A circuit board plate material edge grinding device

Abstract

A kind of circuit board plate edge grinding device, edge grinding device includes: base;First drive mechanism, including first motor, first screw rod and first moving part;Second drive mechanism, with first drive mechanism opposite in base, including second motor, second screw rod and second moving part;Third drive mechanism, including third motor, third screw rod and edge grinding mechanism with grinding head;Vacuum suction plate, integrally formed with air hole, when circuit board plate is placed on vacuum suction plate, vacuum is extracted through air hole, air hole forms negative pressure between vacuum suction plate and circuit board plate, at this time, vacuum suction plate adsorbs circuit board plate, first motor and second motor synchronously drive first screw rod and second screw rod to rotate, first moving part and second moving part are synchronously moved along first direction, and drive edge grinding mechanism also move along first direction, third motor drives third screw rod to rotate, and edge grinding mechanism moves along second direction.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing equipment, and in particular to a circuit board material edge grinding device. Background Technology

[0002] PCB edge grinding machines are key pieces of equipment in the PCB manufacturing process. They are mainly used for precision grinding of the edges of PCB boards to remove defects such as burrs and cracks, ensuring smooth and even edges, thereby improving the dimensional accuracy, assembly reliability, and electrical performance of the PCB. The core principle is to use mechanical grinding methods, such as grinding wheels, abrasive belts, or diamond grinding heads, to cut the edges of the board, making it suitable for edge treatment of circuit board materials.

[0003] Currently, most circuit board materials are rectangular. These regularly shaped circuit boards can usually be processed using standard edge grinding machines commonly available on the market. However, some circuit boards need to be irregularly shaped for special applications. Conventional standard edge grinding machines often cannot accurately grind irregularly shaped circuit boards, potentially resulting in uneven ground surfaces and further affecting subsequent circuit board processing steps. Furthermore, existing circuit board materials are typically fixed using clamps during processing. Irregularly shaped circuit boards have many gaps or curved surfaces, and traditional clamping devices often cannot effectively hold irregularly shaped circuit boards as they do with regular rectangular ones. This can lead to horizontal displacement of the circuit board during grinding.

[0004] Therefore, it is necessary to provide a circuit board edge grinding device that can be applied to the processing of irregularly shaped circuit boards and can prevent the circuit board from shifting during edge grinding. Utility Model Content

[0005] The purpose of this invention is to provide a circuit board edge grinding device that is applicable to the processing of irregularly shaped circuit boards and can prevent the circuit board from shifting during edge grinding.

[0006] According to one aspect of this application, a circuit board material edge grinding device is provided, the edge grinding device comprising:

[0007] Base

[0008] A first drive mechanism is fixedly connected to the base. The first drive mechanism includes a first motor, a first lead screw fixedly connected to the output shaft of the first motor and having threads on its surface, and a first moving component threadedly connected to the first lead screw.

[0009] The second drive mechanism is fixedly connected to the base and is disposed opposite to the first drive mechanism on the base. The second drive mechanism includes a second motor, a second lead screw fixedly connected to the output shaft of the second motor and having threads on its surface, and a second moving component threadedly connected to the second lead screw.

[0010] The third drive mechanism is fixedly connected between the first moving part and the second moving part. The third drive mechanism includes a third motor, a third lead screw fixedly connected to the output end of the third motor and having threads on its surface, and a grinding mechanism threadedly connected to the third lead screw and fixedly connected to a grinding head.

[0011] A vacuum adsorption plate is fixedly connected to the base and located on the side of the base where the first driving mechanism and the second driving mechanism are fixedly connected. A plurality of air holes penetrating the plate surface are integrally formed on the vacuum adsorption plate, and the circuit board material is placed on the vacuum adsorption plate.

[0012] When the air pores are evacuated, a negative pressure is formed between the vacuum adsorption plate and the circuit board material. The vacuum adsorption plate adsorbs the circuit board material. The first motor and the second motor synchronously drive the first lead screw and the second lead screw to rotate. The first moving part and the second moving part synchronously move along a first direction parallel to the surface of the vacuum adsorption plate and drive the edge grinding mechanism to move along the first direction. The third motor drives the third lead screw to rotate. The edge grinding mechanism moves along a second direction parallel to the surface of the vacuum adsorption plate and perpendicular to the first direction.

