A semiconductor auxiliary refrigeration device for an automobile air conditioner

Abstract

The utility model provides a kind of semiconductor auxiliary refrigeration device of automobile air conditioner, comprising: fixed component, the rear side of the fixed component is equipped with auxiliary refrigeration component, the fixed component includes installation frame, the inside of the front side of the installation frame is equipped with fan, the auxiliary refrigeration component includes refrigeration box, one through hole hole is formed in the middle of the refrigeration box and is backward, the front side of the refrigeration box is embedded and is equipped with multiple refrigeration modules for auxiliary refrigeration, compared with prior art, the utility model has the beneficial effects as follows: by setting ventilation hole in the middle of refrigeration box, heat located in the front side portion of mounting groove is quickly removed from refrigeration box, avoid heat accumulation to cause refrigeration effect to be insufficient, by setting refrigeration module, multiple low-temperature heat-conducting plates can continuously cool the condensate in the inside of refrigeration box, and then the refrigerant flowing through the serpentine pipe can be cooled, to reach the purpose of auxiliary automobile air conditioner refrigeration.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor-assisted refrigeration technology, and specifically relates to a semiconductor-assisted refrigeration device for automotive air conditioning. Background Technology

[0002] Existing automotive air conditioning systems suffer from insufficient cooling performance in hot weather or during prolonged use, and lack effective auxiliary cooling structures, resulting in significant drawbacks. Firstly, the air conditioning compressor operates less efficiently in high-temperature environments, limiting refrigerant circulation and causing slow cooling of the cabin, failing to quickly reach a comfortable temperature and impacting the driving and riding experience. Secondly, traditional air conditioning system designs do not adequately consider extreme operating conditions; their single cooling path struggles to cope with high heat loads, especially under direct sunlight or when the vehicle is stationary, further weakening the cooling effect.

[0003] Conventional solutions include increasing refrigerant capacity to improve refrigeration efficiency or introducing a stand-alone refrigeration module as an auxiliary device. However, these methods have certain drawbacks: simply increasing refrigerant can improve refrigeration capacity, but it may increase the burden on the compressor and reduce system reliability; while a stand-alone refrigeration module can alleviate the pressure on the main system, it is limited by occupying additional space and increasing energy consumption, and its maintenance costs are also high. Therefore, we hope to design a semiconductor-assisted refrigeration device with a novel structure to solve this problem. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a semiconductor-assisted refrigeration device for automotive air conditioning, and solve the problems mentioned in the background art.

[0005] This utility model is achieved through the following technical solution: a semiconductor auxiliary cooling device for automotive air conditioning, comprising: a fixing component, an auxiliary cooling component installed on the rear side of the fixing component, the fixing component including a mounting frame, a fan installed inside the front side of the mounting frame, and the auxiliary cooling component including a cooling box, wherein a through hole is formed through the middle of the cooling box.

[0006] The front side of the refrigeration box is embedded with multiple refrigeration modules for auxiliary refrigeration, and the front part of the refrigeration box is embedded and fixed inside the rear side of the mounting frame.

[0007] In a preferred embodiment, a strip-shaped perforated plate 1 is provided on the left, right, upper and lower rear sides of the refrigeration box, and a strip-shaped perforated plate 2 is provided on the left, right, upper and lower rear sides of the mounting frame. The structure, distribution position and size of the perforated plate 1 are matched with the structure, distribution position and size of the perforated plate 2.

[0008] In a preferred embodiment, a gap is provided between the edge of the refrigeration box and the inner wall of the mounting frame, the ventilation hole is a rectangular through hole structure, and multiple heat dissipation plates are provided inside the ventilation hole at equal intervals.

[0009] In a preferred embodiment, the front surface of the refrigeration box is recessed to form multiple mounting slots. These mounting slots are arranged in an axisymmetric structure about the ventilation holes. In actual use, the refrigeration effect is ensured by placing multiple refrigeration modules in the recessed mounting slots.

