Multilayer composite high-temperature-resistant circuit shielding adhesive tape

Abstract

The utility model discloses a multilayer composite high temperature resistant circuit shielding adhesive tape relates to circuit shielding adhesive tape technical field, and the adhesive tape body includes base layer, viscose layer, shielding layer and heat insulating layer, the shielding layer includes conducting part, screen and shielding coating, the screen is integrated in the conducting part inside, the shielding coating is sprayed in the conducting part both sides, the conducting part adopts the conductive polymer to be made of material, the screen is metal grid network, the shielding coating adopts and sprays and is formed with the graphene material, the base layer inside is provided with through -hole, and a plurality of through -hole is established, in the technical scheme provided by the utility model, adopt the screen and spray the shielding coating in both sides in the conducting part inside addition, make the shielding layer form the composite structure, make the shielding layer have better electromagnetic shielding effect, make the adhesive tape still have better shielding effect in high frequency or complex electromagnetic environment, and have high strength, make the adhesive tape not easy breakage.

Description

Technical Field

[0001] This utility model relates to the field of circuit shielding tape technology, and in particular to a multi-layer composite high-temperature resistant circuit shielding tape. Background Technology

[0002] Adhesive tape is a household product. Based on its function, it can be divided into: high-temperature tape, double-sided tape, insulating tape, specialty tape, pressure-sensitive tape, and die-cut tape. Different functions suit different industry needs. Circuit shielding tape is widely used in electronics, communications, automotive, and other fields.

[0003] However, with the development of technology, there is a greater need for circuit shielding tape. Traditional circuit shielding tape usually uses metal foil (copper, aluminum) for shielding, but the shielding effect decreases in high-frequency or complex electromagnetic environments, resulting in poor performance of circuit shielding tape. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a multi-layer composite high-temperature resistant circuit shielding tape to solve the problem that the shielding effect of the prior art decreases in high-frequency or complex electromagnetic environments, resulting in poor performance of the circuit shielding tape.

[0005] In view of this, the present invention provides a multi-layer composite high-temperature resistant circuit shielding tape. The tape body includes a base layer, an adhesive layer, a shielding layer and a heat insulation layer. The shielding layer is bonded to one side of the base layer with adhesive, and the heat insulation layer is bonded to the shielding layer with adhesive.

[0006] The shielding layer includes a conductive component, a mesh, and a shielding coating. The mesh is integrated inside the conductive component, and the shielding coating is sprayed on both sides of the conductive component.

[0007] Optionally, the conductive element is made of a conductive polymer.

[0008] Optionally, the mesh is a metal mesh with several diamond-shaped holes inside, and the mesh is integrally formed within the conductive component.

[0009] Optionally, the shielding coating is formed by spraying graphene material.

[0010] Optionally, the base layer is made of conductive foam, and the base layer has through holes, and there are several through holes.

[0011] Optionally, the adhesive layer is disposed at the bottom of the base layer, and the bottom of the base layer is laminated with an adhesive layer.

[0012] Optionally, the bottom of the adhesive layer is provided with a plurality of grooves, and the adhesive layer adheres to the bottom of the adhesive layer.

[0013] Optionally, a protective coating is sprayed on one side of the heat insulation layer, and a protective film is adhered to the other side of the protective coating.

[0014] As can be seen from the above technical solutions, the embodiments of this utility model have the following advantages:

[0015] 1. This utility model discloses a multi-layer composite high-temperature resistant circuit shielding tape, which adds a spacer inside the conductive component and sprays a shielding coating on both sides to form a composite structure of shielding layers, so that the shielding layers have better electromagnetic shielding effect. The tape still has a good shielding effect in high-frequency or complex electromagnetic environments, and has high strength, making the tape not easy to break.

[0016] 2. The present invention provides a multi-layer composite high-temperature resistant circuit shielding tape, which uses conductive foam as the base layer to reduce the overall weight of the tape, thereby avoiding affecting the lightweight design of portable devices such as drones and mobile phones.

[0017] These features and advantages of the present invention will be disclosed in detail in the following specific embodiments and accompanying drawings. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0021] Figure 3 This is a cross-sectional view of the shielding layer of this utility model.

[0022] Explanation of reference numerals in the attached drawings: 1. Tape body; 11. Base layer; 12. Through hole; 13. Adhesive layer; 14. Shielding layer; 141. Conductive component; 142. Spacing mesh; 143. Shielding coating; 15. Heat insulation layer; 16. Protective coating; 17. Adhesive layer; 171. Groove; 18. Protective film. Detailed Implementation

[0023] The technical solutions of the present utility model will be explained and described below with reference to the accompanying drawings. However, the following embodiments are only preferred embodiments of the present utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments in the implementation methods without creative effort are all within the protection scope of the present utility model.

[0024] The following describes in detail, with reference to the accompanying drawings, a multi-layer composite high-temperature resistant circuit shielding tape according to an embodiment of the present invention.