[0013] More preferably, the first drive mechanism further includes:

[0014] The first limiting plate is fixedly connected to the base, and the first lead screw is rotatably connected between the two first limiting plates;

[0015] The first guide shaft is fixedly connected between the two first limiting plates, and the first moving component is slidably connected to the first guide shaft.

[0016] More preferably, the second drive mechanism further includes:

[0017] The second limiting plate is fixedly connected to the base, and the second lead screw is rotatably connected between the two second limiting plates;

[0018] The second guide shaft is fixedly connected between the two second limiting plates, and the second moving part is slidably connected to the second guide shaft.

[0019] More preferably, the third drive mechanism further includes:

[0020] The third guide shaft is fixedly connected between the first moving part and the second moving part;

[0021] The third lead screw extends along the second direction. When viewed along the first direction, the third lead screw is located between the two third guide shafts, and the third guide shafts are parallel to the third lead screw.

[0022] More preferably, the first lead screw extends along the first direction, and the second lead screw also extends along the first direction;

[0023] Wherein, the first guide shaft is parallel to the first lead screw, and the second guide shaft is parallel to the second lead screw.

[0024] More preferably, the edge grinding mechanism includes:

[0025] The base is slidably connected to the third guide shaft and threadedly connected to the third lead screw;

[0026] The fourth lead screw is rotatably connected to the substrate and extends in a third direction perpendicular to the surface of the vacuum adsorption plate.

[0027] More preferably, the edge grinding mechanism further includes:

[0028] The fourth guide shaft is fixedly connected to the base and parallel to the fourth lead screw. When viewed along the first direction, the fourth lead screw is located between the two fourth guide shafts.

[0029] The third moving part is threadedly connected to the fourth lead screw and slidably connected to the fourth guide shaft.

[0030] More preferably, the edge grinding mechanism further includes:

[0031] The fourth motor is fixedly connected to the base and is located on the side of the base away from the base;

[0032] The fourth lead screw is fixedly connected to the output shaft of the fourth motor. The fourth motor drives the fourth lead screw to rotate. When the fourth lead screw rotates, the thread drives the third moving component to move along the third direction.

[0033] More preferably, the edge grinding mechanism further includes:

[0034] The fifth motor is fixedly connected to the third moving part;

[0035] The grinding head is fixedly connected to the output shaft of the fifth motor, and the fifth motor drives the grinding head to rotate.

[0036] More preferably, the edge grinding mechanism further includes:

[0037] The camera is fixedly connected to the base and is located on the side of the fifth motor away from the fourth lead screw, and on the side of the vacuum adsorption plate away from the base;

[0038] The camera is electrically connected to the edge grinding device, and the camera captures images of the circuit board material on the vacuum adsorption plate to control the movement of the first drive mechanism, the second drive mechanism, and the third drive mechanism respectively.

[0039] This utility model has the following beneficial effects:

[0040] The first and second moving parts move synchronously along a first direction parallel to the surface of the vacuum adsorption plate, driving the edge grinding mechanism to move along the first direction. After the third motor drives the third lead screw to rotate, the edge grinding mechanism moves along a second direction parallel to the surface of the vacuum adsorption plate and perpendicular to the first direction. This allows the grinding position of the grinding head on the edge grinding mechanism to move in two mutually perpendicular directions in the horizontal direction, enabling the grinding head to reach any position on the circuit board material in the horizontal direction, suitable for processing irregularly shaped circuit boards. Furthermore, the use of air holes to create a vacuum between the vacuum adsorption plate and the circuit board material, along with the design of the vacuum adsorption plate adsorbing the circuit board material, effectively fixes the circuit board material on the vacuum adsorption plate, replacing the clamping method and effectively preventing displacement of the circuit board material on the edge grinding device during edge grinding. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0042] Figure 1 This is a three-dimensional structural diagram of the edge grinding device described in one embodiment of this application;

[0043] Figure 2 This is a schematic diagram of the planar structure of the edge grinding device described in one embodiment of this application, viewed from a frontal perspective.

[0044] Figure 3 This is a schematic diagram of the planar structure of the edge grinding device described in one embodiment of this application, viewed from a top-down perspective.

