A high-precision alignment mechanism for wafer lithography

Abstract

The utility model relates to wafer photoetching technical field discloses a kind of high-precision alignment mechanism for wafer photoetching, including conveying assembly and correction assembly, the conveying assembly includes containing box, and the inside of containing box is connected with push spring, and the one end of push spring is connected with push plate, while the upside of push plate is equipped with wafer placement plate, conveying groove is equipped on the containing box, and the inside of containing box is connected with baffle, the conveying assembly further includes conveying electric telescopic handle, and the one end of conveying electric telescopic handle is connected with conveying plate, by conveying assembly using push spring and conveying electric telescopic handle, wafer placement plate is accurately conveyed to alignment position, and correction assembly is through the linkage of correction electric telescopic handle and multistage connecting plate, wafer placement plate is clamped and corrected operation, and this multistage alignment mechanism can effectively reduce the position deviation of wafer in alignment process, improve alignment accuracy.

Description

Technical Field

[0001] This utility model relates to the field of wafer lithography technology, specifically a high-precision alignment mechanism for wafer lithography. Background Technology

[0002] With the continuous development of semiconductor manufacturing technology, wafer lithography plays a crucial role in chip manufacturing. As one of the core components of the lithography process, traditional alignment mechanisms suffer from low alignment accuracy and reliability. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high-precision alignment mechanism for wafer lithography.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a high-precision alignment mechanism for wafer lithography, comprising a conveying assembly and a correction assembly. The conveying assembly includes a holding box, and a push spring is connected to the inner side of the holding box. One end of the push spring is connected to a push plate, and a wafer placement plate is provided on the upper side of the push plate. The holding box is provided with a conveying groove, and a baffle is connected to the inner side of the holding box. The conveying assembly also includes a conveying electric telescopic rod, and one end of the conveying electric telescopic rod is connected to a conveying plate.

[0005] As a further description of the above technical solution:

[0006] The correction assembly includes a first fixed support plate, and a correction electric telescopic rod is connected to the lower side of the first fixed support plate. One end of the correction electric telescopic rod is connected to a first connecting plate, and the first connecting plate is connected to a second connecting plate. One end of the second connecting plate is connected to a sliding shaft, and a third connecting plate is provided on the sliding shaft. One end of the third connecting plate is connected to a correction plate. The correction assembly also includes a fourth connecting plate, and the fourth connecting plate is provided with a first sliding groove and a second sliding groove. The correction assembly also includes a second fixed support plate, and a conveyor belt is provided on the upper side of the second fixed support plate.

[0007] As a further description of the above technical solution:

[0008] One end of the push spring is fixedly connected to the lower inner side of the container, and the other end of the push spring is fixedly connected to the lower side of the push plate. The wafer placement plate slides against the upper side of the push plate, and several sets of wafer placement plates are evenly distributed on the inner side of the container.

[0009] As a further description of the above technical solution:

[0010] The baffle is fixedly installed inside the container, and the upper side of the wafer placement plate slides against the lower side of the baffle. The height of the wafer placement plate is equal to the height of the conveying trough, and the wafer placement plate slides inside the conveying trough.

[0011] As a further description of the above technical solution:

[0012] The electric telescopic conveying rod is fixedly installed on the lower side of the first fixed support plate, and the conveying plate slides inside the conveying trough.

[0013] As a further description of the above technical solution:

[0014] One end of the second connecting plate is hinged to one end of the first connecting plate, and the sliding shaft is rotatably connected to the end of the second connecting plate away from the first connecting plate. The third connecting plate is rotatably positioned in the middle of the sliding shaft, while the straightening plate is fixedly positioned on the lower side of the third connecting plate.

[0015] As a further description of the above technical solution:

[0016] The first fixed support plate is fixedly mounted on the second fixed support plate, and the fourth connecting plate is fixedly mounted on the second fixed support plate. The sliding shaft is slidably connected in the first sliding groove, while the third connecting plate slides in the second sliding groove.

[0017] This utility model has the following beneficial effects:

[0018] 1. The wafer placement board is precisely transported to the alignment position by the conveying assembly using a push spring and a conveying electric telescopic rod. The alignment assembly clamps and aligns the wafer placement board by the linkage of the alignment electric telescopic rod and the multi-stage connecting plate. This multi-stage alignment mechanism can effectively reduce the positional deviation of the wafer during the alignment process and improve the alignment accuracy.