[0010] In a preferred embodiment, each of the mounting slots is equipped with a refrigeration module. A condensate inlet for the condensate from the car air conditioner is provided in the middle of the top of the refrigeration box. A serpentine tube is installed inside the refrigeration box for introducing refrigerant. The serpentine tube is arranged in a serpentine structure along multiple mounting slots and ventilation holes.

[0011] In a preferred embodiment, the cooling module includes a sealing plate and a semiconductor cooling chip. The sealing plate is embedded and fixed inside the mounting groove, and a plurality of equally spaced positioning frames are provided on the outer side of the sealing plate.

[0012] In a preferred embodiment, each of the positioning frames is equipped with a thermoelectric cooler, the cold side of which abuts against the outer wall of the sealing plate, and the hot side of which faces outward. Under the action of the fan, the heat generated by the thermoelectric cooler can be quickly carried away.

[0013] In a preferred embodiment, the inner wall of the sealing plate is sealed to the bottom of the mounting groove by a sealing gasket. The sealing plate is provided with a plurality of equally spaced heat-conducting plates on the side near the inside of the refrigeration box. The heat-conducting plates are placed inside the refrigeration box and do not directly contact the serpentine tube.

[0014] After adopting the above technical solution, the beneficial effects of this utility model are as follows: 1. By setting a ventilation hole in the middle of the refrigeration box, after the fan is started, it can draw the air from the back of the refrigeration box through the gap between the edge of the refrigeration box and the inner wall of the mounting frame and the ventilation hole, which accelerates the air flow rate of this part of the structure, thereby allowing the heat in the front part of the mounting slot to be quickly drawn away from the refrigeration box, avoiding heat accumulation and insufficient cooling effect. At the same time, setting multiple heat dissipation plates inside the ventilation hole helps to improve the heat dissipation effect of the refrigeration box.

[0015] 2. By setting up a refrigeration module, when the semiconductor refrigeration chip is working, its cold surface will continuously cool the sealing plate, causing the temperature of the sealing plate to drop, which in turn lowers the temperature of the multiple heat-conducting plates connected to it. Since the heat-conducting plates are placed inside the refrigeration box, the multiple low-temperature heat-conducting plates will continuously cool the condensate inside the refrigeration box, thereby cooling the refrigerant flowing through the serpentine tube, achieving the purpose of assisting the car air conditioning in refrigeration. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of a semiconductor-assisted refrigeration device for an automotive air conditioner according to the present invention.

[0018] Figure 2 This is a schematic diagram showing the connection between the fixed component and the auxiliary cooling component of a semiconductor auxiliary cooling device for an automotive air conditioner according to this utility model.

[0019] Figure 3 This is a schematic diagram of the auxiliary cooling component structure of a semiconductor-assisted cooling device for an automotive air conditioner according to this utility model.

[0020] Figure 4 This is a schematic diagram of the refrigeration module of a semiconductor-assisted refrigeration device for an automotive air conditioner according to the present invention.

[0021] In the diagram, 100 is the fixed component, 110 is the mounting frame, and 120 is the fan.

[0022] 200-Auxiliary refrigeration component, 210-Refrigeration box, 211-Ventilation hole, 212-Heat dissipation plate, 213-Mounting slot, 214-Serpentine tube, 215-Condensate inlet, 220-Refrigeration module, 221-Sealing plate, 222-Heat conduction plate, 223-Positioning frame. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] As the first embodiment of this utility model:

[0025] Please see Figures 1 to 4 A semiconductor-assisted cooling device for an automotive air conditioner includes: a fixed assembly 100, an auxiliary cooling assembly 200 mounted on the rear side of the fixed assembly 100, the fixed assembly 100 including a mounting frame 110, a fan 120 mounted inside the front side of the mounting frame 110, and the auxiliary cooling assembly 200 including a cooling box 210, with a through hole formed in the middle of the cooling box 210 extending rearward.