[0025] Example 1

[0026] For easier understanding, please refer to Figures 1 to 3 This utility model provides an embodiment of a multi-layer composite high-temperature resistant circuit shielding tape. The tape body 1 includes a base layer 11, an adhesive layer 13, a shielding layer 14, and a heat insulation layer 15. The shielding layer 14 is bonded to one side of the base layer 11 with adhesive, and the heat insulation layer 15 is bonded to the shielding layer 14 with adhesive.

[0027] The shielding layer 14 includes a conductive element 141, a mesh 142, and a shielding coating 143. The mesh 142 is integrated inside the conductive element 141, and the shielding coating 143 is sprayed on both sides of the conductive element 141.

[0028] It should be noted that by adding a spacer 142 inside the conductive component 141 and spraying a shielding coating 143 on both sides, the shielding layer 14 forms a composite structure, which makes the shielding layer 14 have a better electromagnetic shielding effect. This allows the tape to still have a good shielding effect in high-frequency or complex electromagnetic environments, and it also has high strength, making the tape less prone to breakage.

[0029] In some embodiments, such as Figure 3 As shown, the conductive component 141 is made of conductive polymer, the mesh 142 is a metal mesh with several diamond-shaped holes inside, the mesh 142 is integrally formed inside the conductive component 141, the shielding coating 143 is made of graphene material spraying, the adhesive layer 13 is set at the bottom of the base layer 11, the bottom of the base layer 11 is composite with an adhesive layer 17, the bottom of the adhesive layer 17 is provided with several grooves 171, and the adhesive layer 13 is adhered to the bottom of the adhesive layer 17.

[0030] It should be noted that the conductive polymer can be polyaniline, the mesh 142 is a metal foil film with a mesh structure, the adhesive layer 13 is made of elastomer modified acrylic adhesive, the adhesive layer 17 is made of the same material as the base layer 11, and by opening a groove 171 at the bottom of the adhesive layer 17, the contact area between the adhesive layer 13 and the adhesive layer 17 can be increased, so that the adhesive layer 13 adheres more stably to the bottom of the adhesive layer 17. The conductive component 141 is formed by extrusion molding, and the mesh 142 is directly wrapped inside the conductive component 141 during the molding process.

[0031] In some embodiments, such as Figure 2 As shown, a protective coating 16 is sprayed on one side of the heat insulation layer 15, and a protective film 18 is adhered to one side of the protective coating 16.

[0032] It should be noted that the protective coating 16 is made by aerogel spraying to reduce heat conduction and achieve better heat insulation and high temperature resistance. The protective film 18 is an ultra-thin metal layer formed by sputtering coating technology to ensure the flexibility of the tape and make the tape less prone to breakage.

[0033] Example 2

[0034] In some embodiments, such as Figure 2 As shown, the base layer 11 has through holes 12 inside, and there are several through holes 12. The base layer 11 is made of conductive foam.

[0035] It should be noted that the use of conductive foam to make the base layer 11 reduces the overall weight of the tape, thereby avoiding the impact on the lightweighting of portable devices such as drones and mobile phones. By setting through holes 12, the weight can be further reduced without affecting the performance of the tape. The structure of the tape body 1 from top to bottom consists of a protective film 18, a protective coating 16, a heat insulation layer 15, a shielding layer 14, a base layer 11, an adhesive layer 17, and an adhesive layer 13.

[0036] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A multi-layer composite high-temperature resistant circuit shielding tape, characterized in that: The tape body (1) includes a base layer (11), an adhesive layer (13), a shielding layer (14) and a heat insulation layer (15). The shielding layer (14) is bonded to one side of the base layer (11) with adhesive, and the heat insulation layer (15) is bonded to the shielding layer (14) with adhesive. The shielding layer (14) includes a conductive element (141), a mesh (142), and a shielding coating (143). The mesh (142) is integrated inside the conductive element (141), and the shielding coating (143) is sprayed on both sides of the conductive element (141).

2. The multilayer composite high-temperature resistant circuit shielding tape according to claim 1, characterized in that: The conductive component (141) is made of a conductive polymer.

3. The multilayer composite high-temperature resistant circuit shielding tape according to claim 1, characterized in that: The partition (142) is a metal mesh with several diamond-shaped holes inside, and the partition (142) is integrally formed inside the conductive component (141).

4. The multilayer composite high-temperature resistant circuit shielding tape according to claim 1, characterized in that: The shielding coating (143) is formed by spraying graphene material.

5. The multilayer composite high-temperature resistant circuit shielding tape according to claim 1, characterized in that: The base layer (11) is made of conductive foam, and the base layer (11) has through holes (12) inside, and there are several through holes (12).

6. The multilayer composite high-temperature resistant circuit shielding tape according to claim 1, characterized in that: The adhesive layer (13) is disposed at the bottom of the base layer (11), and the bottom of the base layer (11) is composite with an adhesive layer (17).

7. The multilayer composite high-temperature resistant circuit shielding tape according to claim 6, characterized in that: The adhesive layer (17) has several grooves (171) at its bottom, and the adhesive layer (13) adheres to the bottom of the adhesive layer (17).

8. The multilayer composite high-temperature resistant circuit shielding tape according to claim 1, characterized in that: A protective coating (16) is sprayed on one side of the heat insulation layer (15), and a protective film (18) is adhered to one side of the protective coating (16).

Images