[0019] 2. The design of the correction component adopts a sliding shaft and groove structure, which makes the correction plate more stable when moving in opposite directions. This stable movement mode can avoid alignment errors caused by mechanical vibration or impact, further improving alignment accuracy and reliability. Attached Figure Description

[0020] Figure 1 A three-dimensional structural diagram of a high-precision alignment mechanism for wafer lithography proposed in this utility model. Figure 1 ;

[0021] Figure 2 A three-dimensional structural diagram of a high-precision alignment mechanism for wafer lithography proposed in this utility model. Figure 2 ;

[0022] Figure 3This invention provides a partial structural diagram of a high-precision alignment mechanism for wafer lithography. Figure 1 ;

[0023] Figure 4 This invention provides a partial structural diagram of a high-precision alignment mechanism for wafer lithography. Figure 2 .

[0024] Legend:

[0025] 1. Conveying assembly; 11. Holding box; 12. Push spring; 13. Push plate; 14. Wafer placement plate; 15. Conveying trough; 16. Baffle; 17. Conveying electric telescopic rod; 18. Conveying plate; 2. Correcting assembly; 21. First fixed support plate; 22. Correcting electric telescopic rod; 23. First connecting plate; 24. Second connecting plate; 25. Sliding shaft; 26. Third connecting plate; 27. Correcting plate; 28. Fourth connecting plate; 29. ​​First chute; 210. Second chute; 211. Conveying belt; 212. Second fixed support plate. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Reference Figures 1-4 This utility model provides a high-precision alignment mechanism for wafer lithography, including: a transport component 1 and a correction component 2.

[0028] Specifically, the assembly includes a conveying component 1 and a straightening component 2. The conveying component 1 includes a holding box 11, with a push spring 12 connected to the inner side of the holding box 11. One end of the push spring 12 is connected to a push plate 13, and a wafer placement plate 14 is provided on the upper side of the push plate 13. The holding box 11 has a conveying groove 15, and a baffle 16 is connected to the inner side of the holding box 11. The conveying component 1 also includes a conveying electric telescopic rod 17, with one end of the conveying electric telescopic rod 17 connected to a conveying plate 18. The straightening component 2 includes a first fixed support plate 21, with a straightening electric telescopic rod connected to the lower side of the first fixed support plate 21. The correction assembly 2 includes a telescopic rod 22, one end of which is connected to a first connecting plate 23, and the first connecting plate 23 is connected to a second connecting plate 24. One end of the second connecting plate 24 is connected to a sliding shaft 25, and a third connecting plate 26 is provided on the sliding shaft 25. One end of the third connecting plate 26 is connected to a correction plate 27. The correction assembly 2 also includes a fourth connecting plate 28, and the fourth connecting plate 28 is provided with a first sliding groove 29 and a second sliding groove 210. The correction assembly 2 also includes a second fixed support plate 212, and a conveyor belt 211 is provided on the upper side of the second fixed support plate 212.

[0029] Specifically, one end of the push spring 12 is fixedly connected to the lower inner side of the container 11, and the other end of the push spring 12 is fixedly connected to the lower side of the push plate 13. The wafer placement plate 14 slides against the upper side of the push plate 13. Several sets of wafer placement plates 14 are evenly distributed inside the container 11. A baffle 16 is fixedly installed inside the container 11, and the upper side of the wafer placement plate 14 slides against the lower side of the baffle 16. The height of the wafer placement plate 14 is equal to the height of the conveying trough 15. The wafer placement plate 14 slides inside the conveying trough 15. The conveying electric telescopic rod 17 is fixedly installed below the first fixed support plate 21, and the conveying plate 18 slides inside the conveying trough 15. One end of the second connecting plate 24 is hinged to one end of the first connecting plate 23, and the sliding shaft 25 is rotatably connected to the second connecting plate 24. The connecting plate 24 is located away from the end of the first connecting plate 23, and the third connecting plate 26 is rotatably positioned in the middle of the sliding shaft 25. Meanwhile, the straightening plate 27 is fixedly positioned below the third connecting plate 26. The first fixed support plate 21 is fixedly positioned on the second fixed support plate 212, and the fourth connecting plate 28 is fixedly positioned on the second fixed support plate 212. The sliding shaft 25 is slidably connected to the first slide groove 29, and the third connecting plate 26 slides in the second slide groove 210. The wafer placement plate is precisely transported to the alignment position by the conveying assembly using a push spring and a conveying electric telescopic rod. The straightening assembly clamps and straightens the wafer placement plate through the linkage of the straightening electric telescopic rod and the multi-stage connecting plates. This multi-stage alignment mechanism can effectively reduce the positional deviation of the wafer during the alignment process and improve the alignment accuracy.