[0045] Figure 4 This is a three-dimensional structural schematic diagram of the edge grinding device described in one embodiment of this application from another perspective;

[0046] Figure 5 For the Figure 3 A cross-sectional view AA of the vacuum adsorption plate cut along the cutting line AA;

[0047] Reference numerals: 100, Grinding device; 10, Base; 20, First drive mechanism; 21, First motor; 22, First lead screw; 23, First moving component; 24, First limiting plate; 25, First guide shaft; 30, Second drive mechanism; 31, Second motor; 32, Second lead screw; 33, Second moving component; 34, Second limiting plate; 35, Second guide shaft; 40, Third drive mechanism; 41, Third motor; 42, Third lead screw; 43, Grinding mechanism; 43A, Grinding head; 43B, Base; 43C, Fourth lead screw; 43D, Fourth guide shaft; 43E, Third moving component; 43F, Fourth motor; 43G, Fifth motor; 43H, Camera; 44, Third guide shaft; 50, Vacuum adsorption plate; 51, Air hole; F1, First direction; F2, Second direction; F3, Third direction; 200, Circuit board material. Detailed Implementation

[0048] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0049] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0051] Please refer to Figure 1 - Figure 5 One embodiment of this application provides a grinding device 100 for a circuit board material 200. The grinding device 100 includes: a base 10, a first driving mechanism 20, a second driving mechanism 30, a third driving mechanism 40, and a vacuum adsorption plate 50.

[0052] The first drive mechanism 20 is fixedly connected to the base 10. The first drive mechanism 20 includes a first motor 21, a first lead screw 22 fixedly connected to the output shaft of the first motor 21 and having threads on its surface, and a first moving component 23 threadedly connected to the first lead screw 22. The second drive mechanism 30 is fixedly connected to the base 10 and is disposed opposite to the first drive mechanism 20 on the base 10. The second drive mechanism 30 includes a second motor 31, a second lead screw 32 fixedly connected to the output shaft of the second motor 31 and also having threads on its surface, and a second moving component 33 threadedly connected to the second lead screw 32. The third drive mechanism 40 is fixedly connected between the first moving component 23 and the second moving component 33. The third drive mechanism 40 includes a third motor 41, a third lead screw 42 fixedly connected to the output end of the third motor 41 and having threads on its surface, and a grinding mechanism 43 threadedly connected to the third lead screw 42 and fixedly connected to a grinding head 43A. The vacuum adsorption plate 50 is fixedly connected to the base 10 and is located on the side of the base 10 where the first driving mechanism 20 and the second driving mechanism 30 are fixedly connected. A plurality of air holes 51 penetrating the plate surface are integrally formed on the vacuum adsorption plate 50. The circuit board material 200 is placed on the vacuum adsorption plate 50. When the air holes 51 are evacuated, a negative pressure is formed between the vacuum adsorption plate 50 and the circuit board material 200. The vacuum adsorption plate 50 adsorbs the circuit board material 200. The first motor 21 and the second motor 31 synchronously drive the first lead screw 22 and the second lead screw 32 to rotate. The first moving part 23 and the second moving part 33 synchronously move along a first direction F1 parallel to the surface of the vacuum adsorption plate 50 and drive the edge grinding mechanism 43 to move along the first direction F1. The third motor 41 drives the third lead screw 42 to rotate, and the edge grinding mechanism 43 moves along a second direction F2 parallel to the surface of the vacuum adsorption plate 50 and perpendicular to the first direction F1.