[0026] Multiple refrigeration modules 220 for auxiliary refrigeration are embedded in the front side of the refrigeration box 210, and the front part of the refrigeration box 210 is embedded and fixed inside the rear side of the mounting frame 110.

[0027] A strip-shaped perforated plate is provided on the left, right, top and bottom of the rear end of the refrigeration box 210, and a strip-shaped perforated plate is provided on the left, right, top and bottom of the rear end of the mounting frame 110. The structure, distribution and size of the perforated plate 1 match the structure, distribution and size of the perforated plate 2.

[0028] A gap is provided between the edge of the cooling box 210 and the inner wall of the mounting frame 110. The ventilation hole 211 is a rectangular through hole structure, and multiple heat dissipation plates 212 are arranged at equal intervals inside the ventilation hole 211.

[0029] Specifically, by setting a ventilation hole 211 in the middle of the cooling box 210, in actual use, if the cooling module 220 in the multiple mounting slots 213 on the front side of the cooling box 210 is cooling, the heat generated by the hot surface of the semiconductor cooling chip on it will be concentrated in the front part of the mounting slot 213. Since the ventilation hole 211 is set in the middle of the cooling box 210 in a front-to-back manner, and there is a gap between the edge of the cooling box 210 and the inner wall of the mounting frame 110, after the fan 120 is started, it can draw the air from the rear side of the cooling box 210 through the gap between the edge of the cooling box 210 and the inner wall of the mounting frame 110 and the ventilation hole 211, which accelerates the airflow speed of this part of the structure, thereby making the heat in the front part of the mounting slot 213 quickly drawn away from the cooling box 210, avoiding heat accumulation and insufficient cooling effect. At the same time, multiple heat dissipation plates 212 are set inside the ventilation hole 211, which helps to improve the heat dissipation effect of the cooling box 210.

[0030] As a second embodiment of this utility model:

[0031] Please see Figures 1 to 4The front surface of the refrigeration box 210 is recessed to form multiple mounting slots 213. The multiple mounting slots 213 are arranged in an axisymmetric structure about the ventilation hole 211. In actual use, the refrigeration effect is ensured by placing multiple refrigeration modules 220 in the recessed mounting slots 213.

[0032] Each mounting slot 213 has a refrigeration module 220 installed inside. The top center of the refrigeration box 210 is provided with a condensate inlet 215 for the condensate of the car air conditioner. The refrigeration box 210 is equipped with a serpentine tube 214 for the refrigerant to be introduced. The serpentine tube 214 is arranged in a serpentine structure along multiple mounting slots 213 and ventilation holes 211.

[0033] The cooling module 220 includes a sealing plate 221 and a semiconductor cooling chip. The sealing plate 221 is embedded and fixed inside the mounting groove 213, and multiple positioning frames 223 are provided on the outer side of the sealing plate 221 at equal intervals.

[0034] Each positioning frame 223 has a thermoelectric cooler installed inside. The cold side of the thermoelectric cooler is in contact with the outer wall of the sealing plate 221, and the hot side of the thermoelectric cooler faces outward. Under the action of the fan 120, the heat generated by it can be quickly carried away.

[0035] The inner wall of the sealing plate 221 is sealed to the bottom of the mounting groove 213 by a sealing gasket. Multiple heat-conducting plates 222 are provided on the side of the sealing plate 221 near the inside of the refrigeration box 210. The heat-conducting plates 222 are placed inside the refrigeration box 210 and do not directly contact the serpentine tube 214.

