HDI laminated board main plate structure

Abstract

The utility model provides a kind of HDI laminated plate mainboard structure, including laminated plate main body and the protection plate of middle part aperture, sleeve pipe is fixedly connected on the laminated plate main body, the bottom surface of the protection plate is fixedly connected with the insertion pipe inserted in sleeve pipe.The utility model has the advantages that: when no external force acts, coil spring makes first rotating plate, second rotating plate keep inclined state, the space between adjacent first rotating plate, second rotating plate in inclined state can supply the heat generated by electronic component work on laminated plate main body to overflow outward.Under the action of external force, first rotating plate, second rotating plate will rotate after being pressed, corresponding coil spring also carries out winding power storage.First rotating plate, second rotating plate after rotating will close the aperture on protection plate, realize the protection of laminated plate main body.Under the premise of guaranteeing the heat dissipation effect of laminated plate main body, sufficient protection is provided, which is beneficial to long-term use of HDI laminated plate.

Description

Technical Field

[0001] This utility model relates to the field of HDI multilayer board technology, and in particular to an HDI multilayer board motherboard structure. Background Technology

[0002] HDI, or High-Density Interconnect Board, is a high-end type of printed circuit board that achieves high-density wiring through micro-blind / buried via technology. HDI multilayer boards use traditional double-sided boards as the core board and stack layers through multiple laminations and laser drilling processes to form a multilayer structure.

[0003] In existing technologies, during the transportation and storage of HDI multilayer boards, the electronic components on the surface can be affected by impacts from external objects, impacting the HDI multilayer board and potentially rendering it unusable. Since HDI multilayer boards are expensive, scrapping them results in significant economic losses. Therefore, this paper proposes an improved HDI multilayer board motherboard structure. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose an HDI multilayer board motherboard structure to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of this utility model provides an HDI multilayer board mainboard structure, including a multilayer board body and a protective plate with a central opening. A sleeve is fixedly connected to the multilayer board body, and an insert tube inserted into the sleeve is fixedly connected to the bottom surface of the protective plate. A buffer spring is provided between the multilayer board body and the protective plate, located within the insert tube. A vertical plate is fixedly connected to the outer side of the central opening on the protective plate. Several rotating shafts are rotatably connected to the inner side of the vertical plate. A first rotating plate is fixedly connected to some of the rotating shafts, and a second rotating plate is fixedly connected to another portion of the rotating shafts. The first and second rotating plates are inclined in opposite directions. A partition plate fixedly connected to the vertical plate is provided between adjacent first and second rotating plates. A collar is fixedly connected to the outer side of the rotating shaft on the vertical plate, and a coil spring is provided between the collar and the rotating shaft.

[0007] Preferably, any of the above-mentioned solutions has a plurality of sleeves that are evenly arranged at the corners of the laminated plate body, and the height of the sleeves is not less than the height of the tallest electronic component on the laminated plate body.

[0008] The above technical solution provides a mounting platform for relevant electronic components. A sleeve is installed on the laminated board body; this sleeve, in conjunction with a tubing, protects the buffer spring from external impacts. By controlling the height of the sleeve, the protective board can be prevented from acting on the electronic components on the laminated board body under pressure.

[0009] Preferably, any of the above solutions has two upright plates, which are respectively arranged on both sides of the opening in the protective plate along the length direction.

[0010] The above technical solution employs a buffer spring to provide elastic support for the protective plate, allowing it to undergo a certain displacement after being compressed, thus buffering the external force. A vertical plate is installed on the protective plate, providing a mounting platform for structures such as the rotating shaft and collar. The vertical plate also provides sufficient height for the rotating shaft, accommodating the rotation of the first and second rotating plates.

[0011] Preferably, in any of the above schemes, several of the rotating shafts are evenly arranged along the length of the vertical plate, and the corners of the first rotating plate and the second rotating plate are rounded.