[0053] In this design, traditional single-screw drives are prone to frame deformation due to grinding reaction forces. However, the dual-axis symmetrical layout of the first drive mechanism 20 and the second drive mechanism 30 improves the overall rigidity of the grinding device 100 through force balance. The first moving part 23 and the second moving part 33 move axially along a threaded path by rotating the first lead screw 22 and the second lead screw 32 respectively, without rotating themselves. The rotors of the first motor 21 and the second motor 31 rotate in the same direction, and the external threads on the first lead screw 22 and the second lead screw 32 are identical, as are the external threads at the connection points of the first moving part 23 and the second moving part 33. When the first motor 21 and the second motor 31 start, the encoder provides real-time feedback on the positions of the two axes, dynamically adjusting the motor speeds to ensure they are synchronized. This ensures that the first moving part 23 and the second moving part 33 move synchronously and with consistent strokes in the first direction F1, avoiding wear and vibration caused by loss of precision during dual-axis movement. The third drive mechanism 40 is fixed between the first moving member 23 and the second moving member 33. The axial direction of its internal third lead screw 42 is parallel to the surface of the vacuum adsorption plate 50 and perpendicular to the axial directions of the first lead screw 22 and the second lead screw 32. Through the arrangement of the third lead screw 42, the edge grinding mechanism 43 can move on a horizontal plane parallel to the surface of the vacuum adsorption plate 50, thereby driving the grinding head 43A to be suitable for irregularly shaped circuit board materials 200 with irregular side edges, improving the applicability of the edge grinding device 100. The vacuum adsorption plate 50 is mounted on the base 10 and is connected to a vacuum generating device, such as a vacuum pump or vacuum generator. When the circuit board material 200 is placed on the vacuum adsorption plate 50, the vacuum generating device extracts air from the air holes 51 of the vacuum adsorption plate 50, creating a vacuum negative pressure area between the air holes 51 and the surface of the circuit board material 200. The external atmospheric pressure is then used to press the circuit board material 200 into the negative pressure area to fix it in place. This fixing method can effectively avoid the displacement of the board material caused by the vibration of the grinding operation, ensuring the grinding accuracy and the processing quality of the circuit board material 200.

[0054] More preferably, the first drive mechanism 20 further includes a first limiting plate 24 and a first guide shaft 25.

[0055] The first limiting plate 24 is fixedly connected to the base 10, and the first lead screw 22 is rotatably connected between the two first limiting plates 24. The first guide shaft 25 is fixedly connected between the two first limiting plates 24, and the first moving component 23 is slidably connected to the first guide shaft 25.

[0056] Two first limiting plates 24 are fixed to both ends of one side of the base 10, constraining the rotation of the first lead screw 22 within a precise axial range and, to some extent, eliminating the deflection deformation of the first lead screw 22 caused by the connection of the first moving component 23. The first guide shaft 25 is arranged parallel to the first lead screw 22, and the first moving component 23 is threadedly connected to the external thread of the first lead screw 22 and simultaneously slidably connected to the two first guide shafts 25. The first guide shafts 25 play a guiding and limiting role during the movement of the first moving component 23, avoiding deflection caused by the grinding reaction force and ensuring the path accuracy of the edge grinding mechanism 43 in the first direction F1.

[0057] More preferably, the second drive mechanism 30 further includes: a second limiting plate 34 and a second guide shaft 35.

[0058] The second limiting plate 34 is fixedly connected to the base 10, and the second lead screw 32 is rotatably connected between the two second limiting plates 34. The second guide shaft 35 is fixedly connected between the two second limiting plates 34, and the second moving component 33 is slidably connected to the second guide shaft 35.

[0059] When the grinding device 100 processes circuit boards with asymmetrical contours, the lateral force on the grinding head 43A changes periodically. The first limiting plate 24 and the second limiting plate 34 are both made of cast iron, a material with a high damping coefficient, which can absorb the medium-to-high frequency vibrations transmitted by the rotation of the first lead screw 22 and the second lead screw 32. Meanwhile, the first guide shaft 25 and the second guide shaft 35 can bear part of the radial force, reducing the lateral cutting force of the first lead screw 22 and the second lead screw 32 respectively, and reducing wear on the threads of the lead screws.

[0060] More preferably, the third drive mechanism 40 further includes a third guide shaft 44.

[0061] The third guide shaft 44 is fixedly connected between the first moving member 23 and the second moving member 33. The third lead screw 42 extends along the second direction F2. When viewed along the first direction F1, the third lead screw 42 is located between the two third guide shafts 44, and the third guide shafts 44 are parallel to the third lead screw 42.