[0036] Based on the first embodiment described above, further, in actual use, since the cold side of the semiconductor cooling chip abuts against the outer wall of the sealing plate 221, and the inner wall of the sealing plate 221 is sealed to the bottom of the mounting groove 213 through a sealing gasket, and multiple equally spaced heat-conducting plates 222 are provided on the side of the sealing plate 221 near the interior of the refrigeration box 210, the heat-conducting plates 222 are placed inside the refrigeration box 210 and do not directly contact the serpentine tube 214, when the semiconductor cooling chip is working, its cold side will continuously cool the sealing plate 221, causing the temperature of the sealing plate 221 to drop, and further causing the temperature of the multiple heat-conducting plates 222 connected to it to drop. Since the heat-conducting plates 222 are placed inside the refrigeration box 210, the multiple low-temperature heat-conducting plates 222 will continuously cool the condensate inside the refrigeration box 210, thereby cooling the refrigerant flowing through the serpentine tube 214, achieving the purpose of assisting the automotive air conditioning cooling.

[0037] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor-assisted refrigeration device for an automotive air conditioner, comprising: A fixing component (100) is characterized in that an auxiliary cooling component (200) is installed on the rear side of the fixing component (100), the fixing component (100) includes a mounting frame (110), a fan (120) is installed inside the front side of the mounting frame (110), and the auxiliary cooling component (200) includes a cooling box (210), the cooling box (210) having a ventilation hole (211) extending rearward through the middle; The front side of the refrigeration box (210) is embedded with multiple refrigeration modules (220) for auxiliary refrigeration, and the front part of the refrigeration box (210) is embedded and fixed inside the rear side of the mounting frame (110).

2. The semiconductor-assisted refrigeration device for an automotive air conditioner as described in claim 1, characterized in that: The refrigeration box (210) has a strip-shaped perforated plate 1 on the left, right, upper and lower rear sides respectively, and the mounting frame (110) has a strip-shaped perforated plate 2 on the left, right, upper and lower rear sides respectively. The structure, distribution position and size of the perforated plate 1 are matched with the structure, distribution position and size of the perforated plate 2.

3. The semiconductor-assisted refrigeration device for an automotive air conditioner as described in claim 1, characterized in that: A gap is provided between the edge of the refrigeration box (210) and the inner wall of the mounting frame (110). The ventilation hole (211) is a rectangular through hole structure. Multiple heat dissipation plates (212) are arranged at equal intervals inside the ventilation hole (211).

4. The semiconductor-assisted refrigeration device for an automotive air conditioner as described in claim 1, characterized in that: The front surface of the refrigeration box (210) is recessed to form multiple mounting grooves (213), and the multiple mounting grooves (213) are arranged in an axisymmetric structure with respect to the ventilation hole (211).

5. The semiconductor-assisted refrigeration device for an automotive air conditioner as described in claim 4, characterized in that: Each of the mounting slots (213) is equipped with a refrigeration module (220). The top center of the refrigeration box (210) is provided with a condensate inlet (215) for the condensate of the car air conditioner. The refrigeration box (210) is equipped with a serpentine tube (214) for the refrigerant to be introduced. The serpentine tube (214) is arranged in a serpentine structure along the multiple mounting slots (213) and ventilation holes (211).

6. The semiconductor-assisted refrigeration device for an automotive air conditioner as described in claim 1, characterized in that: The cooling module (220) includes a sealing plate (221) and a semiconductor cooling chip. The sealing plate (221) is embedded and fixed inside the mounting groove (213). Multiple positioning frames (223) are provided on the outside of the sealing plate (221) at equal intervals.

7. The semiconductor-assisted refrigeration device for an automotive air conditioner as described in claim 6, characterized in that: Each of the positioning frames (223) is equipped with a semiconductor cooling chip, the cold side of which abuts against the outer wall of the sealing plate (221).

8. The semiconductor-assisted refrigeration device for an automotive air conditioner as described in claim 7, characterized in that: The inner wall of the sealing plate (221) is sealed to the bottom of the mounting groove (213) by a sealing gasket. The sealing plate (221) has a plurality of equally spaced heat-conducting plates (222) on the side near the inside of the refrigeration box (210). The heat-conducting plates (222) are placed inside the refrigeration box (210) and do not directly contact the serpentine tube (214).

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