[0030] In use, by opening the holding box 11, multiple sets of wafer placement plates 14 are placed on the upper side of the push plate 13. The push plate 13 is then raised by the force of the spring 12, simultaneously raising the multiple sets of wafer placement plates 14 until the uppermost wafer placement plate 14 is against the lower side of the baffle 16. Activating the electric conveyor telescopic rod 17 causes the conveyor plate 18 to slide within the conveyor trough 15, pushing the wafer placement plates 14 onto the conveyor belt 211. Activating the conveyor belt 211 then transports the wafer placement plates 14. Activating the correction electric telescopic rod 22 pulls the... A connecting plate 23 drives two sets of second connecting plates 24 to perform opposing deflection movements, while simultaneously pulling the conveying groove 15 to slide within the first slide groove 29. At the same time, it drives the third connecting plate 26 to slide within the second slide groove 210. Simultaneously, the opposing movements of the two sets of third connecting plates 26 drive the opposing movements of the two sets of straightening plates 27, thus enabling the clamping movement of the wafer placement plate 14 and performing the straightening operation. The design of the straightening component adopts a sliding shaft and slide groove structure, making the straightening plates more stable during opposing movements. This stable movement mode can avoid alignment errors caused by mechanical vibration or impact, further improving alignment accuracy and reliability.

[0031] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-precision alignment mechanism for wafer lithography, characterized in that: The assembly includes a conveying component (1) and a straightening component (2). The conveying component (1) includes a holding box (11), and a push spring (12) is connected to the inner side of the holding box (11). One end of the push spring (12) is connected to a push plate (13), and a wafer placement plate (14) is provided on the upper side of the push plate (13). The holding box (11) is provided with a conveying groove (15), and a baffle (16) is connected to the inner side of the holding box (11). The conveying component (1) also includes a conveying electric telescopic rod (17), and one end of the conveying electric telescopic rod (17) is connected to a conveying plate (18).

2. The high-precision alignment mechanism for wafer lithography according to claim 1, characterized in that: The correction component (2) includes a first fixed support plate (21), and a correction electric telescopic rod (22) is connected to the lower side of the first fixed support plate (21). One end of the correction electric telescopic rod (22) is connected to a first connecting plate (23). The first connecting plate (23) is connected to a second connecting plate (24). One end of the second connecting plate (24) is connected to a sliding shaft (25). A third connecting plate (26) is provided on the sliding shaft (25). One end of the third connecting plate (26) is connected to a correction plate (27). The correction component (2) also includes a fourth connecting plate (28), and a first sliding groove (29) and a second sliding groove (210) are provided on the fourth connecting plate (28). The correction component (2) also includes a second fixed support plate (212), and a conveyor belt (211) is provided on the upper side of the second fixed support plate (212).

3. The high-precision alignment mechanism for wafer lithography according to claim 2, characterized in that: One end of the push spring (12) is fixedly connected to the lower inner side of the container (11), and the other end of the push spring (12) is fixedly connected to the lower side of the push plate (13). The wafer placement plate (14) slides against the upper side of the push plate (13). At the same time, the wafer placement plate (14) is provided in several groups and is evenly distributed on the inner side of the container (11).

4. A high-precision alignment mechanism for wafer lithography according to claim 3, characterized in that: The baffle (16) is fixedly disposed on the inner side of the container (11), and the upper side of the wafer placement plate (14) slides against the lower side of the baffle (16). The height of the wafer placement plate (14) is equal to the height of the conveying trough (15), and the wafer placement plate (14) slides on the inner side of the conveying trough (15).

5. A high-precision alignment mechanism for wafer lithography according to claim 4, characterized in that: The electric telescopic conveying rod (17) is fixedly installed on the lower side of the first fixed support plate (21), and the conveying plate (18) slides inside the conveying groove (15).

6. A high-precision alignment mechanism for wafer lithography according to claim 5, characterized in that: One end of the second connecting plate (24) is hinged to one end of the first connecting plate (23), and the sliding shaft (25) is rotatably connected to the end of the second connecting plate (24) away from the first connecting plate (23). The third connecting plate (26) is rotatably disposed in the middle position of the sliding shaft (25), and the straightening plate (27) is fixedly disposed on the lower side of the third connecting plate (26).

7. A high-precision alignment mechanism for wafer lithography according to claim 6, characterized in that: The first fixed support plate (21) is fixedly mounted on the second fixed support plate (212), and the fourth connecting plate (28) is fixedly mounted on the second fixed support plate (212). The sliding shaft (25) is slidably connected in the first sliding groove (29), while the third connecting plate (26) slides in the second sliding groove (210).

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