[0062] In this design, two third guide shafts 44 parallel to the third lead screw 42 are arranged in the third drive mechanism 40, similar to the design of the first drive mechanism 20 and the second drive mechanism 30. This forms a dual-guide shaft directional constraint structure, improving the motion accuracy of the grinding mechanism 43 in the second direction F2. When the grinding head 43A performs curved or oblique machining, a lateral cutting force is generated on the third lead screw 42. The arrangement of the two third guide shafts 44 also effectively resists this torsional load, preventing slight deflection of the grinding mechanism 43 on the third lead screw 42. In addition, the design that the third lead screw 42 only needs to provide the driving force in the second direction F2 through the thread, while most of the remaining radial load is borne by the two third guide shafts 44, can effectively extend the service life of the third lead screw 42 and reduce the wear of its external threads. The design of the third lead screw 42 and the third guide shaft 44 located between the first moving part 23 and the second moving part 33 not only makes full use of the limited space on the edge grinding device 100, but also directly links the third drive mechanism 40 with the first drive mechanism 20 and the second drive mechanism 30 in the horizontal direction, making the various structures on the edge grinding device 100 more compact and improving the space utilization rate.

[0063] More preferably, the first lead screw 22 extends along the first direction F1, and the second lead screw 32 also extends along the first direction F1. The first guide shaft 25 is parallel to the first lead screw 22, and the second guide shaft 35 is parallel to the second lead screw 32.

[0064] In this design, the first lead screw 22 and the first guide shaft 25, and the second lead screw 32 and the second guide shaft 35, respectively form two sets of completely parallel kinematic pairs. This parallel arrangement allows for perfect separation of driving force and guiding force. Specifically, the first lead screw 22 and the second lead screw 32 focus on providing axial driving force in the first direction F1, while the first guide shaft 25 and the second guide shaft 35 are specifically responsible for bearing radial loads. This provides structural protection for the edge grinding mechanism 43 as it moves along the first direction F1. This structural protection effectively controls the precision tolerance of edge processing when handling ultra-thin and irregularly shaped boards, ensuring that the circuit board meets the requirements of various electronic devices.

[0065] More preferably, the edge grinding mechanism 43 includes: a base 43B and a fourth lead screw 43C.

[0066] The substrate 43B is slidably connected to the third guide shaft 44 and threadedly connected to the third lead screw 42. The fourth lead screw 43C is rotatably connected to the substrate 43B and extends along a third direction F3 perpendicular to the surface of the vacuum adsorption plate 50.

[0067] The edge grinding mechanism 43 can be considered as a moving part on the third drive mechanism 40, while the base 43B serves as the connecting structure between the edge grinding mechanism 43 and the third drive mechanism 40. It has a threaded hole and is threadedly connected to the externally threaded third lead screw 42. The third guide shaft 44 and the third lead screw 42 both pass through the base 43B. This design allows the edge grinding mechanism 43 to move along the second direction F2 via the base 43B along the third guide shaft 44 and the third lead screw 42. The fourth lead screw 43C also passes through the base 43B and can rotate at the connection point. The extension direction of the fourth lead screw 43C is vertical.

[0068] More preferably, the edge grinding mechanism 43 further includes a fourth guide shaft 43D and a third moving component 43E.

[0069] The fourth guide shaft 43D is fixedly connected to the base 43B and parallel to the fourth lead screw 43C. When viewed along the first direction F1, the fourth lead screw 43C is located between the two fourth guide shafts 43D. The third moving part 43E is threadedly connected to the fourth lead screw 43C and slidably connected to the fourth guide shaft 43D.

[0070] The fourth guide shaft 43D extends parallel to the fourth lead screw 43C, with both axes pointing vertically. The third moving part 43E is connected to both the fourth guide shaft 43D and the fourth lead screw 43C, and is used to move along the fourth guide shaft 43D and the fourth lead screw 43C in a vertical third direction F3. The fourth guide shaft 43D also limits and guides the movement of the third moving part 43E, preventing it from deviating during its movement along the fourth lead screw 43C via the thread.

[0071] More preferably, the edge grinding mechanism 43 further includes a fourth motor 43F.

[0072] The fourth motor 43F is fixedly connected to the base 43B and is located on the side of the base 43B opposite to the base 10. The fourth lead screw 43C is fixedly connected to the output shaft of the fourth motor 43F. The fourth motor 43F drives the fourth lead screw 43C to rotate. When the fourth lead screw 43C rotates, the thread drives the third moving member 43E to move along the third direction F3.

