direction; wherein the plurality of limiting rods comprise a first limiting rod connected with the first limiting part of the plurality of limiting members and a second limiting rod connected with the second limiting part of the plurality of limiting members.

5. The wafer carrier of claim 4, wherein, The first direction, the second direction and the up-down direction are arranged perpendicular to each other, and at least part of the limiting protrusions of the first limiting part and at least part of the limiting protrusions of the second limiting part gradually extend downward along the direction of approaching each other in the second direction to support the wafer together.

6. The wafer carrier of claim 5, wherein, The limiting protrusion of each of the first limiting part and the second limiting part comprises: a first protrusion extending along the up-down direction; a second protrusion connected with the lower end of the first protrusion, and the second protrusion of one of the first limiting part and the second limiting part gradually extends downward along the direction of approaching the other in the second direction; wherein the distance between the lower end of the second protrusion of the first limiting part and the lower end of the second protrusion of the second limiting part in the second direction is less than the diameter of the wafer.

7. The wafer carrier of claim 4, wherein The number of the first limiting rods is a plurality, the plurality of first limiting rods are arranged in the extension direction of the limiting protrusions of the first limiting part, and each of the first limiting rods is connected with the limiting protrusions of the first limiting part and the two baffles; and / or, The second limiting rods are arranged in the extending direction of the limiting protrusions of the second limiting parts, and each of the second limiting rods is connected with the limiting protrusions of the second limiting parts and the two baffle plates.

8. The wafer carrier of claim 4, wherein, The baffle plate assembly includes a plurality of first limiting rods connected with the limiting protrusions of the first limiting parts, the two baffle plates of one of the plurality of baffle plate assemblies, and the second limiting rods connected with the limiting protrusions of the second limiting parts, the two baffle plates of one of the plurality of baffle plate assemblies, The distance between the first limiting part and the second limiting part located between the two baffle plates of different baffle plate assemblies in the second direction is different.

9. The wafer carrier of any of claims 2-8, wherein, Further comprising: The first magnetic member and the second magnetic member are magnetically opposite, in adjacent two limiting members, the first magnetic member is arranged on one side of the limiting protrusion of one of the limiting members close to the other limiting member, and the second magnetic member is arranged on the position opposite to the limiting protrusion of the other limiting member.

10. The wafer carrier of any of claims 2-8, wherein, In the baffle plate and the limiting member arranged adjacently, one of the baffle plate and the limiting member has a mounting protrusion, and the other has a mounting groove recessed in the first direction, and the mounting protrusion and the mounting groove are inserted and matched; And / or, the wafer carrier further comprises a plurality of handle rods, and the two baffle plates are connected with the plurality of handle rods together, and the plurality of handle rods are respectively located on the opposite sides of the plurality of limiting rods.

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