[0012] The above technical solution is adopted: when no external force is applied, the coil spring keeps the rotating shaft fixed, and keeps the first rotating plate and the second rotating plate at a certain tilt angle. The space between the adjacent first rotating plate and the second rotating plate in the tilted state can allow the heat generated by the electronic components on the laminated board to dissipate outward.

[0013] Preferably, in any of the above schemes, the adjacent first rotating plates can be in an overlapping state after rotation, and the adjacent second rotating plates can also be in an overlapping state after rotation.

[0014] The above technical solution involves the following: Under external force, the first and second rotating plates rotate after being compressed, and the corresponding coil springs also coil up to store energy. After rotation, the first and second rotating plates close the openings on the protective plate, thus protecting the laminated plate body. Adjacent first and second rotating plates overlap after rotation, forming mutual support under force, which helps to improve their support strength.

[0015] Preferably, in any of the above embodiments, the collar is disposed on the outer side of the upright plate, and the coil spring is disposed on the inner side of the collar.

[0016] The above technical solution employs a coil spring that provides elastic support to the rotating shaft. When the external force disappears, the coil spring will cause the rotating shaft to rotate in the opposite direction, allowing the first and second rotating plates to continue to maintain their tilted state. The collar provides a mounting platform for the coil spring and also protects it, preventing the coil spring from being affected by external objects.

[0017] Preferably, as described in any of the above schemes, the upright plate has a plurality of through holes, which are formed between adjacent collars.

[0018] The above technical solution involves creating several through holes in the vertical plate, allowing heat from the inside of the plate to dissipate outwards.

[0019] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0020] 1. This HDI multilayer board mainboard structure, through the inclusion of a protective plate, upright plate, rotating shaft, first rotating plate, second rotating plate, collar, and coil spring, allows the coil spring to keep the first and second rotating plates tilted when no external force is applied. The space between adjacent first and second rotating plates in this tilted state allows heat generated by the electronic components on the multilayer board to dissipate outwards. Under external force, the first and second rotating plates rotate under pressure, and the corresponding coil spring retracts and stores force. The rotated first and second rotating plates then seal the openings on the protective plate, thus protecting the multilayer board. This provides ample protection while ensuring effective heat dissipation for the multilayer board, contributing to its long-term use.

[0021] 2. In this HDI multilayer board mainboard structure, a buffer spring is installed between the protective board and the multilayer board body. The buffer spring provides elastic support for the protective board, allowing it to undergo a certain displacement after being compressed, thus buffering external forces. A sleeve is installed on the multilayer board body, which, together with the insertion tube, provides protection for the buffer spring, preventing it from being affected by external objects.

[0022] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a first-view structural diagram of the present invention;

[0025] Figure 2 This is a schematic diagram of the second-view structure of the present invention;

[0026] Figure 3 This is a schematic diagram of the first working state structure of this utility model;

[0027] Figure 4 This is a schematic diagram of the second working state structure of this utility model.

[0028] In the diagram: 1-Laminated plate body, 2-Sleeve, 3-Insertion tube, 4-Buffer spring, 5-Protective plate, 6-Upright plate, 7-Rotating shaft, 8-First rotating plate, 9-Second rotating plate, 10-Partition plate, 11-Collar ring, 12-Coil spring. Detailed Implementation

[0029] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] like Figures 1-4 As shown, this utility model includes a laminated plate body 1 and a protective plate 5 with a central opening. A sleeve 2 is fixedly connected to the laminated plate body 1. An insertion tube 3 inserted into the sleeve 2 is fixedly connected to the bottom surface of the protective plate 5. A buffer spring 4 is provided between the laminated plate body 1 and the protective plate 5, located inside the insertion tube 3. A vertical plate 6 is fixedly connected to the outer side of the central opening on the protective plate 5. Several rotating shafts 7 are rotatably connected to the inner side of the vertical plate 6. A first rotating plate 8 is fixedly connected to some of the rotating shafts 7, and a second rotating plate 9 is fixedly connected to another part of the rotating shafts 7. The first rotating plate 8 and the second rotating plate 9 are inclined in opposite directions. A partition 10 fixedly connected to the vertical plate 6 is provided between adjacent first rotating plates 8 and second rotating plates 9. A collar 11 is fixedly connected to the outer side of the rotating shaft 7 on the vertical plate 6. A coil spring 12 is provided between the collar 11 and the rotating shaft 7.