[0073] The fourth motor 43F is located above the base 43B, and the fourth lead screw 43C passes through the base 43B along the vertical third direction F3 and is connected to the output shaft of the fourth motor 43F. The rotation direction of the output shaft of the fourth motor 43F is the same as the rotation direction of the fourth lead screw 43C. The fourth motor 43F drives the fourth lead screw 43C to rotate, and the fourth lead screw 43C drives the third moving component 43E to move along the third direction F3 through its thread. This achieves the vertical position adjustment of the third moving component 43E. The grinding mechanism 43 can adjust the position of the grinding head 43A in the first direction F1, the second direction F2, and the third direction F3, enabling it to grind the material on the vacuum adsorption plate 50 with almost no dead angles.

[0074] More preferably, the edge grinding mechanism 43 further includes a fifth motor 43G.

[0075] The fifth motor 43G is fixedly connected to the third moving part 43E. The grinding head 43A is fixedly connected to the output shaft of the fifth motor 43G, and the fifth motor 43G drives the grinding head 43A to rotate.

[0076] The fifth motor 43G is fixed to the third moving part 43E, and the end of its output shaft is connected to the grinding head 43A. The fifth motor 43G drives its output shaft to rotate through its internal rotor, and finally drives the grinding head 43A to rotate, so as to realize the edge grinding operation of the plate. The grinding head 43A is fixed to the third moving part 43E, the third moving part 43E moves along the fourth lead screw 43C, and the edge grinding device 100 moves along the third lead screw 42. The third lead screw 42 is arranged between the first moving part 23 and the second moving part 33, so that the grinding head 43A can move in the first direction F1, the second direction F2 and the third direction F3 respectively.

[0077] More preferably, the edge grinding mechanism 43 further includes a camera 43H.

[0078] The camera 43H is fixedly connected to the base 43B and is located on the side of the fifth motor 43G away from the fourth lead screw 43C, and on the side of the vacuum adsorption plate 50 away from the base 10. The camera 43H is electrically connected to the edge grinding device 100, and the camera 43H captures images of the circuit board material 200 on the vacuum adsorption plate 50 to control the movement of the first drive mechanism 20, the second drive mechanism 30, and the third drive mechanism 40 respectively.

[0079] The camera 43H is electrically connected to the control unit of the edge grinding device 100. The camera 43H can observe the cutting of the board on the vacuum adsorption plate 50 below it in real time, and can identify the edge structure of different boards through image recognition function, so as to feed back to the control unit to control the movement of the drive mechanism, realize automated grinding operation, and avoid the accuracy problems caused by manual control of grinding operation.

[0080] In this way, the first moving component 23 and the second moving component 33 move synchronously along a first direction F1 parallel to the surface of the vacuum adsorption plate 50, and drive the edge grinding mechanism 43 to move along the first direction F1. After the third motor 41 drives the third lead screw 42 to rotate, the edge grinding mechanism 43 moves along a second direction F2 parallel to the surface of the vacuum adsorption plate 50 and perpendicular to the first direction F1. This allows the grinding position of the grinding head 43A on the edge grinding mechanism 43 to move in two mutually perpendicular directions in the horizontal direction, so that the grinding head 43A can reach any position of the circuit board material 200 in the horizontal direction, which is suitable for the processing of irregularly shaped circuit boards. The air pores 51 are used to create a vacuum, which forms a negative pressure between the vacuum adsorption plate 50 and the circuit board material 200. The design of the vacuum adsorption plate 50 adsorbing the circuit board material 200 effectively fixes the circuit board material 200 on the vacuum adsorption plate 50, replacing the clamp fixing method and effectively avoiding displacement on the edge grinding device 100 when the circuit board material 200 is edge-grinding.

[0081] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A device for grinding edges of circuit board materials, characterized in that, The edge grinding device includes: Base A first drive mechanism is fixedly connected to the base. The first drive mechanism includes a first motor, a first lead screw fixedly connected to the output shaft of the first motor and having threads on its surface, and a first moving component threadedly connected to the first lead screw. The second drive mechanism is fixedly connected to the base and is disposed opposite to the first drive mechanism on the base. The second drive mechanism includes a second motor, a second lead screw fixedly connected to the output shaft of the second motor and having threads on its surface, and a second moving component threadedly connected to the second lead screw. The third drive mechanism is fixedly connected between the first moving part and the second moving part. The third drive mechanism includes a third motor, a third lead screw fixedly connected to the output end of the third motor and having threads on its surface, and a grinding mechanism threadedly connected to the third lead screw and fixedly connected to a grinding head. A vacuum adsorption plate is fixedly connected to the base and located on the side of the base where the first driving mechanism and the second driving mechanism are fixedly connected. A plurality of air holes penetrating the plate surface are integrally formed on the vacuum adsorption plate, and the circuit board material is placed on the vacuum adsorption plate. When the air pores are evacuated, a negative pressure is formed between the vacuum adsorption plate and the circuit board material. The vacuum adsorption plate adsorbs the circuit board material. The first motor and the second motor synchronously drive the first lead screw and the second lead screw to rotate. The first moving part and the second moving part synchronously move along a first direction parallel to the surface of the vacuum adsorption plate and drive the edge grinding mechanism to move along the first direction. The third motor drives the third lead screw to rotate. The edge grinding mechanism moves along a second direction parallel to the surface of the vacuum adsorption plate and perpendicular to the first direction.

2. The circuit board edge grinding device according to claim 1, characterized in that, The first drive mechanism further includes: The first limiting plate is fixedly connected to the base, and the first lead screw is rotatably connected between the two first limiting plates; The first guide shaft is fixedly connected between the two first limiting plates, and the first moving component is slidably connected to the first guide shaft.

3. The circuit board edge grinding device according to claim 2, characterized in that, The second drive mechanism also includes: The second limiting plate is fixedly connected to the base, and the second lead screw is rotatably connected between the two second limiting plates; The second guide shaft is fixedly connected between the two second limiting plates, and the second moving part is slidably connected to the second guide shaft.

4. The circuit board edge grinding device according to claim 3, characterized in that, The third drive mechanism also includes: The third guide shaft is fixedly connected between the first moving part and the second moving part; The third lead screw extends along the second direction. When viewed along the first direction, the third lead screw is located between the two third guide shafts, and the third guide shafts are parallel to the third lead screw.

5. The circuit board material edge grinding device according to claim 4, characterized in that, The first lead screw extends along the first direction, and the second lead screw also extends along the first direction; Wherein, the first guide shaft is parallel to the first lead screw, and the second guide shaft is parallel to the second lead screw.

6. The circuit board edge grinding device according to claim 5, characterized in that, The edge grinding mechanism includes: The base is slidably connected to the third guide shaft and threadedly connected to the third lead screw; The fourth lead screw is rotatably connected to the substrate and extends in a third direction perpendicular to the surface of the vacuum adsorption plate.

7. The circuit board material edge grinding device according to claim 6, characterized in that, The edge grinding mechanism also includes: The fourth guide shaft is fixedly connected to the base and parallel to the fourth lead screw. When viewed along the first direction, the fourth lead screw is located between the two fourth guide shafts. The third moving part is threadedly connected to the fourth lead screw and slidably connected to the fourth guide shaft.

8. The circuit board material edge grinding device according to claim 7, characterized in that, The edge grinding mechanism also includes: The fourth motor is fixedly connected to the base and is located on the side of the base away from the base; The fourth lead screw is fixedly connected to the output shaft of the fourth motor. The fourth motor drives the fourth lead screw to rotate. When the fourth lead screw rotates, the thread drives the third moving component to move along the third direction.

9. A circuit board edge grinding device according to claim 8, characterized in that, The edge grinding mechanism also includes: The fifth motor is fixedly connected to the third moving part; The grinding head is fixedly connected to the output shaft of the fifth motor, and the fifth motor drives the grinding head to rotate.

10. A circuit board edge grinding device according to claim 9, characterized in that, The edge grinding mechanism also includes: The camera is fixedly connected to the base and is located on the side of the fifth motor away from the fourth lead screw, and on the side of the vacuum adsorption plate away from the base; The camera is electrically connected to the edge grinding device, and the camera captures images of the circuit board material on the vacuum adsorption plate to control the movement of the first drive mechanism, the second drive mechanism, and the third drive mechanism respectively.

Images