[0032] Example 1: Several sleeves 2 are evenly arranged at the corners of the laminated plate body 1. The height of the sleeves 2 is not less than the height of the tallest electronic component on the laminated plate body 1. The laminated plate body 1 provides a mounting platform for the relevant electronic components. The sleeves 2, together with the inserts 3, provide protection for the buffer springs 4, preventing them from being affected by external objects. By controlling the height of the sleeves 2, the protective plate 5 can be prevented from acting on the electronic components on the laminated plate body 1 after being compressed. There are two upright plates 6, which are respectively arranged on both sides of the opening in the protective plate 5 along the length direction. The buffer springs 4 provide elastic support for the protective plate 5, allowing it to undergo a certain displacement after being compressed, thus providing a certain buffer against external forces. The upright plates 6 are provided on the protective plate 5, providing a mounting platform for structures such as the rotating shaft 7 and the collar 11. The upright plates 6 also provide a certain height for the rotating shaft 7, providing space for the rotation of the first rotating plate 8 and the second rotating plate 9.

[0033] Example 2: Several rotating shafts 7 are evenly arranged along the length of the vertical plate 6. The corners of the first rotating plate 8 and the second rotating plate 9 are rounded. When no external force is applied, the coil spring 12 keeps the rotating shafts 7 fixed, maintaining a certain tilt angle between the first rotating plate 8 and the second rotating plate 9. The space between adjacent first rotating plates 8 and second rotating plates 9 in the tilted state allows heat generated by the electronic components on the laminated plate body 1 to dissipate outwards. Adjacent first rotating plates 8 and adjacent second rotating plates 9 can overlap after rotation. Under external force, the first rotating plates 8 and second rotating plates 9 will rotate after being compressed, and the corresponding coil spring 12 will also coil up to store force. After rotation, the first rotating plates 8 and second rotating plates 9 will close the openings on the protective plate 5, thus protecting the laminated plate body 1. The overlapping of adjacent first rotating plates 8 and second rotating plates 9 after rotation forms mutual support under force, which helps to improve their support strength.

[0034] Example 3: A collar 11 is located on the outer side of the upright plate 6, and a coil spring 12 is located on the inner side of the collar 11. The coil spring 12 provides elastic support for the rotating shaft 11. When the external force disappears, it will drive the rotating shaft 7 to rotate in the opposite direction, so that the first rotating plate 8 and the second rotating plate 9 continue to maintain their tilted state. The collar 11 provides a mounting platform for the coil spring 12 and also provides protection for it, preventing the coil spring 12 from being affected by external objects. Several through holes are provided on the upright plate 6, and the through holes are located between adjacent collars 11. Several through holes are provided on the upright plate 6 to allow heat inside the upright plate 6 to dissipate outward.

[0035] The working principle of this utility model is as follows:

[0036] S1. When no external force is applied, the coil spring 12 keeps the first rotating plate 8 and the second rotating plate 9 in an inclined state. The space between the adjacent first rotating plate 8 and second rotating plate 9 in the inclined state can dissipate the heat generated by the operation of the electronic components on the laminate body 1.

[0037] S2. Under the action of external force, the first rotating plate 8 and the second rotating plate 9 will rotate after being compressed, and the corresponding coil spring 12 will also coil up and store force. After rotating, the first rotating plate 8 and the second rotating plate 9 will close the opening on the protective plate 5, thereby protecting the laminated plate body 1;

[0038] S3 and buffer spring 4 provide elastic support for the protective plate 5, enabling it to undergo a certain displacement after being compressed, thus buffering the external force and reducing the impact on the laminated plate body 1.

[0039] Compared with the prior art, the present invention has the following advantages:

[0040] 1. This HDI multilayer board mainboard structure, through the inclusion of a protective plate 5, a vertical plate 6, a rotating shaft 7, a first rotating plate 8, a second rotating plate 9, a collar 11, and a coil spring 12, allows the coil spring 12 to keep the first rotating plate 8 and the second rotating plate 9 tilted when no external force is applied. The space between adjacent first rotating plates 8 and second rotating plates 9 in this tilted state allows heat generated by the electronic components on the multilayer board body 1 to dissipate outwards. Under external force, the first rotating plates 8 and second rotating plates 9 rotate when compressed, and the corresponding coil spring 12 retracts and stores force. After rotation, the first rotating plates 8 and second rotating plates 9 close the openings on the protective plate 5, thus protecting the multilayer board body 1. This provides sufficient protection for the multilayer board body 1 while ensuring effective heat dissipation, which is beneficial for the long-term use of the HDI multilayer board.

[0041] 2. In this HDI laminate mainboard structure, a buffer spring 4 is installed between the protective plate 5 and the laminate body 1. The buffer spring 4 provides elastic support for the protective plate 5, allowing it to undergo a certain displacement after being compressed, thus buffering the external force. A sleeve 2 is installed on the laminate body 1. The sleeve 2, together with the insertion tube 3, can protect the buffer spring 4 and prevent it from being affected by external objects.

Claims

1. A HDI multilayer board motherboard structure, comprising a multilayer board body (1) and a protective plate (5) with a central opening; characterized in that, A sleeve (2) is fixedly connected to the laminated plate body (1), and an insertion tube (3) inserted into the sleeve (2) is fixedly connected to the bottom surface of the protective plate (5). A buffer spring (4) is provided between the laminated plate body (1) and the protective plate (5) and is located in the insertion tube (3). A vertical plate (6) is fixedly connected to the outer side of the central opening on the protective plate (5). Several rotating shafts (7) are rotatably connected to the inner side of the vertical plate (6). A first rotating plate (8) is fixedly connected to some of the rotating shafts (7), and a second rotating plate (9) is fixedly connected to another part of the rotating shafts (7). The first rotating plate (8) and the second rotating plate (9) are inclined in opposite directions. A partition plate (10) fixedly connected to the vertical plate (6) is provided between adjacent first rotating plates (8) and second rotating plates (9). A collar (11) is fixedly connected to the outer side of the rotating shaft (7) on the vertical plate (6). A coil spring (12) is provided between the collar (11) and the rotating shaft (7).

2. The HDI multilayer board motherboard structure as described in claim 1, characterized in that: The sleeves (2) are numerous and evenly arranged at the corners of the laminated plate body (1), and the height of the sleeves (2) is not less than the height of the tallest electronic component on the laminated plate body (1).

3. The HDI multilayer board motherboard structure as described in claim 2, characterized in that: There are two upright plates (6), which are respectively arranged on both sides of the opening in the protective plate (5) along the length direction.

4. The HDI multilayer board motherboard structure as described in claim 3, characterized in that: Several rotating shafts (7) are evenly arranged along the length of the vertical plate (6), and the corners of the first rotating plate (8) and the second rotating plate (9) are rounded.

5. The HDI multilayer board motherboard structure as described in claim 4, characterized in that: The adjacent first rotating plates (8) can overlap each other after rotation, and the adjacent second rotating plates (9) can also overlap each other after rotation.

6. The HDI multilayer board motherboard structure as described in claim 5, characterized in that: The collar (11) is located on the outside of the upright plate (6), and the coil spring (12) is located on the inside of the collar (11).

7. The HDI multilayer board motherboard structure as described in claim 6, characterized in that: The upright plate (6) has several through holes, which are located between adjacent collars (11).

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